High-Performance AMD Radeon GPUs to Power All-New Mac Pro

New super­char­ged 7nm AMD Rade­on™ Pro Vega II GPUs with high-speed HBM2 memo­ry and AMD Infi­ni­ty Fab­ric Link GPU inter­con­nect tech­no­lo­gy power deman­ding con­tent creation

San­ta Cla­ra, Calif.


AMD (NASDAQ: AMD) today announ­ced that its new AMD Rade­on™ Pro Vega II GPUs will be inclu­ded in the all-new Mac Pro. Built on indus­try-lea­ding 7nm pro­cess tech­no­lo­gy, AMD Rade­on™ Pro Vega II GPUs pro­vi­de ground­brea­king levels of gra­phics per­for­mance for com­pu­ta­ti­on-inten­si­ve tasks, inclu­ding ren­de­ring, 8K video, video effects, and other high-end con­tent crea­ti­on workloads.

AMD Rade­on™ Pro Vega II GPUs pro­vi­de excep­tio­nal com­pu­ta­tio­nal per­for­mance by harn­essing 7nm AMD Rade­on Vega fami­ly GPUs, ultra-fast High Band­width Memo­ry (HBM2), and AMD Infi­ni­ty Fab­ric Link GPU inter­con­nect tech­no­lo­gy that dra­ma­ti­cal­ly enhan­ces data-trans­fer speeds bet­ween GPUs. Pro­vi­ding up to 14 TFLOPS of sin­gle-pre­cisi­on floa­ting-point (FP32) per­for­mance and up to 28 TFLOPS of half-pre­cisi­on floa­ting-point (FP16) per­for­mance, AMD Rade­on™ Pro Vega II GPUs are opti­mi­zed for powe­ring deman­ding pro­fes­sio­nal applications.

Today’s high-end pro­fes­sio­nal con­tent crea­ti­on app­li­ca­ti­ons are dri­ving an insa­tia­ble need for ever incre­a­sing levels of pro­ces­sing power and memo­ry,” said Scott Her­kel­man, cor­po­ra­te vice pre­si­dent and gene­ral mana­ger, Rade­on Tech­no­lo­gies Group at AMD. “Equip­ped with Rade­on™ Pro Vega II GPUs, the new Mac Pro deli­vers the com­pu­ta­tio­nal hor­se­power and memo­ry band­width to power ultra-high screen reso­lu­ti­ons and help dra­ma­ti­cal­ly acce­le­ra­te com­pu­te and con­tent crea­ti­on workloads, enab­ling crea­ti­ve pro­fes­sio­nals to focus on unlea­shing their crea­ti­vi­ty and deli­vering ama­zing results.”

AMD con­ti­nues to deve­lop ama­zing gra­phics tech­no­lo­gies to acce­le­ra­te work­flows for pro­fes­sio­nals who rely on DaVin­ci Resol­ve for fas­ter color cor­rec­tion and edi­t­ing,” said Dan May, pre­si­dent, Black­ma­gic Design. “Rade­on Pro Vega II deli­vers out­stan­ding per­for­mance, espe­cial­ly when DaVin­ci Resol­ve is put to work with 8K video foo­ta­ge com­bi­ned with various filters.”

 Key capa­bi­li­ties and fea­tures of AMD Rade­on™ Pro Vega II GPUs include:

  • Lea­ding-edge com­pu­te per­for­mance – The AMD Rade­on™ Pro Vega II GPU deli­vers up to 14 TFLOPS of sin­gle-pre­cisi­on FP32 per­for­mance and up to 28 TFLOPS of half-pre­cisi­on FP16 performance.
  • Sup­port for Infi­ni­ty Fab­ric Link GPU inter­con­nect tech­no­lo­gy – With up to 84GB/s per direc­tion low-laten­cy peer-to-peer memo­ry access1, the scala­b­le GPU inter­con­nect tech­no­lo­gy enab­les GPU-to-GPU com­mu­ni­ca­ti­ons up to 5X fas­ter than PCIe® Gen 3 inter­con­nect speeds2.
  • Ultra-fast HBM2 memo­ry – 32GB of high-speed HBM2 memo­ry deli­vers 1TB/s memo­ry band­width, pro­vi­ding the memo­ry capa­ci­ty and data trans­fer speeds requi­red by today’s high-reso­lu­ti­on, mul­ti-dis­play set­ups, 8K video, and other deman­ding con­tent crea­ti­on workloads.

For more infor­ma­ti­on about the Mac Pro visit www.apple.com/mac-pro.

