AMD Announces Next-Generation Leadership Products at Computex 2019 Keynote

— 3rd Gen AMD Ryzen™ desk­top pro­ces­sor fami­ly based on new high-per­for­mance “Zen 2” core inclu­des hig­hest per­for­mance 12 core desk­top pro­ces­sor ever1 —

— New RDNA gaming archi­tec­tu­re and upco­m­ing AMD Rade­on™ RX 5700-series gra­phics cards will acce­le­ra­te the future of PC, con­so­le, and cloud gaming —

— World’s first PCIe® 4.0 rea­dy desk­top PC plat­form with broa­dest eco­sys­tem readi­ness in AMD histo­ry avail­ab­le plan­ned for July 2019 —

SANTA CLARA, Calif.

 

05/26/2019

AMD (NASDAQ: AMD) today again made tech­no­lo­gy histo­ry with the announ­ce­ment of high-per­for­mance 7nm-based com­pu­ting and gra­phics pro­duc­ts that are expec­ted to deli­ver new levels of per­for­mance, fea­tures and expe­ri­en­ces for PC gamers, enthu­si­asts and con­tent crea­tors. During the first-ever Com­pu­tex ope­ning key­note, AMD Pre­si­dent and CEO Dr. Lisa Su announ­ced:

  • The new “Zen 2” core wide­ly out­per­forms the his­to­ri­cal genera­tio­nal per­for­mance impro­ve­ment indus­try trend, up to 15% esti­ma­ted inst­ruc­tions per clock (IPC)2 uplift over the pre­de­ces­sor “Zen” archi­tec­tu­re. The “Zen 2” CPU core powering the next-genera­ti­on AMD Ryzen and EPYC™ pro­ces­sors also inclu­des signi­fi­cant design impro­ve­ments inclu­ding lager cache sizes and a rede­si­gned floa­ting point engi­ne.
  • The 3rd Gen AMD Ryzen desk­top pro­ces­sor fami­ly, inclu­ding the new 12-core Ryzen 9 pro­ces­sor, offers lea­dership per­for­mance.1
  • The AMD X570 chip­set for socket AM4, the world’s first PCIe 4.0 sup­por­ted chip­set with more than 50 new mother­boards at launch.
  • RDNA gaming archi­tec­tu­re desi­gned to dri­ve the future of PC gaming, con­so­le, and cloud, anti­ci­pa­ted to deli­ver incredi­ble per­for­mance, power, and memo­ry effi­ci­en­cy in a smal­ler packa­ge.
  • The 7nm AMD Rade­on RX 5700-series gaming gra­phics card fami­ly fea­turing high-speed GDDR6 memo­ry and sup­port for the PCIe 4.0 inter­face.

Dr. Su was joi­ned by fel­low tech­no­lo­gy lea­ders Micro­soft Cor­po­ra­te Vice Pre­si­dent of OS Plat­forms Roan­ne Sones, Asus Chief Ope­ra­ting Offi­cer Joe Hsieh, Acer Co-Chief Ope­ra­ting Offi­cer Jer­ry Kao and a host of other signi­fi­cant indus­try play­ers to show­ca­se the breadth and depth of the AMD high-per­for­mance com­pu­ting and gra­phics eco­sys­tem.

2019 is off to an incredi­ble start for AMD as we cele­bra­te 50 years of inno­va­ti­on by deli­vering lea­dership pro­duc­ts to push the limits of what is pos­si­ble with com­pu­ting and gra­phics tech­no­lo­gy,” said Dr. Su. “We made signi­fi­cant stra­te­gic invest­ments in next-genera­ti­on cores, a bre­akth­rough chip­let design approach, and advan­ced pro­cess tech­no­lo­gies to deli­ver lea­dership 7nm pro­duc­ts to our high-per­for­mance com­pu­ting eco­sys­tem. We are extre­me­ly exci­ted to kick-off Com­pu­tex 2019 tog­e­ther with our indus­try part­ners as we pre­pa­re to bring our next genera­ti­on of Ryzen desk­top and EPYC ser­ver pro­ces­sors and Rade­on RX gaming gra­phics cards to mar­ket.”  

