—     The AMD Embedded R‑Series SoC (“Hier­ofal­con”), sam­pling to cus­to­mers, trans­forms tele­com­mu­ni­ca­ti­ons infra­struc­tu­re with soft­ware part­ners —

 

SANTA CLARA, Calif.  — ARM® Tech­Con — Oct. 01, 2014 —AMD (NYSE: AMD) today demons­tra­ted the first net­work func­tion vir­tua­liza­ti­on (NFV) solu­ti­on on AMD’s 64-bit ARM-based SoC and announ­ced that it is now sam­pling to AMD’s embedded cus­to­mers. The NFV demons­tra­ti­on is powered by a 64-bit ARM-based AMD Embedded R‑Series SoC, code­na­med “Hier­ofal­con,” sup­port­ed with tech­no­lo­gy from two key eco­sys­tem part­ners – Ari­cent for the net­wor­king soft­ware stack and Men­tor Gra­phics for embedded Linux® and tools. NFV is an inno­va­ti­ve solu­ti­on that sim­pli­fies deploy­ment and manage­ment for net­work and tele­com­mu­ni­ca­ti­ons ser­vice pro­vi­ders with a ful­ly vir­tua­li­zed com­mu­ni­ca­ti­ons infra­struc­tu­re that helps maxi­mi­ze per­for­mance, while working to redu­ce costs.

At ARM Tech­Con, AMD spe­ci­fi­cal­ly show­ca­sed the capa­bi­li­ties of an ARM-based NFV solu­ti­on, vir­tua­li­zing the func­tion­a­li­ty of a packet data net­work gate­way, ser­ving gate­way, and a mobi­li­ty manage­ment enti­ty. In addi­ti­on to vir­tua­li­zing hard­ware com­pon­ents, AMD show­ca­sed a live traf­fic migra­ti­on bet­ween the ARM-based AMD Embedded R‑Series SoC and the x86-based second gene­ra­ti­on AMD R‑Series APU. AMD’s ARM-based NFV solu­ti­on will be espe­ci­al­ly valuable for tele­com­mu­ni­ca­ti­ons net­work infra­struc­tu­re pro­vi­ders inte­res­ted in a fle­xi­ble soft­ware-defi­ned net­wor­king (SDN) imple­men­ta­ti­on to mana­ge net­wor­king ser­vices with con­fi­gura­ble hard­ware to help redu­ce com­ple­xi­ty and cost. NFV is the abs­trac­tion of num­e­rous net­work devices such as rou­ters and gate­ways, to enable relo­ca­ti­on of net­work func­tions from dedi­ca­ted hard­ware appli­ances to gene­ric ser­vers. With NFV, much of the intel­li­gence curr­ent­ly built into pro­prie­ta­ry, spe­cia­li­zed hard­ware is accom­plished with soft­ware run­ning on gene­ral pur­po­se hard­ware. The resul­ting solu­ti­on is a ful­ly vir­tua­li­zed com­mu­ni­ca­ti­ons infra­struc­tu­re – inclu­ding vir­tu­al ser­vers, sto­rage and net­works – that sim­pli­fies deploy­ment and manage­ment for net­work and tele­com­mu­ni­ca­ti­ons ser­vice pro­vi­ders. AMD is paving the way for both new and estab­lished ser­vice pro­vi­ders to design and deploy eit­her x86 or ARM-based NFV infra­struc­tu­re which meets their per­for­mance, cost and com­ple­xi­ty requirements.

“NFV and SDN will revo­lu­tio­ni­ze the next gene­ra­ti­on of net­works. Tog­e­ther, they add fle­xi­bi­li­ty, sca­la­bi­li­ty, intel­li­gence and reu­se to almost every aspect of the net­work,” said Adri­an Neal, Tech­no­lo­gy Lea­der, Voda­fone Group Ser­vices Ltd. “By lever­aging ARM and x86 archi­tec­tures and NFV, AMD is moving bey­ond just enab­ling enter­pri­se and data cen­ter solu­ti­ons, to the com­mu­ni­ca­ti­ons back­bone whe­re ser­vice pro­vi­ders need cost reduc­tion  and increased bandwidth.”

“From the net­works to the data cen­ter, the tele­com­mu­ni­ca­ti­ons land­scape is rapidly chan­ging as an explo­si­on of devices and new methods of com­mu­ni­ca­ti­on span­ning vide­os, images and data dri­ve the need for more effi­ci­ent net­wor­king infra­struc­tu­re,” said Scott Aylor, cor­po­ra­te vice pre­si­dent and gene­ral mana­ger, AMD Embedded Solu­ti­ons. “Demons­tra­ted by our first NFV demo on a 64-bit ARM-based SoC, AMD is moving for­ward with new ARM and x86 solu­ti­ons that offer OEMS and tele­com­mu­ni­ca­ti­ons pro­vi­ders with inno­va­ti­ve ways to more cost-effec­tively design, deploy and mana­ge net­wor­king services.”

