2nd Gen AMD EPYC‚ĄĘ Processors Set New Standard for the Modern Datacenter with Record-Breaking Performance and Significant TCO Savings

‚ÄĒ    AMD EPYC‚ĄĘ 7002 Series pro¬≠ces¬≠sors set 80 per¬≠for¬≠mance world records1, pro¬≠vi¬≠de 2X the per¬≠for¬≠mance com¬≠pared to the pre¬≠vious gene¬≠ra¬≠ti¬≠on2 and deli¬≠ver an esti¬≠ma¬≠ted 25% to 50% lower TCO than com¬≠pe¬≠ti¬≠ti¬≠ve offe¬≠rings3 ‚ÄĒ

‚ÄĒ    Goog¬≠le and Twit¬≠ter join gro¬≠wing list of cus¬≠to¬≠mers adop¬≠ting AMD EPYC processors ‚ÄĒ

SANTA CLARA, Calif. 

At a launch event today, AMD (NASDAQ: AMD) was joi¬≠n¬≠ed by an expan¬≠si¬≠ve eco¬≠sys¬≠tem of dat¬≠a¬≠cen¬≠ter part¬≠ners and cus¬≠to¬≠mers to intro¬≠du¬≠ce the 2ndGene¬≠ra¬≠ti¬≠on AMD EPYC‚ĄĘ fami¬≠ly of pro¬≠ces¬≠sors that deli¬≠ver per¬≠for¬≠mance lea¬≠der¬≠ship across a broad num¬≠ber of enter¬≠pri¬≠se, cloud and high-per¬≠for¬≠mance com¬≠pu¬≠ting (HPC) workloads. 2nd Gen AMD EPYC‚ĄĘ pro¬≠ces¬≠sors fea¬≠ture up to 64 ‚ÄúZen 2‚ÄĚ cores in lea¬≠ding-edge 7nm pro¬≠cess tech¬≠no¬≠lo¬≠gy to deli¬≠ver record-set¬≠ting per¬≠for¬≠mance while hel¬≠ping redu¬≠ce total cost of owner¬≠ship (TCO) by up to 50% across num¬≠e¬≠rous workloads4. At the event, Goog¬≠le and Twit¬≠ter announ¬≠ced new 2nd Gen AMD EPYC pro¬≠ces¬≠sor deploy¬≠ments and HPE and Leno¬≠vo announ¬≠ced imme¬≠dia¬≠te avai¬≠la¬≠bi¬≠li¬≠ty of new platforms.

‚ÄúToday, we set a new stan¬≠dard for the modern dat¬≠a¬≠cen¬≠ter with the launch of our 2nd Gen AMD EPYC pro¬≠ces¬≠sors that deli¬≠ver record-set¬≠ting per¬≠for¬≠mance and signi¬≠fi¬≠cant¬≠ly lower total cost of owner¬≠ship across a broad set of workloads,‚ÄĚ said Dr. Lisa Su, pre¬≠si¬≠dent and CEO, AMD. ‚ÄúAdop¬≠ti¬≠on of our new lea¬≠der¬≠ship ser¬≠ver pro¬≠ces¬≠sors is acce¬≠le¬≠ra¬≠ting with mul¬≠ti¬≠ple new enter¬≠pri¬≠se, cloud and HPC cus¬≠to¬≠mers choo¬≠sing EPYC pro¬≠ces¬≠sors to meet their most deman¬≠ding ser¬≠ver com¬≠pu¬≠ting needs.

2nd Gen EPYC Processors Expand the AMD Datacenter Customer and Partner Ecosystem

At the launch event, seve­ral cus­to­mers and part­ners joi­n­ed AMD on stage to dis­cuss new AMD EPYC pro­ces­sor offerings:

  • Goog¬≠le announ¬≠ced it has deploy¬≠ed 2nd Gen AMD EPYC pro¬≠ces¬≠sors in its inter¬≠nal infra¬≠struc¬≠tu¬≠re pro¬≠duc¬≠tion dat¬≠a¬≠cen¬≠ter envi¬≠ron¬≠ment and in late 2019 will sup¬≠port new gene¬≠ral-pur¬≠po¬≠se machi¬≠nes powered by 2nd Gen AMD EPYC pro¬≠ces¬≠sors on Goog¬≠le Cloud Com¬≠pu¬≠te Engi¬≠ne as well;
  • Twit¬≠ter announ¬≠ced it will deploy 2nd Gen AMD EPYC pro¬≠ces¬≠sors across its dat¬≠a¬≠cen¬≠ter infra¬≠struc¬≠tu¬≠re later this year, redu¬≠cing TCO by 25%;
  • Micro¬≠soft announ¬≠ced the pre¬≠view of new Azu¬≠re vir¬≠tu¬≠al machi¬≠nes for gene¬≠ral pur¬≠po¬≠se appli¬≠ca¬≠ti¬≠ons, as well as limi¬≠t¬≠ed pre¬≠views of cloud-based remo¬≠te desk¬≠tops and HPC workloads based on 2nd Gen AMD EPYC pro¬≠ces¬≠sors today;
  • HPE announ¬≠ced con¬≠tin¬≠ued sup¬≠port of the AMD EPYC pro¬≠ces¬≠sor fami¬≠ly with plans to tri¬≠ple their AMD-based port¬≠fo¬≠lio with a broad ran¬≠ge of 2nd Gen AMD EPYC pro¬≠ces¬≠sor-based sys¬≠tems, inclu¬≠ding the HPE Pro¬≠Li¬≠ant DL385 and HPE Pro¬≠Li¬≠ant DL325 servers;
  • Cray announ¬≠ced The Air Force Wea¬≠ther Agen¬≠cy will be using a Cray Shas¬≠ta sys¬≠tem with 2nd Gen AMD EPYC pro¬≠ces¬≠sors to pro¬≠vi¬≠de com¬≠pre¬≠hen¬≠si¬≠ve ter¬≠restri¬≠al and space wea¬≠ther infor¬≠ma¬≠ti¬≠on to the U.S. Air Force and Army;
  • Leno¬≠vo announ¬≠ced new solu¬≠ti¬≠ons that are spe¬≠ci¬≠fi¬≠cal¬≠ly built to take advan¬≠ta¬≠ge of the full ran¬≠ge of enhan¬≠ced capa¬≠bi¬≠li¬≠ties found in the 2nd Gen AMD EPYC pro¬≠ces¬≠sors. Available today, the Think¬≠Sys¬≠tem SR655 and SR635 are ide¬≠al solu¬≠ti¬≠ons for use cases such as video infra¬≠struc¬≠tu¬≠re, vir¬≠tua¬≠liza¬≠ti¬≠on, soft¬≠ware-defi¬≠ned sto¬≠rage and more, with excep¬≠tio¬≠nal ener¬≠gy efficiency;
  • Dell Tech¬≠no¬≠lo¬≠gies announ¬≠ced the upco¬≠ming avai¬≠la¬≠bi¬≠li¬≠ty of new¬≠ly desi¬≠gned ser¬≠vers opti¬≠mi¬≠zed for 2nd Gen AMD EPYC processors;
  • VMware and AMD announ¬≠ced a clo¬≠se col¬≠la¬≠bo¬≠ra¬≠ti¬≠on to deli¬≠ver sup¬≠port for new secu¬≠ri¬≠ty and other fea¬≠tures of the high-per¬≠for¬≠mance 2nd Gen AMD EPYC pro¬≠ces¬≠sors within VMware vSphere.