AMD High-Performance Desktop Updates

Con­ti­nuing its path of PC lea­dership and indus­try firsts, AMD announ­ced the 3rd Gen AMD Ryzen desk­top pro­ces­sor, the most advan­ced desk­top pro­ces­sor in the world3 with ground-brea­king per­for­mance across gaming, pro­duc­tivi­ty, and con­tent crea­ti­on app­li­ca­ti­ons. Based on the new “Zen 2” core archi­tec­tu­re with AMD chip­let design approach, 3rd Gen AMD Ryzen desk­top pro­ces­sors are expec­ted to offer more per­for­mance-cri­ti­cal on-die cache than ever befo­re to unleash eli­te gaming per­for­mance. Addi­tio­nal­ly, all 3rd Gen Ryzen desk­top pro­ces­sors are sup­por­ted by the world’s first PCIe 4.0 PC readi­ness for the most advan­ced mother­boards, gra­phics, and sto­rage tech­no­lo­gies avail­ab­le, set­ting a new stan­dard of per­for­mance and pro­vi­ding the ulti­ma­te con­su­mer expe­ri­ence.

With the 3rd Gen AMD Ryzen desk­top pro­ces­sor fami­ly, AMD intro­du­ced a new cate­go­ry of Ryzen 9 desk­top pro­ces­sor with the flagship 12 core/24 thread Ryzen 9 3900X. Pushing the high-per­for­mance enve­lo­pe for socket AM4 by offe­ring lea­dership per­for­mance1, the fami­ly is roun­ded out with 8 core Ryzen 7 models and 6 core Ryzen 5 models.

During the key­note, Dr. Su show­ed various live demons­tra­ti­ons high­ligh­t­ing lea­dership per­for­mance of the 3rd Gen Ryzen desk­top pro­ces­sors ver­sus com­pe­ti­ti­ve pro­duc­tion parts:

  • Ryzen™ 7 3700X vs. i7-9700K with real-time ren­de­ring: The Ryzen 7 3700X offe­red 1% more  sin­gle-thre­aded, and 30% more in mul­ti-thre­aded per­for­mance.4
  • Ryzen™ 7 3800X vs. i9-9900K with PlayerUnknown’s Batt­le­grounds game­play: The Ryzen 7 3800X matched the per­for­mance of the i9-9900K.5
  • Ryzen™ 9 3900X vs. i9-9920X with Blen­der Ren­der: The Ryzen 9 3900X beat the Intel i9 9920X by more than 16%.6

3rd Gen AMD Ryzen Desktop Processor Line-up and Availability

Model Cores/
Threads
TDP7 (Watts) Boost/Base Freq. (GHz) Total Cache (MB) PCIe4.0 Lanes (processor+AMD X570) SEP8 (USD) Expec­ted Avai­la­bi­li­ty
Ryzen™ 9 3900X CPU 12/24 105W 4.6/3.8 70 40 $499 July 7, 2019
Ryzen™ 7 3800X CPU 8/16 105W 4.5/3.9 36 40 $399 July 7, 2019
Ryzen™ 7 3700X CPU 8/16 65W 4.4/3.6 36 40 $329 July 7, 2019
Ryzen™ 5 3600X CPU 6/12 95W 4.4/3.8 35 40 $249 July 7, 2019
Ryzen™ 5 3600 CPU 6/12 65W 4.2/3.6 35 40 $199 July 7, 2019

