AMD Launches Ryzen 7000 Series Desktop Processors with ‚ÄúZen 4‚ÄĚ Architecture: the Fastest Core in Gaming¬Ļ

New AMD Socket AM5 platform combines with world’s first 5nm desktop PC processors to deliver powerhouse performance for gamers and content creators

AUSTIN, Texas, Aug. 29, 2022 (GLOBE NEWSWIRE) ‚ÄĒ Today, AMD (NASDAQAMD) reve¬≠a¬≠led the Ryzen‚ĄĘ 7000 Series Desk¬≠top pro¬≠ces¬≠sor lin¬≠e¬≠up powered by the new ‚ÄúZen 4‚ÄĚ archi¬≠tec¬≠tu¬≠re, ushe¬≠ring in the next era of high per¬≠for¬≠mance for gamers, enthu¬≠si¬≠asts, and con¬≠tent crea¬≠tors. Fea¬≠turing up to 16 cores, 32 threads and built on an opti¬≠mi¬≠zed, high-per¬≠for¬≠mance, TSMC 5nm pro¬≠cess node, the Ryzen 7000 Series pro¬≠ces¬≠sors deli¬≠ver domi¬≠nant per¬≠for¬≠mance and lea¬≠der¬≠ship ener¬≠gy effi¬≠ci¬≠en¬≠cy. Com¬≠pared to the pre¬≠vious gene¬≠ra¬≠ti¬≠on, AMD Ryzen 7950X pro¬≠ces¬≠sor enables sin¬≠gle-core per¬≠for¬≠mance impro¬≠ve¬≠ment of up to +29%2, up to 45% more com¬≠pu¬≠te for con¬≠tent crea¬≠tors in POV Ray3, up to 15% fas¬≠ter gam¬≠ing per¬≠for¬≠mance in sel¬≠ect titles4, and up to 27% bet¬≠ter per¬≠for¬≠mance-per-watt5. AMD‚Äôs most expan¬≠si¬≠ve desk¬≠top plat¬≠form to date, the new Socket AM5 plat¬≠form is desi¬≠gned for lon¬≠ge¬≠vi¬≠ty with sup¬≠port through 2025.

‚ÄúThe AMD Ryzen 7000 Series brings lea¬≠der¬≠ship gam¬≠ing per¬≠for¬≠mance, extra¬≠or¬≠di¬≠na¬≠ry power for con¬≠tent crea¬≠ti¬≠on, and advan¬≠ced sca¬≠la¬≠bi¬≠li¬≠ty with the new AMD Socket AM5,‚ÄĚ Saeid Mosh¬≠kela¬≠ni, seni¬≠or vice pre¬≠si¬≠dent and gene¬≠ral mana¬≠ger, Cli¬≠ent busi¬≠ness unit, AMD. ‚ÄúWith the next gene¬≠ra¬≠ti¬≠on Ryzen 7000 Series Desk¬≠top pro¬≠ces¬≠sors, we are proud to uphold our pro¬≠mi¬≠se of lea¬≠der¬≠ship and con¬≠ti¬≠nuous inno¬≠va¬≠ti¬≠on, deli¬≠ve¬≠ring the ulti¬≠ma¬≠te PC expe¬≠ri¬≠ence for gamers and crea¬≠tors alike.‚ÄĚ

AMD Ryzen 7000 Series Desk­top Processors

The AMD Ryzen 7000 Series once again deli¬≠vers a dou¬≠ble-digit IPC uplift over ‚ÄúZen 3‚ÄĚ6, fur¬≠ther soli¬≠di¬≠fy¬≠ing a track record of inno¬≠va¬≠ti¬≠on, exe¬≠cu¬≠ti¬≠on, and deli¬≠very of the award-win¬≠ning ‚ÄúZen‚ÄĚ archi¬≠tec¬≠tu¬≠re. The world‚Äôs first high-per¬≠for¬≠mance x86 5nm CPU, the Ryzen 7000 Series ushers in the remar¬≠kab¬≠le speed of ‚ÄúZen 4‚ÄĚ archi¬≠tec¬≠tu¬≠re, advan¬≠cing gam¬≠ing and con¬≠tent crea¬≠ti¬≠on per¬≠for¬≠mance lea¬≠der¬≠ship to new levels.

At the top of the stack, the 16-core AMD Ryzen 9 7950X pro¬≠ces¬≠sor offers up to 57% bet¬≠ter con¬≠tent crea¬≠ti¬≠on per¬≠for¬≠mance in V‚ÄĎRay Ren¬≠der com¬≠pared to the com¬≠pe¬≠ti¬≠ti¬≠on7. Mean¬≠while, even the 6‚ÄĎcore AMD Ryzen 5 7600X pro¬≠ces¬≠sor offers an avera¬≠ge of 5% fas¬≠ter gam¬≠ing per¬≠for¬≠mance across sel¬≠ect titles than the competitor‚Äôs flag¬≠ship gam¬≠ing pro¬≠ces¬≠sor4.

