Designed for Big Data Applications, AMD Announces Industry셲 First 쏶upercomputing Server Graphics Card With 12GB Memory

New AMD Fire짯Pro S10000 12GB Edi짯ti짯on Gra짯phics Card Is Desi짯gned for Hete짯ro짯ge짯neous Com짯pu짯te Appli짯ca짯ti짯ons Built on Open짯CL and Deli짯vers Peak Dou짯ble Pre짯cis짯i짯on Performance

SUNNYVALE, CA 11/14/13 AMD (NYSE: AMD) today announ짯ced the new AMD Fire짯Pro꽓 S10000 12GB Edi짯ti짯on gra짯phics card, desi짯gned for big data high-per짯for짯mance com짯pu짯ting (HPC) workloads for sin짯gle pre짯cis짯i짯on and dou짯ble pre짯cis짯i짯on per짯for짯mance. With full sup짯port for PCI Express짰 3.0 and opti짯mi짯zed for use with the Open짯CL꽓 com짯pu짯te pro짯gramming lan짯guage, the AMD Fire짯Pro S10000 12GB Edi짯ti짯on GPU fea짯tures ECC memo짯ry plus DirectGMA sup짯port allo짯wing deve짯lo짯pers working with lar짯ge models and assem짯blies to take advan짯ta짯ge of the mas짯si짯ve짯ly par짯al짯lel pro짯ces짯sing capa짯bi짯li짯ties of AMD GPUs based on the latest AMD Gra짯phics Core Next (GCN) archi짯tec짯tu짯re. AMD Fire짯Pro S10000 12GB Edi짯ti짯on GPU is sla짯ted for avai짯la짯bi짯li짯ty in Spring 2014.

The AMD Fire짯Pro S10000 12GB Edi짯ti짯on gra짯phics card is a com짯pel짯ling solu짯ti짯on for a varie짯ty of scenarios:

  • Compute/Visualization Ser짯ver: finan짯ce, oil explo짯ra짯ti짯on, aero짯nau짯tics and auto짯mo짯ti짯ve, design and engi짯nee짯ring, geo짯phy짯sics, life sci짯en짯ces, medi짯ci짯ne and defense
  • Dou짯ble pre짯cis짯i짯on: gene짯tic sequen짯cing, com짯pu짯ta짯tio짯nal flu짯id dyna짯mics, struc짯tu짯ral mecha짯nics, nume짯ral ana짯ly짯tics, reser짯voir simu짯la짯ti짯on, auto짯ma짯ted reaso짯ning and wea짯ther forecasting
  • Sin짯gle pre짯cis짯i짯on: seis짯mic pro짯ces짯sing, mole짯cu짯lar dyna짯mics, satel짯li짯te ima짯ging, expli짯cit crash test simu짯la짯ti짯on, video enhance짯ment, signal pro짯ces짯sing, video trans짯co짯ding, digi짯tal ren짯de짯ring and medi짯cal imaging
  • Ultra High-end Work짯sta짯tion (Requi짯ring GPU com짯pu짯te and 3D gra짯phics per짯for짯mance): Oil and gas, com짯pu짯ter aided engineering

Our com짯pu짯te appli짯ca짯ti짯on cus짯to짯mers asked for a solu짯ti짯on that offers increased memo짯ry to sup짯port lar짯ger data sets as they crea짯te new pro짯ducts and ser짯vices, said David Cum짯mings, seni짯or direc짯tor and gene짯ral mana짯ger, Pro짯fes짯sio짯nal Gra짯phics, AMD. 쏧n respon짯se, we쇑춓e announ짯cing the AMD Fire짯Pro S10000 12GB Edi짯ti짯on gra짯phics card to meet that addi짯tio짯nal memo짯ry demand with sup짯port for Open짯CL and high-end com짯pu짯te and gra짯phics technologies.

AMD is pro짯ving again to be a key play짯er in pro짯vi짯ding out짯stan짯ding 3D gra짯phics and GPGPU com짯pu짯te solu짯ti짯ons based on the Open짯CL Khro짯nos Group stan짯dard for the indus짯try with the announce짯ment of the new AMD Fire짯Pro S10000 12GB gra짯phics card, said Nico짯las Duny, VP R&D Tech짯no짯lo짯gies, Das짯sault Sys짯t챔짯mes. AMD is an indus짯try inno짯va짯tor by respon짯ding to our cus짯to짯mers needs with cut짯ting edge tech짯no짯lo짯gy. The AMD Fire짯Pro S10000 12GB card will be a wel짯co짯me addi짯ti짯on to the mar짯ket and to our customers.