‚ÄúAMD 2nd Gen EPYC pro¬≠ces¬≠sors will help us con¬≠ti¬≠nue to do what we do best in our dat¬≠a¬≠cen¬≠ters: inno¬≠va¬≠te,‚ÄĚ said Bart Sano, Goog¬≠le vice pre¬≠si¬≠dent of Engi¬≠nee¬≠ring. ‚ÄúIts sca¬≠lable com¬≠pu¬≠te, memo¬≠ry and I/O per¬≠for¬≠mance will expand our abili¬≠ty to dri¬≠ve inno¬≠va¬≠ti¬≠on for¬≠ward in our infra¬≠struc¬≠tu¬≠re and will give Goog¬≠le Cloud cus¬≠to¬≠mers the fle¬≠xi¬≠bi¬≠li¬≠ty to choo¬≠se the best VM for their workloads.‚ÄĚ

Designed for Modern Workloads: Enterprise, Cloud and HPC

Second Gen AMD EPYC‚ĄĘ pro¬≠ces¬≠sors are spe¬≠ci¬≠fi¬≠cal¬≠ly desi¬≠gned for modern dat¬≠a¬≠cen¬≠ter workloads, pro¬≠vi¬≠ding cus¬≠to¬≠mers an ide¬≠al com¬≠bi¬≠na¬≠ti¬≠on of fea¬≠tures to help unlock per¬≠for¬≠mance and rede¬≠fi¬≠ne eco¬≠no¬≠mics in vir¬≠tua¬≠liza¬≠ti¬≠on, cloud, HPC and enter¬≠pri¬≠se applications.

For the enter¬≠pri¬≠se dat¬≠a¬≠cen¬≠ter, 2nd Gen AMD EPYC pro¬≠ces¬≠sors offer up to 83% bet¬≠ter Java appli¬≠ca¬≠ti¬≠on per¬≠for¬≠mance5, up to 43% bet¬≠ter SAP SD 2 Tier per¬≠for¬≠mance6 than the com¬≠pe¬≠ti¬≠ti¬≠on and pro¬≠vi¬≠de world record per¬≠for¬≠mance on Real Time Ana¬≠ly¬≠tics with Hadoop7

For modern cloud and vir¬≠tua¬≠liza¬≠ti¬≠on workloads, 2nd Gen AMD EPYC pro¬≠ces¬≠sors deli¬≠ver world record vir¬≠tua¬≠liza¬≠ti¬≠on8 per¬≠for¬≠mance that rede¬≠fi¬≠nes dat¬≠a¬≠cen¬≠ter economics.

For HPC, 2nd Gen AMD EPYC pro¬≠ces¬≠sors offer an unmat¬≠ched com¬≠bi¬≠na¬≠ti¬≠on of record-set¬≠ting floa¬≠ting point per¬≠for¬≠mance9 and the most DRAM memo¬≠ry10 and I/O band¬≠width in its class to super¬≠char¬≠ge HPC workloads, inclu¬≠ding up to 2x bet¬≠ter per¬≠for¬≠mance in com¬≠pu¬≠ta¬≠tio¬≠nal flu¬≠id dyna¬≠mics11 and up to 72% hig¬≠her per¬≠for¬≠mance struc¬≠tu¬≠ral ana¬≠ly¬≠sis12.

AMD Design Innovation Brings Breakthrough Architecture for the Datacenter

The 2nd Gen AMD EPYC pro¬≠ces¬≠sor com¬≠bi¬≠nes lea¬≠der¬≠ship per¬≠for¬≠mance, archi¬≠tec¬≠tu¬≠re and secu¬≠ri¬≠ty fea¬≠tures to meet the most deman¬≠ding chal¬≠lenges facing the dat¬≠a¬≠cen¬≠ter. High¬≠lights of the AMD EPYC 7002 gene¬≠ra¬≠ti¬≠on pro¬≠ces¬≠sor fami¬≠ly include:

  • Lea¬≠der¬≠ship Per¬≠for¬≠mance: Fea¬≠turing up to 64 ‚ÄúZen 2‚ÄĚ cores per SOC, 2nd Gen EPYC pro¬≠ces¬≠sors deli¬≠ver up to 23% more ins¬≠truc¬≠tions per clock (IPC) per core on ser¬≠ver workloads13 and up to 4X more L3 Cache com¬≠pared to the pre¬≠vious generation.
  • Lea¬≠der¬≠ship Archi¬≠tec¬≠tu¬≠re: The next-gene¬≠ra¬≠ti¬≠on AMD Infi¬≠ni¬≠ty Archi¬≠tec¬≠tu¬≠re pushes the boun¬≠da¬≠ries for x86 per¬≠for¬≠mance and com¬≠pu¬≠te capa¬≠bi¬≠li¬≠ties, giving cus¬≠to¬≠mers access to the most I/O14 and memo¬≠ry band¬≠width15 in its class, inclu¬≠ding PCIe Gene¬≠ra¬≠ti¬≠on 4, to unleash the very latest in ser¬≠ver performance.
  • Lea¬≠der¬≠ship Secu¬≠ri¬≠ty Fea¬≠tures: Deli¬≠ve¬≠ring ‚Äúhar¬≠den¬≠ed at the core‚ÄĚ fea¬≠tures based on a sili¬≠con embedded secu¬≠ri¬≠ty sub¬≠sys¬≠tem and advan¬≠ced secu¬≠ri¬≠ty fea¬≠tures like Secu¬≠re Memo¬≠ry Encryp¬≠ti¬≠on and Secu¬≠re Encrypt¬≠ed Vir¬≠tua¬≠liza¬≠ti¬≠on that help cus¬≠to¬≠mers guard their most important assets and data.

A Growing Partner Ecosystem

The AMD EPYC eco¬≠sys¬≠tem con¬≠ti¬≠nues to grow with more than 60 part¬≠ners sup¬≠port¬≠ing the launch on day one. The broad part¬≠ner eco¬≠sys¬≠tem inclu¬≠ding ODMs like Giga¬≠byte and QCT, IHVs like Broad¬≠com, Micron and Xilinx, and broad ope¬≠ra¬≠ting sys¬≠tem sup¬≠port inclu¬≠ding Micro¬≠soft and mul¬≠ti¬≠ple Linux dis¬≠tri¬≠bu¬≠ti¬≠ons. For Linux Cano¬≠ni¬≠cal, Red¬≠Hat and SUSE col¬≠la¬≠bo¬≠ra¬≠ted with AMD to test and vali¬≠da¬≠te solu¬≠ti¬≠ons based on the 2nd Gen AMD EPYC pro¬≠ces¬≠sors for a wide ran¬≠ge of dat¬≠a¬≠cen¬≠ter use cases. This vali¬≠da¬≠ti¬≠on hel¬≠ped the 2nd Gen AMD EPYC pro¬≠ces¬≠sor achie¬≠ve more than 2X plat¬≠forms in deve¬≠lo¬≠p¬≠ment com¬≠pared to the 1st Gen EPYC processors.

You can read more about the expan¬≠ding AMD EPYC eco¬≠sys¬≠tem and the 2nd Gen AMD EPYC pro¬≠ces¬≠sor here at the AMD blog. 

