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AMD 2014 Mobile APUs to Deliver Leaps in Performance and Battery Life in Tablets, 2‑in-1s and Notebooks

Verfasst vonDr@
New designs tar­get hig­hest per­for­mance and best gra­phics for fan­less designs



SAN JOSE, Calif.  —11/13/2013 

AMD (NYSE: AMD), buil­ding on its lea­der­ship in gra­phics and gam­ing, announ­ced its 2014 mobi­le Acce­le­ra­ted Pro­ces­sing Unit (APU) pro­duct road­map at the APU13 Deve­lo­per Con­fe­rence today. Rai­sing the per­for­mance bar across fan­less tablets, 2‑in-1s and ultrath­in note­books, the APUs code­na­med “Mul­lins” and “Bee­ma” are pro­jec­ted to deli­ver more than 2x the per­for­mance-per-watt of the pre­vious gene­ra­ti­on1, 2.

The latest AMD APUs also sup­port Micro­soft Instant­Go for fas­ter wake times and to ensu­re data such as email actively refresh in stand­by. Both new pro­ces­sor fami­lies are also the first to inte­gra­te an AMD-deve­lo­ped plat­form secu­ri­ty pro­ces­sor based on the ARM® Cortex®-A5 fea­turing ARM Trust­Zo­ne® tech­no­lo­gy for enhan­ced data secu­ri­ty. The new low-power APUs join the pre­vious­ly dis­c­lo­sed high-per­for­mance note­book APU, code­na­med “Kaveri,” in AMD’s 2014 mobi­le lineup.

“AMD is estab­li­shing excel­lent momen­tum this year in the low-power, mobi­le com­pu­ting mar­ket and with ‘Mul­lins’ and ‘Bee­ma’ coming in 2014 we are not stan­ding still,” said Mark Paper­mas­ter, AMD’s chief tech­no­lo­gy offi­cer and seni­or vice pre­si­dent, during his clo­sing key­note at APU13. “AMD aims to deli­ver a set of plat­forms in the first half of next year that will out­per­form the com­pe­ti­ti­on in gra­phics and total com­pu­te per­for­mance in fan­less tablets, 2‑in-1s and ultrath­in notebooks.”

Both new pro­ces­sor fami­lies offer two or four “Puma” CPU cores and AMD Rade­on™ gra­phics on a 28nm sys­tem-on-chip (SoC). The new pro­ces­sors are plan­ned to launch in the first half of next year and will be demons­tra­ted at CES 2014 as part of a full suite of AMD products.

Supporting Resources

About AMD

AMD (NYSE: AMD) designs and inte­gra­tes tech­no­lo­gy that powers mil­li­ons of intel­li­gent devices, inclu­ding per­so­nal com­pu­ters, tablets, game con­so­les and cloud ser­vers that defi­ne the new era of sur­round com­pu­ting. AMD solu­ti­ons enable peo­p­le ever­y­whe­re to rea­li­ze the full poten­ti­al of their favo­ri­te devices and appli­ca­ti­ons to push the boun­da­ries of what is pos­si­ble. For more infor­ma­ti­on, visit www.amd.com.

AMD, the AMD Arrow logo and Rade­on are trade­marks of Advan­ced Micro Devices, Inc. Other names are for infor­ma­tio­nal pur­po­ses only and may be trade­marks of their respec­ti­ve owners.

  1. The new 2014 AMD A‑Series low power APU plat­form, code­na­med “Mul­lins,” is expec­ted to deli­ver up to 139 per­cent bet­ter pro­duc­ti­vi­ty per­for­mance per watt when com­pared to the pre­vious gene­ra­ti­on “Temash” plat­form. Test­ing con­duc­ted by AMD Per­for­mance Labs on opti­mi­zed AMD refe­rence sys­tems. PC manu­fac­tu­r­ers may vary con­fi­gu­ra­ti­on yiel­ding dif­fe­rent results. PCMark 8 — Home score divi­ded by TDP (W) is used to simu­la­te pro­duc­ti­vi­ty per­for­mance per watt; the Mul­lins plat­form (4.5W) scored 1809 while the Temash plat­form (8W) scored 1343. AMD “Lar­ne” refe­rence plat­form sys­tem used for both APUs. Temash-based AMD A6-1450 quad-core APU with AMD Rade­on™ HD 8250 Gra­phics, 2x2GB of DDR3-1333MHz RAM (run­ning at 1066MHz), Win­dows 8.1, 13.200.11.0 — 03-Sep-2013 dri­ver. Pre-pro­duc­tion engi­nee­ring sam­ple of “Mul­lins” quad-core APU with next gene­ra­ti­on AMD Rade­on gra­phics (model num­ber TBD), 2x2GB DDR3-1333MHz RAM, Win­dows 8.1, and unre­leased refe­rence dri­ver. MUN‑3
  2. The new 2014 AMD A‑Series main­stream APU plat­form, code­na­med “Bee­ma,” is expec­ted to deli­ver up to 104 per­cent bet­ter pro­duc­ti­vi­ty per­for­mance per watt when com­pared to the pre­vious gene­ra­ti­on “Kabi­ni” plat­form. Test­ing con­duc­ted by AMD Per­for­mance Labs on opti­mi­zed AMD refe­rence sys­tems. PC manu­fac­tu­r­ers may vary con­fi­gu­ra­ti­on yiel­ding dif­fe­rent results. PCMark 8 — Home score divi­ded by TDP (W) is used to simu­la­te pro­duc­ti­vi­ty per­for­mance per watt; the Bee­ma plat­form (15W) scored 2312 while the Kabi­ni plat­form (25W) scored 1861. AMD “Lar­ne” refe­rence plat­form sys­tem used for both APUs. Kabi­ni-based AMD A6-5200 quad-core APU with AMD Rade­on™ HD 8400 Gra­phics, 2x2GB of DDR3-1600MHz RAM, Win­dows 8.1, 13.200.11.0 — 03-Sep-2013 dri­ver. Pre-pro­duc­tion engi­nee­ring sam­ple of “Bee­ma” quad-core APU with next gene­ra­ti­on AMD Rade­on gra­phics (model num­ber TBD), 2x2GB DDR3-1600MHz RAM, Win­dows 8.1, and unre­leased refe­rence driver.BMN‑3