The incre­di­ble per­for­mance impro­ve­ments also come with stun­ning advan­ces in ener­gy effi­ci­en­cy; AMD Ryzen 7950X pro­ces­sor is up to 47% more ener­gy effi­ci­ent than the com­pe­ti­ti­on8. Bey­ond the core, the Ryzen 7000 Series Pro­ces­sors fea­ture an all-new 6nm I/O die, which enables hard­ware-acce­le­ra­ted video encode/decode9, light-duty gra­phics work and mul­ti-dis­play sup­port. Across the CPU, a host of new power manage­ment tech­no­lo­gies lever­a­ged from AMD’s ultra-effi­ci­ent mobi­le pro­ces­sors allow Ryzen 7000 Series Desk­top pro­ces­sors to run more effi­ci­ent­ly than ever before.

Ryzen 7000 Series Desk¬≠top pro¬≠ces¬≠sors are expec¬≠ted to be available glo¬≠bal¬≠ly from lea¬≠ding etail¬≠ers and retail¬≠ers begin¬≠ning Sep¬≠tem¬≠ber 27, start¬≠ing at an SEP of $299 USD.

 Model  Cores/Threads  Boost10/
 Base Frequency
 Total Cache  PCIe¬ģ  TDP  SEP
 (USD)
 AMD Ryzen 9 7950X  16C/32T  Up to 5.7 / 4.5 GHZ  80MB  Gen 5  170W  $699
 AMD Ryzen 9 7900X  12C/24T  Up to 5.6 / 4.7 GHZ  76MB  Gen 5  170W  $549
 AMD Ryzen 7 7700X  8C/16T  Up to 5.4 / 4.5 GHZ  40MB  Gen 5  105W  $399
 AMD Ryzen 5 7600X  6C/12T  Up to 5.3 / 4.7 GHZ  38MB  Gen 5  105W  $299


New AMD Socket AM5 Updates

With the intro¬≠duc¬≠tion of the Ryzen 7000 Series Desk¬≠top pro¬≠ces¬≠sors, AMD also unvei¬≠led the new Socket AM5 plat¬≠form, offe¬≠ring cut¬≠ting-edge con¬≠nec¬≠ti¬≠vi¬≠ty fea¬≠tures like dual-chan¬≠nel DDR5 memo¬≠ry. The AM5 plat¬≠form also includes up to 24 PCIe¬ģ 5.0 lanes, making it AMD‚Äôs most expan¬≠si¬≠ve desk¬≠top plat¬≠form to date. Sup¬≠port for new and evol¬≠ving tech¬≠no¬≠lo¬≠gies like PCIe¬ģ Gen 5 and DDR5 memo¬≠ry empowers users to grow with their Socket AM5 solu¬≠ti¬≠on, which AMD will sup¬≠port with plat¬≠form lon¬≠ge¬≠vi¬≠ty through 2025 and beyond.

The new Socket AM5 mother­board fami­ly fea­tures four new chip­sets, giving users the power and fle­xi­bi­li­ty to choo­se the exact fea­tures they want. The four chip­sets feature:

  • AMD X670 Extre¬≠me: Brin¬≠ging the most con¬≠nec¬≠ti¬≠vi¬≠ty and extre¬≠me over¬≠clo¬≠cking capa¬≠bi¬≠li¬≠ties11 with PCIe 5.0 sup¬≠port for gra¬≠phics and storage
  • AMD X670: Sup¬≠port¬≠ing enthu¬≠si¬≠ast over¬≠clo¬≠cking with PCIe¬ģ 5.0 sup¬≠port for sto¬≠rage and optio¬≠nal gra¬≠phics support
  • AMD B650E: Desi¬≠gned for per¬≠for¬≠mance users with PCIe¬ģ 5.0 sto¬≠rage sup¬≠port and optio¬≠nal gra¬≠phics support
  • AMD B650: Desi¬≠gned for main¬≠stream users with sup¬≠port for DDR5 memo¬≠ry and optio¬≠nal PCIe¬ģ 5.0 support

New mother­boards will be available start­ing at an SEP of $125 USD, with the AMD X670 and X670E chip­sets arri­ving in Sep­tem­ber, and AMD B650E and B650 chip­sets in October.