The 2nd Gen AMD EPYC pro¬≠ces¬≠sor-based sys¬≠tems are available now from the AMD EPYC eco¬≠sys¬≠tem part¬≠ners. Learn more about whe¬≠re to purcha¬≠se tho¬≠se sys¬≠tems here.

Supporting Partner and Customer Quotes

‚ÄúTwit¬≠ter is com¬≠mit¬≠ted to redu¬≠cing our envi¬≠ron¬≠men¬≠tal impact of our dat¬≠a¬≠cen¬≠ters by fin¬≠ding inno¬≠va¬≠ti¬≠ve ways to increase effi¬≠ci¬≠en¬≠cy. The 2nd Gen AMD EPYC pro¬≠ces¬≠sor pro¬≠vi¬≠des us the sweet spot of per¬≠for¬≠mance and ener¬≠gy con¬≠sump¬≠ti¬≠on that we need to honor that com¬≠mit¬≠ment, while sup¬≠port¬≠ing the high traf¬≠fic volu¬≠me on our plat¬≠form,‚ÄĚ Jen¬≠ni¬≠fer Fraser, seni¬≠or direc¬≠tor of Engi¬≠nee¬≠ring at Twit¬≠ter. ‚ÄúUsing the AMD EPYC 7702 pro¬≠ces¬≠sor we can sca¬≠le out our com¬≠pu¬≠te clus¬≠ters with more cores in less space using less power, which trans¬≠la¬≠tes to a 25% lower TCO for Twitter.‚ÄĚ

‚ÄúCus¬≠to¬≠mers today are asking for secu¬≠re, workload-opti¬≠mi¬≠zed ser¬≠vers that can dri¬≠ve new expe¬≠ri¬≠en¬≠ces and value for their cus¬≠to¬≠mers,‚ÄĚ said Jus¬≠tin Hotard, seni¬≠or vice pre¬≠si¬≠dent and gene¬≠ral mana¬≠ger, Volu¬≠me Glo¬≠bal Busi¬≠ness Unit at HPE. ‚ÄúWith the addi¬≠ti¬≠on of new 2nd Gen AMD EPYC‚ĄĘ-equipped ser¬≠vers to our port¬≠fo¬≠lio, HPE deli¬≠vers an unpre¬≠ce¬≠den¬≠ted num¬≠ber of world-record per¬≠for¬≠mance and effi¬≠ci¬≠en¬≠cy results ali¬≠gned to a wide ran¬≠ge of cloud and dat¬≠a¬≠cen¬≠ter workloads, and unmat¬≠ched secu¬≠ri¬≠ty capa¬≠bi¬≠li¬≠ties. We will con¬≠ti¬≠nue to deli¬≠ver inno¬≠va¬≠ti¬≠ve pro¬≠ducts with AMD and look for¬≠ward to buil¬≠ding on our long¬≠stan¬≠ding col¬≠la¬≠bo¬≠ra¬≠ti¬≠ve relationship.‚ÄĚ

‚ÄúAs we enter a new era of com¬≠pu¬≠ting, the exas¬≠ca¬≠le era, we‚Äôre see¬≠ing new workloads, new infra¬≠struc¬≠tu¬≠re, a new way of thin¬≠king ‚Äď and this requi¬≠res capa¬≠bi¬≠li¬≠ties and per¬≠for¬≠mance like we get from our next-gene¬≠ra¬≠ti¬≠on Shas¬≠ta super¬≠com¬≠pu¬≠ter com¬≠bi¬≠ned with AMD EPYC pro¬≠ces¬≠sors,‚ÄĚ said Peter Unga¬≠ro, pre¬≠si¬≠dent and CEO at Cray. ‚ÄúSin¬≠ce Cray announ¬≠ced sup¬≠port for AMD pro¬≠ces¬≠sors in our sys¬≠tems over a year ago, we‚Äôve boo¬≠ked almost $800 mil¬≠li¬≠on in AMD EPYC-based sys¬≠tems. With the 2nd Gen AMD EPYC pro¬≠ces¬≠sors con¬≠nec¬≠ted via our new Slingshot sys¬≠tem inter¬≠con¬≠nect, we‚Äôre able to deli¬≠ver the per¬≠for¬≠mance our cus¬≠to¬≠mers requi¬≠re for the exas¬≠ca¬≠le era.‚ÄĚ

‚ÄúToday, through our expan¬≠ded rela¬≠ti¬≠onship with AMD, we are pushing boun¬≠da¬≠ries on per¬≠for¬≠mance and effi¬≠ci¬≠en¬≠cy in ways that will acce¬≠le¬≠ra¬≠te our cus¬≠to¬≠mers‚Äô intel¬≠li¬≠gent trans¬≠for¬≠ma¬≠ti¬≠on. Our new Think¬≠Sys¬≠tem solu¬≠ti¬≠ons, powered by next-gene¬≠ra¬≠ti¬≠on AMD EPYC‚ĄĘ 7002 Series pro¬≠ces¬≠sors, allow users to store and access huge amounts of data,‚ÄĚ said Doug Fisher, chief ope¬≠ra¬≠ting offi¬≠cer and seni¬≠or vice pre¬≠si¬≠dent of Busi¬≠ness Units, DCG Solu¬≠ti¬≠ons, Leno¬≠vo. ‚ÄúThe grea¬≠ter sto¬≠rage, pro¬≠ces¬≠sing and gra¬≠phics capa¬≠bi¬≠li¬≠ties unlock the poten¬≠ti¬≠al of enhan¬≠ced video secu¬≠ri¬≠ty and other cri¬≠ti¬≠cal appli¬≠ca¬≠ti¬≠ons for edge and vir¬≠tua¬≠li¬≠zed envi¬≠ron¬≠ments. A per¬≠fect exam¬≠p¬≠le is video secu¬≠ri¬≠ty in smart city, cam¬≠pus and mass tran¬≠sit envi¬≠ron¬≠ments whe¬≠re public safe¬≠ty orga¬≠niza¬≠ti¬≠ons need that addi¬≠tio¬≠nal com¬≠pu¬≠ting power in con¬≠fi¬≠ned spaces using less ener¬≠gy so they can bet¬≠ter moni¬≠tor and ana¬≠ly¬≠ze poten¬≠ti¬≠al threats.‚ÄĚ

‚ÄúAs workloads beco¬≠me more deman¬≠ding and com¬≠plex, Dell Tech¬≠no¬≠lo¬≠gies is focu¬≠sed on hel¬≠ping orga¬≠niza¬≠ti¬≠ons suc¬≠ceed in dyna¬≠mic envi¬≠ron¬≠ments using inno¬≠va¬≠ti¬≠ve and indus¬≠try-lea¬≠ding ser¬≠ver designs,‚ÄĚ said Ravi Pen¬≠de¬≠kan¬≠ti, seni¬≠or vice pre¬≠si¬≠dent of pro¬≠duct manage¬≠ment, Ser¬≠ver & Infra¬≠struc¬≠tu¬≠re Sys¬≠tems, Dell Tech¬≠no¬≠lo¬≠gies. ‚ÄúThrough clo¬≠se col¬≠la¬≠bo¬≠ra¬≠ti¬≠on with AMD, we are addres¬≠sing the demands of tra¬≠di¬≠tio¬≠nal, vir¬≠tua¬≠li¬≠zed, hybrid and mul¬≠ti-cloud workloads with a broad port¬≠fo¬≠lio of PowerEdge ser¬≠vers, inclu¬≠ding new¬≠ly desi¬≠gned ser¬≠vers opti¬≠mi¬≠zed for 2nd Gene¬≠ra¬≠ti¬≠on AMD EPYC processors.‚ÄĚ

