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Schlagwort: Lakefield
2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration
Today at CES 2019 in Las Vegas, Intel unveiled the next wave of PC innovation that will advance the PC experience to help power every person’s greatest contribution, including: Details on our highly integrated platform that will feature our upcoming first volume 10nm PC processor, code-named “Ice Lake” Preview of a hybrid 10nm CPU architecture with Foveros 3D packaging, (…) Weiterlesen »