AMD Showcases Industry-Leading Innovation Across the High-Performance Computing Ecosystem at COMPUTEX 2021

Key­note high­lights company’s gro­wing momen­tum, strong and expan­ding set of part­ners, and bre­akthrough AMD tech­no­lo­gies powe­ring gaming, PCs and the data center

05/31/2021 — Today at COMPUTEX 2021, AMD (NASDAQ: AMD) show­ca­sed its latest com­pu­ting and gra­phics tech­no­lo­gy inno­va­tions to acce­le­ra­te the high-per­for­mance com­pu­ting eco­sys­tem, span­ning gaming, PCs and the data cen­ter. AMD Pre­si­dent and CEO Dr. Lisa Su unvei­led the latest bre­akthrough in high-per­for­mance com­pu­ting pionee­red by AMD with new 3D chip­let tech­no­lo­gy; expan­ded adop­ti­on of AMD com­pu­ting and gra­phics tech­no­lo­gies in the auto­mo­ti­ve and mobi­le mar­kets with indus­try lea­ders Tes­la and Sam­sung; new AMD Ryzen™ pro­ces­sor offe­rings for enthu­si­asts and con­su­mer PCs; lea­ders­hip data cen­ter per­for­mance with the latest 3rd Gen AMD EPYC™ pro­ces­sors; and a full sla­te of new AMD gra­phics tech­no­lo­gies for gamers.

At Com­putex, we high­ligh­ted the gro­wing adop­ti­on of our high-per­for­mance com­pu­ting and gra­phics tech­no­lo­gies as AMD con­ti­nues set­ting the pace of inno­va­ti­on for the indus­try,” said Dr. Su. “With the laun­ches of our new Ryzen and Rade­on pro­ces­sors and the first wave of AMD Advan­ta­ge note­books, we con­ti­nue expan­ding the eco­sys­tem of lea­ders­hip AMD pro­ducts and tech­no­lo­gies for gamers and enthu­si­asts. The next fron­tier of inno­va­ti­on in our indus­try is taking chip design into the third dimen­si­on. Our first app­li­ca­ti­on of 3D chip­let tech­no­lo­gy at Com­putex demons­tra­tes our com­mit­ment to con­ti­nue pushing the enve­lo­pe in high-per­for­mance com­pu­ting to signi­fi­cant­ly enhan­ce user expe­ri­en­ces. We are proud of the deep part­ners­hips we have cul­ti­va­ted across the eco­sys­tem to power the pro­ducts and ser­vices that are essen­ti­al to our dai­ly lives.”

Accelerating Chiplet and Packaging Innovation

AMD con­ti­nues to build on its lea­ders­hip IP and invest­ments in lea­ding manu­fac­tu­ring and pack­a­ging tech­no­lo­gies with AMD 3D chip­let tech­no­lo­gy, a pack­a­ging bre­akthrough that com­bi­nes AMD’s inno­va­ti­ve chip­let archi­tec­tu­re with 3D stacking using an indus­try-lea­ding hybrid bond approach that pro­vi­des over 200 times the inter­con­nect den­si­ty of 2D chip­lets and more than 15 times the den­si­ty com­pa­red to exis­ting 3D pack­a­ging solu­ti­ons. Pionee­red in clo­se col­la­bo­ra­ti­on with TSMC, the indus­try-lea­ding tech­no­lo­gy also con­su­mes less ener­gy1 than cur­rent 3D solu­ti­ons and is the most fle­xi­ble acti­ve-on-acti­ve sili­con stacking tech­no­lo­gy in the world.

AMD show­ed the first app­li­ca­ti­on of 3D chip­let tech­no­lo­gy at COMPUTEX 2021 – a 3D ver­ti­cal cache bond­ed to an AMD Ryzen™ 5000 Seri­es pro­ces­sor pro­to­ty­pe that is desi­gned to deli­ver signi­fi­cant per­for­mance gains across a broad set of app­li­ca­ti­ons. AMD is on-track to begin pro­duc­tion on future high-end com­pu­ting pro­ducts with 3D chip­lets by the end of this year. [33:49–38:49]

Bringing the AMD RDNA™ 2 Gaming Architecture to New Markets

AMD announ­ced that it is brin­ging new gaming expe­ri­en­ces to the auto­mo­ti­ve and mobi­le mar­kets through its deep part­ners­hips with indus­try leaders.

