AMD Embeds Intelligent, Interactive and Immersive Experiences With 2nd Generation AMD Embedded R‑Series APUs and CPUs

New “Bald Eagle” Plat­form Deli­vers Unmat­ched Com­pu­te and Gra­phics Per­for­mance Tar­ge­ting Gam­ing Machi­nes, Medi­cal Ima­ging, Digi­tal Signage and Other Embedded Applications

MACAO, CHINA — (Mar­ket­wired) — 05/20/14 — G2E

AMD (NYSE: AMD) today announ­ced the 2nd gene­ra­ti­on AMD Embedded R‑series acce­le­ra­ted pro­ces­sing unit (APU) and CPU fami­ly (pre­vious­ly code­na­med “Bald Eagle”) for embedded appli­ca­ti­ons. The new solu­ti­ons are tar­ge­ted at gam­ing machi­nes, medi­cal ima­ging, digi­tal signage, indus­tri­al con­trol and auto­ma­ti­on (IC&A), com­mu­ni­ca­ti­ons and net­wor­king infra­struc­tu­re that requi­re indus­try-lea­ding com­pu­te and gra­phics pro­ces­sing technology.

When it comes to com­pu­te per­for­mance, gra­phics per­for­mance and per­for­mance-per-watt, the 2nd gene­ra­ti­on AMD Embedded R‑series fami­ly is uni­que in the embedded mar­ket,” said Scott Aylor, cor­po­ra­te vice pre­si­dent and gene­ral mana­ger, AMD Embedded Solu­ti­ons. “The addi­ti­on of HSA, GCN and power manage­ment fea­tures enables our cus­to­mers to crea­te a new world of intel­li­gent, inter­ac­ti­ve and immersi­ve embedded devices.”

The 2nd gene­ra­ti­on AMD R‑series APU and CPU solu­ti­ons are desi­gned for mid- to high-end visu­al and par­al­lel com­pu­te-inten­si­ve embedded appli­ca­ti­ons with sup­port for Linux, RTOS and Win­dows ope­ra­ting sys­tems. The new solu­ti­ons ran­ge from 2.2–3.6 GHz CPU fre­quen­cy with max boost, based on AMD’s latest CPU archi­tec­tu­re (code­na­med: “Steam­rol­ler”) and 533–686 MHz GPU fre­quen­cy based on AMD’s latest Gra­phics Core Next (GCN) archi­tec­tu­re, desi­gned to advan­ce the visu­al growth and par­al­lel pro­ces­sing capa­bi­li­ties of embedded applications.

Indus­try-First Fea­tures, Bene­fits and Support

  • Hete­ro­ge­neous Sys­tem Archi­tec­tu­re (HSA): The 2nd gene­ra­ti­on AMD Embedded R‑series APU is the first embedded pro­ces­sor to incor­po­ra­te HSA fea­tures, enab­ling appli­ca­ti­ons to dis­tri­bu­te workloads to run on the best com­pu­te ele­ment — e.g., CPU, GPU or a spe­cia­li­zed acce­le­ra­tor such as video decode — for up to 44 per­cent more 3‑D gra­phics per­for­mance1 and up to 46 per­cent more com­pu­te per­for­mance than com­pa­ra­ble Intel Has­well Core‑i CPUs2.
  • Open-source Linux deve­lo­p­ment: As a gold-level mem­ber of the Yoc­to Pro­ject™, a Linux Foun­da­ti­on Col­la­bo­ra­ti­on Pro­ject, and as part of a recent mul­ti­year agree­ment with Men­tor Gra­phics, embedded sys­tems deve­lo­pers now have access to cus­to­mi­zed embedded Linux deve­lo­p­ment and com­mer­cial sup­port on the 2nd gene­ra­ti­on AMD Embedded R‑series fami­ly through Men­tor Embedded Linux and Sourcery™ Code­Bench, as well as Men­tor Embedded Linux Lite available at no cost.
  • Embedded-spe­ci­fic fea­tures: The 2nd gene­ra­ti­on AMD Embedded R‑series fami­ly is spe­ci­fi­cal­ly desi­gned for embedded appli­ca­ti­ons with indus­try-lea­ding, 10-year lon­ge­vi­ty3, dual-chan­nel memo­ry with error-cor­rec­ting code (ECC), DDR3-2133 sup­port and con­fi­gura­ble TDP for sys­tem design fle­xi­bi­li­ty to opti­mi­ze the pro­ces­sor at a lower TDP.