‚ÄúVMware and AMD‚Äôs ongo¬≠ing engi¬≠nee¬≠ring col¬≠la¬≠bo¬≠ra¬≠ti¬≠on is focu¬≠sed on deli¬≠ve¬≠ring opti¬≠mal appli¬≠ca¬≠ti¬≠on per¬≠for¬≠mance and secu¬≠ri¬≠ty for our mutu¬≠al cus¬≠to¬≠mers,‚ÄĚ said Krish Pra¬≠sad, seni¬≠or vice pre¬≠si¬≠dent and gene¬≠ral mana¬≠ger, Cloud Plat¬≠form Busi¬≠ness Unit, VMware. ‚ÄúWe both see the value in dri¬≠ving secu¬≠ri¬≠ty deeper into the infra¬≠struc¬≠tu¬≠re espe¬≠ci¬≠al¬≠ly as modern IT infra¬≠struc¬≠tu¬≠re beco¬≠mes more dis¬≠tri¬≠bu¬≠ted. The Secu¬≠re Encrypt¬≠ed Vir¬≠tua¬≠liza¬≠ti¬≠on fea¬≠ture in the 2nd Gen AMD EPYC pro¬≠ces¬≠sor will help pro¬≠tect cus¬≠to¬≠mers‚Äô cri¬≠ti¬≠cal data across the mul¬≠ti-site dat¬≠a¬≠cen¬≠ter fabric. Com¬≠bi¬≠ned with AMD‚Äôs legen¬≠da¬≠ry pro¬≠ces¬≠sor per¬≠for¬≠mance, we expect our mutu¬≠al cus¬≠to¬≠mers will be able to gain effi¬≠ci¬≠en¬≠ci¬≠es and secu¬≠ri¬≠ty capa¬≠bi¬≠li¬≠ties to power their workloads.‚ÄĚ

2nd Gen AMD EPYC‚ĄĘ Processor Stack

Model # Cores Threads Base Freq (GHz) Max Boost Freq (GHz)16 Default TDP (w) L3 Cache (MB) 1Ku

Pri­cing

7742 64 128 2.25 3.40 225w17 256 $6,950
7702 64 128 2.00 3.35 200w 256 $6,450
7702P 64 128 2.00 3.35 200w 256 $4,425
7642 48 96 2.30 3.30 225w18 256 $4,775
7552 48 96 2.20 3.30 200w 192 $4,025
7542 32 64 2.90 3.40 225w19 128 $3,400
7502 32 64 2.50 3.35 180w 128 $2,600
7502P 32 64 2.50 3.35 180w 128 $2,300
7452 32 64 2.35 3.35 155w 128 $2,025
7402 24 48 2.80 3.35 180w 128 $1,783
7402P 24 48 2.80 3.35 180w 128 $1,250
7352 24 48 2.30 3.20 155w 128 $1,350
7302 16 32 3.00 3.30 155w 128 $978
7302P 16 32 3.00 3.30 155w 128 $825
7282 16 32 2.80 3.20 120w 64 $650
7272 12 24 2.90 3.20 120w 64 $625
7262 8 16 3.20 3.40 155w 128 $575
7252 8 16 3.10 3.20 120w 64 $475
7232P 8 16 3.10 3.20 120w 32 $450

Supporting Resources

About AMD

For 50 years, AMD has dri¬≠ven inno¬≠va¬≠ti¬≠on in high-per¬≠for¬≠mance com¬≠pu¬≠ting, gra¬≠phics and visua¬≠liza¬≠ti¬≠on tech¬≠no¬≠lo¬≠gies ‚ÄĒ the buil¬≠ding blocks for gam¬≠ing, immersi¬≠ve plat¬≠forms and the dat¬≠a¬≠cen¬≠ter. Hundreds of mil¬≠li¬≠ons of con¬≠su¬≠mers, lea¬≠ding For¬≠tu¬≠ne 500 busi¬≠nesses and cut¬≠ting-edge sci¬≠en¬≠ti¬≠fic rese¬≠arch faci¬≠li¬≠ties around the world rely on AMD tech¬≠no¬≠lo¬≠gy dai¬≠ly to impro¬≠ve how they live, work and play. AMD employees around the world are focu¬≠sed on buil¬≠ding gre¬≠at pro¬≠ducts that push the boun¬≠da¬≠ries of what is pos¬≠si¬≠ble. For more infor¬≠ma¬≠ti¬≠on about how AMD is enab¬≠ling today and inspi¬≠ring tomor¬≠row, visit the AMD (NASDAQ: AMDweb¬≠siteblogFace¬≠book and Twit¬≠ter pages.