AMD EXPO‚ĄĘ Technology

New for the Ryzen 7000 Series Desk¬≠top pro¬≠ces¬≠sors and opti¬≠mi¬≠zed for AMD Socket AM5 mother¬≠boards, AMD EXPO‚ĄĘ tech¬≠no¬≠lo¬≠gy pro¬≠vi¬≠des users with advan¬≠ced pro¬≠fi¬≠le set¬≠tings for DDR5 memo¬≠ry over¬≠clo¬≠cking11. When opti¬≠mi¬≠zed for high-per¬≠for¬≠mance gam¬≠ing, con¬≠su¬≠mers can expect to see up to 11% fas¬≠ter gam¬≠ing per¬≠for¬≠mance with AMD EXPO tech¬≠no¬≠lo¬≠gy in F1¬ģ 202212.

AMD EXPO tech¬≠no¬≠lo¬≠gy was desi¬≠gned to achie¬≠ve hig¬≠her gam¬≠ing per¬≠for¬≠mance from pre-con¬≠fi¬≠gu¬≠red over¬≠clo¬≠cking pro¬≠files11 and is easy to imple¬≠ment. PC enthu¬≠si¬≠asts who want to under¬≠stand the finer details of an AMD EXPO tech¬≠no¬≠lo¬≠gy-enab¬≠led modu¬≠le can find public self-cer¬≠ti¬≠fi¬≠ca¬≠ti¬≠on reports, which cle¬≠ar¬≠ly lay out the module‚Äôs full timing table, com¬≠pon¬≠ents, and the sys¬≠tem con¬≠fi¬≠gu¬≠ra¬≠ti¬≠on used to fina¬≠li¬≠ze the memory‚Äôs spe¬≠ci¬≠fi¬≠ca¬≠ti¬≠ons. AMD is offe¬≠ring EXPO tech¬≠no¬≠lo¬≠gy to its indus¬≠try memo¬≠ry part¬≠ners wit¬≠hout royal¬≠ties or licen¬≠sing fees.

AMD EXPO tech­no­lo­gy arri­ves to mar­ket along­side the AMD Ryzen 7000 Series pro­ces­sors, with offe­rings from ADATA, Cor­sair, GeIL, G.SKILL, and King­s­ton. Over 15 AMD EXPO tech­no­lo­gy-enab­led memo­ry kits will be initi­al­ly available, with memo­ry speeds up to DDR5-6400.

Sup­port­ing Resources

  • Learn more about AMD Ryzen 7000 Series Desk¬≠top pro¬≠ces¬≠sors here
  • Learn more about AMD EXPO here
  • Beco¬≠me a fan of AMD on Face¬≠book
  • Fol¬≠low AMD on Twit¬≠ter 

About AMD
For more than 50 years AMD has dri¬≠ven inno¬≠va¬≠ti¬≠on in high-per¬≠for¬≠mance com¬≠pu¬≠ting, gra¬≠phics and visua¬≠liza¬≠ti¬≠on tech¬≠no¬≠lo¬≠gies. Bil¬≠li¬≠ons of peo¬≠p¬≠le, lea¬≠ding For¬≠tu¬≠ne 500 busi¬≠nesses and cut¬≠ting-edge sci¬≠en¬≠ti¬≠fic rese¬≠arch insti¬≠tu¬≠ti¬≠ons around the world rely on AMD tech¬≠no¬≠lo¬≠gy dai¬≠ly to impro¬≠ve how they live, work and play. AMD employees are focu¬≠sed on buil¬≠ding lea¬≠der¬≠ship high-per¬≠for¬≠mance and adap¬≠ti¬≠ve pro¬≠ducts that push the boun¬≠da¬≠ries of what is pos¬≠si¬≠ble. For more infor¬≠ma¬≠ti¬≠on about how AMD is enab¬≠ling today and inspi¬≠ring tomor¬≠row, visit the AMD (NASDAQ: AMDweb¬≠siteblogLin¬≠ke¬≠dIn and Twit¬≠ter pages.

