New Ryzen Embedded R‑Series system-on-chips provide up to 2X more cores, enhanced Radeon graphics, Windows 11 support, and versatile, multi-display configurability

NUREMBURG, Ger­ma­ny, June 21, 2022 (GLOBE NEWSWIRE) —  (Embedded World 2022) AMD (NASDAQ: AMD) today announ­ced the Ryzen™ Embedded R2000 Series, second-gene­ra­ti­on mid-ran­ge sys­tem-on-chip (SoC) pro­ces­sors opti­mi­zed for a wide ran­ge of indus­tri­al and robo­tics sys­tems, machi­ne visi­on, IoT and thin-cli­ent equip­ment. Ryzen Embedded R2000 Series dou­bles the core count¹ and deli­vers a signi­fi­cant per­for­mance uplift com­pared to the pri­or gene­ra­ti­on, with the new R2515 model exhi­bi­ting up to 81 per­cent hig­her CPU² and gra­phics³ per­for­mance than the com­pa­ra­ble R1000 series pro­ces­sor. Per­for­mance-per-watt effi­ci­en­cy is also opti­mi­zed using “Zen+” core archi­tec­tu­re with AMD Rade­on™ gra­phics for rich and ver­sa­ti­le mul­ti­me­dia capa­bi­li­ties. Ryzen Embedded R2000 pro­ces­sors can power up to four inde­pen­dent dis­plays in bril­li­ant 4K resolution.

Embedded R2000 Series pro­ces­sors are sca­lable up to four “Zen+” CPU cores with eight threads, 2MB of L2 cache and 4MB of shared L3 cache. This gives embedded sys­tem desi­gners gre­at fle­xi­bi­li­ty to sca­le per­for­mance and power effi­ci­en­ci­es with a sin­gle pro­ces­sing platform.

With sup­port for up to 3200 MT/s DDR4 dual-chan­nel memo­ry and expan­ded I/O con­nec­ti­vi­ty, the Ryzen Embedded R2000 Series pro­ces­sors deli­ver 50 per­cent hig­her memo­ry band­width⁴ and up to 2X grea­ter I/O con­nec­ti­vi­ty⁵ com­pared to R1000 series processors.

“For indus­tri­al appli­ca­ti­ons like robo­tics and machi­ne visi­on as well as thin cli­ents and mini-PCs, the Ryzen Embedded R2000 Series rai­ses the bar on per­for­mance and func­tion­a­li­ty,” said Raj­nee­sh Gaur, cor­po­ra­te vice pre­si­dent and gene­ral mana­ger, Adap­ti­ve & Embedded Com­pu­ting Group at AMD. “The Embedded R2000 Series pro­vi­des sys­tem desi­gners with more per­for­mance, opti­mi­zed power and bet­ter gra­phics, all with a seam­less upgrade path.”

Pro­duct Specifications

Model	TDP Range	Core / Thread Count	GPU CU	Base CPU Freq. (GHz)	L2 Cache	L3 Cache	Expec­ted Availability
R2544	35–54W	4 / 8	8	3.35	2 MB	4 MB	Octo­ber 2022
R2514	12–35W	4 / 8	8	2.1	2 MB	4 MB	Octo­ber 2022
R2314	12–35W	4 / 4	6	2.1	2 MB	4 MB	In Pro­duc­tion
R2312	12–25W	2 / 4	3	2.7	1 MB	2 MB	In Pro­duc­tion

Addi­tio­nal Key Fea­tures and Benefits

• Power up to four inde­pen­dent dis­plays in crisp 4K reso­lu­ti­on lever­aging Dis­play­Po­rt™ 1.4, HDMI™ 2.0b, or eDP 1.3 interfaces
• Broad set of high-speed peri­pherals and inter­faces with up to 16 lanes of PCIe® Gen3, 2x SATA 3.0 and 6 USB ports (USB 3.2 Gen2 and 2.0)
• OS sup­port includes Micro­soft Win­dows^® 11/10, and Linux^® Ubun­tu^® LTS
• Enter­pri­se class secu­ri­ty fea­tures sup­port­ed by the AMD Secu­re Pro­ces­sor to help pro­tect sen­si­ti­ve data and vali­da­te code befo­re it is exe­cu­ted and AMD Memo­ry Guard for real-time DRAM memo­ry encryption
• Plan­ned pro­duct avai­la­bi­li­ty extends up to 10 years, pro­vi­ding cus­to­mers with a long-life­cy­cle sup­port roadmap