Cautionary Statement  

This press release con¬≠ta¬≠ins for¬≠ward-loo¬≠king state¬≠ments con¬≠cer¬≠ning Advan¬≠ced Micro Devices, Inc. (AMD) inclu¬≠ding the fea¬≠tures, func¬≠tion¬≠a¬≠li¬≠ty, avai¬≠la¬≠bi¬≠li¬≠ty, timing, deploy¬≠ment and expec¬≠ta¬≠ti¬≠ons of AMD‚Äôs future pro¬≠ducts, inclu¬≠ding the 2nd Gen AMD EPYC ser¬≠ver pro¬≠ces¬≠sor fami¬≠ly, which are made pur¬≠su¬≠ant to the Safe Har¬≠bor pro¬≠vi¬≠si¬≠ons of the Pri¬≠va¬≠te Secu¬≠ri¬≠ties Liti¬≠ga¬≠ti¬≠on Reform Act of 1995. For¬≠ward-loo¬≠king state¬≠ments are com¬≠mon¬≠ly iden¬≠ti¬≠fied by words such as ‚Äúwould,‚ÄĚ ‚Äúintends,‚ÄĚ ‚Äúbelie¬≠ves,‚ÄĚ ‚Äúexpects,‚ÄĚ ‚Äúmay,‚ÄĚ ‚Äúwill,‚ÄĚ ‚Äúshould,‚ÄĚ ‚Äúseeks,‚ÄĚ ‚Äúintends,‚ÄĚ ‚Äúplans,‚ÄĚ ‚Äúpro for¬≠ma,‚ÄĚ ‚Äúesti¬≠ma¬≠tes,‚ÄĚ ‚Äúanti¬≠ci¬≠pa¬≠tes,‚ÄĚ or the nega¬≠ti¬≠ve of the¬≠se words and phra¬≠ses, other varia¬≠ti¬≠ons of the¬≠se words and phra¬≠ses or com¬≠pa¬≠ra¬≠ble ter¬≠mi¬≠no¬≠lo¬≠gy. Inves¬≠tors are cau¬≠tio¬≠ned that the for¬≠ward-loo¬≠king state¬≠ments in this docu¬≠ment are based on cur¬≠rent beliefs, assump¬≠ti¬≠ons and expec¬≠ta¬≠ti¬≠ons, speak only as of the date of this docu¬≠ment and invol¬≠ve risks and uncer¬≠tain¬≠ties that could cau¬≠se actu¬≠al results to dif¬≠fer mate¬≠ri¬≠al¬≠ly from cur¬≠rent expec¬≠ta¬≠ti¬≠ons. Such state¬≠ments are sub¬≠ject to cer¬≠tain known and unknown risks and uncer¬≠tain¬≠ties, many of which are dif¬≠fi¬≠cult to pre¬≠dict and gene¬≠ral¬≠ly bey¬≠ond AMD‚Äôs con¬≠trol, that could cau¬≠se actu¬≠al results and other future events to dif¬≠fer mate¬≠ri¬≠al¬≠ly from tho¬≠se expres¬≠sed in, or impli¬≠ed or pro¬≠jec¬≠ted by, the for¬≠ward-loo¬≠king infor¬≠ma¬≠ti¬≠on and state¬≠ments. Mate¬≠ri¬≠al fac¬≠tors that could cau¬≠se actu¬≠al results to dif¬≠fer mate¬≠ri¬≠al¬≠ly from cur¬≠rent expec¬≠ta¬≠ti¬≠ons include, wit¬≠hout limi¬≠ta¬≠ti¬≠on, the fol¬≠lo¬≠wing: Intel Corporation‚Äôs domi¬≠nan¬≠ce of the micro¬≠pro¬≠ces¬≠sor mar¬≠ket and its aggres¬≠si¬≠ve busi¬≠ness prac¬≠ti¬≠ces; the abili¬≠ty of  GLOBALFOUNDRIES Inc. (GF) to satis¬≠fy AMD‚Äôs manu¬≠fac¬≠tu¬≠ring requi¬≠re¬≠ments; the abili¬≠ty of third par¬≠ty manu¬≠fac¬≠tures to manu¬≠fac¬≠tu¬≠re AMD‚Äôs pro¬≠ducts on a time¬≠ly basis in suf¬≠fi¬≠ci¬≠ent quan¬≠ti¬≠ties and using com¬≠pe¬≠ti¬≠ti¬≠ve tech¬≠no¬≠lo¬≠gies; the abili¬≠ty of third par¬≠ty manu¬≠fac¬≠tu¬≠r¬≠ers  to achie¬≠ve expec¬≠ted manu¬≠fac¬≠tu¬≠ring yields for AMD‚Äôs pro¬≠ducts;  AMD‚Äôs abili¬≠ty to intro¬≠du¬≠ce pro¬≠ducts on a time¬≠ly basis with fea¬≠tures and per¬≠for¬≠mance levels that pro¬≠vi¬≠de value to its cus¬≠to¬≠mers while sup¬≠port¬≠ing and coin¬≠ci¬≠ding with signi¬≠fi¬≠cant indus¬≠try tran¬≠si¬≠ti¬≠ons; AMD‚Äôs ina¬≠bi¬≠li¬≠ty to gene¬≠ra¬≠te suf¬≠fi¬≠ci¬≠ent reve¬≠nue and ope¬≠ra¬≠ting cash flow or obtain exter¬≠nal finan¬≠cing that may adver¬≠se¬≠ly impact its plan¬≠ned invest¬≠ments in rese¬≠arch and deve¬≠lo¬≠p¬≠ment or other stra¬≠te¬≠gic invest¬≠ments; the loss of a signi¬≠fi¬≠cant cus¬≠to¬≠mer; AMD‚Äôs abili¬≠ty to gene¬≠ra¬≠te reve¬≠nue from its semi-cus¬≠tom SoC pro¬≠ducts; glo¬≠bal eco¬≠no¬≠mic and mar¬≠ket uncer¬≠tain¬≠ty may adver¬≠se¬≠ly impact AMD‚Äôs busi¬≠ness and ope¬≠ra¬≠ting results; AMD‚Äôs world¬≠wi¬≠de ope¬≠ra¬≠ti¬≠ons are sub¬≠ject to poli¬≠ti¬≠cal, legal and eco¬≠no¬≠mic risks and natu¬≠ral dis¬≠as¬≠ters; poten¬≠ti¬≠al secu¬≠ri¬≠ty vul¬≠nerabi¬≠li¬≠ties that could have a mate¬≠ri¬≠al adver¬≠se effect on AMD; poten¬≠ti¬≠al IT