GLOBALFOUNDRIES and SiFive to Deliver Next Level of High Bandwidth Memory on 12LP Platform for AI Applications

Nov 05, 2019

Next gene­ra­ti­on high band­width memo­ry solu­ti­on based on GF’s most advan­ced Fin­FET plat­form aims to deli­ver capa­ci­ty, speed and power for cloud based AI Applications

San­ta Cla­ra Calif. and Hsin­chu, Tai­wan, Novem­ber 5, 2019 – GLOBALFOUNDRIES® (GF®) and SiFi­ve, Inc. announ­ced today at GLOBALFOUNDRIES Tech­no­lo­gy Con­fe­rence (GTC) in Tai­wan that they are working to extend high DRAM per­for­mance levels with High Band­width Memo­ry (HBM2E) on GF’s recent­ly announ­ced 12LP+  Fin­FET solu­ti­on, with 2.5D pack­a­ging design ser­vices to enable fast time-to-mar­ket for Arti­fi­ci­al Intel­li­gence (AI) applications.

In order to achie­ve the capa­ci­ty and band­width for data-inten­si­ve AI trai­ning appli­ca­ti­ons, sys­tem desi­gners are chal­len­ged with squeezing more band­width into a smal­ler area while main­tai­ning a reasonable power pro­fi­le. SiFive’s cus­to­mizable high band­width memo­ry inter­face on GF’s 12LP plat­form and 12LP+ solu­ti­on will enable easy inte­gra­ti­on of high band­width memo­ry into a sin­gle Sys­tem-on-Chip (SoC) solu­ti­ons to deli­ver fast, power-effi­ci­ent data pro­ces­sing for AI appli­ca­ti­ons in the com­pu­ting and wired infra­struc­tu­re markets. 

As a part of the col­la­bo­ra­ti­on, desi­gners will also have access to SiFive’s RISC‑V IP port­fo­lio and DesignSha­re IP eco­sys­tem, which will levera­ge GF’s 12LP+ Design Tech­no­lo­gy Co-Opti­miza­ti­on (DTCO), enab­ling them to signi­fi­cant­ly increase sili­con spe­cia­liza­ti­on, impro­ve design effi­ci­en­cy and deli­ver dif­fe­ren­tia­ted SoC solu­ti­ons quick­ly and cost-effectively. 

Exten­ding SiFive’s refe­rence IP plat­form, with HBM2E, on GF’s best-in-class per­for­mance 12LP+ solu­ti­on­de­li­vers new levels of per­for­mance and inte­gra­ti­on for next gene­ra­ti­on SoCs and acce­le­ra­tors,” said Mohit Gupta, vice pre­si­dent and gene­ral mana­ger, IP Busi­ness Unit at SiFi­ve. “Deploy­ment of high­ly opti­mi­zed sili­con requi­res high­ly cus­to­mizable capa­bi­li­ties in order to rea­li­ze the much-nee­ded hig­her TOPS per mil­li­watt with low laten­cy per­for­mance requi­red for AI, while balan­cing the needs for low power and smal­ler area footprints.”

At GF, we con­ti­nue our com­mit­ment to pro­vi­ding dif­fe­ren­tia­ted Fin­FET spe­ci­fic appli­ca­ti­on solu­ti­ons and IP that allow our cli­ents to deve­lop per­for­mance enhan­ced pro­ducts for AI appli­ca­ti­ons,” said Ted Leta­vic, CTO of Com­pu­ting and Wired Infra­struc­tu­re at GF. “Tog­e­ther, with GF’s most advan­ced Fin­FET plat­form and SiFive’s uni­que design metho­do­lo­gy, we will deve­lop a uni­que high per­for­mance edge com­pu­ting solu­ti­on which empowers desi­gners to take full advan­ta­ge of the data deluge.”

GF’s 12LP+ an inno­va­ti­ve new solu­ti­on for AI trai­ning and infe­rence appli­ca­ti­ons, offers desi­gners a high-speed, low-power 0.5Vmin SRAM bit­cell that sup­ports the fast, power-effi­ci­ent shut­t­ling of data bet­ween pro­ces­sors and memo­ry. Moreo­ver, a new inter­po­ser for 2.5D packa­ges faci­li­ta­tes the inte­gra­ti­on of high-band­width memo­ry with pro­ces­sors for fast, power-effi­ci­ent data processing. 

SiFive’s HBM2E inter­face and cus­tom IP solu­ti­on on GF’s 12LP and 12LP+ are now under deve­lo­p­ment at GF’s Fab 8 in Mal­ta, New York. Cli­ents can start opti­mi­zing their chip designs to deve­lop dif­fe­ren­tia­ted solu­ti­ons for high per­for­mance com­pu­te and edge AI appli­ca­ti­ons in 1H 2020. 

About SiFi­ve

SiFi­ve is the lea­ding pro­vi­der of mar­ket-rea­dy pro­ces­sor core IP and sili­con solu­ti­ons based on the free and open RISC‑V ins­truc­tion set archi­tec­tu­re. Led by a team of sea­so­ned sili­con exe­cu­ti­ves and the RISC‑V inven­tors, SiFi­ve helps SoC desi­gners redu­ce time-to-mar­ket and rea­li­ze cost savings with cus­to­mi­zed, open-archi­tec­tu­re pro­ces­sor cores, and demo­cra­ti­zes access to opti­mi­zed sili­con by enab­ling sys­tem desi­gners in all mar­ket ver­ti­cals to build cus­to­mi­zed RISC‑V based semi­con­duc­tors. With 15 offices world­wi­de, SiFi­ve has back­ing from Sut­ter Hill Ven­tures, Qual­comm Ven­tures, Spark Capi­tal, Osa­ge Uni­ver­si­ty Part­ners, Cheng­wei, Hua­mi, SK Hynix, Intel Capi­tal, and Wes­tern Digi­tal. For more infor­ma­ti­on, www.sifive.com.

About GF

GLOBALFOUNDRIES (GF) is the world’s lea­ding spe­cial­ty foundry. We deli­ver dif­fe­ren­tia­ted fea­ture-rich solu­ti­ons that enable our cli­ents to deve­lop inno­va­ti­ve pro­ducts for high-growth mar­ket seg­ments. GF pro­vi­des a broad ran­ge of plat­forms and fea­tures with a uni­que mix of design, deve­lo­p­ment and fabri­ca­ti­on ser­vices. With an at-sca­le manu­fac­tu­ring foot­print span­ning the U.S., Euro­pe and Asia, GF has the fle­xi­bi­li­ty and agi­li­ty to meet the dyna­mic needs of cli­ents across the glo­be. GF is owned by Muba­d­a­la Invest­ment Com­pa­ny. For more infor­ma­ti­on, visit globalfoundries.com.