AMD Announces Next-Generation Leadership Products at Computex 2019 Keynote

3rd Gen AMD Ryzen꽓 desk짯top pro짯ces짯sor fami짯ly based on new high-per짯for짯mance 쏾en 2 core includes hig짯hest per짯for짯mance 12 core desk짯top pro짯ces짯sor ever1 

New RDNA gam짯ing archi짯tec짯tu짯re and upco짯ming AMD Rade짯on꽓 RX 5700-series gra짯phics cards will acce짯le짯ra짯te the future of PC, con짯so짯le, and cloud gaming 

World셲 first PCIe 4.0 rea짯dy desk짯top PC plat짯form with broa짯dest eco짯sys짯tem rea짯di짯ness in AMD histo짯ry available plan짯ned for July 2019 




AMD (NASDAQ: AMD) today again made tech짯no짯lo짯gy histo짯ry with the announce짯ment of high-per짯for짯mance 7nm-based com짯pu짯ting and gra짯phics pro짯ducts that are expec짯ted to deli짯ver new levels of per짯for짯mance, fea짯tures and expe짯ri짯en짯ces for PC gamers, enthu짯si짯asts and con짯tent crea짯tors. During the first-ever Com짯putex ope짯ning key짯note, AMD Pre짯si짯dent and CEO Dr. Lisa Su announced:

  • The new 쏾en 2 core wide짯ly out짯per짯forms the his짯to짯ri짯cal gene짯ra짯tio짯nal per짯for짯mance impro짯ve짯ment indus짯try trend, up to 15% esti짯ma짯ted ins짯truc짯tions per clock (IPC)2 uplift over the pre짯de짯ces짯sor 쏾en archi짯tec짯tu짯re. The 쏾en 2 CPU core powe짯ring the next-gene짯ra짯ti짯on AMD Ryzen and EPYC꽓 pro짯ces짯sors also includes signi짯fi짯cant design impro짯ve짯ments inclu짯ding lager cache sizes and a rede짯si짯gned floa짯ting point engine.
  • The 3rd Gen AMD Ryzen desk짯top pro짯ces짯sor fami짯ly, inclu짯ding the new 12-core Ryzen 9 pro짯ces짯sor, offers lea짯der짯ship per짯for짯mance.1
  • The AMD X570 chip짯set for socket AM4, the world셲 first PCIe 4.0 sup짯port짯ed chip짯set with more than 50 new mother짯boards at launch.
  • RDNA gam짯ing archi짯tec짯tu짯re desi짯gned to dri짯ve the future of PC gam짯ing, con짯so짯le, and cloud, anti짯ci짯pa짯ted to deli짯ver incre짯di짯ble per짯for짯mance, power, and memo짯ry effi짯ci짯en짯cy in a smal짯ler package.
  • The 7nm AMD Rade짯on RX 5700-series gam짯ing gra짯phics card fami짯ly fea짯turing high-speed GDDR6 memo짯ry and sup짯port for the PCIe 4.0 interface.

Dr. Su was joi짯n짯ed by fel짯low tech짯no짯lo짯gy lea짯ders Micro짯soft Cor짯po짯ra짯te Vice Pre짯si짯dent of OS Plat짯forms Roan짯ne Sones, Asus Chief Ope짯ra짯ting Offi짯cer Joe Hsieh, Acer Co-Chief Ope짯ra짯ting Offi짯cer Jer짯ry Kao and a host of other signi짯fi짯cant indus짯try play짯ers to show짯ca짯se the breadth and depth of the AMD high-per짯for짯mance com짯pu짯ting and gra짯phics ecosystem.

2019 is off to an incre짯di짯ble start for AMD as we cele짯bra짯te 50 years of inno짯va짯ti짯on by deli짯ve짯ring lea짯der짯ship pro짯ducts to push the limits of what is pos짯si짯ble with com짯pu짯ting and gra짯phics tech짯no짯lo짯gy, said Dr. Su. 쏻e made signi짯fi짯cant stra짯te짯gic invest짯ments in next-gene짯ra짯ti짯on cores, a breakth짯rough chip짯let design approach, and advan짯ced pro짯cess tech짯no짯lo짯gies to deli짯ver lea짯der짯ship 7nm pro짯ducts to our high-per짯for짯mance com짯pu짯ting eco짯sys짯tem. We are extre짯me짯ly exci짯ted to kick-off Com짯putex 2019 tog짯e짯ther with our indus짯try part짯ners as we prepa짯re to bring our next gene짯ra짯ti짯on of Ryzen desk짯top and EPYC ser짯ver pro짯ces짯sors and Rade짯on RX gam짯ing gra짯phics cards to market. 

