Inventec Delivers AMD EPYC™ 7002 Series Processor Solutions To Customers, Setting a New Standard for the Modern Datacenter

SAN FRANCISCO, August 9, 2019  PRNewswire/ — Ser­ver manu­fac­tu­rer Inven­tec (2356.TW) proud­ly joi­ned Ame­ri­can semi­con­duc­tor pro­du­cer AMD in laun­ching their latest AMD EPYC™ 7002 Series Pro­ces­sors in San Fran­cis­co, on August 7. The newest AMD EPYC™ pro­ces­sors will help data cen­tres adapt and deal with deman­ding workloads, while offe­ring embed­ded secu­ri­ty fea­tures to help defend against attacks to the CPU, app­li­ca­ti­ons and data.

INVENTEC K885G5:
a high-per­for­mance 2U ser­ver sys­tem based on dual-socket 7nm AMD EPYC™ 7002 Series Pro­ces­sors

During the launch, Inven­tec also unvei­led its new K885G5 ser­ver which is com­pa­ti­ble with the AMD EPYC™ 7002 series pro­ces­sors and will be able to effi­ci­ent­ly and reli­ab­ly hand­le the lar­ge amounts of data brought along by the AMD EPYC™ 7002 Series.

 

AMD EPYC™ 7002 Series Pro­ces­sors

The AMD EPYC™ 7002 Series Pro­ces­sors set a new stan­dard for the modern data cen­ter with bre­akth­rough CPU per­for­mance. The pro­ces­sors are expec­ted to deli­ver up to 2X the per­for­mance-per socket[i] and up to 4X peak FLOPS per-socket[ii] com­pa­red with AMD EPYC™ 7001 Series Pro­ces­sors.

The new series can also enab­le dat­a­cen­tres to be more respon­si­ve to increasing workloads. Deli­vering a com­pre­hen­si­ve, con­sis­tent fea­ture set of I/O, memo­ry and secu­ri­ty fea­tures, across 8 to 64 “Zen” 2 cores, the AMD EPYC™ 7002 Series Pro­ces­sor deli­vers agi­li­ty from a balan­ced set of fea­tures.

With embed­ded secu­ri­ty fea­tures, the pro­ces­sors help custo­mers to bet­ter defend their CPU, app­li­ca­ti­ons, and data.

This pro­ces­sor series will be well-sup­port by Inventec’s sta­te-of-the-art K885G5 ser­ver which is desi­gned to enab­le dat­a­cen­tres to accept and respond lar­ge amounts of requests.

 

Inven­tec K885G5 ser­ver

K885G5 series tar­get com­pre­hen­si­ve app­li­ca­ti­ons in vir­tua­li­za­ti­on, hyper­con­ver­ged sto­rage, cloud com­pu­ting, and high-end enter­pri­se ser­ver, among others, with impres­si­ve TCO reduc­tion bene­fi­ted from the indus­try-lea­ding core den­si­ty and jump in per­for­mance. In addi­ti­on to high­ly ser­vice­ab­le 2U enclo­sure, K885G5 offers sca­la­bi­li­ty and fle­xi­bi­li­ty inclu­ding

  • Up to seven stan­dard PCIe® Gen4 slots inclu­ding the opti­on of two full height dou­ble width add-in cards
  • One hot-swapp­a­ble OCP 3.0 slot sup­por­ting up to 200GbE net­wor­king
  • A front-ser­vice­ab­le hybrid flash array modu­le that not only sup­ports all NVMe but also tre­men­dous sto­rage capa­ci­ty by optio­nal advan­ced SSDs in next genera­ti­on form fac­tors such as NGSFF and EDSFF
  • Excel­lent ser­vicea­bi­li­ty and fle­xi­bi­li­ty from modu­lar design. This sup­ports tooll­ess ope­ra­ti­ons of ser­vice­ab­le parts as well as N+1 red­un­dan­cy for both power and coo­ling fans.