AMD also intro­du­ced a new X570 chip­set for socket AM4, sup­por­ting the world’s first PCIe 4.0 readi­ness, which exhi­bi­ted 42% fas­ter sto­rage per­for­mance than PCIe 3.09, enab­ling high-per­for­mance gra­phics card, net­wor­king devices, NVMe dri­ves, and more. With PCIe 4.0 doub­ling the band­width for mother­boards with the X570 chip­set over PCIe 3.0, PC enthu­si­asts can gain more per­for­mance and fle­xi­bi­li­ty when buil­ding custom sys­tems. The X570 offers the broa­dest eco­sys­tem readi­ness in AMD histo­ry, with over 50 new mother­board models anti­ci­pa­ted from ASRock, Asus, Color­ful, Giga­byte, MSI, as well as PCIe 4.0 sto­rage solu­ti­ons from part­ners inclu­ding Gala­xy, Giga­byte, and Phi­son. The 3rd Gen AMD Ryzen desk­top pro­ces­sors are expec­ted to be avail­ab­le for purcha­se glo­bal­ly on July 7, 2019. 

In addi­ti­on, major OEMs and Sys­tem Inte­gra­tors, inclu­ding Acer, Asus, Cyber­Power­PC, HP, Leno­vo, and MAINGEAR rein­forced strong eco­sys­tem sup­port for the new plat­forms by announ­cing plans to offer 3rd Gen AMD Ryzen pro­ces­sor-based gaming desk­top sys­tems over the com­ing mon­ths.

AMD High-Performance Gaming Updates

AMD unvei­led RDNA, the next foun­da­tio­nal gaming archi­tec­tu­re that was desi­gned to dri­ve the future of PC gaming, con­so­le, and cloud for years to come. With a new com­pu­te unit10 design, RDNA is expec­ted to deli­ver incredi­ble per­for­mance, power and memo­ry effi­ci­en­cy in a smal­ler packa­ge com­pa­red to the pre­vious genera­ti­on Gra­phics Core Next (GCN) archi­tec­tu­re. It is pro­jec­ted to pro­vi­de up to 1.25X hig­her per­for­mance-per-clock11 and up to 1.5X hig­her per­for­mance-per-watt over GCN12, enab­ling bet­ter gaming per­for­mance at lower power and redu­ced laten­cy.

RDNA will power the upco­m­ing 7nm AMD Rade­on RX 5700-series gra­phics cards which fea­ture high-speed GDDR6 memo­ry and sup­port for the PCIe 4.0 inter­face.

During the key­note, Dr. Su show­ca­sed the power of RDNA and one of the new AMD Rade­on RX 5700-series gra­phics cards in a head-to-head com­pa­ri­son with a RTX 2070 card run­ning a Stran­ge Bri­ga­de game­play demo, bea­ting the com­pe­ti­ti­on deli­vering incredi­ble ~100 FPS gaming.13

AMD Rade­on RX 5700-series gra­phics cards are expec­ted to be avail­ab­le in July 2019. Learn more at the AMD E3 live­stream event on June 10, 2019 at 3 pm PT.

AMD Datacenter Updates

The AMD dat­a­cen­ter busi­ness con­ti­nues to gain trac­tion with custo­mers, win­ning in app­li­ca­ti­on workloads from the big­gest cloud envi­ron­ments to exas­ca­le super­com­pu­ting, and capi­ta­li­zing on the mas­si­ve mar­ket oppor­tu­ni­ty for both AMD EPYC and AMD Rade­on Instinct™ pro­ces­sors.

During the key­note, Dr. Su con­ti­nued the anti­ci­pa­ti­on around the next-genera­ti­on AMD EPYC pro­ces­sors with the first public com­pe­ti­ti­ve demons­tra­ti­on of a 2nd Gen AMD EPYC ser­ver plat­form. The demons­tra­ti­on show­ed a 2P 2nd Gen AMD EPYC based ser­ver vs. a 2P Intel Xeon®8280-based ser­ver run­ning a NAMD Apo1 v2.12 bench­mark test. The pre­pro­duc­tion 2nd Gen AMD EPYC pro­ces­sor powe­red ser­ver out­per­for­med the Intel Xeon powe­red ser­vers by more than 2x on the NAMD bench­mark.14