The AMD Ryzen Embedded R2000 Series will be show­ca­sed at the AMD booth (Hall 3A, Stand 239) at Embedded World 2022, June 21–23, in Nurem­berg, Ger­ma­ny, The full list of tech­no­lo­gy demons­tra­ti­ons in the Embedded World booth are available at the AMD event page.

Sup­port­ing Resources

• Learn more about the AMD Ryzen Embedded Family
• Ryzen Embedded R2000 Series Pro­duct Brief
• Fol­low AMD on Twit­ter
• Con­nect with AMD on Lin­ke­dIn

AMD Ryzen Embedded R2000 Series Eco­sys­tem Support

Advan­tech
“Advan­tech Inno­co­re is plea­sed to announ­ce a new addi­ti­on to the DPX‑S ran­ge of gam­ing plat­forms. As the 12^th gene­ra­ti­on of this field-pro­ven plat­form, DPX-S451 is desi­gned for use in slot machi­nes, casi­no games, and bet­ting ter­mi­nals. It is based on the new­ly released AMD Ryzen Embedded R2000 and offers an unbeata­ble com­bi­na­ti­on of com­pu­ting power, gra­phics per­for­mance, and secu­ri­ty fea­tures ide­al for regu­la­ted gam­ing. The R2000 SOC enables DPX-S451 to deli­ver supe­ri­or per­for­mance when com­pared to pre­vious gene­ra­ti­on solu­ti­ons (an over 33% increase) while main­tai­ning a com­pa­ra­tively low-cost point.” — Dirk Finstel, Asso­cia­te Vice Pre­si­dent Embedded IoT & CTO Euro­pe at Advantech

DFI
“DFI is inno­va­ti­ve in desig­ning small-size com­pu­ters with excep­tio­nal gra­phic per­for­mance for the indus­tri­al and embedded fields inclu­ding casi­nos, gam­ing, auto­ma­ti­on, machi­ne visi­on, health­ca­re and digi­tal signage. With the ground­brea­king AMD Ryzen Embedded R2000 Series, we expect to see many new oppor­tu­ni­ties for our pro­ducts to take our cus­to­mers’ appli­ca­ti­ons to a brand-new level through the advan­ced gra­phic pro­ces­sing and com­pu­ting capa­bi­li­ties. For appli­ca­ti­ons with strict space cons­traints, we are curr­ent­ly deve­lo­ping a new, small form fac­tor sin­gle board com­pu­ter that com­bi­nes our spe­cia­li­zed minia­tu­riza­ti­on tech­no­lo­gy with the AMD Ryzen Embedded R2000 for gra­phics-deman­ding, ultra-tiny, edge com­pu­ting solu­ti­ons. Expec­ta­ti­ons are to fur­ther redu­ce cur­rent edge appli­ca­ti­ons’ size with bet­ter over­all ima­ging and machi­ne visi­on ana­ly­sis per­for­mance.” — Jar­ry Chang, Seni­or PM Direc­tor, DFI

IBASE
“The AMD Ryzen Embedded R2000 pro­ces­sor fami­ly is built on the ground­brea­king “Zen 2” x86 core archi­tec­tu­re with impro­ved 14nm pro­cess tech­no­lo­gy, advan­ced VEGA Gra­phics and high-speed I/Os, offe­ring a strong per­for­mance upgrade from the R1000 Series. We are exci­ted to be able to imple­ment the hot­test Ryzen Embedded R2000 pro­ces­sor to our robust embedded plat­forms inclu­ding the MI993 Mini-ITX mother­board, SI-324-N2314 fan­less digi­tal signage play­er, and INA1600 desk­top uCPE/SD-WAN appli­ance. We look for­ward to pro­vi­ding the right solu­ti­ons and time-to-mar­ket advan­ta­ge to our cus­to­mers’ pro­jects in a wide ran­ge of mar­ket appli­ca­ti­ons.” — Albert Lee, Exe­cu­ti­ve Vice Pre­si­dent at IBASE