AMD High-Performance Desktop Updates

Con짯ti짯nuing its path of PC lea짯der짯ship and indus짯try firsts, AMD announ짯ced the 3rd Gen AMD Ryzen desk짯top pro짯ces짯sor, the most advan짯ced desk짯top pro짯ces짯sor in the world3 with ground-brea짯king per짯for짯mance across gam짯ing, pro짯duc짯ti짯vi짯ty, and con짯tent crea짯ti짯on appli짯ca짯ti짯ons. Based on the new 쏾en 2 core archi짯tec짯tu짯re with AMD chip짯let design approach, 3rd Gen AMD Ryzen desk짯top pro짯ces짯sors are expec짯ted to offer more per짯for짯mance-cri짯ti짯cal on-die cache than ever befo짯re to unleash eli짯te gam짯ing per짯for짯mance. Addi짯tio짯nal짯ly, all 3rd Gen Ryzen desk짯top pro짯ces짯sors are sup짯port짯ed by the world셲 first PCIe 4.0 PC rea짯di짯ness for the most advan짯ced mother짯boards, gra짯phics, and sto짯rage tech짯no짯lo짯gies available, set짯ting a new stan짯dard of per짯for짯mance and pro짯vi짯ding the ulti짯ma짯te con짯su짯mer experience.

With the 3rd Gen AMD Ryzen desk짯top pro짯ces짯sor fami짯ly, AMD intro짯du짯ced a new cate짯go짯ry of Ryzen 9 desk짯top pro짯ces짯sor with the flag짯ship 12 core/24 thread Ryzen 9 3900X. Pushing the high-per짯for짯mance enve짯lo짯pe for socket AM4 by offe짯ring lea짯der짯ship per짯for짯mance1, the fami짯ly is roun짯ded out with 8 core Ryzen 7 models and 6 core Ryzen 5 models.

During the key짯note, Dr. Su show짯ed various live demons짯tra짯ti짯ons high짯light짯ing lea짯der짯ship per짯for짯mance of the 3rd Gen Ryzen desk짯top pro짯ces짯sors ver짯sus com짯pe짯ti짯ti짯ve pro짯duc짯tion parts:

  • Ryzen꽓 7 3700X vs. i7-9700K with real-time ren짯de짯ring: The Ryzen 7 3700X offe짯red 1% more  sin짯gle-threa짯ded, and 30% more in mul짯ti-threa짯ded per짯for짯mance.4
  • Ryzen꽓 7 3800X vs. i9-9900K with PlayerUnknown셲 Batt짯le짯grounds game짯play: The Ryzen 7 3800X matched the per짯for짯mance of the i9-9900K.5
  • Ryzen꽓 9 3900X vs. i9-9920X with Blen짯der Ren짯der: The Ryzen 9 3900X beat the Intel i9 9920X by more than 16%.6

3rd Gen AMD Ryzen Desktop Processor Line-up and Availability

Model Cores/
TDP7 (Watts) Boost/Base Freq. (GHz) Total Cache (MB) PCIe4.0 Lanes (processor+AMD X570) SEP8 (USD) Expec짯ted Availability
Ryzen꽓 9 3900X CPU 12/24 105W 4.6/3.8 70 40 $499 July 7, 2019
Ryzen꽓 7 3800X CPU 8/16 105W 4.5/3.9 36 40 $399 July 7, 2019
Ryzen꽓 7 3700X CPU 8/16 65W 4.4/3.6 36 40 $329 July 7, 2019
Ryzen꽓 5 3600X CPU 6/12 95W 4.4/3.8 35 40 $249 July 7, 2019
Ryzen꽓 5 3600 CPU 6/12 65W 4.2/3.6 35 40 $199 July 7, 2019

AMD also intro짯du짯ced a new X570 chip짯set for socket AM4, sup짯port짯ing the world셲 first PCIe 4.0 rea짯di짯ness, which exhi짯bi짯ted 42% fas짯ter sto짯rage per짯for짯mance than PCIe 3.09, enab짯ling high-per짯for짯mance gra짯phics card, net짯wor짯king devices, NVMe dri짯ves, and more. With PCIe 4.0 doubling the band짯width for mother짯boards with the X570 chip짯set over PCIe 3.0, PC enthu짯si짯asts can gain more per짯for짯mance and fle짯xi짯bi짯li짯ty when buil짯ding cus짯tom sys짯tems. The X570 offers the broa짯dest eco짯sys짯tem rea짯di짯ness in AMD histo짯ry, with over 50 new mother짯board models anti짯ci짯pa짯ted from ASRock, Asus, Colorful, Giga짯byte, MSI, as well as PCIe 4.0 sto짯rage solu짯ti짯ons from part짯ners inclu짯ding Gala짯xy, Giga짯byte, and Phison. The 3rd Gen AMD Ryzen desk짯top pro짯ces짯sors are expec짯ted to be available for purcha짯se glo짯bal짯ly on July 7, 2019. 

In addi짯ti짯on, major OEMs and Sys짯tem Inte짯gra짯tors, inclu짯ding Acer, Asus, Cyber짯PowerPC, HP, Leno짯vo, and MAINGEAR rein짯forced strong eco짯sys짯tem sup짯port for the new plat짯forms by announ짯cing plans to offer 3rd Gen AMD Ryzen pro짯ces짯sor-based gam짯ing desk짯top sys짯tems over the coming months.