For­ward-Loo­king State­ment:
This Press Release con­ta­ins for­ward-loo­king state­ments con­cer­ning Advan­ced Micro Devices, Inc. (“AMD” or the “Com­pa­ny”) inclu­ding, among other things, AMD’s 2014 mobi­le Acce­le­ra­ted Pro­ces­sing Unit (APU) pro­duct road­map, AMD’s future pro­ducts inclu­ding stra­tegy, the timing , avai­la­bi­li­ty, fea­tures and func­tion­a­li­ty of such future pro­ducts, which are made pur­su­ant to the safe har­bor pro­vi­si­ons of the Pri­va­te Secu­ri­ties Liti­ga­ti­on Reform Act. For­ward-loo­king state­ments are com­mon­ly iden­ti­fied by words such as “would,” “may,” “expects,” “belie­ves,” “plans,” “intends,” “pro­jects,” and other terms with simi­lar mea­ning. Inves­tors are cau­tio­ned that the for­ward-loo­king state­ments in this pre­sen­ta­ti­on are based on cur­rent beliefs, assump­ti­ons and expec­ta­ti­ons, speak only as of the date of this pre­sen­ta­ti­on and invol­ve risks and uncer­tain­ties that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons. Risks include the pos­si­bi­li­ty that that Intel Corporation’s pri­cing, mar­ke­ting and reba­ting pro­grams, pro­duct bund­ling, stan­dard set­ting, new pro­duct intro­duc­tions or other acti­vi­ties may nega­tively impact the Company’s plans; that the Com­pa­ny will requi­re addi­tio­nal fun­ding and may be unable to rai­se suf­fi­ci­ent capi­tal on favorable terms, or at all; that cus­to­mers stop buy­ing the Company’s pro­ducts or mate­ri­al­ly redu­ce their ope­ra­ti­ons or demand for its pro­ducts; that the Com­pa­ny may be unable to deve­lop, launch and ramp new pro­ducts and tech­no­lo­gies in the volu­mes that are requi­red by the mar­ket at matu­re yields on a time­ly basis; that the company’s third-par­ty foundry sup­pli­ers will be unable to tran­si­ti­on the Company’s pro­ducts to advan­ced manu­fac­tu­ring pro­cess tech­no­lo­gies in a time­ly and effec­ti­ve way or to manu­fac­tu­re the Company’s pro­ducts on a time­ly basis in suf­fi­ci­ent quan­ti­ties and using com­pe­ti­ti­ve pro­cess tech­no­lo­gies; that the Com­pa­ny will be unable to obtain suf­fi­ci­ent manu­fac­tu­ring capa­ci­ty or com­pon­ents to meet demand for its pro­ducts or will not ful­ly uti­li­ze the Company’s pro­jec­ted manu­fac­tu­ring capa­ci­ty needs at GLOBALFOUNDRIES Inc. (GF) micro­pro­ces­sor manu­fac­tu­ring faci­li­ties; that the Company’s requi­re­ments for wafers will be less than the fixed num­ber of wafers that we agreed to purcha­se from GF or GF encoun­ters pro­blems that signi­fi­cant­ly redu­ce the num­ber of func­tion­al die the Com­pa­ny recei­ves from each wafer; that the Com­pa­ny is unable to suc­cessful­ly imple­ment its long-term busi­ness stra­tegy; that the Com­pa­ny inac­cu­ra­te­ly esti­ma­tes the quan­ti­ty or type of pro­ducts that its cus­to­mers will want in the future or will ulti­m­ate­ly end up purcha­sing, resul­ting in excess or obso­le­te inven­to­ry; that the Com­pa­ny is unable to mana­ge the risks rela­ted to the use of its third-par­ty dis­tri­bu­tors and add-in-board (AIB) part­ners or offer the appro­pria­te incen­ti­ves to focus them on the sale of the Company’s pro­ducts; that the Com­pa­ny may be unable to main­tain the level of invest­ment in rese­arch and deve­lo­p­ment that is requi­red to remain com­pe­ti­ti­ve; that the­re may be unex­pec­ted varia­ti­ons in mar­ket growth and demand for the Company’s pro­ducts and tech­no­lo­gies in light of the pro­duct mix that it may have available at any par­ti­cu­lar time; that glo­bal busi­ness and eco­no­mic con­di­ti­ons, inclu­ding con­su­mer PC mar­ket con­di­ti­ons, will not impro­ve or will wor­sen; and the effect of poli­ti­cal or eco­no­mic insta­bi­li­ty, dome­sti­cal­ly or inter­na­tio­nal­ly, on our sales or sup­p­ly chain. Inves­tors are urged to review in detail the risks and uncer­tain­ties in the Company’s Secu­ri­ties and Exch­an­ge Com­mis­si­on filings, inclu­ding but not limi­t­ed to the Quar­ter­ly Report on Form 10‑Q for the quar­ter ended Sept. 28, 2013.