Our cus짯to짯mers are always eager for addi짯tio짯nal memo짯ry, so the intro짯duc짯tion of the AMD Fire짯Pro S10000 12GB Edi짯ti짯on gra짯phics card means key appli짯ca짯ti짯ons will final짯ly be able to take advan짯ta짯ge of the gra짯phics com짯pu짯te capa짯bi짯li짯ties, said Lau짯rent Ber짯taux, CEO, CAPS. 쏛s a lea짯ding pro짯vi짯der of soft짯ware and solu짯ti짯ons for the HPC com짯mu짯ni짯ty, CAPS reco짯gni짯zes that this is a gre짯at oppor짯tu짯ni짯ty for cus짯to짯mers to redu짯ce the poten짯ti짯al for the bot짯t짯len짯eck of data trans짯fer, thus impro짯ving over짯all appli짯ca짯ti짯on per짯for짯mance. CAPS is a long-time AMD sup짯port짯er so we쇑춓e plea짯sed that CAPS FORTAN and C com짯pi짯lers for Open짯CL can imme짯dia짯te짯ly make full use of the 12GB memo짯ry offe짯red in this new AMD Fire짯Pro solution.

The cur짯rent AMD Fire짯Pro꽓 S10000 gra짯phics solu짯ti짯on with 6GB of GDDR5 memo짯ry has recei짯ved gre짯at accla짯im. For exam짯p짯le, the Uni짯ver짯si짯ty of Frankfurt셲 Insti짯tu짯ti짯on of Advan짯ced Stu짯dies use of the card with the SANAM super짯com짯pu짯ter ranks in the top five on the Green500꽓 List as one of the most powerful and ener짯gy-effi짯ci짯ent super짯com짯pu짯ters powered by gra짯phics processors.

The AMD Fire짯Pro꽓 S10000 with 6GB of memo짯ry is curr짯ent짯ly available for purcha짯se while the AMD Fire짯Pro S10000 12GB Edi짯ti짯on gra짯phics card is sla짯ted for avai짯la짯bi짯li짯ty in Spring 2014.

Plea짯se visit AMD at Super짯com짯pu짯ting 13, booth #1113, to see the AMD Fire짯Pro S10000 12GB for the latest in GPU com짯pu짯te technology.

Sup짯port짯ing Resour짯ces

About AMD
AMD (NYSE: AMD) designs and inte짯gra짯tes tech짯no짯lo짯gy that powers mil짯li짯ons of intel짯li짯gent devices, inclu짯ding per짯so짯nal com짯pu짯ters, tablets, game con짯so짯les and cloud ser짯vers that defi짯ne the new era of sur짯round com짯pu짯ting. AMD solu짯ti짯ons enable peo짯p짯le ever짯y짯whe짯re to rea짯li짯ze the full poten짯ti짯al of their favo짯ri짯te devices and appli짯ca짯ti짯ons to push the boun짯da짯ries of what is pos짯si짯ble. For more infor짯ma짯ti짯on, visit

AMD, the AMD Arrow logo and Rade짯on are trade짯marks of Advan짯ced Micro Devices, Inc. Open짯CL is a trade짯mark of Apple, Inc. and used by per짯mis짯si짯on of Khro짯nos. Other names are for infor짯ma짯tio짯nal pur짯po짯ses only and may be trade짯marks of their respec짯ti짯ve owners.