As AMD stra­te­gic part­ner, we always try to deli­ver inno­va­ti­ve next-genera­ti­on pro­duc­ts that can meet the demand for reli­able sup­port for very lar­ge, high-usa­ge deploy­ments. As a high-per­for­mance 2U ser­ver sys­tem based on dual-socket 7nm AMD EPYC™ 7002 Series Pro­ces­sors, K885G5 is desi­gned for today’s soft­ware defi­ned infra­st­ruc­tu­re, offe­ring a visio­na­ry but con­so­li­da­te solu­ti­on for next-genera­ti­on workloads to come.”, said Jack Tsai, Pre­si­dent of Inven­tec Enter­pri­se Busi­ness Group.

We’­re exci­ted and thank­ful to have our part­ners sup­por­ting the launch of AMD EPYC 7002 Series Pro­ces­sors,” said Scott Aylor, Cor­po­ra­te Vice Pre­si­dent and Gene­ral Mana­ger, Dat­a­cen­ter Solu­ti­ons Group, AMD. “Their EPYC based solu­ti­ons are poi­sed to deli­ver a new stan­dard for modern dat­a­cen­ter custo­mers. With twice the cores, bre­akth­rough per­for­mance and embed­ded secu­ri­ty fea­tures, all deli­ve­r­ed by a lea­dership archi­tec­tu­re, custo­mers can trans­form their dat­a­cen­ter ope­ra­ti­ons at the pace of their busi­ness.”

 

About Inven­tec Data Cen­ter Solu­ti­ons ( Inven­tec EBG )

Inven­tec Data Cen­ter Solu­ti­ons (Inven­tec EBG) was estab­lished in 1998 and has been focu­sing on the design and manu­fac­tu­ring of ser­ver sys­tems in Inven­tec Cor­po­ra­ti­on. Over deca­des, Inven­tec EBG has been the key ser­ver sys­tem sup­plier of the glo­bal bran­ding cli­ents.

For more infor­ma­ti­on, plea­se visit: http://ebg.inventec.com/

Fol­low “Inven­tec Data Cen­ter Solu­ti­ons” on Lin­kedIn and Wechat to recei­ve their latest news and announ­ce­ments.

Inven­tec logos are trade­marks or regis­te­red trade­marks of Inven­tec Cor­po­ra­ti­on.

AMD, the AMD Arrow logo, EPYC and com­bi­na­ti­ons the­re­of are trade­marks of Advan­ced Micro Devices, Inc. Other pro­duct names used in this publi­ca­ti­on are for iden­ti­fi­ca­ti­on pur­po­ses only and may be trade­marks of their respec­tive com­pa­nies.

 

[i] Pro­jec­tions as of July 3, 2019. AMD 2nd Genera­ti­on EPYC pro­ces­sor pro­jec­ted SPECrate®2017_int_base per­for­mance scores are deve­lo­ped using com­pu­ter mode­ling of each pro­ces­sors rev B0 which is then adjus­ted for the indi­vi­du­al tar­ge­ted fre­quen­cy. For EPYC 7282, 7272 and 7252, esti­ma­ted con­fi­gu­ra­ti­ons have 4x chan­nels per socket of DDR2666 memo­ry, and all other models have 8x chan­nels per socket of DDR3200. All esti­ma­tes use the AOCC com­pi­ler. Pro­jec­ted score only, actu­al results may vary. Results may vary with pro­duc­tion sili­con tes­ting. AMD EPYC 7742 SPECrate®2017_int_base pro­jec­ted score of 625 vs. EPYC 7601 of 304 in June 2019 at http://spec.org/cpu2017/results/res2019q2/cpu2017-20190411–11817.pdf. 625 / 304 = 2.056 = 2x the per­for­mance. SPEC®, SPE­Cra­te® and SPEC CPU® are regis­te­red trade­marks of the Stan­dard Per­for­mance Eva­lua­ti­on Cor­po­ra­ti­on. See www.spec.org for more infor­ma­ti­on. ROM-23

[ii] Esti­ma­ted genera­tio­nal increa­se based upon AMD inter­nal design spe­ci­fi­ca­ti­ons for “Zen 2” com­pa­red to “Zen”. “Zen 2” has 2X the core den­si­ty of “Zen”, and when mul­ti­plied by 2X peak FLOPs per core, at the same fre­quen­cy, results in 4X the FLOPs in through­put. Actu­al results with pro­duc­tion sili­con may vary. ROM-04