Cau­tio­na­ry Statement
This press release con¬≠ta¬≠ins for¬≠ward-loo¬≠king state¬≠ments con¬≠cer¬≠ning Advan¬≠ced Micro Devices, Inc. (AMD) such the fea¬≠tures, func¬≠tion¬≠a¬≠li¬≠ty, per¬≠for¬≠mance, avai¬≠la¬≠bi¬≠li¬≠ty, timing and expec¬≠ted bene¬≠fits of AMD pro¬≠ducts inclu¬≠ding the AMD Ryzen‚ĄĘ 7000 desk¬≠top pro¬≠ces¬≠sors, the AMD Socket AM5 plat¬≠form and AMD EXPO‚ĄĘ tech¬≠no¬≠lo¬≠gy, which are made pur¬≠su¬≠ant to the Safe Har¬≠bor pro¬≠vi¬≠si¬≠ons of the Pri¬≠va¬≠te Secu¬≠ri¬≠ties Liti¬≠ga¬≠ti¬≠on Reform Act of 1995. For¬≠ward-loo¬≠king state¬≠ments are com¬≠mon¬≠ly iden¬≠ti¬≠fied by words such as ‚Äúwould,‚ÄĚ ‚Äúmay,‚ÄĚ ‚Äúexpects,‚ÄĚ ‚Äúbelie¬≠ves,‚ÄĚ ‚Äúplans,‚ÄĚ ‚Äúintends,‚ÄĚ ‚Äúpro¬≠jects‚ÄĚ and other terms with simi¬≠lar mea¬≠ning. Inves¬≠tors are cau¬≠tio¬≠ned that the for¬≠ward-loo¬≠king state¬≠ments in this press release are based on cur¬≠rent beliefs, assump¬≠ti¬≠ons and expec¬≠ta¬≠ti¬≠ons, speak only as of the date of this press release and invol¬≠ve risks and uncer¬≠tain¬≠ties that could cau¬≠se actu¬≠al results to dif¬≠fer mate¬≠ri¬≠al¬≠ly from cur¬≠rent expec¬≠ta¬≠ti¬≠ons. Such state¬≠ments are sub¬≠ject to cer¬≠tain known and unknown risks and uncer¬≠tain¬≠ties, many of which are dif¬≠fi¬≠cult to pre¬≠dict and gene¬≠ral¬≠ly bey¬≠ond AMD‚Äôs con¬≠trol, that could cau¬≠se actu¬≠al results and other future events to dif¬≠fer mate¬≠ri¬≠al¬≠ly from tho¬≠se expres¬≠sed in, or impli¬≠ed or pro¬≠jec¬≠ted by, the for¬≠ward-loo¬≠king infor¬≠ma¬≠ti¬≠on and state¬≠ments. Mate¬≠ri¬≠al fac¬≠tors that could cau¬≠se actu¬≠al results to dif¬≠fer mate¬≠ri¬≠al¬≠ly from cur¬≠rent expec¬≠ta¬≠ti¬≠ons include, wit¬≠hout limi¬≠ta¬≠ti¬≠on, the fol¬≠lo¬≠wing: Intel Corporation‚Äôs domi¬≠nan¬≠ce of the micro¬≠pro¬≠ces¬≠sor mar¬≠ket and its aggres¬≠si¬≠ve busi¬≠ness prac¬≠ti¬≠ces; glo¬≠bal eco¬≠no¬≠mic uncer¬≠tain¬≠ty; loss of a signi¬≠fi¬≠cant cus¬≠to¬≠mer; impact of the COVID-19 pan¬≠de¬≠mic on AMD‚Äôs busi¬≠ness, finan¬≠cial con¬≠di¬≠ti¬≠on and results of ope¬≠ra¬≠ti¬≠ons; com¬≠pe¬≠ti¬≠ti¬≠ve mar¬≠kets in which AMD‚Äôs pro¬≠ducts are sold; mar¬≠ket con¬≠di¬≠ti¬≠ons of the indus¬≠tries in which AMD pro¬≠ducts are sold; cycli¬≠cal natu¬≠re of the semi¬≠con¬≠duc¬≠tor indus¬≠try; quar¬≠ter¬≠ly and sea¬≠so¬≠nal sales pat¬≠terns; AMD‚Äôs abili¬≠ty to ade¬≠qua¬≠te¬≠ly pro¬≠tect its tech¬≠no¬≠lo¬≠gy or other intellec¬≠tu¬≠al pro¬≠per¬≠ty; unfa¬≠vorable cur¬≠ren¬≠cy exch¬≠an¬≠ge rate fluc¬≠tua¬≠tions; abili¬≠ty of third par¬≠ty manu¬≠fac¬≠tu¬≠r¬≠ers to manu¬≠fac¬≠tu¬≠re AMD‚Äôs pro¬≠ducts on a time¬≠ly basis in suf¬≠fi¬≠ci¬≠ent quan¬≠ti¬≠ties and using com¬≠pe¬≠ti¬≠ti¬≠ve tech¬≠no¬≠lo¬≠gies; avai¬≠la¬≠bi¬≠li¬≠ty of essen¬≠ti¬≠al equip¬≠ment, mate¬≠ri¬≠als, sub¬≠stra¬≠tes or manu¬≠fac¬≠tu¬≠ring pro¬≠ces¬≠ses; abili¬≠ty to achie¬≠ve expec¬≠ted manu¬≠fac¬≠tu¬≠ring yields for AMD‚Äôs pro¬≠ducts; AMD‚Äôs abili¬≠ty to intro¬≠du¬≠ce pro¬≠ducts on a time¬≠ly basis with expec¬≠ted fea¬≠tures and per¬≠for¬≠mance levels; AMD‚Äôs abili¬≠ty to gene¬≠ra¬≠te reve¬≠nue from its semi-cus¬≠tom SoC pro¬≠ducts; poten¬≠ti¬≠al secu¬≠ri¬≠ty vul¬≠nerabi¬≠li¬≠ties; poten¬≠ti¬≠al