Synopsys’ Fusion Compiler Adopted by AMD

Syn­op­sys and AMD Col­la­bo­ra­te to Opti­mi­ze Syn­op­sys’ Fusi­on Com­pi­ler for Ser­vers Powered by AMD EPYC Processors

 

MOUNTAIN VIEW, Calif.Feb. 19, 2020

High­lights:

  • AMD deploys Syn­op­sys’ Fusi­on Com­pi­ler RTL-to-GDSII pro­duct for the deve­lo­p­ment of its next-gene­ra­ti­on pro­ces­sor products
  • Uni­que, sin­gle-data-model archi­tec­tu­re and uni­fied, full-flow opti­miza­ti­on engi­nes deli­ver supe­ri­or per­for­mance, power and area metrics

Syn­op­sys, Inc. (Nasdaq: SNPS) today announ­ced that AMD is deploy­ing Syn­op­sys’ Fusi­on Com­pi­ler™ RTL-to-GDSII pro­duct for its full-flow, digi­tal-design imple­men­ta­ti­on. Based on an eva­lua­ti­on pro­cess, the Fusi­on Com­pi­ler pro­duct deli­ver­ed indus­try-lea­ding per­for­mance, power and area (PPA) metrics. This work has addi­tio­nal­ly resul­ted in an expan­ded col­la­bo­ra­ti­on bet­ween Syn­op­sys and AMD to opti­mi­ze Syn­op­sys appli­ca­ti­ons on AMD EPYC pro­ces­sors, tar­ge­ted to deli­ver mark­ed run­time acce­le­ra­ti­on bene­fits when deploy­ing the Fusi­on Com­pi­ler RTL-to-GDSII pro­duct across ser­vers powered by AMD EPYC pro­ces­sors. The­se advance­ments will be made available to all users in upco­ming ser­vice packs.

At AMD, we are com­mit­ted to excee­ding cus­to­mer expec­ta­ti­ons by con­ti­nu­al­ly expan­ding our lea­der­ship posi­ti­on in high-per­for­mance com­pu­ting,” said Mark Paper­mas­ter, Chief Tech­no­lo­gy Offi­cer and Exe­cu­ti­ve Vice Pre­si­dent, Tech­no­lo­gy and Engi­nee­ring at AMD. “Based on our eva­lua­ti­on results, Syn­op­sys’ Fusi­on Com­pi­ler hel­ped us meet our per­for­mance and time-to-mar­ket goals for our latest pro­ducts. As a result, we plan to use Fusi­on Com­pi­ler for the deve­lo­p­ment of our next-gene­ra­ti­on products.”

Syn­op­sys’ Fusi­on Com­pi­ler pro­duct is the suc­cessful result of a mul­ti-year invest­ment in a visi­on to build high­ly dif­fe­ren­tia­ted and trans­for­ma­ti­ve pro­ducts for an incre­asing­ly deman­ding indus­try,” said Sas­si­ne Gha­zi, gene­ral mana­ger, Design Group at Syn­op­sys. “It is very satis­fy­ing to see dozens of cus­to­mers across the indus­try rapidly rea­li­ze the bene­fits of the new pro­duct and extra­ct pre­vious­ly untap­ped value in their digi­tal designs. We are exci­ted to work with mar­ket lea­ders like AMD who are bene­fiting from the­se leaps in inno­va­ti­on to deli­ver exci­ting pro­ducts to their exis­ting mar­kets and crea­ting the path to new ones.”