  • The new­ly desi­gned info­tain­ment sys­tems in the Tes­la Model S and Model X are powe­red by an AMD Ryzen Embed­ded APU and an AMD RDNA 2 archi­tec­tu­re-based GPU that enab­les AAA gaming. [11:19–12:02]
  • AMD is part­ne­ring with Sam­sung on its next genera­ti­on Exy­nos SoC, which will fea­ture cus­tom AMD RDNA 2 archi­tec­tu­re-based gra­phics IP that brings ray­t­ra­cing and varia­ble rate shading capa­bi­li­ties to flagship mobi­le devices. [12:08–12:40]


AMD Radeon 6000M Series Mobile Graphics Powering Next-Gen Premium Gaming Laptops

AMD intro­du­ced several power­ful new solu­ti­ons that take high-per­for­mance gaming to new levels.

AMD Rade­on RX 6000M Seri­es Mobi­le Gra­phics: Desi­gned to bring world-class per­for­mance, incredi­ble visu­al fide­li­ty and immer­si­ve expe­ri­en­ces to gaming lap­tops, AMD Rade­on RX 6000M Seri­es GPUs harness the bre­akthrough AMD RDNA 2 gaming archi­tec­tu­re to deli­ver up to 1.5X2 hig­her gaming per­for­mance than AMD RDNA archi­tec­tu­re. [12:40–19:06]

  • AMD Advan­ta­ge Design Frame­work: col­la­bo­ra­ti­ve effort bet­ween AMD and its glo­bal PC part­ners to deli­ver the next genera­ti­on of pre­mi­um gaming lap­tops by com­bi­ning high-per­for­mance AMD Rade­on RX 6000M Seri­es Mobi­le Gra­phics, AMD Rade­on™ Soft­ware and AMD Ryzen™ 5000 Seri­es Mobi­le Pro­ces­sors with exclu­si­ve AMD smart tech­no­lo­gies and other advan­ced sys­tem design cha­rac­te­ris­tics. The first AMD Advan­ta­ge lap­tops are expec­ted to be avail­ab­le from lea­ding OEMs star­ting this mon­th. [24:10–32:28]
  • AMD Fide­li­ty­FX Super Reso­lu­ti­on (FSR): A cut­ting-edge spa­ti­al ups­ca­ling tech­no­lo­gy desi­gned to boost frame­ra­tes up to 2.5X in select tit­les to deli­ver a high-qua­li­ty, high-reso­lu­ti­on gaming expe­ri­ence. The open-source tech­no­lo­gy offers broad sup­port on more than 100 AMD pro­ces­sors and GPUs, as well as com­pe­ti­tor GPUs, and more than 10 game deve­lo­pers plan to inte­gra­te FSR into their top tit­les and game engi­nes in 2021. [19:10–23:17]


Expanding the AMD Ryzen Portfolio

AMD expan­ded the Ryzen fami­ly of pro­ces­sors fur­ther into the desk­top space with new opti­ons for com­mer­cial sys­tems and enthusiasts.

  • AMD Ryzen 5000G Seri­es Desk­top APUs: The Ryzen 7 5700G and the Ryzen 5 5600G bring the power of “Zen 3” and inte­gra­ted Rade­on gra­phics per­for­mance tog­e­ther in a sin­gle chip and will be avail­ab­le to the DIY mar­ket later this year. [8:26–10:20]
  • AMD Ryzen PRO 5000 Seri­es Desk­top Pro­ces­sors: The G- and GE-Seri­es of desk­top pro­ces­sors, also laun­ching today, bring lea­ders­hip per­for­mance and the most modern secu­ri­ty fea­tures to busi­ness-rea­dy, enter­pri­se-gra­de systems.


Solving Business Challenges with 3rd Gen AMD EPYC™ Processors

AMD show­ca­sed how its lea­ders­hip 3rd Gen AMD EPYC pro­ces­sors and deep part­ners­hips across the ser­ver eco­sys­tem are enab­ling the digi­tal ser­vices and expe­ri­en­ces that bil­li­ons of users rely on every day.

  • With the intro­duc­tion of 3rd Gen EPYC pro­ces­sors, AMD has more than dou­bled the num­ber of avail­ab­le solu­ti­ons com­pa­red to the pre­vious genera­ti­on pro­ces­sor, inclu­ding lea­ding solu­ti­ons for hyper con­ver­ged infra­st­ruc­tu­re, data manage­ment, data ana­ly­tics and HPC that deli­ver out­stan­ding per­for­mance, secu­ri­ty fea­tures and value to cus­to­mers. [2:45–5:00]
  • In the first public com­pe­ti­ti­ve demons­tra­ti­on against the latest Intel Xeon Scala­b­le pro­ces­sors using an e‑commerce app­li­ca­ti­on, 3rd Gen EPYC pro­ces­sors deli­ve­r­ed 50% more busi­ness tran­sac­tions than the competition’s most power­ful two-socket sys­tem, while main­tai­ning a com­pa­ra­ble SLA3. [5:00–6:48]
  • AMD EPYC pro­ces­sors cur­r­ent­ly hold 220 world records4 across cloud, enter­pri­se and HPC workloads and applications.


