AMD Brings World-Class Performance of 4th Gen AMD EPYC‚ĄĘ Processors to Embedded Networking, Security, Storage and Industrial Systems

 New ener¬≠gy-effi¬≠ci¬≠ent EPYC Embedded 9004 Series com¬≠bi¬≠nes embedded sys¬≠tem-opti¬≠mi¬≠zed fea¬≠tures, enhan¬≠ced secu¬≠ri¬≠ty and sca¬≠la¬≠bi¬≠li¬≠ty up to 96 cores ‚ÄĒ

Sie¬≠mens and Advan¬≠tech are initi¬≠al cus¬≠to¬≠mers deploy¬≠ing solu¬≠ti¬≠ons based on EPYC Embedded 9004 Series ‚ÄĒ

N√úRNBERG, Ger¬≠ma¬≠ny, March 14, 2023 (GLOBE NEWSWIRE) ‚ÄĒ Embedded World 2023 (Hall 2, Stand 2‚Äď411) ‚ÄĒ AMD (NASDAQ: AMD) today announ¬≠ced it is brin¬≠ging world-class per¬≠for¬≠mance and ener¬≠gy effi¬≠ci¬≠en¬≠cy to embedded sys¬≠tems with AMD EPYC‚ĄĘ Embedded 9004 Series pro¬≠ces¬≠sors. The new 4th gene¬≠ra¬≠ti¬≠on EPYC Embedded pro¬≠ces¬≠sors powered by ‚ÄúZen 4‚ÄĚ archi¬≠tec¬≠tu¬≠re pro¬≠vi¬≠de tech¬≠no¬≠lo¬≠gy and fea¬≠tures for embedded net¬≠wor¬≠king, security/firewall and sto¬≠rage sys¬≠tems in cloud and enter¬≠pri¬≠se com¬≠pu¬≠ting as well as indus¬≠tri¬≠al edge ser¬≠vers for the fac¬≠to¬≠ry floor.


Built on the ‚ÄúZen 4‚ÄĚ 5nm core, the pro¬≠ces¬≠sors com¬≠bi¬≠ne speed and per¬≠for¬≠mance while hel¬≠ping redu¬≠ce both over¬≠all sys¬≠tem ener¬≠gy cos¬≠ts and TCO. The series is com¬≠pri¬≠sed of 10 pro¬≠ces¬≠sor models with per¬≠for¬≠mance opti¬≠ons ran¬≠ging from 16 to 96 cores, and a ther¬≠mal design power (TDP) pro¬≠fi¬≠le ran¬≠ging from 200W to 400W. The per¬≠for¬≠mance and power sca¬≠la¬≠bi¬≠li¬≠ty affor¬≠ded with AMD EPYC Embedded 9004 Series pro¬≠ces¬≠sors make them an ide¬≠al fit for embedded sys¬≠tem OEMs expan¬≠ding their pro¬≠duct port¬≠fo¬≠li¬≠os across a ran¬≠ge of per¬≠for¬≠mance and pri¬≠cing opti¬≠ons. The AMD EPYC Embedded 9004 Series pro¬≠ces¬≠sors also include enhan¬≠ced secu¬≠ri¬≠ty fea¬≠tures to help mini¬≠mi¬≠ze thre¬≠ats and main¬≠tain a secu¬≠re com¬≠pu¬≠te envi¬≠ron¬≠ment from power-on to run time, making them well sui¬≠ted for appli¬≠ca¬≠ti¬≠ons with enter¬≠pri¬≠se-class per¬≠for¬≠mance and secu¬≠ri¬≠ty needs.


‚ÄúSup¬≠port¬≠ing enter¬≠pri¬≠se-gra¬≠de relia¬≠bi¬≠li¬≠ty, AMD EPYC Embedded 9004 Series pro¬≠ces¬≠sors are tar¬≠ge¬≠ted for hea¬≠vy workload, ‚Äėalways-on‚Äô embedded sys¬≠tems requi¬≠ring excep¬≠tio¬≠nal com¬≠pu¬≠te per¬≠for¬≠mance and I/O agi¬≠li¬≠ty in a power-opti¬≠mi¬≠zed pro¬≠fi¬≠le,‚ÄĚ said Raj¬≠nee¬≠sh Gaur, cor¬≠po¬≠ra¬≠te vice pre¬≠si¬≠dent and gene¬≠ral mana¬≠ger, Embedded Solu¬≠ti¬≠ons Group, AMD. ‚ÄúWith the launch of the EPYC Embedded 9004 Series pro¬≠ces¬≠sors, we‚Äôre brin¬≠ging the power of data cen¬≠ter-level com¬≠pu¬≠ting to embedded net¬≠wor¬≠king, secu¬≠ri¬≠ty, sto¬≠rage and indus¬≠tri¬≠al applications.‚ÄĚ