Supporting Resources

  • Learn more about AMD Rade­on™ Pro Vega II GPUs here
  • Beco­me a fan of AMD on Face­book
  • Fol­low AMD on Twit­ter
  • Fol­low Rade­on™ Pro gra­phics on Twit­ter

About AMD

For 50 years AMD has dri­ven inno­va­ti­on in high-per­for­mance com­pu­ting, gra­phics and visua­liz­a­ti­on tech­no­lo­gies ― the buil­ding blocks for gaming, immer­si­ve plat­forms and the dat­a­cen­ter. Hund­reds of mil­li­ons of con­su­mers, lea­ding For­tu­ne 500 busi­nes­ses and cut­ting-edge sci­en­ti­fic rese­arch faci­li­ties around the world rely on AMD tech­no­lo­gy dai­ly to impro­ve how they live, work and play. AMD employees around the world are focu­sed on buil­ding gre­at pro­ducts that push the bounda­ries of what is pos­si­ble. For more infor­ma­ti­on about how AMD is enab­ling today and inspi­ring tomor­row, visit the AMD (NASDAQ: AMDweb­siteblogFace­book and Twit­ter pages.


Cau­tio­na­ry Statement

This press release con­tains for­ward-loo­king state­ments con­cer­ning Advan­ced Micro Devices, Inc. (AMD) inclu­ding AMD’s expec­ted bene­fits asso­cia­ted with uti­li­zing AMD Rade­on™ Pro Vega II GPUs in Apple’s next-genera­ti­on Mac Pro, which are made pur­suant to the Safe Har­bor pro­vi­si­ons of the Pri­va­te Secu­ri­ties Liti­ga­ti­on Reform Act of 1995. For­ward-loo­king state­ments are com­mon­ly iden­ti­fied by words such as “would,” “intends,” “belie­ves,” “expects,” “may,” “will,” “should,” “seeks,” “intends,” “plans,” “pro for­ma,” “esti­ma­tes,” “anti­ci­pa­tes,” or the nega­ti­ve of the­se words and phra­ses, other varia­ti­ons of the­se words and phra­ses or com­pa­ra­ble ter­mi­no­lo­gy. Inves­tors are cau­tio­ned that the for­ward-loo­king state­ments in this docu­ment are based on cur­rent beliefs, assump­ti­ons and expec­ta­ti­ons, speak only as of the date of this docu­ment and invol­ve risks and uncer­tain­ties that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons. Such state­ments are sub­ject to cer­tain known and unknown risks and uncer­tain­ties, many of which are dif­fi­cult to pre­dict and gene­ral­ly bey­ond AMD’s con­trol, that could cau­se actu­al results and other future events to dif­fer mate­ri­al­ly from tho­se expres­sed in, or implied or pro­jec­ted by, the for­ward-loo­king infor­ma­ti­on and state­ments. Mate­ri­al fac­tors that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons inclu­de, without limi­ta­ti­on, the fol­lowing: Intel Corporation’s domi­nan­ce of the micro­pro­ces­sor mar­ket and its aggres­si­ve busi­ness prac­ti­ces may limit AMD’s abi­li­ty to com­pe­te effec­tively; AMD has a wafer sup­ply agree­ment with GLOBALFOUNDRIES Inc. (GF) with obli­ga­ti­ons to purcha­se all of its micro­pro­ces­sor and APU pro­duct requi­re­ments, and a cer­tain por­ti­on of its GPU pro­duct requi­re­ments, manu­fac­tu­red at pro­cess nodes lar­ger than 7 nano­me­ter from GF with limi­ted excep­ti­ons. If GF is not able to satisfy AMD’s manu­fac­tu­ring requi­re­ments, AMD’s busi­ness could be adver­se­ly impac­ted; AMD reli­es on third par­ties to manu­fac­tu­re its pro­ducts, and if they are unab­le to do so on a time­ly basis in suf­fi­ci­ent quan­ti­ties and using com­pe­ti­ti­ve tech­no­lo­gies, AMD’s busi­ness could be mate­ri­al­ly adver­se­ly affec­ted; fail­u­re to achie­ve expec­ted manu­fac­tu­ring yiel­ds for AMD’s pro­ducts could nega­tively impact its finan­cial results; the suc­cess of AMD’s busi­ness is depen­dent upon its abi­li­ty to intro­du­ce pro­ducts on a time­ly basis with fea­tures and per­for­mance levels that pro­vi­de value to its cus­to­mers while sup­por­ting and coin­ci­ding with signi­fi­cant indus­try tran­si­ti­ons; if AMD can­not gene­ra­te suf­fi­ci­ent reve­nue and ope­ra­ting cash flow or obtain exter­nal finan­cing, it may face a cash short­fall and be unab­le to make all of its plan­ned invest­ments in rese­arch and deve­lo­p­ment or other stra­te­gic invest­ments; the loss of a signi­fi­cant cus­to­mer may have a mate­ri­al adver­se effect on AMD; AMD’s rece­i­pt of reve­nue from its semi-cus­tom SoC pro­ducts is depen­dent upon its tech­no­lo­gy being desi­gned into third-par­ty pro­ducts and the suc­cess of tho­se pro­ducts; glo­bal eco­no­mic and mar­ket uncer­tain­ty may adver­se­ly impact AMD’s busi­ness and ope­ra­ting results; AMD’s pro­ducts may be sub­ject to secu­ri­ty vul­nera­bi­li­ties that could have a mate­ri­al adver­se effect on AMD; IT outa­ges, data loss, data breaches and cyber-attacks could com­pro­mi­se AMD’s intel­lec­tu­al pro­per­ty or other sen­si­ti­ve infor­ma­ti­on, be cos­t­ly to reme­dia­te and cau­se signi­fi­cant dama­ge to its busi­ness, repu­ta­ti­on and ope­ra­ti­ons; AMD’s ope­ra­ting results are sub­ject to quar­ter­ly and sea­so­nal sales pat­terns; AMD may not be able to gene­ra­te suf­fi­ci­ent cash to ser­vice its debt obli­ga­ti­ons or meet its working capi­tal requi­re­ments; AMD has a lar­ge amount of indeb­ted­ness which could adver­se­ly affect its finan­cial posi­ti­on and pre­vent it from imple­men­ting its stra­te­gy or ful­fil­ling its con­trac­tu­al obli­ga­ti­ons; the agree­ments gover­ning AMD’s notes and the Secu­red Revol­ving Line of Credit impo­se restric­tions on AMD that may adver­se­ly affect AMD’s abi­li­ty to ope­ra­te its busi­ness; the mar­kets in which AMD’s pro­ducts are sold are high­ly com­pe­ti­ti­ve; AMD’s world­wi­de ope­ra­ti­ons are sub­ject to poli­ti­cal, legal and eco­no­mic risks and natu­ral dis­as­ters, which could have a mate­ri­al adver­se effect on it; the con­ver­si­on of the 2.125% Con­ver­ti­ble Seni­or Notes due 2026 may dilu­te the owners­hip inte­rest of AMD’s exis­ting stock­hol­ders, or may other­wi­se depress the pri­ce of its com­mon stock; uncer­tain­ties invol­ving the orde­ring and ship­ment of AMD’s pro­ducts could mate­ri­al­ly adver­se­ly affect it; the demand for AMD’s pro­ducts depends in part on the mar­ket con­di­ti­ons in the indus­tries into which they are sold. Fluc­tua­tions in demand for AMD’s pro­ducts or a mar­ket decli­ne in any of the­se indus­tries could have a mate­ri­al adver­se effect on its results of ope­ra­ti­ons; AMD’s abi­li­ty to design and intro­du­ce new pro­ducts in a time­ly man­ner is depen­dent upon third-par­ty intel­lec­tu­al pro­per­ty; AMD depends on third-par­ty com­pa­nies for the design, manu­fac­tu­re and sup­ply of mother­boards, soft­ware and other com­pu­ter plat­form com­pon­ents to sup­port its busi­ness; if AMD loses Micro­soft Corporation’s sup­port for its pro­ducts or other soft­ware ven­dors do not design and deve­lop soft­ware to run on AMD’s pro­ducts, its abi­li­ty to sell its pro­ducts could be mate­ri­al­ly adver­se­ly affec­ted; and AMD’s reli­an­ce on third-par­ty dis­tri­bu­tors and add-in-board part­ners sub­jects it to cer­tain risks.  Inves­tors are urged to review in detail the risks and uncer­tain­ties in AMD’s Secu­ri­ties and Exchan­ge Com­mis­si­on filings, inclu­ding but not limi­ted to AMD’s Quar­ter­ly Report on Form 10‑Q for the quar­ter ended March 30, 2019.

