2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration

At CES 2019, Intel Cor­po­ra­ti­on pre­views a new cli­ent plat­form code-named “Lakefield.” If fea­tures a hybrid CPU archi­tec­tu­re with Intel’s Fover­os 3D pack­a­ging tech­no­lo­gy. Lakefield has five cores, com­bi­ning a 10nm high-per­for­mance Sun­ny Cove core with four Intel Atom pro­ces­sor-based cores into a tiny mother­board for thin and light devices packed with per­for­mance, long bat­te­ry life and con­nec­ti­vi­ty. Intel dis­plays how its tech­no­lo­gy is the foun­da­ti­on for the world’s most important inno­va­tions and advan­ces at CES 2019 from Jan. 8–11 in Las Vegas. (Credit: Intel Corporation)


Today at CES 2019 in Las Vegas, Intel unvei­led the next wave of PC inno­va­ti­on that will advan­ce the PC expe­ri­ence to help power every person’s grea­test con­tri­bu­ti­on, including:

  • Details on our high­ly inte­gra­ted plat­form that will fea­ture our upco­m­ing first volu­me 10nm PC pro­ces­sor, code-named “Ice Lake”
  • Pre­view of a hybrid 10nm CPU archi­tec­tu­re with Fover­os 3D pack­a­ging, code-named “Lakefield”
  • Pro­ject Athena, an inno­va­ti­on pro­gram to deli­ver a new class of advan­ced laptops
  • Expan­si­on of the 9th Gen Intel® Core™ desk­top pro­ces­sor family

New 10nm Plat­forms for Mobi­le PCs

In the com­ing mon­ths, Intel will launch its new mobi­le PC plat­form with Intel’s upco­m­ing first volu­me 10nm pro­ces­sor, code-named “Ice Lake.”

Built on Intel’s new Sun­ny Cove CPU micro­ar­chi­tec­tu­re detail­ed last mon­th at Archi­tec­tu­re Day, Ice Lake is expec­ted to deli­ver a new level of tech­no­lo­gy inte­gra­ti­on on a cli­ent platform.

More: Intel at 2019 CES (All Intel News)

Ice Lake is the first plat­form to fea­ture the all-new Gen11 inte­gra­ted gra­phics archi­tec­tu­re, sup­port Intel Adap­ti­ve Sync tech­no­lo­gy, enab­ling smooth frame rates and capa­ble of more than 1 TFLOP of per­for­mance for richer gaming and crea­ti­on experience.

The new mobi­le PC plat­form is also the first to inte­gra­te Thun­der­bolt™ 3 and the new high-speed Wi-Fi 6 wire­less stan­dard as a built-in tech­no­lo­gy, as well as fea­ture Intel® DL Boost inst­ruc­tion sets to acce­le­ra­te arti­fi­cial intel­li­gence (AI) workloads. Ice Lake brings this all tog­e­ther with incredi­ble bat­te­ry life to enab­le super-thin, ultra-mobi­le designs with world-class per­for­mance and respon­si­ve­ness, enab­ling peop­le to enjoy an ama­zing com­pu­ting expe­ri­ence. As shown by Dell*, look for new devices from Intel OEM part­ners on shel­ves by holi­day 2019.

Intel also pro­vi­ded a sneak peek of a new cli­ent plat­form, code-named “Lakefield,” that fea­tures a hybrid CPU archi­tec­tu­re with Intel’s new inno­va­ti­ve Fover­os 3D pack­a­ging tech­no­lo­gy. Lakefield has five cores, com­bi­ning a 10nm high-per­for­mance Sun­ny Cove core with four Intel Atom® pro­ces­sor-based cores into a tiny packa­ge that deli­vers low-power effi­ci­en­cy with gra­phics and other IPs, I/O and memo­ry. The result is a smal­ler board that pro­vi­des OEMs more fle­xi­bi­li­ty for thin and light form fac­tor design and is packed with all the tech­no­lo­gy peop­le have come to expect from Intel inclu­ding long bat­te­ry life, per­for­mance and con­nec­ti­vi­ty. Lakefield is expec­ted to be in pro­duc­tion this year.

Intel is uni­que­ly posi­tio­ned to deli­ver this type of inno­va­ti­on becau­se the broad set of tech­no­lo­gies – the pack­a­ging, the archi­tec­tu­re, the per­for­mance and con­nec­ti­vi­ty – are all under one roof to help bring incredi­ble new designs and expe­ri­en­ces to life.

