Low-power COM Express Module with AMD Ryzen Embedded V1000/R1000 SoC

Tai­pei, Tai­wan, Octo­ber 16, 2020 — IBASE Tech­no­lo­gy Inc. (TPEx: 8050), a lea­ding pro­vi­der of indus­tri­al mother­boards and embed­ded solu­ti­ons, announ­ces the launch of the ET977 low-power COM Express Com­pact Type 6 modu­les, which are based on the AMD Ryzen™ Embed­ded SoC to enab­le next-genera­ti­on embed­ded designs. The seri­es tar­gets a wide ran­ge of app­li­ca­ti­ons inclu­ding AIoT, retail, medi­cal, trans­por­ta­ti­on, auto­ma­ti­on and gaming fields.

The ET977 COM Express modu­le allows IBASE cus­to­mers to deli­ver com­pact embed­ded solu­ti­ons with a new class of per­for­mance and power effi­ci­en­cy,” said Wil­son Lin, Direc­tor of IBASE Pro­duct Plan­ning Depart­ment. “Built with the AMD Ryzen™ Embed­ded V1000/R1000 SoC, it is very sui­ta­ble for modu­lar designs and plat­forms that requi­re high sca­la­bi­li­ty to meet cus­to­mers’ time-to-mar­ket needs.”

The new ET977 pro­vi­des power­ful com­pu­ting with ‘Zen’ CPU cores and excel­lent image pro­ces­sing per­for­mance with the inte­gra­ted AMD Rade­on Vega gra­phics with 3 com­pu­te units to deli­ver stun­nin­gly visu­al expe­ri­en­ces. It fea­tures four (V1000) or three (R1000) inde­pen­dent dis­plays (HDMI/DVI/DP, LVDS or eDP) with up to 4K UltraHD reso­lu­ti­ons and two DDR4 SO-DIMM slots for up to 32GB memo­ry and with ECC compatibility.

The unit pro­vi­des a wealth of advan­ced con­nec­ti­vi­ty opti­ons inclu­ding 2x seri­al, 4x USB 3.1, 8x USB 2.0, and 2x SATA 6Gb/s ports, as well as high-speed PCIe 3.0 lanes. Mea­su­ring 125mm x 95 mm, the Com­pu­ter-on-Modu­le is avail­ab­le in V1807B and V1605B vari­ants for high com­pu­ting and R1606G vari­ant for low-power app­li­ca­ti­ons. Both Win­dows 10 and Linux Ubun­tu are sup­por­ted. For more infor­ma­ti­on, plea­se visit www.ibase.com.tw.


  •  Onboard AMD Ryzen™ Embed­ded V1000/ R1000 processor
  • 2x DDR4-2400 SO-DIMM sockets, Max. 32GB, ECC compatible
  • Sup­ports up to 4x inde­pen­dent dis­plays (HDMI/DVI/DisplayPort, LVDS, and eDP) via the car­ri­er board
  • 4x USB 3.1, 8x USB 2.0, 2x SATA III
  • Sup­ports TPM 2.0