Final­ly, Micro­soft Azu­re announ­ced the achie­ve­ment of pre­vious­ly unob­tainab­le levels of per­for­mance for com­pu­ta­tio­nal flu­id dyna­mics (CFD) using an Azu­re HB cloud instan­ce run­ning on an 1st Gen AMD EPYC-pro­ces­sor based sys­tem. Lever­aging the excep­tio­nal memo­ry band­width of AMD EPYC, Azu­re HB sca­led Sie­mens Star -CCM+ app­li­ca­ti­on across over 11,500 cores using a Le Mans 100 Mil­li­on Cell simu­la­ti­on, well bey­ond the never befo­re achie­ved 10,000 cores goal. “HB-series VMs on Azu­re are a game chan­ger for HPC in the cloud. For the first time, HPC custo­mers can sca­le their MPI workloads to tens of thousands of cores with the agi­li­ty of the cloud and per­for­mance and eco­no­mics that rival on-pre­mi­se clus­ter,” said Navneet Jone­ja, head of pro­duct for Azu­re Vir­tu­al Machi­nes, Micro­soft Corp. “We look for­ward to this new Azu­re offe­ring doing gre­at things for HPC-dri­ven inno­va­ti­on and pro­duc­tivi­ty.”

The 2nd Gen AMD EPYC ser­ver pro­ces­sor fami­ly is pro­jec­ted to deli­ver up to 2X the per­for­mance-per socket15 and up to 4X the floa­ting per­for­mance-per-socket16 over the pre­vious genera­ti­on.

The 2nd Gen AMD EPYC ser­ver pro­ces­sor fami­ly is expec­ted to launch in Q3 2019.

Supporting Resources

About AMD

For 50 years AMD has dri­ven inno­va­ti­on in high-per­for­mance com­pu­ting, gra­phics and visua­li­za­ti­on tech­no­lo­gies ― the buil­ding blocks for gaming, immer­si­ve plat­forms and the dat­a­cen­ter. Hund­reds of mil­li­ons of con­su­mers, lea­ding For­tu­ne 500 busi­nes­ses and cut­ting-edge sci­en­ti­fic rese­arch faci­li­ties around the world rely on AMD tech­no­lo­gy dai­ly to impro­ve how they live, work and play. AMD employees around the world are focu­sed on buil­ding gre­at pro­duc­ts that push the bounda­ries of what is pos­si­ble. For more infor­ma­ti­on about how AMD is enab­ling today and inspi­ring tomor­row, visit the AMD (NASDAQ:AMDweb­siteblogFace­book and Twit­ter pages. 