Sap­phi­re
“Sap­phi­re Tech­no­lo­gy is a long­stan­ding AMD part­ner and lea­ding sup­pli­er of com­pon­ents and solu­ti­ons for a broad ran­ge of con­su­mer and embedded pro­ducts, with exper­ti­se in next-gene­ra­ti­on mother­boards and gra­phics add, mini-STX and play-cen­tric appli­ca­ti­ons. By lever­aging the AMD Ryzen Embedded V1000 and R2000 SoCs in our latest Sap­phi­re boards, we can increase CPU and GPU per­for­mance in our NUC, mini-STX and thin mini-ITX form fac­tors, dri­ving extra­or­di­na­ry gra­phics capa­bi­li­ties, sup­port­ing up to four simul­ta­neous 4K reso­lu­ti­on dis­plays, and pro­vi­ding unpre­ce­den­ted per­for­mance-per-watt for our cus­to­mers.” — Adri­an Thomp­son, vice pre­si­dent of mar­ke­ting, Sap­phi­re Technology

About AMD

For more than 50 years AMD has dri­ven inno­va­ti­on in high-per­for­mance com­pu­ting, gra­phics and visua­liza­ti­on tech­no­lo­gies ― the buil­ding blocks for gam­ing, immersi­ve plat­forms and the dat­a­cen­ter. Hundreds of mil­li­ons of con­su­mers, lea­ding For­tu­ne 500 busi­nesses and cut­ting-edge sci­en­ti­fic rese­arch faci­li­ties around the world rely on AMD tech­no­lo­gy dai­ly to impro­ve how they live, work and play. AMD employees around the world are focu­sed on buil­ding gre­at pro­ducts that push the boun­da­ries of what is pos­si­ble. For more infor­ma­ti­on about how AMD is enab­ling today and inspi­ring tomor­row, visit the AMD (NASDAQ: AMD) web­site, blog, Face­book and Twit­ter pages.