With AMD EPYC Embedded 9004 Series pro­ces­sors, cus­to­mers can crea­te a varie­ty of embedded net­wor­king, secu­ri­ty, sto­rage and indus­tri­al sys­tems that ope­ra­te in the most deman­ding con­di­ti­ons. AMD EPYC Embedded 9004 offers the world-class per­for­mance and effi­ci­en­cy, enhan­ced data secu­ri­ty fea­tures and unmat­ched core sca­la­bi­li­ty of the EPYC 9004 Series ser­ver pro­ces­sor, while pro­vi­ding uni­que, embedded-spe­ci­fic bene­fits to help impro­ve relia­bi­li­ty and sys­tem lon­ge­vi­ty including:


Non-Trans¬≠pa¬≠rent Bridging (NTB): Helps enhan¬≠ce sys¬≠tem relia¬≠bi¬≠li¬≠ty by enab¬≠ling data exch¬≠an¬≠ge bet¬≠ween two red¬≠un¬≠dant CPUs.

Non-Vola¬≠ti¬≠le Dual In-Line Memo¬≠ry Modu¬≠le (NVDIMM1): NVDIMM is a hybrid memo¬≠ry con¬≠sis¬≠ting of vola¬≠ti¬≠le DRAMs and non-vola¬≠ti¬≠le Flash memo¬≠ry that helps retain data after a sys¬≠tem power fail¬≠ure or reset by saving DRAM con¬≠tents to Flash.

Dual Seri¬≠al Peri¬≠phe¬≠ral Inter¬≠face (SPI): Enables two off-chip ROMs to be sup¬≠port¬≠ed for secu¬≠re boot.

Avai¬≠la¬≠bi¬≠li¬≠ty: Up to 7‚ÄĎyear plan¬≠ned avai¬≠la¬≠bi¬≠li¬≠ty to address embedded requi¬≠re¬≠ments for long life and support.

Cus­to­mer Traction


Sie­mens and Advan­tech are among the lead OEM and ODM cus­to­mers deploy­ing the AMD EPYC Embedded 9004 Series. The pro­ces­sors will also be deploy­ed by cus­to­mers in net­wor­king for next-gen fire­walls and soft­ware-defi­ned rou­ters, as well as enter­pri­se and cloud sto­rage systems.


Sie­mens’ new SIMATIC IPC RS-828A ser­ver is powered by the EPYC Embedded 9004 Series pro­ces­sors. The sys­tem is desi­gned for hyper-con­ver­gent infra­struc­tures ser­ving a wide ran­ge of appli­ca­ti­ons, inclu­ding auto­mo­ti­ve manu­fac­tu­ring, 5G base sta­ti­ons and IoT public clouds. The ser­ver can also be useful for appli­ca­ti­ons invol­ving AI or hea­vy com­pu­ta­ti­on, such as visu­al track­ing in a retail environment.


‚ÄúSie¬≠mens sel¬≠ec¬≠ted the AMD EPYC Embedded 9004 Series devices for our new high-per¬≠for¬≠mance, data cen¬≠ter-class ser¬≠ver becau¬≠se the pro¬≠ces¬≠sors relia¬≠bly deli¬≠ver per¬≠for¬≠mance and power effi¬≠ci¬≠en¬≠cy while being able to ope¬≠ra¬≠te seam¬≠less¬≠ly in extre¬≠me tem¬≠pe¬≠ra¬≠tures, as well as in set¬≠tings with vibra¬≠ti¬≠on or elec¬≠tro¬≠ma¬≠gne¬≠tic inter¬≠fe¬≠rence,‚ÄĚ said Thi¬≠bau¬≠lt de Assi, head of busi¬≠ness line indus¬≠tri¬≠al com¬≠pu¬≠ting, Sie¬≠mens. ‚ÄúWith AMD lea¬≠der¬≠ship in the data cen¬≠ter, we have been able to levera¬≠ge its excep¬≠tio¬≠nal exper¬≠ti¬≠se for our indus¬≠tri¬≠al-gra¬≠de pro¬≠ducts, whe¬≠re per¬≠for¬≠mance and effi¬≠ci¬≠en¬≠cy are para¬≠mount. The new pro¬≠ces¬≠sors will open new oppor¬≠tu¬≠ni¬≠ties for the indus¬≠tri¬≠al market.‚ÄĚ


Advantech‚Äôs new ASMB-831 ser¬≠ver board, with HPC-7420 4U Rack¬≠mount, fea¬≠tures five PCIe¬ģ Gen5 x16 and two PCIe Gen5 x8 slots for four dou¬≠ble-deck cards with DDR5 4800 MHz RDIMM and up to 384GB (6 DIMMS). The ASMB-831 ser¬≠ver board is desi¬≠gned to enable image ana¬≠ly¬≠sis in various use cases, inclu¬≠ding indus¬≠tri¬≠al machi¬≠ne visi¬≠on, AOI and facial reco¬≠gni¬≠ti¬≠on for smart city appli¬≠ca¬≠ti¬≠ons, and secu¬≠ri¬≠ty surveillance.