secu¬≠ri¬≠ty inci¬≠dents inclu¬≠ding IT outa¬≠ges, data loss, data brea¬≠ches and cyber-attacks; poten¬≠ti¬≠al dif¬≠fi¬≠cul¬≠ties in upgrading and ope¬≠ra¬≠ting AMD‚Äôs new enter¬≠pri¬≠se resour¬≠ce plan¬≠ning sys¬≠tem; uncer¬≠tain¬≠ties invol¬≠ving the orde¬≠ring and ship¬≠ment of AMD‚Äôs pro¬≠ducts; AMD‚Äôs reli¬≠ance on third-par¬≠ty intellec¬≠tu¬≠al pro¬≠per¬≠ty to design and intro¬≠du¬≠ce new pro¬≠ducts in a time¬≠ly man¬≠ner; AMD‚Äôs reli¬≠ance on third-par¬≠ty com¬≠pa¬≠nies for design, manu¬≠fac¬≠tu¬≠re and sup¬≠p¬≠ly of mother¬≠boards, soft¬≠ware and other com¬≠pu¬≠ter plat¬≠form com¬≠pon¬≠ents; AMD‚Äôs reli¬≠ance on Micro¬≠soft and other soft¬≠ware ven¬≠dors‚Äô sup¬≠port to design and deve¬≠lop soft¬≠ware to run on AMD‚Äôs pro¬≠ducts; AMD‚Äôs reli¬≠ance on third-par¬≠ty dis¬≠tri¬≠bu¬≠tors and add-in-board part¬≠ners; impact of modi¬≠fi¬≠ca¬≠ti¬≠on or inter¬≠rup¬≠ti¬≠on of AMD‚Äôs inter¬≠nal busi¬≠ness pro¬≠ces¬≠ses and infor¬≠ma¬≠ti¬≠on sys¬≠tems; com¬≠pa¬≠ti¬≠bi¬≠li¬≠ty of AMD‚Äôs pro¬≠ducts with some or all indus¬≠try-stan¬≠dard soft¬≠ware and hard¬≠ware; cos¬≠ts rela¬≠ted to defec¬≠ti¬≠ve pro¬≠ducts; effi¬≠ci¬≠en¬≠cy of AMD‚Äôs sup¬≠p¬≠ly chain; AMD‚Äôs abili¬≠ty to rely on third par¬≠ty sup¬≠p¬≠ly-chain logi¬≠stics func¬≠tions; AMD‚Äôs abili¬≠ty to effec¬≠tively con¬≠trol sales of its pro¬≠ducts on the gray mar¬≠ket; impact of govern¬≠ment actions and regu¬≠la¬≠ti¬≠ons such as export admi¬≠nis¬≠tra¬≠ti¬≠on regu¬≠la¬≠ti¬≠ons, tariffs and trade pro¬≠tec¬≠tion mea¬≠su¬≠res; AMD‚Äôs abili¬≠ty to rea¬≠li¬≠ze its defer¬≠red tax assets; poten¬≠ti¬≠al tax lia¬≠bi¬≠li¬≠ties; cur¬≠rent and future claims and liti¬≠ga¬≠ti¬≠on; impact of envi¬≠ron¬≠men¬≠tal laws, con¬≠flict mine¬≠rals-rela¬≠ted pro¬≠vi¬≠si¬≠ons and other laws or regu¬≠la¬≠ti¬≠ons; impact of acqui¬≠si¬≠ti¬≠ons, joint ven¬≠tures and/or invest¬≠ments, inclu¬≠ding acqui¬≠si¬≠ti¬≠ons of Xilinx and Pen¬≠san¬≠do, on AMD‚Äôs busi¬≠ness and AMD‚Äôs abili¬≠ty to inte¬≠gra¬≠te acqui¬≠red busi¬≠nesses;  impact of any impair¬≠ment of the com¬≠bi¬≠ned company‚Äôs assets on the com¬≠bi¬≠ned company‚Äôs finan¬≠cial posi¬≠ti¬≠on and results of ope¬≠ra¬≠ti¬≠on; rest¬≠ric¬≠tions impo¬≠sed by agree¬≠ments gover¬≠ning AMD‚Äôs notes, the gua¬≠ran¬≠tees of Xilinx‚Äôs notes and the revol¬≠ving cre¬≠dit faci¬≠li¬≠ty; AMD‚Äôs indeb¬≠ted¬≠ness; AMD‚Äôs abili¬≠ty to gene¬≠ra¬≠te suf¬≠fi¬≠ci¬≠ent cash to meet its working capi¬≠tal requi¬≠re¬≠ments or gene¬≠ra¬≠te suf¬≠fi¬≠ci¬≠ent reve¬≠nue and ope¬≠ra¬≠ting cash flow to make all of its plan¬≠ned R&D or stra¬≠te¬≠gic invest¬≠ments; poli¬≠ti¬≠cal, legal, eco¬≠no¬≠mic risks and natu¬≠ral dis¬≠as¬≠ters; future impairm¬≠ents of good¬≠will and tech¬≠no¬≠lo¬≠gy licen¬≠se purcha¬≠ses; AMD‚Äôs abili¬≠ty to attract and retain qua¬≠li¬≠fied per¬≠son¬≠nel; AMD‚Äôs stock pri¬≠ce vola¬≠ti¬≠li¬≠ty; and world¬≠wi¬≠de poli¬≠ti¬≠cal con¬≠di¬≠ti¬≠ons. Inves¬≠tors are urged to review in detail the risks and uncer¬≠tain¬≠ties in AMD‚Äôs Secu¬≠ri¬≠ties and Exch¬≠an¬≠ge Com¬≠mis¬≠si¬≠on filings, inclu¬≠ding but not limi¬≠t¬≠ed to AMD‚Äôs most recent reports on Forms 10‚ÄĎK and 10‚ÄĎQ.