outa¬≠ges, data loss, data brea¬≠ches and cyber-attacks; AMD‚Äôs  abili¬≠ty to gene¬≠ra¬≠te suf¬≠fi¬≠ci¬≠ent cash to ser¬≠vice its debt obli¬≠ga¬≠ti¬≠ons or meet its working capi¬≠tal requi¬≠re¬≠ments; AMD‚Äôs lar¬≠ge amount of indeb¬≠ted¬≠ness could adver¬≠se¬≠ly affect its finan¬≠cial posi¬≠ti¬≠on and pre¬≠vent it from imple¬≠men¬≠ting its stra¬≠tegy or ful¬≠fil¬≠ling its con¬≠trac¬≠tu¬≠al obli¬≠ga¬≠ti¬≠ons; the rest¬≠ric¬≠tions impo¬≠sed by agree¬≠ment gover¬≠ning AMD‚Äôs notes and its secu¬≠red revol¬≠ving faci¬≠li¬≠ty; the com¬≠pe¬≠ti¬≠ti¬≠ve mar¬≠kets in which AMD‚Äôs pro¬≠ducts are sold; the poten¬≠ti¬≠al dilu¬≠ti¬≠ve effect of the 2.125% Con¬≠ver¬≠ti¬≠ble Seni¬≠or Notes due 2026 if con¬≠ver¬≠ted; uncer¬≠tain¬≠ties invol¬≠ving the orde¬≠ring and ship¬≠ment of AMD‚Äôs pro¬≠ducts; the mar¬≠ket con¬≠di¬≠ti¬≠ons of the indus¬≠tries in which AMD pro¬≠ducts are sold; AMD‚Äôs reli¬≠ance on third-par¬≠ty intellec¬≠tu¬≠al pro¬≠per¬≠ty to design and intro¬≠du¬≠ce new pro¬≠ducts in a time¬≠ly man¬≠ner; AMD‚Äôs reli¬≠ance on third-par¬≠ty com¬≠pa¬≠nies for the design, manu¬≠fac¬≠tu¬≠re and sup¬≠p¬≠ly of mother¬≠boards, soft¬≠ware and other com¬≠pu¬≠ter plat¬≠form com¬≠pon¬≠ents; AMD‚Äôs reli¬≠ance on Micro¬≠soft Cor¬≠po¬≠ra¬≠ti¬≠on and other soft¬≠ware ven¬≠dors‚Äô sup¬≠port to design and deve¬≠lop soft¬≠ware to run on AMD‚Äôs pro¬≠ducts; AMD‚Äôs reli¬≠ance on third-par¬≠ty dis¬≠tri¬≠bu¬≠tors and add-in-board part¬≠ners; future impairm¬≠ents of good¬≠will and tech¬≠no¬≠lo¬≠gy licen¬≠se purcha¬≠ses; AMD‚Äôs abili¬≠ty to attract and retain qua¬≠li¬≠fied per¬≠son¬≠nel; AMD‚Äôs abili¬≠ty to repurcha¬≠se its out¬≠stan¬≠ding debt in the event of a chan¬≠ge of con¬≠trol; the cycli¬≠cal natu¬≠re of the semi¬≠con¬≠duc¬≠tor indus¬≠try; future acqui¬≠si¬≠ti¬≠ons, dives¬≠ti¬≠tures, joint ven¬≠tures and/or invest¬≠ments could adver¬≠se¬≠ly affect AMD‚Äôs busi¬≠ness; modi¬≠fi¬≠ca¬≠ti¬≠on or inter¬≠rup¬≠ti¬≠on of AMD‚Äôs inter¬≠nal busi¬≠ness pro¬≠ces¬≠ses and infor¬≠ma¬≠ti¬≠on sys¬≠tems may dis¬≠rupt its busi¬≠ness, pro¬≠ces¬≠ses and inter¬≠nal con¬≠trols; the avai¬≠la¬≠bi¬≠li¬≠ty of essen¬≠ti¬≠al equip¬≠ment, mate¬≠ri¬≠als or manu¬≠fac¬≠tu¬≠ring pro¬≠ces¬≠ses; com¬≠pa¬≠ti¬≠bi¬≠li¬≠ty of AMD‚Äôs pro¬≠ducts with some or all indus¬≠try-stan¬≠dard soft¬≠ware and hard¬≠ware; cos¬≠ts rela¬≠ted to defec¬≠ti¬≠ve pro¬≠ducts; the effi¬≠ci¬≠en¬≠cy of AMD‚Äôs sup¬≠p¬≠ly chain as it responds to chan¬≠ges in cus¬≠to¬≠mer demand for its pro¬≠ducts; AMD‚Äôs abili¬≠ty to rely on third par¬≠ty sup¬≠p¬≠ly-chain logi¬≠stics func¬≠tions; AMD‚Äôs stock pri¬≠ce vola¬≠ti¬≠li¬≠ty; unfa¬≠vorable cur¬≠ren¬≠cy exch¬≠an¬≠ge rate fluc¬≠tua¬≠tions could adver¬≠se¬≠ly affect AMD; AMD‚Äôs abili¬≠ty to effec¬≠tively con¬≠trol the sales of its pro¬≠ducts on the gray mar¬≠ket; AMD‚Äôs abili¬≠ty to ade¬≠qua¬≠te¬≠ly pro¬≠tect its tech¬≠no¬≠lo¬≠gy or other intellec¬≠tu¬≠al pro¬≠per¬≠ty in the United Sta¬≠tes and abroad; cur¬≠rent and future claims and liti¬≠ga¬≠ti¬≠on; and envi¬≠ron¬≠men¬≠tal laws, con¬≠flict mine¬≠rals-rela¬≠ted pro¬≠vi¬≠si¬≠ons and other laws or regu¬≠la¬≠ti¬≠ons that could result in addi¬≠tio¬≠nal cos¬≠ts and lia¬≠bi¬≠li¬≠ties. Inves¬≠tors are urged to review in detail the risks and uncer¬≠tain¬≠ties in AMD‚Äôs Secu¬≠ri¬≠ties and Exch¬≠an¬≠ge Com¬≠mis¬≠si¬≠on filings, inclu¬≠ding but not limi¬≠t¬≠ed to AMD‚Äôs Quar¬≠ter¬≠ly Report on Form 10‚ÄĎQ for the quar¬≠ter ended June 29, 2019.

