AMD Details Embedded Product Roadmap

AMD extends ambi짯dex짯trous stra짯tegy to embedded cus짯to짯mers beco짯ming the first to offer choice of ARM or x86 SoC, APU or CPU opti짯ons cou짯pled with indus짯try-lea짯ding AMD Rade짯on graphics


SUNNYVALE, Calif. 9/9/2013 

AMD (NYSE: AMD) today dis짯c짯lo짯sed its road짯map for the fast-gro짯wing embedded com짯pu짯ting mar짯ket, as it beco짯mes the first com짯pa짯ny to offer both ARM and x86 pro짯ces짯sor solu짯ti짯ons for low-power and high-per짯for짯mance embedded com짯pu짯te designs. The new lin짯e짯up includes two best-in-class x86 acce짯le짯ra짯ted pro짯ces짯sing units (APUs) and cen짯tral pro짯ces짯sing units (CPUs), a first look at a high-per짯for짯mance ARM sys짯tem-on-chip (SoC) and a new fami짯ly of dis짯crete AMD Embedded Rade짯on꽓 gra짯phics pro짯ces짯sing units (GPUs) expec짯ted to launch in 2014. The짯se addi짯ti짯ons pro짯vi짯de the embedded industry셲 engi짯nee짯ring com짯mu짯ni짯ty with more choices to match their exact design needs, and are desi짯gned to offer impro짯ve짯ments in per짯for짯mance-per-watt and per짯for짯mance-per-dol짯lar. Tog짯e짯ther with the recent launch of the award-win짯ning AMD Embedded G멣eries SoC fami짯ly that set a supe짯ri짯or  bar for per짯for짯mance-per-watt low-power mul짯ti짯co짯re APUs, the짯se latest addi짯ti짯ons to the embedded pro짯duct road짯map fur짯ther signi짯fy a stra짯te짯gic push by AMD to focus on the high-growth embedded market.

The embedded sys짯tems mar짯ket is vast and forms the under짯pin짯ning for the Sur짯round Com짯pu짯ting era. This mar짯ket is com짯pri짯sed of dif짯fe짯rent seg짯ments of which intel짯li짯gent embedded devices tho짯se enab짯led with high-per짯for짯mance micro짯pro짯ces짯sors, IP con짯nec짯ti짯vi짯ty, and high-level ope짯ra짯ting sys짯tems are quick짯ly beco짯ming the most signi짯fi짯cant. A recent VDC Rese짯arch report indi짯ca짯tes the mar짯ket for CPUs in tra짯di짯tio짯nal and intel짯li짯gent embedded sys짯tems will grow 36 per짯cent from rough짯ly 330 mil짯li짯on units in 2013 to more than 450 mil짯li짯on units by 2016 with x86 and ARM archi짯tec짯tures accoun짯ting for 82 per짯cent of the total addressa짯ble mar짯ket (TAM)1.

AMD is com짯mit짯ted to pro짯vi짯ding the embedded com짯mu짯ni짯ty with the solu짯ti짯ons requi짯red to suc짯ceed in today셲 trans짯for짯ma짯ti짯ve mar짯ket as it con짯ti짯nues to expand at an unpre짯ce짯den짯ted rate, said Arun Iyen짯gar, vice pre짯si짯dent and gene짯ral mana짯ger, AMD Embedded Solu짯ti짯ons. 쏷he짯re are dif짯fe짯rent cus짯to짯mer needs in dif짯fe짯rent seg짯ments of this mar짯ket from low-power to high-per짯for짯mance, Linux to Win짯dows, x86 to ARM and now with our upco짯ming pro짯duct port짯fo짯lio, we are addres짯sing them by pro짯vi짯ding embedded design engi짯neers with a ran짯ge of solu짯ti짯ons backed by our embedded lon짯ge짯vi짯ty pro짯gram for sup짯p짯ly sta짯bi짯li짯ty assu짯rance to fit their every need.