“In col­la­bo­ra­ti­on with AMD and Ari­cent, we are enab­ling a fle­xi­ble, effi­ci­ent, open approach to addres­sing the needs of tele­com­mu­ni­ca­ti­ons sub­scri­bers and mee­ting per­for­mance requi­re­ments for rapidly-evol­ving infra­struc­tu­re for deploy­ment by tele­com­mu­ni­ca­ti­ons ope­ra­tors,” said Char­le­ne Mari­ni, vice pre­si­dent of mar­ke­ting, embedded seg­ment, ARM. “The NFV solu­ti­on on AMD’s 64-bit ARM-based ‘Hier­ofal­con’ SoC deli­vers effi­ci­ent plat­forms to accom­mo­da­te the gro­wing demands of sub­scri­bers and ope­ra­tors alike.”

 

About the AMD NFV Demonstration

AMD show­ca­sed their first 64-bit ARM-based pro­ces­sor run­ning vir­tua­li­zed Wire­less Evol­ved Packet Core (vEPC) appli­ca­ti­ons. Through a spe­cial tech­no­lo­gy col­la­bo­ra­ti­on with eco­sys­tem part­ners ARM, Ari­cent, and Men­tor Gra­phics, AMD demons­tra­ted an embedded Linux®-based vir­tu­al NFV solu­ti­on that show­ed a mobi­le packet core net­work run­ning sub­scri­ber calls from simu­la­ted Evol­ved Node B (eNodeB) user equip­ment such as a cell pho­ne or tablet with Ser­ving Gate­way (SGW), Packet Data Net­work Gate­way (PGW), and Mobi­li­ty Manage­ment Enti­ty (MME) con­trol and data pla­ne func­tions hos­ted on the AMD Embedded R‑Series plat­form. The demo also included a pro­to­ty­pe ver­si­on of the Men­tor Embedded Linux deve­lo­p­ment plat­form and Sourcery Code­Bench tools. As part of this solu­ti­on, AMD has also enab­led the industry’s first Open­Da­ta­Pla­ne (ODP) demons­tra­ti­on with Evol­ved Packet Core appli­ca­ti­ons on a 64-bit ARM pro­ces­sor in addi­ti­on to Data Pla­ne Deve­lo­p­ment Kit (DPDK) on the AMD x86 pro­ces­sor and Open­Stack to crea­te the basis for an AMD NFV refe­rence solu­ti­on. The AMD NFV refe­rence solu­ti­on is per­for­mance opti­mi­zed and can be uti­li­zed for ser­vice pro­vi­der pro­duc­tion deployments.

For a live demons­tra­ti­on, visit booth 613 at ARM Tech­Con from Oct. 1 – 3, 2014.

 

About the AMD Embedded R‑Series SoC (Code­na­med: “Hier­ofal­con”)

The AMD Embedded R‑Series SoC is the first 64-bit ARM Cortex™-A57-based plat­form from AMD tar­ge­ting embedded data cen­ter appli­ca­ti­ons, com­mu­ni­ca­ti­ons infra­struc­tu­re and indus­tri­al solu­ti­ons. It includes up to eight ARM Cor­tex-A57 CPUs and pro­vi­des high-per­for­mance memo­ry with two 64-bit DDR3/4 chan­nels with error cor­rec­tion code (ECC) for high relia­bi­li­ty appli­ca­ti­ons. The inte­gra­ted SoC includes 10Gb KR Ether­net and PCI-Express® Gen 3 for high-speed net­work con­nec­ti­vi­ty, making it ide­al for con­trol pla­ne appli­ca­ti­ons. The AMD Embedded R‑Series SoC also pro­vi­des enhan­ced secu­ri­ty capa­bi­li­ty with sup­port for ARM Trust­Zo­ne® tech­no­lo­gy and a dedi­ca­ted cryp­to­gra­phic secu­ri­ty co-pro­ces­sor, alig­ning to the increased need for secu­re, net­work­ed sys­tems. The AMD Embedded R‑Series SoC is expec­ted to ship in the first half of 2015.

 

Sup­port­ing Resources 

• Learn moreabout AMD Embedded Solu­ti­ons for com­mu­ni­ca­ti­ons infrastructure
• Join AMD on Goog­le Plus
• Fol­low @AMDEmbedded on Twitter
• Beco­me a fan of AMD onFacebook

 

About AMD

AMD (NYSE: AMD) designs and inte­gra­tes tech­no­lo­gy that powers mil­li­ons of intel­li­gent devices, inclu­ding per­so­nal com­pu­ters, tablets, game con­so­les and cloud ser­vers that defi­ne the new era of sur­round com­pu­ting. AMD solu­ti­ons enable peo­p­le ever­y­whe­re to rea­li­ze the full poten­ti­al of their favo­ri­te devices and appli­ca­ti­ons to push the boun­da­ries of what is pos­si­ble. For more infor­ma­ti­on, visit www.amd.com.

