What’s New:
Intel Cor­po­ra­ti­on will invest $3.5 bil­li­on to equip its New Mexi­co ope­ra­ti­ons for the manu­fac­tu­ring of advan­ced semi­con­duc­tor pack­a­ging tech­no­lo­gies, inclu­ding Fover­os, Intel’s bre­akthrough 3D pack­a­ging tech­no­lo­gy. The mul­ti­ye­ar invest­ment is expec­ted to crea­te at least 700 high-tech jobs and 1,000 con­struc­tion jobs and sup­port an addi­tio­nal 3,500 jobs in the sta­te. Plan­ning acti­vi­ties begin immedia­te­ly, with con­struc­tion expec­ted to start in late 2021.

“A key dif­fe­ren­tia­tor for our IDM 2.0 stra­te­gy is our unques­tio­ned lea­ders­hip in advan­ced pack­a­ging, which allows us to mix and match com­pu­te tiles to deli­ver the best pro­ducts. We’re see­ing tre­men­dous inte­rest in the­se capa­bi­li­ties from the indus­try, espe­cial­ly fol­lowing the intro­duc­tion of our new Intel Found­ry Ser­vices. We’re proud to have inves­ted in New Mexi­co for more than 40 years and we see our Rio Ran­cho cam­pus con­ti­nuing to play a cri­ti­cal role in Intel’s glo­bal manu­fac­tu­ring net­work in our new era of IDM 2.0.”

Key­van Esfar­ja­ni, Intel seni­or vice pre­si­dent and gene­ral mana­ger of Manu­fac­tu­ring and Ope­ra­ti­on (…) Wei­ter­le­sen »