AMD EPYC Embedded 9004 Series Pro­ces­sor Overview


OPN Model Cores Nomi¬≠nal TDP (W) cTDP (W) Base 




(GHz) Max Freq



100‚Äď000000921 9654 96 360 320‚Äď400 2.4 3.7

100‚Äď000000912 9554 64 360 320‚Äď400 3.1 3.75

100‚Äď000000913 9454 48 290 240‚Äď300 2.75 3.8

100‚Äď000000914 9354 32 280 240‚Äď300 3.25 3.8

100‚Äď000000915 9254 24 200 200‚Äď240 2.9 4.15

100‚Äď000000916 9124 16 200 200‚Äď240 3.0 3.7

100‚Äď000000917 9654P 96 360 320‚Äď400 2.4 3.7

100‚Äď000000918 9554P 64 360 320‚Äď400 3.1 3.75

100‚Äď000000919 9454P 48 290 240‚Äď300 2.75 3.8

100‚Äď000000920 9354P 32 280 240‚Äď300 3.25 3.8

AMD at Embedded World 2023

At Embedded World 2023, AMD will be show¬≠ca¬≠sing its latest hard¬≠ware and soft¬≠ware inno¬≠va¬≠tions for embedded appli¬≠ca¬≠ti¬≠ons and mar¬≠kets in Hall 2, Stand 2‚Äď411. Pro¬≠duct and solu¬≠ti¬≠on demons¬≠tra¬≠ti¬≠ons will fea¬≠ture the new AMD EPYC Embedded 9004 Series pro¬≠ces¬≠sors, Ryzen‚ĄĘ Embedded devices, Kria‚ĄĘ SOMs and Zynq‚ĄĘ and Ver¬≠sal‚ĄĘ adap¬≠ti¬≠ve SoCs powe¬≠ring indus¬≠tri¬≠al, visi¬≠on, auto¬≠mo¬≠ti¬≠ve and health¬≠ca¬≠re-based appli¬≠ca¬≠ti¬≠ons. Learn More


EPYC Embedded 9004 Availability

The AMD EPYC Embedded 9004 Series pro­ces­sors are sam­pling now with pro­duc­tion ship­ments expec­ted in April 2023. To acce­le­ra­te deve­lo­p­ment, eva­lua­ti­on kits fea­turing a refe­rence board, com­pre­hen­si­ve docu­men­ta­ti­on and deve­lo­p­ment tool kits are available now to qua­li­fied customers.


Sup¬≠port¬≠ing Resources 


Learn more about EPYC Embedded 9004 Series processors

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Con­nect with AMD on LinkedIn

About AMD 

For more than 50 years AMD has dri¬≠ven inno¬≠va¬≠ti¬≠on in high-per¬≠for¬≠mance com¬≠pu¬≠ting, gra¬≠phics and visua¬≠liza¬≠ti¬≠on tech¬≠no¬≠lo¬≠gies. Bil¬≠li¬≠ons of peo¬≠p¬≠le, lea¬≠ding For¬≠tu¬≠ne 500 busi¬≠nesses and cut¬≠ting-edge sci¬≠en¬≠ti¬≠fic rese¬≠arch insti¬≠tu¬≠ti¬≠ons around the world rely on AMD tech¬≠no¬≠lo¬≠gy dai¬≠ly to impro¬≠ve how they live, work and play. AMD employees are focu¬≠sed on buil¬≠ding lea¬≠der¬≠ship high-per¬≠for¬≠mance and adap¬≠ti¬≠ve pro¬≠ducts that push the boun¬≠da¬≠ries of what is pos¬≠si¬≠ble. For more infor¬≠ma¬≠ti¬≠on about how AMD is enab¬≠ling today and inspi¬≠ring tomor¬≠row, visit the AMD (NASDAQ: AMD) web¬≠site, blog, Lin¬≠ke¬≠dIn and Twit¬≠ter pages.


AMD, the AMD Arrow logo, EPYC, Kria, Ryzen, Ver­sal, Xilinx and com­bi­na­ti­ons the­reof are trade­marks of Advan­ced Micro Devices, Inc. Other names are for infor­ma­tio­nal pur­po­ses only and may be trade­marks of their respec­ti­ve owners


NVDIMM fea­ture avai­la­bi­li­ty depen­dent on eco­sys­tem support