¬©2022 Advan¬≠ced Micro Devices, Inc.  All rights reser¬≠ved. AMD, the AMD Arrow logo, AMD Expo, Ryzen, Smart Access Memo¬≠ry, Thre¬≠ad¬≠rip¬≠per, and com¬≠bi¬≠na¬≠ti¬≠ons the¬≠reof are trade¬≠marks of Advan¬≠ced Micro Devices, Inc. Other pro¬≠duct names used her¬≠ein are for iden¬≠ti¬≠fi¬≠ca¬≠ti¬≠on pur¬≠po¬≠ses and may be trade¬≠marks of their respec¬≠ti¬≠ve owners. 

1. RPL-010: Test¬≠ing as of 15 August, 2022, by AMD Per¬≠for¬≠mance Labs using the fol¬≠lo¬≠wing hard¬≠ware: AMD AM5 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 7950X/7900X/7700X/7600X and G.Skill DDR5-6000C30, ver¬≠sus AMD AM4 Refe¬≠rence Mother¬≠board with Ryzen‚ĄĘ 9 5950X and DDR4-3600C16, ver¬≠sus ROG Maxi¬≠mus Z690 Hero mother¬≠board with Core i9-12900KS and DDR5-6000C30. ALL SYSTEMS con¬≠fi¬≠gu¬≠red with NXZT Kra¬≠ken X63, open air test bench, Rade¬≠on‚ĄĘ RX 6950XT (dri¬≠ver 22.7.1 Optio¬≠nal), Win¬≠dows¬ģ 11 22000.856, AMD Smart Access Memory/PCIe¬ģ Resizable Base Address Regis¬≠ter (‚ÄúReBAR‚ÄĚ) ON, Vir¬≠tua¬≠liza¬≠ti¬≠on-Based Secu¬≠ri¬≠ty (VBSOFF.
2. RPL-006: Test¬≠ing with Geek¬≠bench 5.4.x as of 15 August, 2022, by AMD Per¬≠for¬≠mance Labs using the fol¬≠lo¬≠wing hard¬≠ware: AMD AM5 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 9 7950X and G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ, ver¬≠sus AMD AM4 Refe¬≠rence Mother¬≠board with Ryzen‚ĄĘ 9 5950X and DDR4-3600C16. ALL SYSTEMS con¬≠fi¬≠gu¬≠red with NXZT Kra¬≠ken X63, open air test bench, Rade¬≠on‚ĄĘ RX 6950XT (dri¬≠ver 22.7.1 Optio¬≠nal), Win¬≠dows¬ģ 11 22000.856, AMD Smart Access Memory/PCIe¬ģ Resizable Base Address Regis¬≠ter (‚ÄúReBAR‚ÄĚ) ON, Vir¬≠tua¬≠liza¬≠ti¬≠on-Based Secu¬≠ri¬≠ty (VBS) OFF. Results may vary.