Tar­get Markets
Visu­al Embedded: For embedded appli­ca­ti­ons like gam­ing machi­nes and digi­tal signage that pro­vi­de immersi­ve and inter­ac­ti­ve visu­al expe­ri­en­ces, AMD cus­to­mers can achie­ve up to 64 per­cent more 3‑D gra­phics per­for­mance than a stan­da­lo­ne 2nd gene­ra­ti­on AMD Embedded R‑series APU4, and grea­ter fle­xi­bi­li­ty and sca­la­bi­li­ty with sup­port for up to nine inde­pen­dent dis­plays and 4K reso­lu­ti­on with the com­bi­na­ti­on of the new­ly laun­ched AMD Embedded Rade­on™ E8860 dis­crete GPU.

Medi­cal Ima­ging: The 2nd gene­ra­ti­on AMD R‑series APU is also ide­al for cli­ni­cal and field medi­cal ima­ging appli­ca­ti­ons across por­ta­ble, 3‑D and 4‑D ultra­sound, low-dose X‑ray, and ima­ging-assis­ted sur­gi­cal sys­tems. The new AMD Embedded R‑series APUs deli­ver high image trans­for­ma­ti­on per­for­mance and low laten­ci­es in a low-power and high­ly inte­gra­ted solu­ti­on for medi­cal ima­ging device ven­dors loo­king to help redu­ce size, weight, com­ple­xi­ty and sys­tem cost. The com­bi­na­ti­on of high com­pu­te per­for­mance and low memo­ry access laten­cy affor­ded by hUMA, as well as high gra­phics per­for­mance in the 2nd gene­ra­ti­on AMD Embedded R‑series plat­form acce­le­ra­te image trans­for­ma­ti­on and deli­ver excel­lent image ren­de­ring to enable next-gene­ra­ti­on ultra­sound appli­ca­ti­ons to help dia­gno­se and tre­at patients.

Com­mu­ni­ca­ti­ons and Net­wor­king Infra­struc­tu­re: For non-visu­al appli­ca­ti­ons, the advan­ced par­al­lel-com­pu­te gra­phics engi­ne in the 2nd gene­ra­ti­on AMD Embedded R‑series APU pro­vi­des a high­ly uni­que hete­ro­ge­neous com­pu­te plat­form for con­trol pla­ne swit­ching and rou­ting appli­ca­ti­ons. With up to 66 per­cent more com­pu­te per­for­mance than the pre­vious gene­ra­ti­on AMD Embedded R‑series APU,5 the high-per­for­mance GPU enables acce­le­ra­ti­on of par­al­le­lizable func­tions such as deep packet inspec­tion, encryp­ti­on or decryp­ti­on, search, and com­pres­si­on or decom­pres­si­on allo­wing more CPU head­room for cus­to­mers to help increase fea­ture velocity.

Sup­port­ing Resour­ces

  • Learn more about the 2nd gene­ra­ti­on AMD Embedded R‑series pro­duct family
  • Blog: Rad­ga­mes opti­mi­ze Bink 2.0 for AMD R‑series APU
  • Beco­me a fan of AMD on Facebook
  • Fol­low @AMDEmbedded on Twitter
  • Join AMD on Goog­le Plus

About AMD
AMD (NYSE: AMD) designs and inte­gra­tes tech­no­lo­gy that powers mil­li­ons of intel­li­gent devices, inclu­ding per­so­nal com­pu­ters, tablets, game con­so­les and cloud ser­vers that defi­ne the new era of sur­round com­pu­ting. AMD solu­ti­ons enable peo­p­le ever­y­whe­re to rea­li­ze the full poten­ti­al of their favo­ri­te devices and appli­ca­ti­ons to push the boun­da­ries of what is pos­si­ble. For more infor­ma­ti­on, visit www.amd.com.