This Press Release con짯ta짯ins for짯ward-loo짯king state짯ments con짯cer짯ning Advan짯ced Micro Devices, Inc. (AMD or the 쏞om짯pa짯ny) inclu짯ding, among other things, AMD셲 ser짯ver gra짯phics pro짯duct inclu짯ding stra짯tegy, the timing, avai짯la짯bi짯li짯ty, fea짯tures and func짯tion짯a짯li짯ty of such future pro짯ducts, which are made pur짯su짯ant to the safe har짯bor pro짯vi짯si짯ons of the Pri짯va짯te Secu짯ri짯ties Liti짯ga짯ti짯on Reform Act. For짯ward-loo짯king state짯ments are com짯mon짯ly iden짯ti짯fied by words such as 쐗ould, 쐌ay, 쐃xpects, 쐀elie짯ves, 쐏lans, 쐇ntends, 쐏ro짯jects, and other terms with simi짯lar mea짯ning. Inves짯tors are cau짯tio짯ned that the for짯ward-loo짯king state짯ments in this pre짯sen짯ta짯ti짯on are based on cur짯rent beliefs, assump짯ti짯ons and expec짯ta짯ti짯ons, speak only as of the date of this announce짯ment and invol짯ve risks and uncer짯tain짯ties that could cau짯se actu짯al results to dif짯fer mate짯ri짯al짯ly from cur짯rent expec짯ta짯ti짯ons. Risks include the pos짯si짯bi짯li짯ty that Intel Corporation셲 pri짯cing, mar짯ke짯ting and reba짯ting pro짯grams, pro짯duct bund짯ling, stan짯dard set짯ting, new pro짯duct intro짯duc짯tions or other acti짯vi짯ties may nega짯tively impact the Company셲 plans; that the Com짯pa짯ny will requi짯re addi짯tio짯nal fun짯ding and may be unable to rai짯se suf짯fi짯ci짯ent capi짯tal on favorable terms, or at all; that cus짯to짯mers stop buy짯ing the Company셲 pro짯ducts or mate짯ri짯al짯ly redu짯ce their ope짯ra짯ti짯ons or demand for its pro짯ducts; that the Com짯pa짯ny may be unable to deve짯lop, launch and ramp new pro짯ducts and tech짯no짯lo짯gies in the volu짯mes that are requi짯red by the mar짯ket at matu짯re yields on a time짯ly basis; that the company셲 third-par짯ty foundry sup짯pli짯ers will be unable to tran짯si짯ti짯on the Company셲 pro짯ducts to advan짯ced manu짯fac짯tu짯ring pro짯cess tech짯no짯lo짯gies in a time짯ly and effec짯ti짯ve way or to manu짯fac짯tu짯re the Company셲 pro짯ducts on a time짯ly basis in suf짯fi짯ci짯ent quan짯ti짯ties and using com짯pe짯ti짯ti짯ve pro짯cess tech짯no짯lo짯gies; that the Com짯pa짯ny will be unable to obtain suf짯fi짯ci짯ent manu짯fac짯tu짯ring capa짯ci짯ty or com짯pon짯ents to meet demand for its pro짯ducts or will not ful짯ly uti짯li짯ze the Company셲 pro짯jec짯ted manu짯fac짯tu짯ring capa짯ci짯ty needs at GLOBALFOUNDRIES Inc. (GF) micro짯pro짯ces짯sor manu짯fac짯tu짯ring faci짯li짯ties; that the Company셲 requi짯re짯ments for wafers will be less than the fixed num짯ber of wafers that we agreed to purcha짯se from GF or GF encoun짯ters pro짯blems that signi짯fi짯cant짯ly redu짯ce the num짯ber of func짯tion짯al die the Com짯pa짯ny recei짯ves from each wafer; that the Com짯pa짯ny is unable to suc짯cessful짯ly imple짯ment its long-term busi짯ness stra짯tegy; that the Com짯pa짯ny inac짯cu짯ra짯te짯ly esti짯ma짯tes the quan짯ti짯ty or type of pro짯ducts that its cus짯to짯mers will want in the future or will ulti짯m짯ate짯ly end up purcha짯sing, resul짯ting in excess or obso짯le짯te inven짯to짯ry; that the Com짯pa짯ny is unable to mana짯ge the risks rela짯ted to the use of its third-par짯ty dis짯tri짯bu짯tors and add-in-board (AIB) part짯ners or offer the appro짯pria짯te incen짯ti짯ves to focus them on the sale of the Company셲 pro짯ducts; that the Com짯pa짯ny may be unable to main짯tain the level of invest짯ment in rese짯arch and deve짯lo짯p짯ment that is requi짯red to remain com짯pe짯ti짯ti짯ve; that the짯re may be unex짯pec짯ted varia짯ti짯ons in mar짯ket growth and demand for the Company셲 pro짯ducts and tech짯no짯lo짯gies in light of the pro짯duct mix that it may have available at any par짯ti짯cu짯lar time; that glo짯bal busi짯ness and eco짯no짯mic con짯di짯ti짯ons, inclu짯ding con짯su짯mer PC mar짯ket con짯di짯ti짯ons, will not impro짯ve or will wor짯sen; and the effect of poli짯ti짯cal or eco짯no짯mic insta짯bi짯li짯ty, dome짯sti짯cal짯ly or inter짯na짯tio짯nal짯ly, on our sales or sup짯p짯ly chain. Inves짯tors are urged to review in detail the risks and uncer짯tain짯ties in the Company셲 Secu짯ri짯ties and Exch짯an짯ge Com짯mis짯si짯on filings, inclu짯ding but not limi짯t짯ed to the Quar짯ter짯ly Report on Form 10멡 for the quar짯ter ended Sep짯tem짯ber 28, 2013.