Cautionary Statement

This press release con­tains for­ward-loo­king state­ments con­cer­ning Advan­ced Micro Devices, Inc. (AMD) inclu­ding the fea­tures, func­tio­n­a­li­ty, avai­la­bi­li­ty, timing, deploy­ment and expec­ta­ti­ons of AMD’s future pro­duc­ts, inclu­ding 3rd Gen AMD Ryzen desk­top pro­ces­sors, 7nm AMD Rade­on RX 5700-series gra­phics cards and the 2nd Gen AMD EPYC ser­ver pro­ces­sor fami­ly, which are made pur­suant to the Safe Har­bor pro­vi­si­ons of the Pri­va­te Secu­ri­ties Liti­ga­ti­on Reform Act of 1995. For­ward-loo­king state­ments are com­mon­ly iden­ti­fied by words such as “would,” “intends,” “belie­ves,” “expec­ts,” “may,” “will,” “should,” “seeks,” “intends,” “plans,” “pro for­ma,” “esti­ma­tes,” “anti­ci­pa­tes,” or the nega­ti­ve of the­se words and phra­ses, other varia­ti­ons of the­se words and phra­ses or com­pa­ra­ble ter­mi­no­lo­gy. Inves­tors are cau­tio­ned that the for­ward-loo­king state­ments in this docu­ment are based on cur­rent beliefs, assump­ti­ons and expec­ta­ti­ons, speak only as of the date of this docu­ment and invol­ve risks and uncer­tain­ties that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons. Such state­ments are sub­ject to cer­tain known and unknown risks and uncer­tain­ties, many of which are dif­fi­cult to pre­dict and gene­ral­ly bey­ond AMD’s con­trol, that could cau­se actu­al results and other future events to dif­fer mate­ri­al­ly from tho­se expres­sed in, or implied or pro­jec­ted by, the for­ward-loo­king infor­ma­ti­on and state­ments. Mate­ri­al fac­tors that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons inclu­de, wit­hout limi­ta­ti­on, the fol­lo­wing: Intel Corporation’s domi­nan­ce of the micropro­ces­sor mar­ket and its aggres­si­ve busi­ness prac­tices may limit AMD’s abi­li­ty to com­pe­te effec­tively; AMD has a wafer sup­ply agree­ment with GLOBALFOUNDRIES Inc. (GF) with obli­ga­ti­ons to purcha­se all of its micropro­ces­sor and APU pro­duct requi­re­ments, and a cer­tain por­ti­on of its GPU pro­duct requi­re­ments, manu­fac­tu­red at pro­cess nodes lar­ger than 7 nano­me­ter from GF with limi­ted excep­ti­ons. If GF is not able to satis­fy AMD’s manu­fac­tu­ring requi­re­ments, AMD’s busi­ness could be adver­se­ly impac­ted; AMD reli­es on third par­ties to manu­fac­tu­re its pro­duc­ts, and if they are unab­le to do so on a time­ly basis in suf­fi­ci­ent quan­ti­ties and using com­pe­ti­ti­ve tech­no­lo­gies, AMD’s busi­ness could be mate­ri­al­ly adver­se­ly affec­ted; fail­u­re to achie­ve expec­ted manu­fac­tu­ring yields for AMD’s pro­duc­ts could nega­tively impact its finan­ci­al results; the suc­cess of AMD’s busi­ness is depen­dent upon its abi­li­ty to intro­du­ce pro­duc­ts on a time­ly basis with fea­tures and per­for­mance levels that pro­vi­de value to its custo­mers while sup­por­ting and coin­ci­ding with signi­fi­cant indus­try tran­si­ti­ons; if AMD can­not gene­ra­te suf­fi­ci­ent reve­nue and ope­ra­ting cash flow or obtain exter­nal finan­cing, it may face a cash short­fall and be unab­le to make all of its plan­ned invest­ments in rese­arch and deve­lop­ment or other