STMicroelectronics and TSMC Collaborate to Accelerate Market Adoption of Gallium Nitride-Based Products

  • Acce­le­ra­tes the deve­lo­p­ment and deli­very of advan­ced power GaN solu­ti­ons to market
  • Lever­a­ges Auto­mo­ti­ve-mar­ket exper­ti­se of ST and the found­ry lea­ders­hip of TSMC
  • Impro­ves wide band­gap effi­ci­en­cy for bet­ter ener­gy effi­ci­en­cy in power con­ver­si­on applications

Gene­va, Switz­er­land and Hsin­chu, Tai­wan R.O.C., Febru­a­ry 20, 2020 – STMi­croelec­tro­nics (NYSE:STM), a glo­bal semi­con­duc­tor lea­der ser­ving cus­to­mers across the spec­trum of elec­tro­nics app­li­ca­ti­ons, and TSMC (TWSE:2330, NYSE: TSM), the world’s lar­gest dedi­ca­ted semi­con­duc­tor found­ry, are col­la­bo­ra­ting to acce­le­ra­te the deve­lo­p­ment of Gal­li­um Nitri­de (GaN) pro­cess tech­no­lo­gy and the sup­ply of both dis­cre­te and inte­gra­ted GaN devices to mar­ket. Through this col­la­bo­ra­ti­on, ST’s inno­va­ti­ve and stra­te­gic GaN pro­ducts will be manu­fac­tu­red using TSMC’s lea­ding GaN pro­cess technology.

GaN is a wide band­gap semi­con­duc­tor mate­ri­al which offers signi­fi­cant bene­fits over tra­di­tio­nal Sili­con-based semi­con­duc­tors for power app­li­ca­ti­ons. The­se bene­fits inclu­de grea­ter ener­gy effi­ci­en­cy at hig­her power, lea­ding to a sub­stan­ti­al reduc­tion in para­si­tic power los­ses. GaN tech­no­lo­gy also allows the design of more com­pact devices for bet­ter form fac­tors. Addi­tio­nal­ly, GaN-based devices switch at speeds as much as 10X fas­ter than Sili­con-based devices while ope­ra­ting at hig­her peak tem­pe­ra­tures. The­se robust and intrinsic mate­ri­al cha­rac­te­ris­tics make GaN ide­al­ly sui­ted for broad-based adop­ti­on in evol­ving auto­mo­ti­ve, indus­tri­al, telecom, and spe­ci­fic con­su­mer app­li­ca­ti­ons across both the 100V and the 650V clusters.

Spe­ci­fi­cal­ly, Power GaN and GaN IC tech­no­lo­gy-based pro­ducts will enab­le ST to pro­vi­de solu­ti­ons for medi­um and high-power app­li­ca­ti­ons with bet­ter effi­ci­en­cy com­pa­red to sili­con tech­no­lo­gies on the same topo­lo­gies, inclu­ding auto­mo­ti­ve con­ver­ters and char­gers for hybrid and electric vehi­cles. Power GaN and GaN IC tech­no­lo­gies will help acce­le­ra­te the mega­trend of the elec­tri­fi­ca­ti­on of con­su­mer and com­mer­cial vehicles.

As a lea­der in both wide band­gap semi­con­duc­tor tech­no­lo­gy and in power semi­con­duc­tors for the deman­ding auto­mo­ti­ve and indus­tri­al mar­kets, ST sees signi­fi­cant oppor­tu­ni­ty in acce­le­ra­ting the deve­lo­p­ment and deli­very of GaN pro­cess tech­no­lo­gy and brin­ging power GaN and GaN IC pro­ducts to the mar­ket. TSMC is a trus­ted found­ry part­ner that can uni­que­ly meet the chal­len­ging relia­bi­li­ty and road­map evo­lu­ti­on requi­re­ments of ST’s tar­get cus­to­mers,” said Mar­co Mon­ti, Pre­si­dent of STMi­croelec­tro­nics’ Auto­mo­ti­ve and Dis­cre­te Group. “This coope­ra­ti­on com­ple­ments our exis­ting acti­vi­ties on power GaN under­ta­ken at our site in Tours, Fran­ce and with CEA-Leti. GaN repres­ents the next major inno­va­ti­on in Power and Smart Power elec­tro­nics, as well in pro­cess tech­no­lo­gy”.