Supporting Resources


About AMD

For more than 50 years AMD has dri­ven inno­va­ti­on in high-per­for­mance com­pu­ting, gra­phics and visua­liz­a­ti­on tech­no­lo­gies ― the buil­ding blocks for gaming, immer­si­ve plat­forms and the data cen­ter. Hund­reds of mil­li­ons of con­su­mers, lea­ding For­tu­ne 500 busi­nes­ses and cut­ting-edge sci­en­ti­fic rese­arch faci­li­ties around the world rely on AMD tech­no­lo­gy dai­ly to impro­ve how they live, work and play. AMD employees around the world are focu­sed on buil­ding gre­at pro­ducts that push the bounda­ries of what is pos­si­ble. For more infor­ma­ti­on about how AMD is enab­ling today and inspi­ring tomor­row, visit the AMD (NASDAQ: AMDweb­siteblogFace­book and Twit­ter pages.


AMD, the AMD Arrow logo, EPYC, Rade­on, Ryzen and com­bi­na­ti­ons the­re­of, are trade­marks of Advan­ced Micro Devices, Inc. Other names are for infor­ma­tio­nal pur­po­ses only and may be trade­marks of their respec­ti­ve owners.


Cautionary Statement

This press release con­tains for­ward-loo­king state­ments con­cer­ning Advan­ced Micro Devices, Inc. (AMD) such as the fea­tures, func­tio­n­a­li­ty, per­for­mance, avai­la­bi­li­ty, timing and expec­ted bene­fits of AMD Rade­onTM RX 6000M Seri­es Mobi­le Gra­phics GPUs, the AMD Advan­ta­ge Design Frame­work, AMD Fide­li­ty­FX Super Reso­lu­ti­on and AMD Rade­on RX 6000M-based lap­tops, which are made pur­suant to the Safe Har­bor pro­vi­si­ons of the Pri­va­te Secu­ri­ties Liti­ga­ti­on Reform Act of 1995. For­ward-loo­king state­ments are com­mon­ly iden­ti­fied by words such as “would,” “may,” “expects,” “belie­ves,” “plans,” “intends,” “pro­jects” and other terms with simi­lar mea­ning. Inves­tors are cau­tio­ned that the for­ward-loo­king state­ments in this press release are based on cur­rent beliefs, assump­ti­ons and expec­ta­ti­ons, speak only as of the date of this press release and invol­ve risks and uncer­tain­ties that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons. Such state­ments are sub­ject to cer­tain known and unknown risks and uncer­tain­ties, many of which are dif­fi­cult to pre­dict and gene­ral­ly bey­ond AMD’s con­trol, that could cau­se actu­al results and other future events to dif­fer mate­ri­al­ly from tho­se expres­sed in, or implied or pro­jec­ted by, the for­ward-loo­king infor­ma­ti­on and state­ments. Mate­ri­al fac­tors that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons inclu­de, without limi­ta­ti­on, the fol­lowing: Intel Corporation’s domi­nan­ce of the micro­pro­ces­sor mar­ket and its aggres­si­ve busi­ness prac­ti­ces; glo­bal eco­no­mic uncer­tain­ty; the loss of a signi­fi­cant cus­to­mer; the impact of the COVID-19 pan­de­mic on AMD’s busi­ness, finan­cial con­di­ti­on and results of ope­ra­ti­ons; the com­pe­ti­ti­ve mar­kets in which AMD’s pro­ducts are sold; quar­ter­ly and sea­so­nal sales pat­terns; mar­ket con­di­ti­ons of the indus­tries in which AMD pro­ducts are sold; the cycli­cal natu­re of the semi­con­duc­tor indus­try; AMD’s abi­li­ty to ade­qua­te­ly pro­tect its tech­no­lo­gy or other intel­lec­tu­al pro­per­ty; unfa­vor­able cur­ren­cy exchan­ge rate fluc­tua­tions; the abi­li­ty of third par­ty manu­fac­tu­rers to manu­fac­tu­re AMD’s pro­ducts on a time­ly basis in suf­fi­ci­ent quan­ti­ties and using com­pe­ti­ti­ve tech­no­lo­gies; the avai­la­bi­li­ty of essen­ti­al equip­ment, mate­ri­als, sub­stra­tes