 
FOOTNOTES
 

AMD, the AMD Arrow logo, EPYC, and com­bi­na­ti­ons the­reof, are trade­marks of Advan­ced Micro Devices, Inc. PCIe is a regis­tered trade­mark of PCI-SIG cor­po­ra­ti­on. Other names are for infor­ma­tio­nal pur­po­ses only and may be trade­marks of their respec­ti­ve owners.

  1. For a com¬≠ple¬≠te list of world records see http://amd.com/worldrecords.  ROM-169
  2. Results as of 8/7/2019 using SPECrate¬ģ2017_int_base. The EPYC 7742 2P score is 654 on the SPECrate¬ģ2017_int_base, https://spec.org/cpu2017/results/res2019q3/cpu2017-20190722‚Äď16242.html.  EPYC 7601 2P score of 304 results at http://spec.org/cpu2017/results/res2019q2/cpu2017-20190411‚Äď11817.pdf.  654 / 304 = 2.15 or 2x hig¬≠her inte¬≠ger per¬≠for¬≠mance for the EPYC 7742. SPEC¬ģ, SPE¬≠Cra¬≠te¬ģ and SPEC CPU¬ģ are regis¬≠tered trade¬≠marks of the Stan¬≠dard Per¬≠for¬≠mance Eva¬≠lua¬≠ti¬≠on Cor¬≠po¬≠ra¬≠ti¬≠on. See www.spec.org for more infor¬≠ma¬≠ti¬≠on. ROM-37
  3. Based on 25% TCO impro¬≠ve¬≠ment clai¬≠med by Twit¬≠ter in EPYC Hori¬≠zon pre¬≠sen¬≠ta¬≠ti¬≠on 8.7.2019; and AMD esti¬≠ma¬≠ted TCO impro¬≠ve¬≠ment of up to and 50% TCO in vir¬≠tua¬≠li¬≠zed infra¬≠struc¬≠tu¬≠re. TCO‚ÄĎ3
  4. Com¬≠pa¬≠ri¬≠son results cal¬≠cu¬≠la¬≠ted by AMD based on a hypo¬≠the¬≠ti¬≠cal sce¬≠na¬≠rio hos¬≠ting 2,560 vir¬≠tu¬≠al machi¬≠nes on 2‚ÄĎsocket Intel Xeon 6242 (32 total cores) based sys¬≠tems ver¬≠sus AMD EPYC‚ĄĘ 7702P (64 total cores) based No Com¬≠pro¬≠mi¬≠se Sin¬≠gle Socket Sys¬≠tems, exclu¬≠ding soft¬≠ware appli¬≠ca¬≠ti¬≠on cos¬≠ts.  Each vir¬≠tu¬≠al machi¬≠ne is allo¬≠ca¬≠ted one core and 8GB of DRAM, resul¬≠ting in 80 Intel based sys¬≠tems (2,560/32) and 40 AMD EPYC based sys¬≠tems (2,560/64).  Sys¬≠tem Con¬≠fi¬≠gu¬≠ra¬≠ti¬≠ons:  Intel Xeon based ser¬≠vers in 2U Rack Mount chas¬≠sis, with (2) Intel¬ģ Xeon¬ģ Gold 6242 2.8GHz base fre¬≠quen¬≠cy, 16 cores/32 threads, (16) 16GB RDIMM DDR4 2933MT/s, Dual Rank DIMMs, (1) 480GB SSD SAS Mix Use dri¬≠ve, one dual port 10GbE ether¬≠net adap¬≠ter, dual hot swap power sup¬≠pli¬≠es w/cables, and OEM stan¬≠dard war¬≠ran¬≠ty with esti¬≠ma¬≠ted pri¬≠ce of $21,196 each for a total hard¬≠ware acqui¬≠si¬≠ti¬≠on pri¬≠ce of $1,695,680.  AMD EPYC based ser¬≠vers include ‚ÄĒ (40) 1U Rack Mount chas¬≠sis with (1) AMD EPYC 7702P 2.0GHz base fre¬≠quen¬≠cy, 64 cores/128 threads, (16) 32GB RDIMM DDR4 2933MT/s, Dual Rank DIMMs, (1) 480GB SSD SAS Mix Use dri¬≠ve, one dual port 10GbE ether¬≠net adap¬≠ter, dual hot swap power sup¬≠pli¬≠es w/cables, and  OEM stan¬≠dard war¬≠ran¬≠ty with esti¬≠ma¬≠ted pri¬≠ce of $23,696 each for a total hard¬≠ware acqui¬≠si¬≠ti¬≠on pri¬≠ce of $947,840.  Esti¬≠ma¬≠ted Sys¬≠tem Pri¬≠cing: AMD Esti¬≠ma¬≠ted Pri¬≠cing based on sel¬≠ect OEM list pri¬≠cing as of 7/30/2019 for Intel based sys¬≠tems and AMD pro¬≠jec¬≠ted OEM list pri¬≠cing as of 8/7/2019 for AMD EPYC based sys¬≠tems. Pri¬≠cing is an AMD esti¬≠ma¬≠te only ‚Äď actu¬≠al sys¬≠tem pri¬≠cing will vary by sys¬≠tem and by sel¬≠ler.  Power cost esti¬≠ma¬≠te is an inter¬≠nal AMD esti¬≠ma¬≠te based on Intel Xeon based sys¬≠tem input power ‚ÄĒ 498 watts, AMD EPYC-based sys¬≠tem input power ‚ÄĒ 389 watts elec¬≠tri¬≠ci¬≠ty cost cal¬≠cu¬≠la¬≠ted at $0.12/kw/hr with an assu¬≠med PUE of 2.0.  Intel Xeon power cost/server/year is esti¬≠ma¬≠ted at $1,047, AMD EPYC power cost/server/year is esti¬≠ma¬≠ted at $818 for a three year total power cost of  $251,280 and  $98,040 for an esti¬≠ma¬≠ted total power savings of 61%.  Dat¬≠a¬≠cen¬≠ter space cos¬≠ts include 160 U‚Äôs for Intel Xeon-based Sys¬≠tems or 4 Rack Cabi¬≠nets and 40 U‚Äôs for AMD EPYC-based Sys¬≠tems or 1 Rack Cabi¬≠net ‚Äď AMD inter¬≠nal esti¬≠ma¬≠te of Data Cen¬≠ter space cost of $19,053 per cabi¬≠net per year results in 3 year space cos¬≠ts of $228,636 and $57,159 respec¬≠tively ‚Äď a 75% savings.  Ser¬≠ver Admi¬≠nis¬≠tra¬≠ti¬≠on cost is cal¬≠cu¬≠la¬≠ted with an esti¬≠ma¬≠te of $85,795 per ser¬≠ver admi¬≠nis¬≠tra¬≠tor with a ratio of one ser¬≠ver admi¬≠nis¬≠tra¬≠tor per 30 ser¬≠vers resul¬≠ting in 3 year esti¬≠ma¬≠ted admi¬≠nis¬≠tra¬≠ti¬≠on cos¬≠ts of $686,360 for 80 Intel Xeon-based Sys¬≠tems and $343,180 for 40 AMD EPYC-based sys¬≠tems ‚Äď 50% savings.  Licen¬≠sing cos¬≠ts are cal¬≠cu¬≠la¬≠ted using VMware vSphe¬≠re Enter¬≠pri¬≠se Plus licen¬≠sed per socket and pri¬≠ced as of 7/28/2019 on www.cdw.com at $3,612 each for a total 3‚ÄĎyear cost of $577,920 for (80) Intel Xeon-based 2 socket sys¬≠tems and $144,480 for (40) AMD EPYC No Com¬≠pro¬≠mi¬≠se Sin¬≠gle Socket-based Sys¬≠tems.   Total esti¬≠ma¬≠ted 3 Year TCO as a result is $3,439,876 for Intel-based Sys¬≠tems and $1,590,699 for AMD EPYC-based sys¬≠tems resul¬≠ting in an esti¬≠ma¬≠ted TCO/VM/YR of $448 and $207 respec¬≠tively ‚Äď a 54% savings inclu¬≠ding vir¬≠tua¬≠liza¬≠ti¬≠on manage¬≠ment soft¬≠ware licen¬≠ses but exclu¬≠ding other soft¬≠ware cos¬≠ts.  This sce¬≠na¬≠rio con¬≠ta¬≠ins many assump¬≠ti¬≠ons and esti¬≠ma¬≠tes and, while based on AMD inter¬≠nal rese¬≠arch and best appro¬≠xi¬≠ma¬≠ti¬≠ons, should be con¬≠side¬≠red an exam¬≠p¬≠le for infor¬≠ma¬≠ti¬≠on pur¬≠po¬≠ses only, and not used as a basis for decis¬≠i¬≠on making over actu¬≠al test¬≠ing. TCO‚ÄĎ2
  5. A 2P EPYC 7742 powered ser¬≠ver has a World Record 2P SPEC¬≠jb¬≠b2015-Mul¬≠tiJVM Max max-jOPS score of 355,121 (SPEC¬≠jb¬≠b2015-Mul¬≠tiJVM Cri¬≠ti¬≠cal scored 151,270 cri¬≠ti¬≠cal-jOPS), http://www.spec.org/jbb2015/results/res2019q3/jbb2015-20190717‚Äď00460.html as of August 7, 2019. The hig¬≠hest pre¬≠vious 2P max-jOPS score is 194,068 (SPEC¬≠jb¬≠b2015-Mul¬≠tiJVM Cri¬≠ti¬≠cal scored 53,616 cri¬≠ti¬≠cal-jOPS) by an Intel 8280 ser¬≠ver, https://www.spec.org/jbb2015/results/res2019q2/jbb2015-20190313‚Äď00374.html. SPEC¬ģ and SPEC¬≠jbb¬ģ are regis¬≠tered trade¬≠marks of the Stan¬≠dard Per¬≠for¬≠mance Eva¬≠lua¬≠ti¬≠on Cor¬≠po¬≠ra¬≠ti¬≠on. See www.spec.org for more infor¬≠ma¬≠ti¬≠on. ROM-107