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Pro­ject Athena Advan­ces Lap­top Innovation

Intel also announ­ced Pro­ject Athena, an inno­va­ti­on pro­gram that defi­nes and aims to help bring to mar­ket a new class of advan­ced lap­tops. Com­bi­ning world-class per­for­mance, bat­te­ry life and con­nec­ti­vi­ty in sleek, beau­ti­ful designs, the first Pro­ject Athena lap­tops are expec­ted to be avail­ab­le in the second half of this year across both Win­dows* and Chro­me* ope­ra­ting systems.

Desi­gned to enab­le new expe­ri­en­ces and capi­ta­li­ze on next-genera­ti­on tech­no­lo­gies, inclu­ding 5G and arti­fi­cial intel­li­gence, Pro­ject Athena crea­tes a path for­ward to acce­le­ra­te lap­top inno­va­ti­on through:

  • An annu­al spec out­lining plat­form requirements
  • New user expe­ri­ence and bench­mar­king tar­gets defi­ned by real-world usa­ge models
  • Exten­si­ve co-engi­nee­ring sup­port and inno­va­ti­on pathfinding
  • Eco­sys­tem col­la­bo­ra­ti­on to acce­le­ra­te key lap­top com­po­nent deve­lo­p­ment and availability
  • Veri­fi­ca­ti­on of Pro­ject Athena devices through a com­pre­hen­si­ve cer­ti­fi­ca­ti­on process

Based on exten­si­ve rese­arch to under­stand how peop­le use their devices and the chal­len­ges they face, the annu­al spec com­bi­nes key are­as of inno­va­ti­on to deli­ver lap­tops that are pur­po­se-built to help peop­le focus, adapt to life’s roles and always be rea­dy. Intel’s Pro­ject Athena inno­va­ti­on part­ners inclu­de Acer*, Asus*, Dell, Goog­le*, HP*, Inno­lux*, Leno­vo*, Micro­soft*, Sam­sung* and Sharp*, among others.

From deli­vering the first con­nec­ted PC with inte­gra­ted Wi-Fi in the Intel® Cen­tri­no® plat­form to dri­ving main­stream adop­ti­on of super thin and light designs, touch­screens and 2 in 1 form fac­tors with Ultra­book™, Intel is uni­que­ly posi­tio­ned to be the cata­lyst in deli­vering the next-gen PC experience.

Expan­ding 9th Gen Intel Core Pro­ces­sor Family

In Octo­ber, Intel laun­ched the first set of the 9th Gen Intel® Core™ desk­top pro­ces­sors, inclu­ding the Intel Core i9-9900K pro­ces­sor, the world’s best gaming pro­ces­sor1. Today, Intel intro­du­ced new addi­ti­ons to the 9th Gen Intel Core desk­top pro­ces­sor fami­ly that expand the opti­ons to meet a broad ran­ge of con­su­mer needs from casu­al users to pro­fes­sio­nals to gamers and serious con­tent creators. The first of the new 9th Gen Intel Core desk­top pro­ces­sors is expec­ted to be avail­ab­le star­ting this mon­th with more rol­ling out through the second quar­ter of this year.

1As mea­su­red by in-game bench­mark mode per­for­mance whe­re avail­ab­le, or hig­hest medi­an frames per second (FPS) whe­re bench­mark mode is unavail­ab­le. PC Gaming Pro­ces­sors Com­pa­red:  9th Gen Intel® Core™ i9-9900K, Intel® Core™ i9-9980­XE Extre­me Edi­ti­on, and Intel® Core™ i9-9900X X‑series; 8th Gen Intel® Core™ i7-8700K and i7-8086K; and AMD Ryzen™ 7 2700X, AMD Ryzen™ Thre­ad­rip­per 2990WX, and AMD Ryzen™ Thre­ad­rip­per 2950X. Pri­ces of com­pa­red pro­ducts may dif­fer.  Con­fi­gu­ra­ti­ons: Gra­phics: NVIDIA GeFor­ce GTX 1080 TI, Memo­ry: 4x16GB DDR4 (2666 or 2933 per hig­hest speed of the cor­re­spon­ding pro­ces­sor), Sto­rage: 1TB, OS: Win­dows* 10 RS4 Build 1803, Sam­sung 970 Pro SSD. Results: Intel® Core™ i9-9900K scored bet­ter on the majo­ri­ty of the 19 game tit­les tes­ted. The Intel® Core™ i9-9900K scored the same as the Intel® Core™ i7-8700K and the Intel® Core™ i7-8086K on “Midd­le Earth: Shadow of War,” and scored less than the Intel® Core™ i9-9980­XE Extre­me Edi­ti­on on “Rise of the Tomb Rai­der.” More detail on workloads, test metho­do­lo­gy, and con­fi­gu­ra­ti­ons avail­ab­le at http://facts.pt/11u9e2.