or manu­fac­tu­ring pro­ces­ses; expec­ted manu­fac­tu­ring yiel­ds for AMD’s pro­ducts; AMD’s abi­li­ty to intro­du­ce pro­ducts on a time­ly basis with fea­tures and per­for­mance levels that pro­vi­de value to its cus­to­mers; AMD’s abi­li­ty to gene­ra­te reve­nue from its semi-cus­tom SoC pro­ducts; poten­ti­al secu­ri­ty vul­nera­bi­li­ties; poten­ti­al IT outa­ges, data loss, data breaches and cyber-attacks; uncer­tain­ties invol­ving the orde­ring and ship­ment of AMD’s pro­ducts; AMD’s reli­an­ce on third-par­ty intel­lec­tu­al pro­per­ty to design and intro­du­ce new pro­ducts in a time­ly man­ner; AMD’s reli­an­ce on third-par­ty com­pa­nies for the design, manu­fac­tu­re and sup­ply of mother­boards, soft­ware and other com­pu­ter plat­form com­pon­ents; AMD’s reli­an­ce on Micro­soft Cor­po­ra­ti­on and other soft­ware ven­dors’ sup­port to design and deve­lop soft­ware to run on AMD’s pro­ducts; AMD’s reli­an­ce on third-par­ty dis­tri­bu­tors and add-in-board part­ners; the impact of modi­fi­ca­ti­on or inter­rup­ti­on of AMD’s inter­nal busi­ness pro­ces­ses and infor­ma­ti­on sys­tems; com­pa­ti­bi­li­ty of AMD’s pro­ducts with some or all indus­try-stan­dard soft­ware and hard­ware; cos­ts rela­ted to defec­ti­ve pro­ducts; the effi­ci­en­cy of AMD’s sup­ply chain; AMD’s abi­li­ty to rely on third par­ty sup­ply-chain logistics func­tions; AMD’s abi­li­ty to effec­tively con­trol the sales of its pro­ducts on the gray mar­ket; the impact of government actions and regu­la­ti­ons such as export admi­nis­tra­ti­on regu­la­ti­ons, tariffs and tra­de pro­tec­tion mea­su­res; AMD’s abi­li­ty to rea­li­ze its defer­red tax assets; poten­ti­al tax lia­bi­li­ties; cur­rent and future claims and liti­ga­ti­on; the impact of envi­ron­men­tal laws, con­flict mine­rals-rela­ted pro­vi­si­ons and other laws or regu­la­ti­ons; the impact of acqui­si­ti­ons, joint ven­tures and/or invest­ments on AMD’s busi­ness, inclu­ding the announ­ced acqui­si­ti­on of Xilinx, and the fail­u­re to inte­gra­te acqui­red busi­nes­ses; AMD’s abi­li­ty to com­ple­te the Xilinx mer­ger; the impact of the announ­ce­ment and pen­den­cy of the Xilinx mer­ger on AMD’s busi­ness; the impact of any impairment of the com­bi­ned company’s assets on the com­bi­ned company’s finan­cial posi­ti­on and results of ope­ra­ti­on; the restric­tions impo­sed by agree­ments gover­ning AMD’s notes and the revol­ving credit faci­li­ty; AMD’s indeb­ted­ness; AMD’s abi­li­ty to gene­ra­te suf­fi­ci­ent cash to ser­vice its debt obli­ga­ti­ons or meet its working capi­tal requi­re­ments; AMD’s abi­li­ty to repurcha­se its out­stan­ding debt in the event of a chan­ge of con­trol; AMD’s abi­li­ty to gene­ra­te suf­fi­ci­ent reve­nue and ope­ra­ting cash flow or obtain exter­nal finan­cing for rese­arch and deve­lo­p­ment or other stra­te­gic invest­ments; poli­ti­cal, legal, eco­no­mic risks and natu­ral dis­as­ters; future impairments of good­will and tech­no­lo­gy licen­se purcha­ses; AMD’s abi­li­ty to attract and retain qua­li­fied per­son­nel; AMD’s stock pri­ce vola­ti­li­ty; and world­wi­de poli­ti­cal con­di­ti­ons. Inves­tors are urged to review in detail the risks and uncer­tain­ties in AMD’s Secu­ri­ties and Exchan­ge Com­mis­si­on filings, inclu­ding but not limi­ted to AMD’s most recent reports on Forms 10‑K and 10‑Q.

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