©2019 Advan­ced Micro Devices, Inc.  All rights reser­ved. AMD, the AMD Arrow logo, Rade­on, and com­bi­na­ti­ons the­re­of are trade­marks of Advan­ced Micro Devices, Inc. “Vega” is an inter­nal AMD code­na­me and is not a pro­duct name. Apple, Mac, and the Apple Logo are trade­marks of Apple Inc., regis­tered in the U.S. and other coun­tries. Other pro­duct names used in this publi­ca­ti­on are for iden­ti­fi­ca­ti­on pur­po­ses only and may be trade­marks of their respec­ti­ve com­pa­nies. Other pro­duct names used in this publi­ca­ti­on are for iden­ti­fi­ca­ti­on pur­po­ses only and may be trade­marks of their respec­ti­ve companies.


  1. Infi­ni­ty Fab­ric Link Band­width with 2 bi-direc­tio­n­al x16 links at up to 21Gbps = 2 x 16 x 21Gbps / 8 = up to 84GB/s band­width per direction
  2. Gen 3.0 PCI Express x16 slot capa­ble of 16 GB/s of band­width per direc­tion and Rade­on Pro Vega II with Infi­ni­ty Fab­ric Link capa­ble of 84GB/s band­width per direc­tion. 84 / 16 = 5.25X fas­ter  than Gen 3.0 PCI Express x16.