Per­for­mance results are based on tes­ting by Princi­pled Tech­no­lo­gies as of Octo­ber 4, 2018, and may not reflect all publicly avail­ab­le secu­ri­ty updates. See con­fi­gu­ra­ti­on dis­clo­sure for details. No pro­duct can be abso­lute­ly secure.

Intel will be mar­ke­ting the Intel® Core™ i9-9900K with the tag line “Per­for­mance Unleas­hed” in cer­tain juris­dic­tions, inclu­ding PRC and Viet­nam. Intel will be mar­ke­ting the Intel® Core™ i9-9900K with the tag line “Intel’s Best Gaming Desk­top Pro­ces­sor” in cer­tain juris­dic­tions, inclu­ding Argen­ti­na, Bela­rus, Beli­ze, Egypt, El Sal­va­dor, Gua­te­ma­la, Hon­du­ras, Ita­ly, Japan, Pana­ma, Peru, Sau­di Ara­bia, and Tur­key. If you are media or an influ­en­cer from the­se coun­tries, or other­wi­se com­mu­ni­ca­ting direct­ly to resi­dents in the­se coun­tries (e.g., on local-lan­guage social media), plea­se only refer to the tag line Intel will be using in that coun­try in lieu of the claim on this slide/document.

For­ward-Loo­king Statements

State­ments in this news sum­ma­ry that refer to future plans and expec­ta­ti­ons, inclu­ding with respect to Intel’s future pro­ducts and the expec­ted avai­la­bi­li­ty and bene­fits of such pro­ducts, are for­ward-loo­king state­ments that invol­ve a num­ber of risks and uncer­tain­ties. Words such as “anti­ci­pa­tes,” “expects,” “intends,” “goals,” “plans,” “belie­ves,” “seeks,” “esti­ma­tes,” “con­ti­nues,” “may,” “will,” “would,” “should,” “could,” and varia­ti­ons of such words and simi­lar expres­si­ons are inten­ded to iden­ti­fy such for­ward-loo­king state­ments. State­ments that refer to or are based on esti­ma­tes, fore­casts, pro­jec­tions, uncer­tain events or assump­ti­ons, inclu­ding state­ments rela­ting to total address­able mar­ket (TAM) or mar­ket oppor­tu­ni­ty and anti­ci­pa­ted trends in our busi­nes­ses or the mar­kets rele­vant to them, also iden­ti­fy for­ward-loo­king state­ments. Such state­ments are based on the company’s cur­rent expec­ta­ti­ons and invol­ve many risks and uncer­tain­ties that could cau­se actu­al results to dif­fer mate­ri­al­ly from tho­se expres­sed or implied in the­se for­ward-loo­king state­ments. Important fac­tors that could cau­se actu­al results to dif­fer mate­ri­al­ly from the company’s expec­ta­ti­ons are set forth in Intel’s ear­nings release dated Octo­ber 25, 2018, which is inclu­ded as an exhi­bit to Intel’s Form 8‑K fur­nis­hed to the SEC on such date. Addi­tio­nal infor­ma­ti­on regar­ding the­se and other fac­tors that could affect Intel’s results is inclu­ded in Intel’s SEC filings, inclu­ding the company’s most recent reports on Forms 10‑K and 10‑Q. Copies of Intel’s Form 10‑K, 10‑Q and 8‑K reports may be obtai­ned by visi­t­ing our Inves­tor Rela­ti­ons web­site at www.intc.com or the SEC’s web­site at www.sec.gov.


About Intel

Intel (NASDAQ: INTC), a lea­der in the semi­con­duc­tor indus­try, is shaping the data-centric future with com­pu­ting and com­mu­ni­ca­ti­ons tech­no­lo­gy that is the foun­da­ti­on of the world’s inno­va­tions. The company’s engi­nee­ring exper­ti­se is hel­ping address the world’s grea­test chal­len­ges as well as hel­ping secu­re, power and con­nect bil­li­ons of devices and the infra­st­ruc­tu­re of the smart, con­nec­ted world – from the cloud to the net­work to the edge and ever­ything in bet­ween. Find more infor­ma­ti­on about Intel at newsroom.intel.com and intel.com.

Intel and the Intel logo are trade­marks of Intel Cor­po­ra­ti­on in the United Sta­tes and other countries.

*Other names and brands may be clai­med as the pro­per­ty of others.

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