In die­ser Sek­ti­on wer­den Pres­se­mit­tei­lun­gen der Her­stel­ler 1:1 ver­öf­fent­licht. Pla­net 3DNow! über­nimmt weder für die Rich­tig­keit der Anga­ben noch für die Art der For­mu­lie­rung jed­we­de Ver­ant­wor­tung. Die Anga­ben kön­nen sub­jek­tiv sein und geben nicht not­wen­di­ger­wei­se die Mei­nung der auf Pla­net 3DNow! schrei­ben­den Autoren wieder.

Designed for Big Data Applications, AMD Announces Industry’s First “Supercomputing” Server Graphics Card With 12GB Memory

Verfasst vonDr@

New AMD Fire­Pro S10000 12GB Edi­ti­on Gra­phics Card Is Desi­gned for Hete­ro­ge­neous Com­pu­te Appli­ca­ti­ons Built on Open­CL and Deli­vers Peak Dou­ble Pre­cis­i­on Performance

SUNNYVALE, CA — 11/14/13 – AMD (NYSE: AMD) today announ­ced the new AMD Fire­Pro™ S10000 12GB Edi­ti­on gra­phics card, desi­gned for big data high-per­for­mance com­pu­ting (HPC) workloads for sin­gle pre­cis­i­on and dou­ble pre­cis­i­on per­for­mance. With full sup­port for PCI Express® 3.0 and opti­mi­zed for use with the Open­CL™ com­pu­te pro­gramming lan­guage, the AMD Fire­Pro S10000 12GB Edi­ti­on GPU fea­tures ECC memo­ry plus DirectGMA sup­port allo­wing deve­lo­pers working with lar­ge models and assem­blies to take advan­ta­ge of the mas­si­ve­ly par­al­lel pro­ces­sing capa­bi­li­ties of AMD GPUs based on the latest AMD Gra­phics Core Next (GCN) archi­tec­tu­re. AMD Fire­Pro S10000 12GB Edi­ti­on GPU is sla­ted for avai­la­bi­li­ty in Spring 2014.

The AMD Fire­Pro S10000 12GB Edi­ti­on gra­phics card is a com­pel­ling solu­ti­on for a varie­ty of scenarios:

  • Compute/Visualization Ser­ver: finan­ce, oil explo­ra­ti­on, aero­nau­tics and auto­mo­ti­ve, design and engi­nee­ring, geo­phy­sics, life sci­en­ces, medi­ci­ne and defense
  • Dou­ble pre­cis­i­on: gene­tic sequen­cing, com­pu­ta­tio­nal flu­id dyna­mics, struc­tu­ral mecha­nics, nume­ral ana­ly­tics, reser­voir simu­la­ti­on, auto­ma­ted reaso­ning and wea­ther forecasting
  • Sin­gle pre­cis­i­on: seis­mic pro­ces­sing, mole­cu­lar dyna­mics, satel­li­te ima­ging, expli­cit crash test simu­la­ti­on, video enhance­ment, signal pro­ces­sing, video trans­co­ding, digi­tal ren­de­ring and medi­cal imaging
  • Ultra High-end Work­sta­tion (Requi­ring GPU com­pu­te and 3D gra­phics per­for­mance): Oil and gas, com­pu­ter aided engineering

“Our com­pu­te appli­ca­ti­on cus­to­mers asked for a solu­ti­on that offers increased memo­ry to sup­port lar­ger data sets as they crea­te new pro­ducts and ser­vices,” said David Cum­mings, seni­or direc­tor and gene­ral mana­ger, Pro­fes­sio­nal Gra­phics, AMD. “In respon­se, we’­re announ­cing the AMD Fire­Pro S10000 12GB Edi­ti­on gra­phics card to meet that addi­tio­nal memo­ry demand with sup­port for Open­CL and high-end com­pu­te and gra­phics technologies.”