  6. An EPYC‚ĄĘ 7702 powered ser¬≠ver has a World Record x86 2P SAP SD¬ģ 2 tier with Win¬≠dows¬ģ Ser¬≠ver  score of 45,600 on Aug 7, 2019, https://www.sap.com/dmc/benchmark/2019/Cert19044, that is 43% (45600/ 31900 = 1.429) hig¬≠her than the pre¬≠vious #1,  an Intel Pla¬≠ti¬≠num 8180 powered ser¬≠ver with a score of 31,900, https://www.sap.com/dmc/benchmark/2017/Cert17028.pdf.  SAP¬ģ SD scores can be found at https://www.sap.com/dmc/exp/2018-benchmark-directory/#/sd, July 31, 2019.  More infor¬≠ma¬≠ti¬≠on on SAP Stan¬≠dard Appli¬≠ca¬≠ti¬≠on Bench¬≠marks go to https://www.sap.com/about/benchmark.html. ROM-128; An EPYC‚ĄĘ 7702 powered ser¬≠ver has a World Record x86 2P SAP SD¬ģ 2 tier score of 45,600 on Aug 7, 2019, https://www.sap.com/dmc/benchmark/2019/Cert19044, that is 28% (45600/ 35505 = 1.284) hig¬≠her than the pre¬≠vious #1,  an Intel Pla¬≠ti¬≠num 8280 powered ser¬≠ver with a score of 35,505, https://www.sap.com/dmc/benchmark/2019/Cert19026.pdf.  SAP¬ģ SD scores can be found at https://www.sap.com/dmc/exp/2018-benchmark-directory/#/sd, July 31, 2019.  More infor¬≠ma¬≠ti¬≠on on SAP Stan¬≠dard Appli¬≠ca¬≠ti¬≠on Bench¬≠marks go to https://www.sap.com/about/benchmark.html. ROM-129
  7. Results as of 8/7/2019. EPYC‚ĄĘ 7502P result published at TPC web¬≠site, http://www.tpc.org/5533. Pre¬≠vious best published result on the TPC web¬≠site at http://www.tpc.org/tpcx-hs/results/tpcxhs_advanced_sort.asp?version=2. TPC and TPC Bench¬≠mark are regis¬≠tered trade¬≠marks of the Tran¬≠sac¬≠tion Pro¬≠ces¬≠sing Per¬≠for¬≠mance Coun¬≠cil. ROM-162
  8. A 2P EPYC 7702 powered ser¬≠ver has SPECvirt_sc2013 score of 5451.2 and 305 VMs, https://www.spec.org/virt_sc2013/results/res2019q3/virt_sc2013-20190716‚Äď00120-perf.html as of August 7, 2019. The next hig¬≠hest score is a 2P Intel Pla¬≠ti¬≠num 8180 ser¬≠ver with a score of 3376 and 189 VMs, https://www.spec.org/virt_sc2013/results/res2017q4/virt_sc2013-20171017‚Äď00098-perf.html as of July 28, 2019. SPEC¬ģ and SPECvirt¬ģ are regis¬≠tered trade¬≠marks of the Stan¬≠dard Per¬≠for¬≠mance Eva¬≠lua¬≠ti¬≠on Cor¬≠po¬≠ra¬≠ti¬≠on. See www.spec.org for more infor¬≠ma¬≠ti¬≠on. ROM-99.
  9. Based on SPECrate¬ģ2017 peak inte¬≠ger scores. A 2P EPYC‚ĄĘ 7742 pro¬≠ces¬≠sor powered ser¬≠ver has hig¬≠her SPECrate¬ģ2017_int_peak score of 749 and a base score of 682 as of August 7, 2019, http:/spec.org/cpu2017/results/res2019q3/cpu2017-20190722‚Äď16242.html. The next high¬≠test int_peak score with a 2P Intel Pla¬≠ti¬≠num 9282 of 676 and a base score of 643, http://spec.org/cpu2017/results/res2019q3/cpu2017-20190624‚Äď15369.pdf, on July 28, 2019. SPEC¬ģ, SPE¬≠Cra¬≠te¬ģ and SPEC CPU¬ģ are regis¬≠tered trade¬≠marks of the Stan¬≠dard Per¬≠for¬≠mance Eva¬≠lua¬≠ti¬≠on Cor¬≠po¬≠ra¬≠ti¬≠on. See www.spec.org for more infor¬≠ma¬≠ti¬≠on. ROM-114.
  10. Each 2nd Gen AMD EPYC pro¬≠ces¬≠sors sup¬≠port up to 4TB of DRAM.  Intel Sca¬≠lable pro¬≠ces¬≠sors sup¬≠port up to 2TB with Pla¬≠ti¬≠num 8200 and 1TB with the 9200 pro¬≠ces¬≠sors per ark.intel.com, July 9, 2019. ROM-39
  11. Based on AMD inter­nal test­ing of ANSYS FLUENT 19.1, lm6000_16m bench­mark, as of July 17, 2019 using a 2P EPYC 7742 powered refe­rence ser­ver ver­sus a 2P Xeon Pla­ti­num 8280 powered ser­ver. Results may vary. ROM-77
  12. Based on AMD inter­nal test­ing of Alta­ir RADIOSS 2018, T10M bench­mark, as of July 17, 2019 using a 2P EPYC 7742 powered refe­rence ser­ver ver­sus a 2P Xeon Pla­ti­num 8280 powered ser­ver. Results may vary. Class based on indus­try-stan­dard pin-based (LGA) X86 pro­ces­sors. ROM-55
  13. Based on AMD inter¬≠nal test¬≠ing, avera¬≠ge per thread per¬≠for¬≠mance impro¬≠ve¬≠ment at ISO-fre¬≠quen¬≠cy on a 32-core, 64-thread, 2nd gene¬≠ra¬≠ti¬≠on AMD EPYC‚ĄĘ plat¬≠form as com¬≠pared to 32-core 64-thread 1st gene¬≠ra¬≠ti¬≠on AMD EPYC‚ĄĘ plat¬≠form mea¬≠su¬≠red on a sel¬≠ec¬≠ted set of workloads inclu¬≠ding sub-com¬≠pon¬≠ents of SPEC CPU¬ģ 2017_int and  repre¬≠sen¬≠ta¬≠ti¬≠ve ser¬≠ver workloads. ROM-236
  14. Based on pro¬≠ces¬≠sor lanes mul¬≠ti¬≠pli¬≠ed by PCIe¬ģ band¬≠width. PCIe 4 = 16 GB/s link band¬≠width vs. PCIe 3 = 8 GB/s. ROM-21
  15. EPYC‚ĄĘ 7002 series has 8 memo¬≠ry chan¬≠nels, sup¬≠port¬≠ing 3200 MHz DIMMs yiel¬≠ding 204.8 GB/s of band¬≠width vs. the same class of Intel Sca¬≠lable Gen 2 pro¬≠ces¬≠sors with only 6 memo¬≠ry chan¬≠nels and sup¬≠port¬≠ing 2933 MHz DIMMs yiel¬≠ding 140.8 GB/s of band¬≠width. 204.8 / 140.8 = 1.454545 ‚ÄĒ 1.0 = .45 or 45% more.  AMD EPYC has 45% more band¬≠width. Class based on indus¬≠try-stan¬≠dard pin-based (LGA) X86 pro¬≠ces¬≠sors. ROM-11
  16. Maxi­mum sin­gle-core fre­quen­cy at which the pro­ces­sor is capa­ble of operating.
  17. Mother¬≠boards desi¬≠gned for 1st Gen EPYC pro¬≠ces¬≠sors may not be com¬≠pa¬≠ti¬≠ble with 2nd Gen AMD EPYC pro¬≠ces¬≠sors with a TDP grea¬≠ter than 200 watts.  Cont¬≠act the ser¬≠ver manu¬≠fac¬≠tu¬≠rer to con¬≠firm com¬≠pa¬≠ti¬≠bi¬≠li¬≠ty.  ROM-07
  18. Mother¬≠boards desi¬≠gned for 1st Gen EPYC pro¬≠ces¬≠sors may not be com¬≠pa¬≠ti¬≠ble with 2nd Gen AMD EPYC pro¬≠ces¬≠sors with a TDP grea¬≠ter than 200 watts.  Cont¬≠act the ser¬≠ver manu¬≠fac¬≠tu¬≠rer to con¬≠firm com¬≠pa¬≠ti¬≠bi¬≠li¬≠ty.  ROM-07
  19. Mother¬≠boards desi¬≠gned for 1st Gen EPYC pro¬≠ces¬≠sors may not be com¬≠pa¬≠ti¬≠ble with 2nd Gen AMD EPYC pro¬≠ces¬≠sors with a TDP grea¬≠ter than 200 watts.  Cont¬≠act the ser¬≠ver manu¬≠fac¬≠tu¬≠rer to con¬≠firm com¬≠pa¬≠ti¬≠bi¬≠li¬≠ty.  ROM-07