Schlagwort: Foveros

Intel to Invest $3.5 Billion to Expand New Mexico Manufacturing Operations

What’s New:
Intel Cor­po­ra­ti­on will invest $3.5 bil­li­on to equip its New Mexi­co ope­ra­ti­ons for the manu­fac­tu­ring of advan­ced semi­con­duc­tor pack­a­ging tech­no­lo­gies, inclu­ding Fover­os, Intel’s bre­akthrough 3D pack­a­ging tech­no­lo­gy. The mul­ti­ye­ar invest­ment is expec­ted to crea­te at least 700 high-tech jobs and 1,000 con­struc­tion jobs and sup­port an addi­tio­nal 3,500 jobs in the sta­te. Plan­ning acti­vi­ties begin immedia­te­ly, with con­struc­tion expec­ted to start in late 2021.

A key dif­fe­ren­tia­tor for our IDM 2.0 stra­te­gy is our unques­tio­ned lea­ders­hip in advan­ced pack­a­ging, which allows us to mix and match com­pu­te tiles to deli­ver the best pro­ducts. We’re see­ing tre­men­dous inte­rest in the­se capa­bi­li­ties from the indus­try, espe­cial­ly fol­lowing the intro­duc­tion of our new Intel Found­ry Ser­vices. We’re proud to have inves­ted in New Mexi­co for more than 40 years and we see our Rio Ran­cho cam­pus con­ti­nuing to play a cri­ti­cal role in Intel’s glo­bal manu­fac­tu­ring net­work in our new era of IDM 2.0.”

Key­van Esfar­ja­ni, Intel seni­or vice pre­si­dent and gene­ral mana­ger of Manu­fac­tu­ring and Ope­ra­ti­on (…) Wei­ter­le­sen »

2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration

  Today at CES 2019 in Las Vegas, Intel unvei­led the next wave of PC inno­va­ti­on that will advan­ce the PC expe­ri­ence to help power every person’s grea­test con­tri­bu­ti­on, inclu­ding: Details on our high­ly inte­gra­ted plat­form that will fea­ture our upco­m­ing first volu­me 10nm PC pro­ces­sor, code-named “Ice Lake” Pre­view of a hybrid 10nm CPU archi­tec­tu­re with Fover­os 3D pack­a­ging, (…) Wei­ter­le­sen »

New Intel Architectures and Technologies Target Expanded Market Opportunities

SANTA CLARA, Calif., Dec. 12, 2018 – At Intel “Archi­tec­tu­re Day,” top exe­cu­ti­ves, archi­tects and fel­lows reve­a­led next-gene­r­a­­ti­on tech­no­lo­gies and dis­cus­sed pro­gress on a stra­te­gy to power an expan­ding uni­ver­se of data-inten­­si­­ve workloads for PCs and other smart con­su­mer devices, high-speed net­works, ubi­qui­tous arti­fi­cial intel­li­gence (AI), spe­cia­li­zed cloud data cen­ters and auto­no­mous vehi­cles. Intel demons­tra­ted (…) Wei­ter­le­sen »

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