3. RPL-008: Test¬≠ing as of 15 August, 2022, by AMD Per¬≠for¬≠mance Labs using the fol¬≠lo¬≠wing hard¬≠ware: AMD AM5 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 9 7950X with G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ loa¬≠ded, AMD AM4 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 9 5950X and DDR4-3600C16, and ROG Maxi¬≠mus Z690 Hero with Core i9-12900K and G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ loa¬≠ded. ALL SYSTEMS con¬≠fi¬≠gu¬≠red with NXZT Kra¬≠ken X63, open air test bench, Rade¬≠on‚ĄĘ RX 6950XT (dri¬≠ver 22.7.1 Optio¬≠nal), Win¬≠dows¬ģ 11 22000.856, AMD Smart Access Memory/PCIe¬ģ Resizable Base Address Regis¬≠ter (‚ÄúReBAR‚ÄĚ) ON, Vir¬≠tua¬≠liza¬≠ti¬≠on-Based Secu¬≠ri¬≠ty (VBS) OFF. Results may vary.
4. RPL-007: Test¬≠ing as of 15 August, 2022, by AMD Per¬≠for¬≠mance Labs using the fol¬≠lo¬≠wing hard¬≠ware: AMD Socket AM5 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 9 7950X, Ryzen‚ĄĘ 9 7900X, Ryzen‚ĄĘ 5 7600X and G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ; ver¬≠sus AMD Socket AM4 Refe¬≠rence Mother¬≠board with Ryzen‚ĄĘ 9 5950X, Ryzen‚ĄĘ 9 5900X, Ryzen‚ĄĘ 5 5600X; ver¬≠sus ROG Maxi¬≠mus Z690 Hero with Core i9-12900K and G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ loa¬≠ded. ALL SYSTEMS con¬≠fi¬≠gu¬≠red with NXZT Kra¬≠ken X63, open air test bench, Rade¬≠on‚ĄĘ RX 6950XT (dri¬≠ver 22.7.1 Optio¬≠nal), Win¬≠dows¬ģ 11 22000.856, AMD Smart Access Memory/PCIe¬ģ Resizable Base Address Regis¬≠ter (‚ÄúReBAR‚ÄĚ) ON, Vir¬≠tua¬≠liza¬≠ti¬≠on-Based Secu¬≠ri¬≠ty (VBS) OFF. All games tes¬≠ted at 1920x1080 with HIGH in-game pre¬≠set and the chro¬≠no¬≠lo¬≠gi¬≠cal¬≠ly newest gra¬≠phics indus¬≠try API available within the game‚Äôs ren¬≠de¬≠ring engi¬≠ne (e.g. Vul¬≠kan¬ģ over OpenGL‚ĄĘ, DirectX¬ģ 12 over DirectX¬ģ 11). Results may vary.
5. RPL-014: Test¬≠ing as of 15 August, 2022, by AMD Per¬≠for¬≠mance Labs using the fol¬≠lo¬≠wing hard¬≠ware: AMD AM5 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 9 7950X with G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ loa¬≠ded, AMD AM4 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 9 5950X and DDR4-3600C16. ALL SYSTEMS con¬≠fi¬≠gu¬≠red with NXZT Kra¬≠ken X63, open air test bench, Rade¬≠on‚ĄĘ RX 6950XT (dri¬≠ver 22.7.1 Optio¬≠nal), Win¬≠dows¬ģ 11 22000.856, AMD Smart Access Memory/PCIe¬ģ Resizable Base Address Regis¬≠ter (‚ÄúReBAR‚ÄĚ) ON, Vir¬≠tua¬≠liza¬≠ti¬≠on-Based Secu¬≠ri¬≠ty (VBS) OFF. Pro¬≠ces¬≠sor power mea¬≠su¬≠red at the packa¬≠ge, per¬≠for¬≠mance mea¬≠su¬≠red in Cine¬≠bench R23 nT score. Results may vary.
6. RPL-005: Test¬≠ing as of 15 August, 2022, by AMD Per¬≠for¬≠mance Labs using the fol¬≠lo¬≠wing hard¬≠ware: AMD AM5 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 7 7700X with G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ loa¬≠ded, AMD AM4 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 7 5800X and DDR4-3600C16. Pro¬≠ces¬≠sors fixed to 4GHz fre¬≠quen¬≠cy with 8C16 enab¬≠led and eva¬≠lua¬≠ted with 22 dif¬≠fe¬≠rent workloads. ALL SYSTEMS con¬≠fi¬≠gu¬≠red with NXZT Kra¬≠ken X63, open air test bench, Rade¬≠on‚ĄĘ RX 6950XT (dri¬≠ver 22.7.1 Optio¬≠nal), Win¬≠dows¬ģ 11 22000.856, AMD Smart Access Memory/PCIe¬ģ Resizable Base Address Regis¬≠ter (‚ÄúReBAR‚ÄĚ) ON, Vir¬≠tua¬≠liza¬≠ti¬≠on-Based Secu¬≠ri¬≠ty (VBS) OFF. Results may vary.
