GLOBALFOUNDRIES and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications

Aug 07, 2019

Arm셲 inter짯con짯nect tech짯no짯lo짯gy on GF12LP pro짯cess enables high per짯for짯mance and low laten짯cy, while incre짯asing band짯width for high core designs in AI, Cloud Com짯pu짯ting and Mobi짯le SoCs

San짯ta Cla짯ra, Calif. and Cam짯bridge, UK, August 7, 2019  GLOBALFOUNDRIES, the world셲 lea짯ding spe짯cial짯ty foundry, today announ짯ced that it has taped-out an Arm짰-based 3D high-den짯si짯ty test chip that will enable a new level of sys짯tem per짯for짯mance and power effi짯ci짯en짯cy for com짯pu짯ting appli짯ca짯ti짯ons such as AI/ML and high-end con짯su짯mer mobi짯le and wire짯less solu짯ti짯ons. The new chip was fabri짯ca짯ted using GF셲 12nm Lea짯ding-Per짯for짯mance (12LP) Fin짯FET pro짯cess and fea짯tures Arm셲 mesh inter짯con짯nect tech짯no짯lo짯gy in 3D that allows data to take a more direct path to other cores, mini짯mi짯zing laten짯cy while incre짯asing data trans짯fer rates as deman짯ded by data cen짯ters, edge com짯pu짯ting and high-end con짯su짯mer applications. 

The deli짯very of this chip demons짯tra짯tes the fast pro짯gress that Arm and GF are making in rese짯ar짯ching and deve짯lo짯ping dif짯fe짯ren짯tia짯ted solu짯ti짯ons that enable impro짯ve짯ments in device den짯si짯ty and per짯for짯mance for sca짯lable high-per짯for짯mance com짯pu짯ting. Moreo짯ver, the com짯pa짯nies vali짯da짯ted a 3D Design-for-Test (DFT) metho짯do짯lo짯gy, using GF셲 hybrid wafer-to-wafer bon짯ding that can enable up to 1 mil짯li짯on 3D con짯nec짯tions per mm2, exten짯ding the abili짯ty to sca짯le 12nm designs long into the future.

Arm셲 inter짯con짯nect tech짯no짯lo짯gy in 3D enables the semi짯con짯duc짯tor indus짯try to aug짯ment Moore셲 Law to address a grea짯ter diver짯si짯ty of com짯pu짯ting appli짯ca짯ti짯ons, said Eric Hen짯nen짯hoe짯fer, vice pre짯si짯dent, Arm Rese짯arch. GF셲 exper짯ti짯se in fabri짯ca짯ti짯on and advan짯ced pack짯a짯ging capa짯bi짯li짯ties, com짯bi짯ned with Arm tech짯no짯lo짯gy, gives our mutu짯al part짯ners addi짯tio짯nal dif짯fe짯ren짯tia짯ti짯on to ven짯ture into new para짯digms for next gene짯ra짯ti짯on, high-per짯for짯mance computing.

In the era of big data and cogni짯ti짯ve com짯pu짯ting, advan짯ced pack짯a짯ging is play짯ing a much lar짯ger role than it has in the past. The use of AI and the need for power-effi짯ci짯ent, high-through짯put inter짯con짯nect is dri짯ving the growth of acce짯le짯ra짯tors through advan짯ced pack짯a짯ging, said John Pel짯le짯rin, chief tech짯no짯lo짯gist, plat짯forms at GF.   쏻e are deligh짯ted to be working with inno짯va짯ti짯ve part짯ners such as Arm to deli짯ver advan짯ced pack짯a짯ging solu짯ti짯ons which fur짯ther enable inte짯gra짯ting various node tech짯no짯lo짯gies opti짯mi짯zed for logic sca짯ling, memo짯ry band짯width and RF per짯for짯mance in a small form fac짯tor. This work will allow us to unco짯ver new insights in advan짯ced pack짯a짯ging that will enable our mutu짯al cli짯ents to crea짯te com짯ple짯te, dif짯fe짯ren짯tia짯ted solu짯ti짯ons more efficiently.

GF셲 busi짯ness model has trans짯for짯med to enable its cli짯ents to deve짯lop new mar짯ket and appli짯ca짯ti짯on-focu짯sed solu짯ti짯ons spe짯ci짯fi짯cal짯ly desi짯gned to meet the requi짯re짯ments of today셲 deman짯ding mar짯kets. GF3D face-to-face (F2F) pack짯a짯ging solu짯ti짯on not only pro짯vi짯des desi짯gners a path to hete짯ro짯ge짯neous logic and logic/memory inte짯gra짯ti짯on, but can be manu짯fac짯tu짯red using an opti짯mum pro짯duc짯tion node that enables lower laten짯cy, hig짯her band짯width and smal짯ler fea짯ture sizes. This approach, along with enga짯ging ear짯ly with part짯ners such as Arm, gives cli짯ents maxi짯mum choice and fle짯xi짯bi짯li짯ty, while deli짯ve짯ring cost savings and fas짯ter time-to-volu짯me for their next-gene짯ra짯ti짯on products.

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GLOBALFOUNDRIES (GF) is the world셲 lea짯ding spe짯cial짯ty foundry. We deli짯ver dif짯fe짯ren짯tia짯ted fea짯ture-rich solu짯ti짯ons that enable our cli짯ents to deve짯lop inno짯va짯ti짯ve pro짯ducts for high-growth mar짯ket seg짯ments. GF pro짯vi짯des a broad ran짯ge of plat짯forms and fea짯tures with a uni짯que mix of design, deve짯lo짯p짯ment and fabri짯ca짯ti짯on ser짯vices. With an at-sca짯le manu짯fac짯tu짯ring foot짯print span짯ning the U.S., Euro짯pe and Asia, GF has the fle짯xi짯bi짯li짯ty and agi짯li짯ty to meet the dyna짯mic needs of cli짯ents across the glo짯be. GF is owned by Muba짯d짯a짯la Invest짯ment Com짯pa짯ny. For more infor짯ma짯ti짯on, visit

About Arm

Arm tech짯no짯lo짯gy is at the heart of a com짯pu짯ting and con짯nec짯ti짯vi짯ty revo짯lu짯ti짯on that is trans짯forming the way peo짯p짯le live and busi짯nesses ope짯ra짯te. Our advan짯ced, ener짯gy-effi짯ci짯ent pro짯ces짯sor designs have enab짯led intel짯li짯gent com짯pu짯ting in more than 145 bil짯li짯on chips and our tech짯no짯lo짯gies now secu짯re짯ly power pro짯ducts from the sen짯sor to the smart짯phone and the super짯com짯pu짯ter. In com짯bi짯na짯ti짯on with our IoT device, con짯nec짯ti짯vi짯ty and data manage짯ment plat짯form, we are also enab짯ling cus짯to짯mers with powerful and actionable busi짯ness insights that are gene짯ra짯ting new value from their con짯nec짯ted devices and data. Tog짯e짯ther with 1,000+ tech짯no짯lo짯gy part짯ners we are at the fore짯front of desig짯ning, secu짯ring and mana짯ging all are짯as of com짯pu짯te from the chip to the cloud.

All infor짯ma짯ti짯on is pro짯vi짯ded 쏿s is and wit짯hout war짯ran짯ty or repre짯sen짯ta짯ti짯on. This docu짯ment may be shared free짯ly, attri짯bu짯ted and unmo짯di짯fied. Arm is a regis짯tered trade짯mark of Arm Limi짯t짯ed (or its sub짯si짯dia짯ries). All brands or pro짯duct names are the pro짯per짯ty of their respec짯ti짯ve hol짯ders. 짤 19952019 Arm Group.