In die­ser Sek­ti­on wer­den Pres­se­mit­tei­lun­gen der Her­stel­ler 1:1 ver­öf­fent­licht. Pla­net 3DNow! über­nimmt weder für die Rich­tig­keit der Anga­ben noch für die Art der For­mu­lie­rung jed­we­de Ver­ant­wor­tung. Die Anga­ben kön­nen sub­jek­tiv sein und geben nicht not­wen­di­ger­wei­se die Mei­nung der auf Pla­net 3DNow! schrei­ben­den Autoren wieder.

Samsung Electronics Introduces New High Bandwidth Memory Technology Tailored to Data Centers, Graphic Applications, and AI

Verfasst vonpipin

SAN JOSE, Calif.–Samsung Elec­tro­nics Co., Ltd., the world lea­der in advan­ced semi­con­duc­tor tech­no­lo­gy, today announ­ced its new High Band­width Memo­ry (HBM2E) pro­duct at NVIDIA’s GPU Tech­no­lo­gy Con­fe­rence (GTC) to deli­ver the hig­hest DRAM per­for­mance levels for use in next-gene­ra­ti­on super­com­pu­ters, gra­phics sys­tems, and arti­fi­ci­al intel­li­gence (AI).

The new solu­ti­on, Flash­bolt™, is the industry’s first HBM2E to deli­ver a 3.2 giga­bits-per-second (Gbps) data trans­fer speed per pin, which is 33 per­cent fas­ter than the pre­vious-gene­ra­ti­on HBM2. Flash­bolt has a den­si­ty of 16Gb per die, dou­ble the capa­ci­ty of the pre­vious gene­ra­ti­on. With the­se impro­ve­ments, a sin­gle Sam­sung HBM2E packa­ge will offer a 410 giga­bytes-per-second (GBps) data band­width and 16GB of memory.

“Flashbolt’s indus­try-lea­ding per­for­mance will enable enhan­ced solu­ti­ons for next-gene­ra­ti­on data cen­ters, arti­fi­ci­al intel­li­gence, machi­ne lear­ning, and gra­phics appli­ca­ti­ons,” said Jin­man Han, seni­or vice pre­si­dent of Memo­ry Pro­duct Plan­ning and Appli­ca­ti­on Engi­nee­ring Team at Sam­sung Elec­tro­nics. “We will con­ti­nue to expand our pre­mi­um DRAM offe­ring, and impro­ve our ‘high-per­for­mance, high capa­ci­ty, and low power’ memo­ry seg­ment to meet mar­ket demand.”

For GTC atten­de­es, the­re are seve­ral ways to con­nect with the Sam­sung team on-site:

  • Spea­king Ses­si­on: Samsung’s Anand Iyer will host a panel along­side experts from Goog­le, Micro­soft, Face­book, IBM, Bai­du and NVIDIA who will dis­cuss the AI hard­ware chal­lenges facing data cen­ters and brain­storm cur­rent and neces­sa­ry advan­ces in architectures. 
    • When: Thurs­day, March 21, 11:00 a.m. PST
    • Whe­re: Mar­riott Hotel Ball­room 3 (Level 2/Concourse)
  • Spea­king Ses­si­on: Samsung’s Tien Shiah will dis­cuss two DRAM-based memo­ry tech­no­lo­gies enab­ling a new gene­ra­ti­on of AI workloads. 
    • When: Thurs­day, March 21 at 9 a.m. PST
    • Whe­re: SJCC Room 210G (Con­cour­se Level)
  • Visit the Sam­sung Booth: Meet the Sam­sung team for an update on the latest tech­no­lo­gy for appli­ca­ti­ons inclu­ding AI/ML, Gra­phics, and Auto­no­mous Vehicles. 
    • When:
      • Tues­day, March 19, 12:00 – 7:00 p.m. PST
      • Wed­nes­day, March 20, 12:00 – 7:00 p.m. PST
      • Thurs­day, March 21, 11:00 AM – 2:00 p.m. PST
    • Whe­re:
      • Booth #726

About Sam­sung Elec­tro­nics Co., Ltd.

Sam­sung inspi­res the world and shapes the future with trans­for­ma­ti­ve ide­as and tech­no­lo­gies. The com­pa­ny is rede­fi­ning the worlds of TVs, smart­phones, weara­ble devices, tablets, digi­tal appli­ances, net­work sys­tems, and memo­ry, sys­tem LSI, foundry and LED solu­ti­ons. For the latest news, plea­se visit the Sam­sung News­room at http://news.samsung.com.