“AMD is pro­ving again to be a key play­er in pro­vi­ding out­stan­ding 3D gra­phics and GPGPU com­pu­te solu­ti­ons based on the Open­CL Khro­nos Group stan­dard for the indus­try with the announce­ment of the new AMD Fire­Pro S10000 12GB gra­phics card,” said Nico­las Duny, VP R&D Tech­no­lo­gies, Das­sault Sys­tè­mes. “AMD is an indus­try inno­va­tor by respon­ding to our cus­to­mers’ needs with cut­ting edge tech­no­lo­gy. The AMD Fire­Pro S10000 12GB card will be a wel­co­me addi­ti­on to the mar­ket and to our customers.”

“Our cus­to­mers are always eager for addi­tio­nal memo­ry, so the intro­duc­tion of the AMD Fire­Pro S10000 12GB Edi­ti­on gra­phics card means key appli­ca­ti­ons will final­ly be able to take advan­ta­ge of the gra­phics com­pu­te capa­bi­li­ties,” said Lau­rent Ber­taux, CEO, CAPS. “As a lea­ding pro­vi­der of soft­ware and solu­ti­ons for the HPC com­mu­ni­ty, CAPS reco­gni­zes that this is a gre­at oppor­tu­ni­ty for cus­to­mers to redu­ce the poten­ti­al for the bot­t­len­eck of data trans­fer, thus impro­ving over­all appli­ca­ti­on per­for­mance. CAPS is a long-time AMD sup­port­er so we’­re plea­sed that CAPS FORTAN and C com­pi­lers for Open­CL can imme­dia­te­ly make full use of the 12GB memo­ry offe­red in this new AMD Fire­Pro solution.”

The cur­rent AMD Fire­Pro™ S10000 gra­phics solu­ti­on with 6GB of GDDR5 memo­ry has recei­ved gre­at accla­im. For exam­p­le, the Uni­ver­si­ty of Frankfurt’s Insti­tu­ti­on of Advan­ced Stu­dies use of the card with the SANAM super­com­pu­ter ranks in the top five on the Green500™ List as one of the most powerful and ener­gy-effi­ci­ent super­com­pu­ters powered by gra­phics processors.

The AMD Fire­Pro™ S10000 with 6GB of memo­ry is curr­ent­ly available for purcha­se while the AMD Fire­Pro S10000 12GB Edi­ti­on gra­phics card is sla­ted for avai­la­bi­li­ty in Spring 2014.

Plea­se visit AMD at Super­com­pu­ting 13, booth #1113, to see the AMD Fire­Pro S10000 12GB for the latest in GPU com­pu­te technology.

Sup­port­ing Resour­ces

About AMD
AMD (NYSE: AMD) designs and inte­gra­tes tech­no­lo­gy that powers mil­li­ons of intel­li­gent devices, inclu­ding per­so­nal com­pu­ters, tablets, game con­so­les and cloud ser­vers that defi­ne the new era of sur­round com­pu­ting. AMD solu­ti­ons enable peo­p­le ever­y­whe­re to rea­li­ze the full poten­ti­al of their favo­ri­te devices and appli­ca­ti­ons to push the boun­da­ries of what is pos­si­ble. For more infor­ma­ti­on, visit www.amd.com.

AMD, the AMD Arrow logo and Rade­on are trade­marks of Advan­ced Micro Devices, Inc. Open­CL is a trade­mark of Apple, Inc. and used by per­mis­si­on of Khro­nos. Other names are for infor­ma­tio­nal pur­po­ses only and may be trade­marks of their respec­ti­ve owners.