1. The AMD RX-427BB scored 2051 and Intel Has­well Core i7-4765T scored 1424, when run­ning 3DMark® 11P bench­mark. RX-427BB’s TDP is 35W and Core i7-4765T’s TDP is 35W. The per­for­mance del­ta of 44% was cal­cu­la­ted based on RX-427BB’s per­for­mance score of 2051 and Core i7-4765T’s per­for­mance score of 1424. The AMD RX-427BB used an AMD Bal­li­na mother­board with 8GB DDR3 SO-DIMM memo­ry and 256GB San­Disk HDD. The Core i7-4765T used a Leno­vo Think­Cent­re M93p with 8GB DDR3 memo­ry and 128GB Cru­cial M4 HDD. Both sys­tems ran Win­dows® 7 Ulti­ma­te. EMB-93
2. The AMD RX-427BB scored 76 and Intel Has­well Core i7-4765T scored 52, when run­ning Base­mark­CL 1.0 bench­mark. RX-427BB’s TDP is 35W and Core i7-4765T’s TDP is 35W. The per­for­mance del­ta of 46% was cal­cu­la­ted based on RX-427BB’s per­for­mance score of 76 and Core i7-4765T’s per­for­mance score of 52. The AMD RX-427BB used an AMD Bal­li­na mother­board with 8GB DDR3 SO-DIMM memo­ry and 256GB San­Disk HDD. The Core i7-4765T used a Leno­vo Think­Cent­re M93p with 8GB DDR3 memo­ry and 128GB Cru­cial M4 HDD. Both sys­tems ran Win­dows® 7 Ulti­ma­te. EMB-94
3. Part avai­la­bi­li­ty is plan­ned for 10 years from date of announce­ment, sub­ject to chan­ge wit­hout noti­ce. Fur­ther sup­port available under contract 
4. The AMD RX-427BB scored 2,051, and the AMD Rade­on™ E8860 pai­red with RX-427BB at dual-gra­phics mode scored 3,359 when run­ning 3DMark®11P bench­mark. The AMD Bald Eagle RX-427BB used an AMD Bal­li­na mother­board with 8GB DDR3 SO-DIMM memo­ry and 256GB San­Disk HDD. The AMD Rade­on E8860 used an AMD DB-FS1r2 mother­board with 8GB DDR3 memo­ry, 64GB Cru­cial M4 HDD, and RX-427BB. The sys­tem ran Win­dows® 7 Ulti­ma­te. EMB-97 
5. The AMD Bald Eagle RX-427BB scored 76 and AMD R‑Series 464L scored 46, when run­ning Base­mark­CL 1.0 bench­mark. The per­for­mance del­ta of 66% was cal­cu­la­ted based on RX-427BB’s per­for­mance score of 76 and R‑464L’s per­for­mance score of 46. The AMD Bald Eagle RX-427BB used an AMD Bal­li­na mother­board with 8GB DDR3 SO-DIMM memo­ry and 256GB San­Disk HDD. The R‑464L used an AMD DB-FS1r2 deve­lo­p­ment board with 8GB DDR3 memo­ry and 160GB Hita­chi HDD. Both sys­tems ran Win­dows® 7 Ulti­ma­te. EMB-95

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Men­tor Gra­phics, Men­tor, and Nucleus are trade­marks of Men­tor Gra­phics Cor­po­ra­ti­on and Sourcery is a trade­mark of Men­tor Gra­phics Cor­po­ra­ti­on. All other com­pa­ny or pro­duct names are the regis­tered trade­marks of their respec­ti­ve owners.