The unpre짯ce짯den짯ted rise of intel짯li짯gent con짯nec짯ted solu짯ti짯ons over the next seve짯ral years will requi짯re a myri짯ad of ultra low-power to ultra high-per짯for짯mance solu짯ti짯ons con짯nec짯ting devices to the cloud, said Jim McGre짯gor, Prin짯ci짯pal Ana짯lyst with TIRIAS Rese짯arch. 쏻ith their new road짯map, AMD lever짯a짯ges both ARM and x86 com짯pu짯ting and gra짯phics archi짯tec짯tures to ful짯fill the company셲 visi짯on of crea짯ting an ambi짯dex짯trous eco짯sys짯tem. The cur짯rent pro짯ducts com짯bi짯ned with the new road짯map offer pri짯ce, per짯for짯mance and power opti짯ons to meet the needs of embedded designers.

2014 AMD Embedded Roadmap

In 2014, AMD  plans to bring to mar짯ket two new high-per짯for짯mance AMD Embedded R멣eries pro짯ces짯sor fami짯lies: the 쏦ier짯ofal짯con CPU SoC fami짯ly based on the ARM Cortex꽓-A57 archi짯tec짯tu짯re and the 쏝ald Eagle APU and CPU offe짯ring based on the x86 micro짯pro짯ces짯sor archi짯tec짯tu짯re code짯na짯med 쏶team짯rol짯ler. The upco짯ming 쏶tep짯pe Eagle APU SoC is desi짯gned to pro짯vi짯de impro짯ved per짯for짯mance while exten짯ding the low-power cha짯rac짯te짯ristics of the cur짯rent AMD Embedded G멣eries SoC fami짯ly. In addi짯ti짯on, 쏛del짯a짯ar will bring to mar짯ket the first dis짯crete GPU based on AMD Gra짯phics Core Next archi짯tec짯tu짯re for embedded systems.

Hierofalcon CPU SoC

Hier짯ofal짯con is the first 64-bit ARM-based plat짯form from AMD tar짯ge짯ting embedded data cen짯ter appli짯ca짯ti짯ons, com짯mu짯ni짯ca짯ti짯ons infra짯struc짯tu짯re and indus짯tri짯al solu짯ti짯ons. It will include up to eight ARM Cortex꽓-A57 CPUs expec짯ted to run up to 2.0 GHz, and pro짯vi짯des high-per짯for짯mance memo짯ry with two 64-bit DDR3/4 chan짯nels with error cor짯rec짯tion code (ECC) for high relia짯bi짯li짯ty appli짯ca짯ti짯ons. The high짯ly inte짯gra짯ted SoC includes 10 Gb KR Ether짯net and PCI-Express Gen 3 for high-speed net짯work con짯nec짯ti짯vi짯ty, making it ide짯al for con짯trol pla짯ne appli짯ca짯ti짯ons. The 쏦ier짯ofal짯con series also pro짯vi짯des enhan짯ced secu짯ri짯ty with sup짯port for ARM Trust짯Zo짯ne짰 tech짯no짯lo짯gy and a dedi짯ca짯ted cryp짯to짯gra짯phic secu짯ri짯ty co-pro짯ces짯sor, alig짯ning to the increased need for net짯work짯ed, secu짯re sys짯tems. 쏦ier짯ofal짯con is expec짯ted to be sam짯pling in the second quar짯ter of 2014 with pro짯duc짯tion in the second half of the year.