Cau­tio­na­ry State­ment   

This press release con­ta­ins for­ward-loo­king state­ments con­cer­ning Advan­ced Micro Devices, Inc. (AMD) such as the fea­tures, func­tion­a­li­ty, per­for­mance, avai­la­bi­li­ty, timing and expec­ted bene­fits of the Ryzen™ Embedded R2000 Series, which are made pur­su­ant to the Safe Har­bor pro­vi­si­ons of the Pri­va­te Secu­ri­ties Liti­ga­ti­on Reform Act of 1995. For­ward-loo­king state­ments are com­mon­ly iden­ti­fied by words such as “would,” “may,” “expects,” “belie­ves,” “plans,” “intends,” “pro­jects” and other terms with simi­lar mea­ning. Inves­tors are cau­tio­ned that the for­ward-loo­king state­ments in this press release are based on cur­rent beliefs, assump­ti­ons and expec­ta­ti­ons, speak only as of the date of this press release and invol­ve risks and uncer­tain­ties that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons. Such state­ments are sub­ject to cer­tain known and unknown risks and uncer­tain­ties, many of which are dif­fi­cult to pre­dict and gene­ral­ly bey­ond AMD’s con­trol, that could cau­se actu­al results and other future events to dif­fer mate­ri­al­ly from tho­se expres­sed in, or impli­ed or pro­jec­ted by, the for­ward-loo­king infor­ma­ti­on and state­ments. Mate­ri­al fac­tors that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons include, wit­hout limi­ta­ti­on, the fol­lo­wing: Intel Corporation’s domi­nan­ce of the micro­pro­ces­sor mar­ket and its aggres­si­ve busi­ness prac­ti­ces; glo­bal eco­no­mic uncer­tain­ty; loss of a signi­fi­cant cus­to­mer; impact of the COVID-19 pan­de­mic on AMD’s busi­ness, finan­cial con­di­ti­on and results of ope­ra­ti­ons; com­pe­ti­ti­ve mar­kets in which AMD’s pro­ducts are sold; mar­ket con­di­ti­ons of the indus­tries in which AMD pro­ducts are sold; cycli­cal natu­re of the semi­con­duc­tor indus­try; quar­ter­ly and sea­so­nal sales pat­terns; AMD’s abili­ty to ade­qua­te­ly pro­tect its tech­no­lo­gy or other intellec­tu­al pro­per­ty; unfa­vorable cur­ren­cy exch­an­ge rate fluc­tua­tions; abili­ty of third par­ty manu­fac­tu­r­ers to manu­fac­tu­re AMD’s pro­ducts on a time­ly basis in suf­fi­ci­ent quan­ti­ties and using com­pe­ti­ti­ve tech­no­lo­gies; avai­la­bi­li­ty of essen­ti­al equip­ment, mate­ri­als, sub­stra­tes or manu­fac­tu­ring pro­ces­ses; abili­ty to achie­ve expec­ted manu­fac­tu­ring yields for AMD’s pro­ducts; AMD’s abili­ty to intro­du­ce pro­ducts on a time­ly basis with expec­ted fea­tures and per­for­mance levels; AMD’s abili­ty to gene­ra­te reve­nue from its semi-cus­tom SoC pro­ducts; poten­ti­al secu­ri­ty vul­nerabi­li­ties; poten­ti­al secu­ri­ty inci­dents inclu­ding IT outa­ges, data loss, data brea­ches and cyber-attacks; uncer­tain­ties invol­ving the orde­ring and ship­ment of AMD’s pro­ducts; AMD’s reli­ance on third-par­ty intellec­tu­al pro­per­ty to design and intro­du­ce new pro­ducts in a time­ly man­ner; AMD’s reli­ance on third-par­ty com­pa­nies for design, manu­fac­tu­re and sup­p­ly of mother­boards, soft­ware and other com­pu­ter plat­form com­pon­ents; AMD’s reli­ance on Micro­soft and other soft­ware ven­dors’ sup­port to design and deve­lop soft­ware to run on AMD’s pro­ducts; AMD’s reli­ance on third-par­ty dis­tri­bu­tors and add-in-board part­ners; impact of modi­fi­ca­ti­on or inter­rup­ti­on of AMD’s inter­nal busi­ness pro­ces­ses and infor­ma­ti­on sys­tems; com­pa­ti­bi­li­ty of AMD’s pro­ducts with some or all indus­try-stan­dard soft­ware and hard­ware; cos­ts rela­ted to defec­ti­ve pro­ducts; effi­ci­en­cy of AMD’s sup­p­ly chain; AMD’s abili­ty to rely on third par­ty sup­p­ly-chain logi­stics func­tions; AMD’s abili­ty to effec­tively con­trol sales of its pro­ducts on the gray mar­ket; impact of govern­ment actions and regu­la­ti­ons such as export admi­nis­tra­ti­on regu­la­ti­ons, tariffs and trade pro­tec­tion mea­su­res; AMD’s abili­ty to rea­li­ze its defer­red tax assets; poten­ti­al tax lia­bi­li­ties; cur­rent and future claims and liti­ga­ti­on; impact of envi­ron­men­tal laws, con­flict mine­rals-rela­ted pro­vi­si­ons and other laws or regu­la­ti­ons; impact of acqui­si­ti­ons, joint ven­tures and/or invest­ments on AMD’s busi­ness, and abili­ty to inte­gra­te acqui­red busi­nesses, such as Xilinx;  impact of any impair­ment of the com­bi­ned company’s assets on the com­bi­ned company’s finan­cial posi­ti­on and results of ope­ra­ti­on; rest­ric­tions impo­sed by agree­ments gover­ning AMD’s notes, the gua­ran­tees of Xilinx’s notes and the revol­ving cre­dit faci­li­ty; AMD’s indeb­ted­ness; AMD’s abili­ty to gene­ra­te suf­fi­ci­ent cash to meet its working capi­tal requi­re­ments or gene­ra­te suf­fi­ci­ent reve­nue and ope­ra­ting cash flow to make all of its plan­ned R&D or stra­te­gic invest­ments; poli­ti­cal, legal, eco­no­mic risks and natu­ral dis­as­ters; future impairm­ents of good­will and tech­no­lo­gy licen­se purcha­ses; AMD’s abili­ty to attract and retain qua­li­fied per­son­nel; AMD’s stock pri­ce vola­ti­li­ty; and world­wi­de poli­ti­cal con­di­ti­ons. Inves­tors are urged to review in detail the risks and uncer­tain­ties in AMD’s Secu­ri­ties and Exch­an­ge Com­mis­si­on filings, inclu­ding but not limi­t­ed to AMD’s most recent reports on Forms 10‑K and 10‑Q. 