 

AMD, the AMD Arrow logo and com­bi­na­ti­ons the­reof are trade­marks of Advan­ced Micro Devices, Inc. PCI Express is a regis­tered trade­mark of PCI-SIG Cor­po­ra­ti­on. Other names are for infor­ma­tio­nal pur­po­ses only and may be trade­marks of their respec­ti­ve owners.

Cau­tio­na­ry Statement 
This press release con­ta­ins for­ward-loo­king state­ments con­cer­ning AMD, inclu­ding the timing and fea­tures of AMD’s future pro­ducts, which are made pur­su­ant to the safe har­bor pro­vi­si­ons of the Pri­va­te Secu­ri­ties Liti­ga­ti­on Reform Act of 1995. For­ward-loo­king state­ments are com­mon­ly iden­ti­fied by words such as “belie­ves, “expects,” “may,” “will,” “should,” “seeks,” “intends,” “pro for­ma,” “esti­ma­tes,” “anti­ci­pa­tes,” “plans,” “pro­jects,” “would” and other terms with simi­lar mea­ning. Inves­tors are cau­tio­ned that the for­ward-loo­king state­ments in this release are based on cur­rent beliefs, assump­ti­ons and expec­ta­ti­ons, speak only as of the date of this release and invol­ve risks and uncer­tain­ties that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons. Risks include the pos­si­bi­li­ty that Intel Corporation’s pri­cing, mar­ke­ting and reba­ting pro­grams, pro­duct bund­ling, stan­dard set­ting, new pro­duct intro­duc­tions or other acti­vi­ties may nega­tively impact AMD’s plans; that AMD will requi­re addi­tio­nal fun­ding and may be unable to rai­se suf­fi­ci­ent capi­tal on favorable terms, or at all; that cus­to­mers stop buy­ing AMD’s pro­ducts or mate­ri­al­ly redu­ce their ope­ra­ti­ons or demand for AMD’s pro­ducts; that AMD may be unable to deve­lop, launch and ramp new pro­ducts and tech­no­lo­gies in the volu­mes that are requi­red by the mar­ket at matu­re yields on a time­ly basis; that AMD’s third-par­ty foundry sup­pli­ers will be unable to tran­si­ti­on its pro­ducts to advan­ced manu­fac­tu­ring pro­cess tech­no­lo­gies in a time­ly and effec­ti­ve way or to manu­fac­tu­re its pro­ducts on a time­ly basis in suf­fi­ci­ent quan­ti­ties and using com­pe­ti­ti­ve pro­cess tech­no­lo­gies; that AMD will be unable to obtain suf­fi­ci­ent manu­fac­tu­ring capa­ci­ty or com­pon­ents to meet demand for its pro­ducts or will not ful­ly uti­li­ze our pro­jec­ted manu­fac­tu­ring capa­ci­ty needs at GF’s micro­pro­ces­sor manu­fac­tu­ring faci­li­ties; that AMD’s requi­re­ments for wafers will be less than the fixed num­ber of wafers that it agreed to purcha­se from GLOBALFOUNDRIES INC. (GF) or GF encoun­ters pro­blems that signi­fi­cant­ly redu­ce the num­ber of func­tion­al die AMD recei­ves from each wafer; that AMD is unable to suc­cessful­ly imple­ment its long-term busi­ness stra­tegy; that AMD inac­cu­ra­te­ly esti­ma­tes the quan­ti­ty or type of pro­ducts that its cus­to­mers will want in the future or will ulti­m­ate­ly end up purcha­sing, resul­ting in excess or obso­le­te inven­to­ry; that AMD is unable to mana­ge the risks rela­ted to the use of its third-par­ty dis­tri­bu­tors and add-in-board (AIB) part­ners or offer the appro­pria­te incen­ti­ves to focus them on the sale of its pro­ducts; that AMD may be unable to main­tain the level of invest­ment in rese­arch and deve­lo­p­ment that is requi­red to remain com­pe­ti­ti­ve; that the­re may be unex­pec­ted varia­ti­ons in mar­ket growth and demand for AMD’s pro­ducts and tech­no­lo­gies in light of the pro­duct mix that it may have available at any par­ti­cu­lar time; that glo­bal busi­ness and eco­no­mic con­di­ti­ons will not impro­ve or will wor­sen; that PC mar­ket con­di­ti­ons do not impro­ve or will wor­sen; that demand for com­pu­ters will be lower than curr­ent­ly expec­ted; and the effect of poli­ti­cal or eco­no­mic insta­bi­li­ty, dome­sti­cal­ly or inter­na­tio­nal­ly, on AMD’s sales or sup­p­ly chain. Inves­tors are urged to review in detail the risks and uncer­tain­ties in AMD’s Secu­ri­ties and Exch­an­ge Com­mis­si­on filings, inclu­ding but not limi­t­ed to the Quar­ter­ly Report on Form 10‑Q for the quar­ter ended June 28, 2014.

 

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