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Ansys Collaborates with Microsoft to Drive Innovation Forward with Chip Development, Simulation, and Cloud Computing

Verfasst vonpipin

3rd Gen AMD EPYC™ pro­ces­sors with AMD 3D V‑Cache™ tech­no­lo­gy — available on Micro­soft Azu­re HBv3 vir­tu­al machi­nes (VMs) — will be offe­red to Ansys Cloud cus­to­mers in 2022

Key High­lights
  • Ansys Cloud will auto­ma­ti­cal­ly upgrade to offer the AMD EPYC 7003 Series pro­ces­sors with AMD 3D V‑Cache tech­no­lo­gy today
  • 3rd Gen AMD EPYC pro­ces­sors with AMD 3D V‑Cache use 3D stack­ing tech­no­lo­gy to pro­vi­de fan­ta­stic per­for­mance for tech­ni­cal com­pu­ting workloads

PITTSBURGH, March 21, 2022  — Ansys (NASDAQ: ANSS) cus­to­mers will have auto­ma­tic cloud access to the latest 3rd Gen AMD EPYC pro­ces­sors with AMD 3D V‑Cache tech­no­lo­gy, available on Micro­soft Azu­re HBv3 VMs. Ansys Cloud, the mana­ged cloud ser­vice pro­vi­ded by Ansys and enab­led on Azu­re, will auto­ma­ti­cal­ly upgrade to offer the abili­ty to use the latest AMD chips today.

Desi­gned spe­ci­fi­cal­ly to acce­le­ra­te com­pu­ter-aided engi­nee­ring (CAE) work­flows, the new Azu­re HBv3 VMs with 3rd Gen AMD EPYC pro­ces­sors with AMD 3D V‑Cache tech­no­lo­gy pro­du­ce unpre­ce­den­ted per­for­mance boosts for tech­ni­cal com­pu­ting workloads. In ear­ly test­ing by Azu­re, the com­pa­ny saw up to 80% impro­ve­ment in lar­ge-sca­le com­pu­ta­tio­nal flu­id dyna­mics (CFD) simu­la­ti­ons and up to 50% impro­ve­ment in expli­cit fini­te ele­ment ana­ly­sis (FEA) crash tests. This means that Ansys Cloud cus­to­mers can sol­ve CAE pro­blems much fas­ter, lea­ding to bet­ter design decis­i­ons in a shorter amount of time.

“The­re is more demand than ever for high per­for­mance com­pu­ting. At AMD we con­ti­nue to look at pro­vi­ding our part­ners and cus­to­mers with the right pro­ces­sor to sup­port the right workload, and the 3rd Gen AMD EPYC pro­ces­sors with AMD 3D V‑Cache tech­no­lo­gy do that for tech­ni­cal workloads,” said Ram Ped­dib­hot­la, cor­po­ra­te vice pre­si­dent, EPYC pro­duct manage­ment, AMD. “We are exci­ted to work with Azu­re and Ansys to crea­te a solu­ti­on that pro­vi­des fan­ta­stic per­for­mance for tech­ni­cal workloads like CFD, FEA and more.”

“The incre­di­ble per­for­mance boost of the HBv3 vir­tu­al machi­nes on Azu­re is unpre­ce­den­ted, and it is espe­ci­al­ly rewar­ding to see this made pos­si­ble by the inno­va­ti­ve 3D memo­ry stack­ing imple­men­ted by AMD,” said Shane Ems­wi­ler, seni­or vice pre­si­dent of pro­ducts at Ansys. “This is tru­ly a vir­tuous cir­cle for Ansys, and it will result in our cus­to­mers gai­ning the con­fi­dence to shift more of their simu­la­ti­on workloads to the cloud to reap the per­for­mance gains as soon as possible.”

“In every indus­try and rese­arch com­mu­ni­ty, inno­va­ti­on is now a com­pu­te bound pro­blem which means advan­ces in HPC are now more stra­te­gi­cal­ly important to Micro­soft Azu­re cus­to­mers than ever,” said Evan Bur­ness, Prin­ci­pal Pro­gram Mana­ger for HPC, Micro­soft Azu­re. “Working clo­se­ly with Ansys, we’­re able to quick­ly bring 3rd Gen AMD EPYC pro­ces­sors with AMD 3D V‑Cache into Azure’s most popu­lar HPC vir­tu­al machi­ne, HBv3, to the bene­fit of all Ansys Cloud cus­to­mers. It’s a powerful com­bi­na­ti­on of soft­ware tools and one of the most powerful HPC solu­ti­ons available.”

Once released, Ansys Cloud cus­to­mers can easi­ly sel­ect HBv3 as their VM opti­on; no fur­ther actions will be neces­sa­ry for the upgrade.

About Ansys

If you’­ve ever seen a rocket launch, flown on an air­plane, dri­ven a car, used a com­pu­ter, touch­ed a mobi­le device, crossed a bridge, or put on weara­ble tech­no­lo­gy, chan­ces are you’­ve used a pro­duct whe­re Ansys soft­ware play­ed a cri­ti­cal role in its crea­ti­on. Ansys is the glo­bal lea­der in engi­nee­ring simu­la­ti­on. Through our stra­tegy of Per­va­si­ve Engi­nee­ring Simu­la­ti­on, we help the world’s most inno­va­ti­ve com­pa­nies deli­ver radi­cal­ly bet­ter pro­ducts to their cus­to­mers. By offe­ring the best and broa­dest port­fo­lio of engi­nee­ring simu­la­ti­on soft­ware, we help them sol­ve the most com­plex design chal­lenges and crea­te pro­ducts limi­t­ed only by ima­gi­na­ti­on. Foun­ded in 1970, Ansys is head­quar­te­red south of Pitts­burgh, Penn­syl­va­nia, U.S.A. Visit www.ansys.com for more information.

Ansys and any and all ANSYS, Inc. brand, pro­duct, ser­vice and fea­ture names, logos and slo­gans are regis­tered trade­marks or trade­marks of ANSYS, Inc. or its sub­si­dia­ries in the United Sta­tes or other count­ries. All other brand, pro­duct, ser­vice and fea­ture names or trade­marks are the pro­per­ty of their respec­ti­ve owners.

AMD, the AMD Arrow logo, EPYC, AMD 3D V‑Cache tech­no­lo­gy and com­bi­na­ti­ons the­reof are trade­marks of Advan­ced Micro Devices, Inc.