stra­te­gic invest­ments; the loss of a signi­fi­cant custo­mer may have a mate­ri­al adver­se effect on AMD; AMD’s rece­ipt of reve­nue from its semi-custom SoC pro­duc­ts is depen­dent upon its tech­no­lo­gy being desi­gned into third-par­ty pro­duc­ts and the suc­cess of tho­se pro­duc­ts; glo­bal eco­no­mic and mar­ket uncer­tain­ty may adver­se­ly impact AMD’s busi­ness and ope­ra­ting results; AMD’s pro­duc­ts may be sub­ject to secu­ri­ty vul­nera­bi­li­ties that could have a mate­ri­al adver­se effect on AMD; IT outa­ges, data loss, data breaches and cyber-attacks could com­pro­mi­se AMD’s intel­lec­tu­al pro­per­ty or other sen­si­ti­ve infor­ma­ti­on, be cost­ly to reme­dia­te and cau­se signi­fi­cant dama­ge to its busi­ness, repu­ta­ti­on and ope­ra­ti­ons; AMD’s ope­ra­ting results are sub­ject to quar­ter­ly and sea­so­nal sales pat­terns; AMD may not be able to gene­ra­te suf­fi­ci­ent cash to ser­vice its debt obli­ga­ti­ons or meet its working capi­tal requi­re­ments; AMD has a lar­ge amount of indeb­ted­ness which could adver­se­ly affect its finan­ci­al posi­ti­on and pre­vent it from imple­men­ting its stra­te­gy or ful­fil­ling its con­trac­tu­al obli­ga­ti­ons; the agree­ments gover­ning AMD’s notes and the Secu­red Revol­ving Line of Credit impo­se restric­tions on AMD that may adver­se­ly affect AMD’s abi­li­ty to ope­ra­te its busi­ness; the mar­kets in which AMD’s pro­duc­ts are sold are high­ly com­pe­ti­ti­ve; AMD’s world­wi­de ope­ra­ti­ons are sub­ject to poli­ti­cal, legal and eco­no­mic risks and natu­ral dis­as­ters, which could have a mate­ri­al adver­se effect on it; the con­ver­si­on of the 2.125% Con­ver­ti­ble Seni­or Notes due 2026 may dilu­te the ownership inte­rest of AMD’s exis­ting stock­hol­ders, or may other­wi­se depress the pri­ce of its com­mon stock; uncer­tain­ties invol­ving the orde­ring and ship­ment of AMD’s pro­duc­ts could mate­ri­al­ly adver­se­ly affect it; the demand for AMD’s pro­duc­ts depends in part on the mar­ket con­di­ti­ons in the indus­tries into which they are sold. Fluc­tua­ti­ons in demand for AMD’s pro­duc­ts or a mar­ket decli­ne in any of the­se indus­tries could have a mate­ri­al adver­se effect on its results of ope­ra­ti­ons; AMD’s abi­li­ty to design and intro­du­ce new pro­duc­ts in a time­ly man­ner is depen­dent upon third-par­ty intel­lec­tu­al pro­per­ty; AMD depends on third-par­ty com­pa­nies for the design, manu­fac­tu­re and sup­ply of mother­boards, soft­ware and other com­pu­ter plat­form com­pon­ents to sup­port its busi­ness; if AMD loses Micro­soft Corporation’s sup­port for its pro­duc­ts or other soft­ware ven­dors do not design and deve­lop soft­ware to run on AMD’s pro­duc­ts, its abi­li­ty to sell its pro­duc­ts could be mate­ri­al­ly adver­se­ly affec­ted; and AMD’s reli­an­ce on third-par­ty dis­tri­bu­tors and add-in-board part­ners sub­jec­ts it to cer­tain risks.  Inves­tors are urged to review in detail the risks and uncer­tain­ties in AMD’s Secu­ri­ties and Exchan­ge Com­mis­si­on filings, inclu­ding but not limi­ted to AMD’s Quar­ter­ly Report on Form 10-Q for the quar­ter ended March 30, 2019.