This Press Release con­ta­ins for­ward-loo­king state­ments con­cer­ning Advan­ced Micro Devices, Inc. (“AMD” or the “Com­pa­ny”) inclu­ding, among other things, AMD’s ser­ver gra­phics pro­duct inclu­ding stra­tegy, the timing, avai­la­bi­li­ty, fea­tures and func­tion­a­li­ty of such future pro­ducts, which are made pur­su­ant to the safe har­bor pro­vi­si­ons of the Pri­va­te Secu­ri­ties Liti­ga­ti­on Reform Act. For­ward-loo­king state­ments are com­mon­ly iden­ti­fied by words such as “would,” “may,” “expects,” “belie­ves,” “plans,” “intends,” “pro­jects,” and other terms with simi­lar mea­ning. Inves­tors are cau­tio­ned that the for­ward-loo­king state­ments in this pre­sen­ta­ti­on are based on cur­rent beliefs, assump­ti­ons and expec­ta­ti­ons, speak only as of the date of this announce­ment and invol­ve risks and uncer­tain­ties that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons. Risks include the pos­si­bi­li­ty that Intel Corporation’s pri­cing, mar­ke­ting and reba­ting pro­grams, pro­duct bund­ling, stan­dard set­ting, new pro­duct intro­duc­tions or other acti­vi­ties may nega­tively impact the Company’s plans; that the Com­pa­ny will requi­re addi­tio­nal fun­ding and may be unable to rai­se suf­fi­ci­ent capi­tal on favorable terms, or at all; that cus­to­mers stop buy­ing the Company’s pro­ducts or mate­ri­al­ly redu­ce their ope­ra­ti­ons or demand for its pro­ducts; that the Com­pa­ny may be unable to deve­lop, launch and ramp new pro­ducts and tech­no­lo­gies in the volu­mes that are requi­red by the mar­ket at matu­re yields on a time­ly basis; that the company’s third-par­ty foundry sup­pli­ers will be unable to tran­si­ti­on the Company’s pro­ducts to advan­ced manu­fac­tu­ring pro­cess tech­no­lo­gies in a time­ly and effec­ti­ve way or to manu­fac­tu­re the Company’s pro­ducts on a time­ly basis in suf­fi­ci­ent quan­ti­ties and using com­pe­ti­ti­ve pro­cess tech­no­lo­gies; that the Com­pa­ny will be unable to obtain suf­fi­ci­ent manu­fac­tu­ring capa­ci­ty or com­pon­ents to meet demand for its pro­ducts or will not ful­ly uti­li­ze the Company’s pro­jec­ted manu­fac­tu­ring capa­ci­ty needs at GLOBALFOUNDRIES Inc. (GF) micro­pro­ces­sor manu­fac­tu­ring faci­li­ties; that the Company’s requi­re­ments for wafers will be less than the fixed num­ber of wafers that we agreed to purcha­se from GF or GF encoun­ters pro­blems that signi­fi­cant­ly redu­ce the num­ber of func­tion­al die the Com­pa­ny recei­ves from each wafer; that the Com­pa­ny is unable to suc­cessful­ly imple­ment its long-term busi­ness stra­tegy; that the Com­pa­ny inac­cu­ra­te­ly esti­ma­tes the quan­ti­ty or type of pro­ducts that its cus­to­mers will want in the future or will ulti­m­ate­ly end up purcha­sing, resul­ting in excess or obso­le­te inven­to­ry; that the Com­pa­ny is unable to mana­ge the risks rela­ted to the use of its third-par­ty dis­tri­bu­tors and add-in-board (AIB) part­ners or offer the appro­pria­te incen­ti­ves to focus them on the sale of the Company’s pro­ducts; that the Com­pa­ny may be unable to main­tain the level of invest­ment in rese­arch and deve­lo­p­ment that is requi­red to remain com­pe­ti­ti­ve; that the­re may be unex­pec­ted varia­ti­ons in mar­ket growth and demand for the Company’s pro­ducts and tech­no­lo­gies in light of the pro­duct mix that it may have available at any par­ti­cu­lar time; that glo­bal busi­ness and eco­no­mic con­di­ti­ons, inclu­ding con­su­mer PC mar­ket con­di­ti­ons, will not impro­ve or will wor­sen; and the effect of poli­ti­cal or eco­no­mic insta­bi­li­ty, dome­sti­cal­ly or inter­na­tio­nal­ly, on our sales or sup­p­ly chain. Inves­tors are urged to review in detail the risks and uncer­tain­ties in the Company’s Secu­ri­ties and Exch­an­ge Com­mis­si­on filings, inclu­ding but not limi­t­ed to the Quar­ter­ly Report on Form 10‑Q for the quar­ter ended Sep­tem­ber 28, 2013.