Rugged COM Express Module with AMD Ryzen™ Embedded V1000/R1000 SoC

Nur­em­berg, Ger­ma­ny – April 16, 2019. The CB71C is an ultra-rug­ged COM Express modu­le for rail, public trans­por­ta­ti­on and indus­try app­li­ca­ti­ons, e.g. data acqui­si­ti­on, info­tain­ment, trans­co­ding and live 3D. It is 100% com­pa­ti­ble with COM Express Type 6 Pin-Out and con­forms to the VITA 59 stan­dard, which spe­ci­fies robust mecha­nics to ensu­re reli­able ope­ra­ti­on even under the har­shest envi­ron­men­tal con­di­ti­ons.

 
 
 
 
  • AMD Ryzen™ Embed­ded V1000/R1000 series
  • Up to 32 GB DDR4 RAM with ECC
  • Up to 4 Digi­tal Dis­play Inter­faces (DP, eDP, HDMI, DVI)
  • Hard­ware memo­ry encryp­ti­on
  • Safe­ty-rele­vant super­vi­si­on func­tions
  • Vir­tua­li­za­ti­on
  • The Ryzen Embed­ded V1000 powe­red pro­duc­ts sup­port up to -40°C to +85°C Tca­se, con­duc­tion coo­ling
  • VITA 59 in pro­cess, com­pli­ant with COM Express Basic, type 6
  • PICMG COM.0 COM Express ver­si­on also avail­ab­le

Extremely Robust, Powerful Graphics and High Performance

The CB71C Rug­ged COM Express Modu­le is based on the AMD Ryzen Embed­ded fami­ly and can now be equip­ped with the new Ryzen™ Embed­ded R1000 SoC in addi­ti­on to the Ryzen Embed­ded V1000 SoC. The new AMD Ryzen Embed­ded R1000 SoC fea­tures a Rade­on™ Vega gra­phics engi­ne with three com­pu­te units and sup­port for up to three dis­plays with a reso­lu­ti­on of up to 4k wit­hout addi­tio­nal gra­phics hard­ware. With up to four power­ful “Zen” pro­ces­sor cores, when using the AMD Ryzen Embed­ded V1000 SoC, the CB71C is also sui­ta­ble for vir­tua­li­za­ti­on.

With the AMD Ryzen Embed­ded fami­ly, the COM modu­le gains valu­able fle­xi­bi­li­ty: The design can be based on eit­her a Ryzen Embed­ded R1000 dual-core SoC or a Ryzen Embed­ded V1000 quad-core SoC. The strength of the new AMD Ryzen Embed­ded R1000 SoC lies in its low power con­sump­ti­on com­bi­ned with its high sin­gle-thread per­for­mance and high clock with dual core and quad thread per­for­mance.

The modu­les with AMD Ryzen Embed­ded V1000 pro­vi­de pas­si­ve coo­ling and a tem­pe­ra­tu­re ran­ge from -40°C to +85°C are pos­si­ble with the low-power ver­si­ons. The CB71C can be equip­ped with up to 32 GB direc­t­ly sol­de­red DDR4 main memo­ry and a 16 GB eMMC. PCI Express 3.0, DDI (DP, eDP, HDMI), SATA 3.0, Giga­bit Ether­net and USB 3.0 are avail­ab­le as high-speed inter­faces.

The COM modu­le has a board manage­ment con­trol­ler with moni­to­ring func­tions and a trusted plat­form modu­le. The modu­le also uses the Secu­re Memo­ry Encryp­ti­on capa­bi­li­ty in the AMD Ryzen Embed­ded R1000 SoC – an essen­ti­al fea­ture for secu­ri­ty-cri­ti­cal app­li­ca­ti­ons such as pay­ment and ticke­ting ter­mi­nals, fleet manage­ment or moni­to­ring.

AMD wel­co­mes MEN’s decisi­on to imple­ment the new pro­duct fami­ly with AMD Ryzen Embed­ded:

We are exci­ted to con­ti­nue our work with MEN and see them deve­lop fan­tastic devices and modu­les that take advan­ta­ge of the fea­tures in the AMD Ryzen Embed­ded fami­ly,” said Ste­phen Turn­bull, direc­tor of pro­duct manage­ment and busi­ness deve­lop­ment, Embed­ded Solu­ti­ons, AMD. “MEN deve­lops sys­tems with the hig­hest demands on robust­ness and safe­ty and the AMD Ryzen Embed­ded R1000 and AMD Ryzen Embed­ded V1000 help make tho­se fea­tures a rea­li­ty for MEN’s custo­mers.”