 

AMD, the AMD Arrow logo, EPYC, Ryzen, Rade­on and com­bi­na­ti­ons the­re­of, are trade­marks of Advan­ced Micro Devices, Inc. Other names are for infor­ma­tio­nal pur­po­ses only and may be trade­marks of their respec­tive owners.

  1. Tes­ting by AMD Per­for­mance Labs as of 05/26/2019 uti­li­zing the Ryzen 9 3900X vs. Core i9-9920X in Cine­bench R20 nT. Results may vary. RZ3-13
  2. Tes­ting by AMD Per­for­mance Labs as of 5/23.2918 AMD “Zen2” CPU-based sys­tem scored an esti­ma­ted 15% hig­her than pre­vious genera­ti­on AMD “Zen” based sys­tem using esti­ma­ted SPECint®_rate_base2006 results. SPEC and SPE­C­int are regis­te­red trade­marks of the Stan­dard Per­for­mance Eva­lua­ti­on Cor­po­ra­ti­on. See www.spec.org. GD-141
  3. Advan­ced” defi­ned as supe­ri­or pro­cess tech­no­lo­gy in a smal­ler node and uni­que sup­port for PCIe® Gen 4 in the gaming mar­ket as of 05/26/2019. RZ3-14
  4. Tes­ting by AMD Per­for­mance Labs as of 05/26/2019 uti­li­zing the Ryzen 7 3700X vs. Core i7-9700K in Cine­bench R20 1T and nT. Results may vary. RZ3-15
  5. Tes­ting by AMD Per­for­mance Labs as of 05/26/2019 uti­li­zing the Ryzen 7 3800X and Core i9-9900K in PUBG. Results may vary. RZ3-16
  6. Tes­ting by AMD Per­for­mance Labs as of 05/26/2019 uti­li­zing the Ryzen 9 3900X vs. Core i9-9920X in Cine­bench R20 nT. Results may vary. RZ3-17
  7. Though both are often mea­su­red in watts, it is important to dis­tin­guish bet­ween ther­mal and elec­tri­cal watts. Ther­mal wat­ta­ge for pro­ces­sors is con­vey­ed via ther­mal design power (TDP). TDP is a cal­cu­la­ted value that con­veys an appro­pria­te ther­mal solu­ti­on to achie­ve the inten­ded ope­ra­ti­on of a pro­ces­sor. Elec­tri­cal watts are not a varia­ble in the TDP cal­cu­la­ti­on. By design, elec­tri­cal watts can vary from workload to workload and may exceed ther­mal watts. GD-109
  8. Sug­gest online retailer pri­ce in US dol­lars as of 5/23/2019.
  9. Tes­ting as of 05/20/2019 by AMD Per­for­mance Labs using a 3rd Gen AMD Ryzen™ Pro­ces­sor in Crys­tal DiskMark 6.0.2. Results may vary with con­fi­gu­ra­ti­on. RZ3-12 
  10. AMD APUs and GPUs based on the Gra­phics Core Next and RDNA archi­tec­tures con­tain GPU Cores com­pri­sed of com­pu­te units, which are defi­ned as 64 shaders (or stream pro­ces­sors) working tog­e­ther. GD-142
  11. Tes­ting done by AMD per­for­mance labs 5/23/19, sho­wing a geo­me­an of 1.25x per/clock across 30 dif­fe­rent games @ 4K Ultra, 4xAA set­tings. Per­for­mance may vary based on use of latest dri­vers. RX-327
  12. Tes­ting done by AMD per­for­mance labs 5/23/19, using the Divi­si­on 2 @ 25x14 Ultra set­tings.  Per­for­mance may vary based on use of latest dri­vers. RX-325
  13. Tes­ting done by AMD per­for­mance labs 5/23/19, using the Stran­ge Bri­ga­de @ 25x14 Ultra set­tings. Per­for­mance may vary based on use of latest dri­vers. RX-328
  14. Pre­pro­duc­tion 7nm 2nd Genera­ti­on EPYC™ powe­red ser­ver CPU in a 2P ser­ver con­fi­gu­ra­ti­on out­per­for­med 2P Intel Xeon 8280 powe­red ser­ver by an average of up to 2X on the NAMD bench­mark. AMD inter­nal tes­ting as of May 21, 2019. Pro­duc­tion sili­con results may vary. ROM-05
  15. Tes­ting per­for­med by AMD Engi­nee­ring as of Octo­ber 2018 using AMD refe­rence sys­tem with a pre­pro­duc­tion “Rome” engi­nee­ring sam­ple, whe­re “Rome” scored appro­xi­mate­ly 2x hig­her com­pa­red to “Nap­les” Sys­tem. Actu­al results with pro­duc­tion sili­con may vary. ROM-03
  16. Esti­ma­ted genera­tio­nal increa­se based upon AMD inter­nal design spe­ci­fi­ca­ti­ons for “Zen 2” com­pa­red to “Zen 1”.  “Zen 2” has 2X the core den­si­ty of “Zen 1”, and when mul­ti­plied by 2X peak FLOPs per core, at the same fre­quen­cy, results in 4X the FLOPs in through­put. Actu­al results with pro­duc­tion sili­con may vary. ROM-04