7. RPL-008: Test¬≠ing as of 15 August, 2022, by AMD Per¬≠for¬≠mance Labs using the fol¬≠lo¬≠wing hard¬≠ware: AMD AM5 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 9 7950X with G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ loa¬≠ded, AMD AM4 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 9 5950X and DDR4-3600C16, and ROG Maxi¬≠mus Z690 Hero with Core i9-12900K and G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ loa¬≠ded. ALL SYSTEMS con¬≠fi¬≠gu¬≠red with NXZT Kra¬≠ken X63, open air test bench, Rade¬≠on‚ĄĘ RX 6950XT (dri¬≠ver 22.7.1 Optio¬≠nal), Win¬≠dows¬ģ 11 22000.856, AMD Smart Access Memory/PCIe¬ģ Resizable Base Address Regis¬≠ter (‚ÄúReBAR‚ÄĚ) ON, Vir¬≠tua¬≠liza¬≠ti¬≠on-Based Secu¬≠ri¬≠ty (VBS) OFF. Results may vary.
8. RPL-009: Test¬≠ing as of 15 August, 2022, by AMD Per¬≠for¬≠mance Labs using the fol¬≠lo¬≠wing hard¬≠ware: AMD AM5 Refe¬≠rence Mother¬≠board with AMD Ryzen‚ĄĘ 9 7950X with G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ loa¬≠ded, ver¬≠sus ROG Maxi¬≠mus Z690 Hero with Core i9-12900K and G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ loa¬≠ded. ALL SYSTEMS con¬≠fi¬≠gu¬≠red with NXZT Kra¬≠ken X63, open air test bench, Giga¬≠byte RTX 3090 Gam¬≠ing OC (dri¬≠ver 516.40), Win¬≠dows¬ģ 11 22000.856, AMD Smart Access Memory/PCIe¬ģ Resizable Base Address Regis¬≠ter (‚ÄúReBAR‚ÄĚ) ON, Vir¬≠tua¬≠liza¬≠ti¬≠on-Based Secu¬≠ri¬≠ty (VBS) OFF. Power mea¬≠su¬≠red at the wall in Joules of ener¬≠gy con¬≠su¬≠med for the full workload. Ray¬≠tra¬≠ced ren¬≠de¬≠ring per¬≠for¬≠mance eva¬≠lua¬≠ted with Cha¬≠os V‚ÄĎRay Bench¬≠mark. Results may vary.
9. Video codec acce­le­ra­ti­on (inclu­ding at least the HEVC (H.265), H.264, VP9, and AV1 codecs) is sub­ject to and not ope­ra­ble wit­hout inclusion/installation of com­pa­ti­ble media play­ers. GD-176.
10. Max boost for AMD Ryzen pro­ces­sors is the maxi­mum fre­quen­cy achie­va­ble by a sin­gle core on the pro­ces­sor run­ning a burs­ty sin­gle-threa­ded workload. Max boost will vary based on seve­ral fac­tors, inclu­ding, but not limi­t­ed to: ther­mal pas­te; sys­tem coo­ling; mother­board design and BIOS; the latest AMD chip­set dri­ver; and the latest OS updates. GD-150.
11. GD-26: AMD’s pro­duct war­ran­ty does not cover dama­ges cau­sed by over­clo­cking, even when over­clo­cking is enab­led via AMD hard­ware and/or software.
12. RPL-011: Test¬≠ing as of 15 August, 2022, by AMD Per¬≠for¬≠mance Labs using the fol¬≠lo¬≠wing hard¬≠ware: AMD Socket AM5 Refe¬≠rence Mother¬≠board with Ryzen‚ĄĘ 5 7600X and G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ ver¬≠sus ROG Maxi¬≠mus Z690 Hero with Core i9-12900K and G.Skill DDR5-6000C30 (F5-6000J3038F16GX2-TZ5N) with AMD EXPO‚ĄĘ loa¬≠ded. ALL SYSTEMS con¬≠fi¬≠gu¬≠red with NXZT Kra¬≠ken X63, open air test bench, Rade¬≠on‚ĄĘ RX 6950XT (dri¬≠ver 22.7.1 Optio¬≠nal), Win¬≠dows¬ģ 11 22000.856, AMD Smart Access Memory/PCIe¬ģ Resizable Base Address Regis¬≠ter (‚ÄúReBAR‚ÄĚ) ON, Vir¬≠tua¬≠liza¬≠ti¬≠on-Based Secu¬≠ri¬≠ty (VBS) OFF. F1 2022 tes¬≠ted at 1920x1080 with HIGH in-game pre¬≠set and the chro¬≠no¬≠lo¬≠gi¬≠cal¬≠ly newest gra¬≠phics indus¬≠try API available within the game‚Äôs ren¬≠de¬≠ring engi¬≠ne (e.g. Vul¬≠kan¬ģ over OpenGL‚ĄĘ, DirectX¬ģ 12 over DirectX¬ģ 11). Results may vary.