The Fusi­on Com­pi­ler pro­duct is uni­que­ly archi­tec­ted to enable design teams to achie­ve the opti­mal levels of power, per­for­mance, and area (PPA) in the most con­ver­gent man­ner to ensu­re the fas­test and most pre­dic­ta­ble time-to-results (TTR). Built using a sin­gle, high­ly-sca­lable data model, and based around an ana­ly­sis back­bone that lever­a­ges tech­no­lo­gy from the industry’s gol­den-sign­off ana­ly­sis tools, Fusi­on Com­pi­ler gua­ran­tees that the­se cri­ti­cal PPA metrics are opti­mi­zed effi­ci­ent­ly and effec­tively throug­hout the full RTL-to-GDSII design flow. Fusi­on Com­pi­ler deli­vers best-in-class PPA through a high­ly-lever­a­ged opti­miza­ti­on frame­work, resul­ting in a ful­ly-uni­fied phy­si­cal syn­the­sis and opti­miza­ti­on metho­do­lo­gy whe­re indus­try-lea­ding tech­no­lo­gies can be deploy­ed at any point throug­hout the flow for maxi­mum effect. This ground­brea­king approach deli­vers bet­ter timing, bet­ter total power, and impro­ved area den­si­ty com­pared to using a tra­di­tio­nal com­bi­na­ti­on of front- and back-end tools. Fusi­on Com­pi­ler offers Sim­ply Bet­ter PPA.

About Fusi­on Tech­no­lo­gy

Syn­op­sys’ breakth­rough Fusi­on Tech­no­lo­gy™ trans­forms the RTL-to-GDSII design flow with the fusi­on of best-in-class opti­miza­ti­on and indus­try-gol­den sign­off tools, enab­ling desi­gners to acce­le­ra­te the deli­very of their next-gene­ra­ti­on designs with the indus­try-best full-flow qua­li­ty of results (QoR) and the fas­test TTR. It rede­fi­nes con­ven­tio­nal EDA tool boun­da­ries across syn­the­sis, place-and-rou­te, and sign­off, sha­ring engi­nes across the industry’s pre­mier digi­tal design tools, and using a uni­que, sin­gle data model for both logi­cal and phy­si­cal repre­sen­ta­ti­on. Fusi­on Tech­no­lo­gy enables one DNA back­bone across the Syn­op­sys Design Plat­form that includes IC Com­pi­ler II place-and-rou­te, Design Com­pi­ler® Gra­phi­cal syn­the­sis, Prime­Time® sign­off, StarRC extra­c­tion, IC Vali­da­tor phy­si­cal veri­fi­ca­ti­on, DFTMAX test, Tetra­MAX® II auto­ma­tic test pat­tern gene­ra­ti­on (ATPG), Spy­Glass® DFT ADV RTL test­a­bi­li­ty ana­ly­sis, and For­ma­li­ty® equi­va­lence che­cking. It pro­vi­des Design Fusi­on, ECO Fusi­on, Sign­off Fusi­on, and Test Fusi­on, resul­ting in the most pre­dic­ta­ble RTL-to-GDSII flow with the fewest ite­ra­ti­ons, as well as unsur­pas­sed design fre­quen­cy, power, and area.

About Syn­op­sys

Syn­op­sys, Inc. (Nasdaq: SNPS) is the Sili­con to Soft­ware part­ner for inno­va­ti­ve com­pa­nies deve­lo­ping the elec­tro­nic pro­ducts and soft­ware appli­ca­ti­ons we rely on every day. As the world’s 15th lar­gest soft­ware com­pa­ny, Syn­op­sys has a long histo­ry of being a glo­bal lea­der in elec­tro­nic design auto­ma­ti­on (EDA) and semi­con­duc­tor IP and is also gro­wing its lea­der­ship in soft­ware secu­ri­ty and qua­li­ty solu­ti­ons. Whe­ther you’­re a sys­tem-on-chip (SoC) desi­gner crea­ting advan­ced semi­con­duc­tors, or a soft­ware deve­lo­per wri­ting appli­ca­ti­ons that requi­re the hig­hest secu­ri­ty and qua­li­ty, Syn­op­sys has the solu­ti­ons nee­ded to deli­ver inno­va­ti­ve, high-qua­li­ty, secu­re pro­ducts. Learn more at www.synopsys.com.

Edi­to­ri­al Cont­act: 
Kel­ly James
Syn­op­sys, Inc.
650–584-8972
kellyj@synopsys.com