Ansys Collaborates with Microsoft to Drive Innovation Forward with Chip Development, Simulation, and Cloud Computing

3rd Gen AMD EPYC꽓 pro짯ces짯sors with AMD 3D V멌ache꽓 tech짯no짯lo짯gy available on Micro짯soft Azu짯re HBv3 vir짯tu짯al machi짯nes (VMs) will be offe짯red to Ansys Cloud cus짯to짯mers in 2022

Key High짯lights
  • Ansys Cloud will auto짯ma짯ti짯cal짯ly upgrade to offer the AMD EPYC 7003 Series pro짯ces짯sors with AMD 3D V멌ache tech짯no짯lo짯gy today
  • 3rd Gen AMD EPYC pro짯ces짯sors with AMD 3D V멌ache use 3D stack짯ing tech짯no짯lo짯gy to pro짯vi짯de fan짯ta짯stic per짯for짯mance for tech짯ni짯cal com짯pu짯ting workloads

PITTSBURGH, March 21, 2022  Ansys (NASDAQ: ANSS) cus짯to짯mers will have auto짯ma짯tic cloud access to the latest 3rd Gen AMD EPYC pro짯ces짯sors with AMD 3D V멌ache tech짯no짯lo짯gy, available on Micro짯soft Azu짯re HBv3 VMs. Ansys Cloud, the mana짯ged cloud ser짯vice pro짯vi짯ded by Ansys and enab짯led on Azu짯re, will auto짯ma짯ti짯cal짯ly upgrade to offer the abili짯ty to use the latest AMD chips today.

Desi짯gned spe짯ci짯fi짯cal짯ly to acce짯le짯ra짯te com짯pu짯ter-aided engi짯nee짯ring (CAE) work짯flows, the new Azu짯re HBv3 VMs with 3rd Gen AMD EPYC pro짯ces짯sors with AMD 3D V멌ache tech짯no짯lo짯gy pro짯du짯ce unpre짯ce짯den짯ted per짯for짯mance boosts for tech짯ni짯cal com짯pu짯ting workloads. In ear짯ly test짯ing by Azu짯re, the com짯pa짯ny saw up to 80% impro짯ve짯ment in lar짯ge-sca짯le com짯pu짯ta짯tio짯nal flu짯id dyna짯mics (CFD) simu짯la짯ti짯ons and up to 50% impro짯ve짯ment in expli짯cit fini짯te ele짯ment ana짯ly짯sis (FEA) crash tests. This means that Ansys Cloud cus짯to짯mers can sol짯ve CAE pro짯blems much fas짯ter, lea짯ding to bet짯ter design decis짯i짯ons in a shorter amount of time.

The짯re is more demand than ever for high per짯for짯mance com짯pu짯ting. At AMD we con짯ti짯nue to look at pro짯vi짯ding our part짯ners and cus짯to짯mers with the right pro짯ces짯sor to sup짯port the right workload, and the 3rd Gen AMD EPYC pro짯ces짯sors with AMD 3D V멌ache tech짯no짯lo짯gy do that for tech짯ni짯cal workloads, said Ram Ped짯dib짯hot짯la, cor짯po짯ra짯te vice pre짯si짯dent, EPYC pro짯duct manage짯ment, AMD. 쏻e are exci짯ted to work with Azu짯re and Ansys to crea짯te a solu짯ti짯on that pro짯vi짯des fan짯ta짯stic per짯for짯mance for tech짯ni짯cal workloads like CFD, FEA and more.

The incre짯di짯ble per짯for짯mance boost of the HBv3 vir짯tu짯al machi짯nes on Azu짯re is unpre짯ce짯den짯ted, and it is espe짯ci짯al짯ly rewar짯ding to see this made pos짯si짯ble by the inno짯va짯ti짯ve 3D memo짯ry stack짯ing imple짯men짯ted by AMD, said Shane Ems짯wi짯ler, seni짯or vice pre짯si짯dent of pro짯ducts at Ansys. 쏷his is tru짯ly a vir짯tuous cir짯cle for Ansys, and it will result in our cus짯to짯mers gai짯ning the con짯fi짯dence to shift more of their simu짯la짯ti짯on workloads to the cloud to reap the per짯for짯mance gains as soon as possible.

In every indus짯try and rese짯arch com짯mu짯ni짯ty, inno짯va짯ti짯on is now a com짯pu짯te bound pro짯blem which means advan짯ces in HPC are now more stra짯te짯gi짯cal짯ly important to Micro짯soft Azu짯re cus짯to짯mers than ever, said Evan Bur짯ness, Prin짯ci짯pal Pro짯gram Mana짯ger for HPC, Micro짯soft Azu짯re. 쏻orking clo짯se짯ly with Ansys, we쇑춓e able to quick짯ly bring 3rd Gen AMD EPYC pro짯ces짯sors with AMD 3D V멌ache into Azure셲 most popu짯lar HPC vir짯tu짯al machi짯ne, HBv3, to the bene짯fit of all Ansys Cloud cus짯to짯mers. It셲 a powerful com짯bi짯na짯ti짯on of soft짯ware tools and one of the most powerful HPC solu짯ti짯ons available.

Once released, Ansys Cloud cus짯to짯mers can easi짯ly sel짯ect HBv3 as their VM opti짯on; no fur짯ther actions will be neces짯sa짯ry for the upgrade.

About Ansys

If you쇑춚e ever seen a rocket launch, flown on an air짯plane, dri짯ven a car, used a com짯pu짯ter, touch짯ed a mobi짯le device, crossed a bridge, or put on weara짯ble tech짯no짯lo짯gy, chan짯ces are you쇑춚e used a pro짯duct whe짯re Ansys soft짯ware play짯ed a cri짯ti짯cal role in its crea짯ti짯on. Ansys is the glo짯bal lea짯der in engi짯nee짯ring simu짯la짯ti짯on. Through our stra짯tegy of Per짯va짯si짯ve Engi짯nee짯ring Simu짯la짯ti짯on, we help the world셲 most inno짯va짯ti짯ve com짯pa짯nies deli짯ver radi짯cal짯ly bet짯ter pro짯ducts to their cus짯to짯mers. By offe짯ring the best and broa짯dest port짯fo짯lio of engi짯nee짯ring simu짯la짯ti짯on soft짯ware, we help them sol짯ve the most com짯plex design chal짯lenges and crea짯te pro짯ducts limi짯t짯ed only by ima짯gi짯na짯ti짯on. Foun짯ded in 1970, Ansys is head짯quar짯te짯red south of Pitts짯burgh, Penn짯syl짯va짯nia, U.S.A. Visit for more information.

Ansys and any and all ANSYS, Inc. brand, pro짯duct, ser짯vice and fea짯ture names, logos and slo짯gans are regis짯tered trade짯marks or trade짯marks of ANSYS, Inc. or its sub짯si짯dia짯ries in the United Sta짯tes or other count짯ries. All other brand, pro짯duct, ser짯vice and fea짯ture names or trade짯marks are the pro짯per짯ty of their respec짯ti짯ve owners.

AMD, the AMD Arrow logo, EPYC, AMD 3D V멌ache tech짯no짯lo짯gy and com짯bi짯na짯ti짯ons the짯reof are trade짯marks of Advan짯ced Micro Devices, Inc.