Bald Eagle APU/CPU

With 쏝ald Eagle, AMD con짯ti짯nues to build on its heri짯ta짯ge as a lea짯ding pro짯vi짯der of x86 solu짯ti짯ons for the embedded mar짯ket. 쏝ald Eagle is the next gene짯ra짯ti짯on high-per짯for짯mance x86-based embedded pro짯ces짯sor available as both an APU and CPU fea짯turing up to four new 쏶team짯rol짯ler CPU cores within a 35W TDP. The APU pro짯ducts will pro짯vi짯de the new power-opti짯mi짯zed AMD Rade짯on꽓 Gra짯phics Core Next GPU archi짯tec짯tu짯re and HSA enhance짯ments for high-per짯for짯mance embedded appli짯ca짯ti짯ons, making it a supe짯ri짯or solu짯ti짯on for next-gene짯ra짯ti짯on digi짯tal signage and embedded digi짯tal gam짯ing. The 쏝ald Eagle fami짯ly will also intro짯du짯ce new power manage짯ment fea짯tures, such as con짯fi짯gura짯ble TDP, allo짯wing engi짯neers more design fle짯xi짯bi짯li짯ty. 쏝ald Eagle is expec짯ted to be available in the first half of 2014.

Steppe Eagle APU SoC

Step짯pe Eagle will fur짯ther extend the per짯for짯mance and low-power ran짯ge of the cur짯rent award-win짯ning AMD Embedded G멣eries APU SoC plat짯form with an enhan짯ced 쏪agu짯ar CPU core archi짯tec짯tu짯re and AMD Gra짯phics Core Next GPU archi짯tec짯tu짯re that include new fea짯tures for increased CPU and GPU fre짯quen짯cy. Desi짯gned for low-power embedded appli짯ca짯ti짯ons, 쏶tep짯pe Eagle is desi짯gned to offer increased per짯for짯mance-per-watt both at a lower TDP than the cur짯rent AMD Embedded G멣eries APU SoC, as well as exten짯ding the high-end per짯for짯mance abo짯ve 2 GHz. 쏶tep짯pe Eagle also pro짯vi짯des embedded design engi짯neers the fle짯xi짯bi짯li짯ty to levera짯ge the cur짯rent AMD Embedded G멣eries APU SoC board design and soft짯ware stack for a varie짯ty of appli짯ca짯ti짯ons with foot짯print com짯pa짯ti짯bi짯li짯ty. 쏶tep짯pe Eagle is expec짯ted to be available in the first half of 2014.

Adelaar discrete GPU

Adel짯a짯ar is the next-gene짯ra짯ti짯on dis짯crete AMD Embedded Rade짯on GPU based on Gra짯phics Core Next archi짯tec짯tu짯re spe짯ci짯fi짯cal짯ly desi짯gned for embedded appli짯ca짯ti짯ons. Brin짯ging indus짯try-lea짯ding per짯for짯mance to embedded appli짯ca짯ti짯ons, 쏛del짯a짯ar comes as a mar짯ket-dif짯fe짯ren짯tia짯ting mul짯ti-chip modu짯le (MCM) with pre-qua짯li짯fied and inte짯gra짯ted 2 GB of gra짯phics memo짯ry. The 쏛del짯a짯ar GPU fami짯ly will deli짯ver rich 3D gra짯phics, mul짯ti-dis짯play sup짯port and sup짯port for DirectX짰 11.1, OpenGL 4.2 and both Win짯dows and Linux. 쏛del짯a짯ar is expec짯ted to be available in the first half of 2014 with seven years of plan짯ned sup짯p짯ly avai짯la짯bi짯li짯ty as an MCM, mobi짯le PCI express modu짯le (MXM) and stan짯dard PC gra짯phics card2.

With cur짯rent and future offe짯rings, AMD is actively pur짯suing the intel짯li짯gent embedded device mar짯ket with a broad eco짯sys짯tem of soft짯ware and hard짯ware part짯ners sup짯port짯ing mul짯ti짯ple ope짯ra짯ting sys짯tems inclu짯ding Win짯dows and Linux. In par짯ti짯cu짯lar, the com짯pa짯ny is focu짯sing on:

  • Indus짯tri짯al Con짯trol & Automation
  • Digi짯tal Gaming
  • Com짯mu짯ni짯ca짯ti짯on Infrastructure
  • Visu짯al Embedded: 
    • Digi짯tal Signage
    • Thin Cli짯ent
    • Medi짯cal Imaging
    • Auto Info짯tain짯ment
  • Set-top-Box/In짯ter짯net-enab짯led smart TV
  • Printing/Imaging
  • Digi짯tal Surveillance
  • Sto짯rage
  • Military/Aero