©2022 Advan­ced Micro Devices, Inc. All rights reser­ved. AMD, the AMD Arrow logo, Rade­on, Ryzen, and com­bi­na­ti­ons the­reof are trade­marks of Advan­ced Micro Devices, Inc. 3DMark is a trade­mark of Future­mark Cor­po­ra­ti­on. Dis­play­Po­rt™ and the Dis­play­Po­rt™ logo are trade­marks owned by the Video Elec­tro­nics Stan­dards Asso­cia­ti­on (VESA®) in the United Sta­tes and other count­ries. HDMI, the HDMI logo and High-Defi­ni­ti­on Mul­ti­me­dia Inter­face are trade­marks or regis­tered trade­marks of HDMI Licen­sing, LLC in the United Sta­tes and/or other count­ries. PCIe is a regis­tered trade­mark of PCI-SIG Cor­po­ra­ti­on. Other pro­duct names used in this publi­ca­ti­on are for iden­ti­fi­ca­ti­on pur­po­ses only and may be trade­marks of their respec­ti­ve companies.

^[1] Ryzen™ Embedded R2000 SoC offers up to 4 CPU cores. Ryzen™ Embedded R1000 SoC offers up to 2 CPU cores. EMB-178
^[2] Test­ing con­duc­ted by AMD Embedded Soft­ware Engi­nee­ring Labs as of June 1st, 2022 on the Ryzen™ Embedded R2514 and Ryzen™ Embedded R1606G pro­ces­sors on AMD R2000 Deve­lo­p­ment plat­form run­ning Win­dows 10 Enter­pri­se ver­si­on 21H2 on Pass­mark v10 — CPU Mark. The R2514 sys­tem used DDR4-2667 RAM, AMD Rade­on™ Gra­phics (dri­ver ver­si­on: 22.20–220506a-379436E) and BIOS TBP1000B. The R1606G sys­tem used DDR4-2400 RAM, AMD Rade­on™ Gra­phics (dri­ver ver­si­on: 21.50.18–220315a-378119C), and BIOS RBB1208B. Results may vary. EMB-184
^[3] Test­ing con­duc­ted by AMD Embedded Soft­ware Engi­nee­ring Labs as of June 1st, 2022 on the Ryzen™ Embedded R2514 and Ryzen™ Embedded R1606G pro­ces­sors on AMD R2000 Deve­lo­p­ment plat­form run­ning Win­dows 10 Enter­pri­se ver­si­on 21H2 on 3DMark® 11–3DMarkscore. The R2514 sys­tem used DDR4-2667 RAM, AMD Rade­on™ Gra­phics (dri­ver ver­si­on: 22.20–220506a-379436E) and BIOS TBP1000B. The R1606G sys­tem used DDR4-2400 RAM, AMD Rade­on™ Gra­phics (dri­ver ver­si­on: 21.50.18–220315a-378119C), and BIOS RBB1208B. Results may vary. EMB-182
^[4] Ryzen™ Embedded R2544 SoC offers dual-chan­nel 64-bit DDR4 up to 3200 MT/s. Ryzen™ Embedded R1606G SoC offers dual-chan­nel 64-bit DDR4 up to 2400 MT/s. EMB-179
^[5] Ryzen™ Embedded R2000 SoC offers up to 16 lanes of PCIe Gen3. Ryzen™ Embedded R1000 SoC offers up to 8 lanes of PCIe Gen3. EMB-180