We look for­ward to col­la­bo­ra­ting with ST and bring the app­li­ca­ti­ons of GaN power-elec­tro­nics to Indus­tri­al and Auto­mo­ti­ve Power Con­ver­si­on,” said Dr. Kevin Zhang, Vice Pre­si­dent of Busi­ness Deve­lo­p­ment at TSMC. “TSMC’s lea­ding GaN manu­fac­tu­ring exper­ti­se, com­bi­ned with STMi­croelec­tro­nics’ pro­duct design and auto­mo­ti­ve-gra­de qua­li­fi­ca­ti­on capa­bi­li­ties, will deli­ver gre­at ener­gy effi­ci­en­cy impro­ve­ment for indus­tri­al and auto­mo­ti­ve power con­ver­si­on app­li­ca­ti­ons that are more eco-friend­ly and help acce­le­ra­te the elec­tri­fi­ca­ti­on of vehi­cles.”

ST expects the deli­very of first sam­ples of power GaN dis­cre­te devices to its key cus­to­mers later this year, fol­lo­wed by GaN IC pro­ducts wit­hin a few months.

About STMi­croelec­tro­nics
ST is a glo­bal semi­con­duc­tor lea­der deli­vering intel­li­gent and ener­gy-effi­ci­ent pro­ducts and solu­ti­ons that power the elec­tro­nics at the heart of ever­y­day life. ST’s pro­ducts are found ever­y­whe­re today, and tog­e­ther with our cus­to­mers, we are enab­ling smar­ter dri­ving and smar­ter fac­to­ries, cities and homes, along with the next genera­ti­on of mobi­le and Inter­net of Things devices.
By get­ting more from tech­no­lo­gy to get more from life, ST stands for life.augmented.

In 2019, the Company’s net reve­nues were $9.56 bil­li­on, ser­ving more than 100,000 cus­to­mers world­wi­de. Fur­ther infor­ma­ti­on can be found at

About TSMC
TSMC pionee­red the pure-play found­ry busi­ness model when it was foun­ded in 1987, and has been the world’s lar­gest dedi­ca­ted semi­con­duc­tor found­ry ever sin­ce. The com­pa­ny sup­ports a thri­ving eco­sys­tem of glo­bal cus­to­mers and part­ners with the industry’s lea­ding pro­cess tech­no­lo­gy and port­fo­lio of design ena­b­le­ment solu­ti­ons to unleash inno­va­ti­on for the glo­bal semi­con­duc­tor industry.

TSMC ser­ves its cus­to­mers with glo­bal capa­ci­ty of about 13 mil­li­on 12-inch equi­va­lent wafers per year in 2020, and pro­vi­des the broa­dest ran­ge of tech­no­lo­gies from 2 micron all the way to foundry’s most advan­ced pro­ces­ses, which is 7‑nanometer today. TSMC is the first found­ry to pro­vi­de 7‑nanometer pro­duc­tion capa­bi­li­ties and the first to com­mer­cia­li­ze Extre­me Ultra­vio­let (EUV) litho­gra­phy tech­no­lo­gy in deli­vering cus­to­mer pro­ducts to mar­ket in high volu­me. TSMC is head­quar­te­red in Hsin­chu, Taiwan.
For more infor­ma­ti­on about TSMC plea­se visit

STMi­croelec­tro­nics contacts
Céli­ne Berthier

Group VP, Inves­tor Relations
Tel: +41 22 929 58 12

Alexis Bre­ton
Cor­po­ra­te Exter­nal Communications
Tel: + 33 6 59 16 79 08

TSMC Media Contacts
Nina Kao
Head of PR Department
Tel: 886–3‑5636688 ext.7125036
Mobi­le: 886–988-239–163

Micha­el Kramer
PR Department
Tel: 886–3‑5636688 ext.7125031
Mobi­le: 886–988-931–352

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