AMD has quick짯ly embra짯ced the need to deli짯ver the right SoC for the right task in one of the industry셲 most com짯pre짯hen짯si짯ve pro짯duct port짯fo짯li짯os for the embedded com짯mu짯ni짯ty, said Tom Cronk, exe짯cu짯ti짯ve vice pre짯si짯dent and gene짯ral mana짯ger, Pro짯ces짯sor Divi짯si짯on, ARM. 쏷he addi짯ti짯on of devices based on the 64-bit ARM Cor짯tex-A57 pro짯ces짯sor to their embedded road짯map gives desi짯gners of high-per짯for짯mance embedded sys짯tems a solu짯ti짯on that deli짯vers incre짯di짯ble savings in terms of both ener짯gy and sys짯tem cost.

Resources

About AMD

AMD (NYSE: AMD) designs and inte짯gra짯tes tech짯no짯lo짯gy that powers mil짯li짯ons of intel짯li짯gent devices, inclu짯ding per짯so짯nal com짯pu짯ters, tablets, game con짯so짯les and cloud ser짯vers that defi짯ne the new era of sur짯round com짯pu짯ting. AMD solu짯ti짯ons enable peo짯p짯le ever짯y짯whe짯re to rea짯li짯ze the full poten짯ti짯al of their favo짯ri짯te devices and appli짯ca짯ti짯ons to push the boun짯da짯ries of what is possible.

AMD, the AMD Arrow logo, AMD Opte짯ron and com짯bi짯na짯ti짯ons the짯reof, are trade짯marks of Advan짯ced Micro Devices, Inc. Other names are for infor짯ma짯tio짯nal pur짯po짯ses only and may be trade짯marks of their respec짯ti짯ve owners.

  1. VDC Rese짯arch Stra짯te짯gic Insights 2012: Embedded Pro짯ces짯sing Technologies
  2. Part avai짯la짯bi짯li짯ty is plan짯ned for seven years from date of announce짯ment, sub짯ject to chan짯ge wit짯hout noti짯ce. Fur짯ther sup짯port available under contract

Cautionary Statement

This press release con짯ta짯ins for짯ward-loo짯king state짯ments con짯cer짯ning AMD, its embedded pro짯duct road짯map and stra짯tegy and the timing, fea짯tures and func짯tion짯a짯li짯ty of AMD셲 future pro짯ducts, which are made pur짯su짯ant to the safe har짯bor pro짯vi짯si짯ons of the Pri짯va짯te Secu짯ri짯ties Liti짯ga짯ti짯on Reform Act of 1995. For짯ward-loo짯king state짯ments are com짯mon짯ly iden짯ti짯fied by words such as 쐀elie짯ves, 쐃xpects, 쐌ay, 쐗ill, 쐓hould, 쐓eeks, 쐇ntends, 쐏ro for짯ma, 쐃sti짯ma짯tes, 쏿nti짯ci짯pa짯tes, 쐏lans, 쐏ro짯jects, and other terms with simi짯lar mea짯ning. Inves짯tors are cau짯tio짯ned that the for짯ward-loo짯king state짯ments in this release are based on cur짯rent beliefs, assump짯ti짯ons and expec짯ta짯ti짯ons, speak only as of the date of this release and invol짯ve risks and uncer짯tain짯ties that could cau짯se actu짯al results to dif짯fer mate짯ri짯al짯ly from cur짯rent expec짯ta짯ti짯ons. Risks include the pos짯si짯bi짯li짯ty that Intel Corp.셲 pri짯cing, mar짯ke짯ting and reba짯ting pro짯grams, pro짯duct bund짯ling, stan짯dard set짯ting, new pro짯duct intro짯duc짯tions or other acti짯vi짯ties may nega짯tively impact the company셲 plans that the com짯pa짯ny will requi짯re addi짯tio짯nal fun짯ding and may be unable to rai짯se suf짯fi짯ci짯ent capi짯tal on favorable terms, or at all; that cus짯to짯mers stop buy짯ing the company셲 pro짯ducts or mate짯ri짯al짯ly redu짯ce their ope짯ra짯ti짯ons or demand for the company셲 pro짯ducts; that the com짯pa짯ny may be unable to deve짯lop, launch and ramp new pro짯ducts and tech짯no짯lo짯gies in the volu짯mes that are requi짯red by the mar짯ket at matu짯re yields on a time짯ly basis; that the company셲 third par짯ty foundry sup짯pli짯ers will be unable to tran짯si짯ti짯on the company셲 pro짯ducts to advan짯ced manu짯fac짯tu짯ring pro짯cess tech짯no짯lo짯gies in a time짯ly and effec짯ti짯ve way or to manu짯fac짯tu짯re the company셲 pro짯ducts on a time짯ly basis in suf짯fi짯ci짯ent quan짯ti짯ties and using com짯pe짯ti짯ti짯ve pro짯cess tech짯no짯lo짯gies; that the com짯pa짯ny will be unable to obtain suf짯fi짯ci짯ent manu짯fac짯tu짯ring capa짯ci짯ty or com짯pon짯ents to meet demand for its pro짯ducts or will not ful짯ly uti짯li짯ze its pro짯jec짯ted manu짯fac짯tu짯ring capa짯ci짯ty needs at GLOBALFOUNDRIES (GF) micro짯pro짯ces짯sor manu짯fac짯tu짯ring faci짯li짯ties; that the company셲 requi짯re짯ments for wafers will be less than the fixed num짯ber of wafers that it agreed to purcha짯se from GF or GF encoun짯ters pro짯blems that signi짯fi짯cant짯ly redu짯ce the num짯ber of func짯tion짯al die it recei짯ves from each wafer; that the com짯pa짯ny is unable to suc짯cessful짯ly imple짯ment its long-term busi짯ness stra짯tegy; that the com짯pa짯ny inac짯cu짯ra짯te짯ly esti짯ma짯tes the quan짯ti짯ty or type of pro짯ducts that its cus짯to짯mers will want in the future or will ulti짯m짯ate짯ly end up purcha짯sing, resul짯ting in excess or obso짯le짯te inven짯to짯ry; that the com짯pa짯ny is unable to mana짯ge the risks rela짯ted to the use of its third-par짯ty dis짯tri짯bu짯tors and add-in-board (AIB) part짯ners or offer the appro짯pria짯te incen짯ti짯ves to focus them on the sale of the company셲 pro짯ducts; that the com짯pa짯ny may be unable to main짯tain the level of invest짯ment in rese짯arch and deve짯lo짯p짯ment that is requi짯red to remain com짯pe짯ti짯ti짯ve; that the짯re may be unex짯pec짯ted varia짯ti짯ons in mar짯ket growth and demand for the company셲 pro짯ducts and tech짯no짯lo짯gies in light of the pro짯duct mix that it may have available at any par짯ti짯cu짯lar time; that glo짯bal busi짯ness and eco짯no짯mic con짯di짯ti짯ons, inclu짯ding PC mar짯ket con짯di짯ti짯ons, will not impro짯ve or will wor짯sen; that demand for com짯pu짯ters will be lower than curr짯ent짯ly expec짯ted; and the effect of poli짯ti짯cal or eco짯no짯mic insta짯bi짯li짯ty, dome짯sti짯cal짯ly or inter짯na짯tio짯nal짯ly, on the company셲 sales or sup짯p짯ly chain. Inves짯tors are urged to review in detail the risks and uncer짯tain짯ties in the company셲 Secu짯ri짯ties and Exch짯an짯ge Com짯mis짯si짯on filings, inclu짯ding but not limi짯t짯ed to the Quar짯ter짯ly Report on Form 10멡 for the quar짯ter ended June 29, 2013.