AMD High-Performance Gaming Updates

AMD unvei짯led RDNA, the next foun짯da짯tio짯nal gam짯ing archi짯tec짯tu짯re that was desi짯gned to dri짯ve the future of PC gam짯ing, con짯so짯le, and cloud for years to come. With a new com짯pu짯te unit10 design, RDNA is expec짯ted to deli짯ver incre짯di짯ble per짯for짯mance, power and memo짯ry effi짯ci짯en짯cy in a smal짯ler packa짯ge com짯pared to the pre짯vious gene짯ra짯ti짯on Gra짯phics Core Next (GCN) archi짯tec짯tu짯re. It is pro짯jec짯ted to pro짯vi짯de up to 1.25X hig짯her per짯for짯mance-per-clock11 and up to 1.5X hig짯her per짯for짯mance-per-watt over GCN12, enab짯ling bet짯ter gam짯ing per짯for짯mance at lower power and redu짯ced latency.

RDNA will power the upco짯ming 7nm AMD Rade짯on RX 5700-series gra짯phics cards which fea짯ture high-speed GDDR6 memo짯ry and sup짯port for the PCIe 4.0 interface.

During the key짯note, Dr. Su show짯ca짯sed the power of RDNA and one of the new AMD Rade짯on RX 5700-series gra짯phics cards in a head-to-head com짯pa짯ri짯son with a RTX 2070 card run짯ning a Stran짯ge Bri짯ga짯de game짯play demo, bea짯ting the com짯pe짯ti짯ti짯on deli짯ve짯ring incre짯di짯ble ~100 FPS gam짯ing.13

AMD Rade짯on RX 5700-series gra짯phics cards are expec짯ted to be available in July 2019. Learn more at the AMD E3 live짯stream event on June 10, 2019 at 3 pm PT.

AMD Datacenter Updates

The AMD dat짯a짯cen짯ter busi짯ness con짯ti짯nues to gain trac짯tion with cus짯to짯mers, win짯ning in appli짯ca짯ti짯on workloads from the big짯gest cloud envi짯ron짯ments to exas짯ca짯le super짯com짯pu짯ting, and capi짯ta짯li짯zing on the mas짯si짯ve mar짯ket oppor짯tu짯ni짯ty for both AMD EPYC and AMD Rade짯on Instinct꽓 processors.

During the key짯note, Dr. Su con짯tin짯ued the anti짯ci짯pa짯ti짯on around the next-gene짯ra짯ti짯on AMD EPYC pro짯ces짯sors with the first public com짯pe짯ti짯ti짯ve demons짯tra짯ti짯on of a 2nd Gen AMD EPYC ser짯ver plat짯form. The demons짯tra짯ti짯on show짯ed a 2P 2nd Gen AMD EPYC based ser짯ver vs. a 2P Intel Xeon8280-based ser짯ver run짯ning a NAMD Apo1 v2.12 bench짯mark test. The pre짯pro짯duc짯tion 2nd Gen AMD EPYC pro짯ces짯sor powered ser짯ver out짯per짯for짯med the Intel Xeon powered ser짯vers by more than 2x on the NAMD bench짯mark.14

Final짯ly, Micro짯soft Azu짯re announ짯ced the achie짯ve짯ment of pre짯vious짯ly unob짯tainable levels of per짯for짯mance for com짯pu짯ta짯tio짯nal flu짯id dyna짯mics (CFD) using an Azu짯re HB cloud ins짯tance run짯ning on an 1st Gen AMD EPYC-pro짯ces짯sor based sys짯tem. Lever짯aging the excep짯tio짯nal memo짯ry band짯width of AMD EPYC, Azu짯re HB sca짯led Sie짯mens Star CCM+ appli짯ca짯ti짯on across over 11,500 cores using a Le Mans 100 Mil짯li짯on Cell simu짯la짯ti짯on, well bey짯ond the never befo짯re achie짯ved 10,000 cores goal. 쏦B-series VMs on Azu짯re are a game chan짯ger for HPC in the cloud. For the first time, HPC cus짯to짯mers can sca짯le their MPI workloads to tens of thou짯sands of cores with the agi짯li짯ty of the cloud and per짯for짯mance and eco짯no짯mics that rival on-pre짯mi짯se clus짯ter, said Nav짯neet Jone짯ja, head of pro짯duct for Azu짯re Vir짯tu짯al Machi짯nes, Micro짯soft Corp. 쏻e look for짯ward to this new Azu짯re offe짯ring doing gre짯at things for HPC-dri짯ven inno짯va짯ti짯on and productivity.

The 2nd Gen AMD EPYC ser짯ver pro짯ces짯sor fami짯ly is pro짯jec짯ted to deli짯ver up to 2X the per짯for짯mance-per socket15 and up to 4X the floa짯ting per짯for짯mance-per-socket16 over the pre짯vious generation.

The 2nd Gen AMD EPYC ser짯ver pro짯ces짯sor fami짯ly is expec짯ted to launch in Q3 2019.

Supporting Resources

About AMD

For 50 years AMD has dri짯ven inno짯va짯ti짯on in high-per짯for짯mance com짯pu짯ting, gra짯phics and visua짯liza짯ti짯on tech짯no짯lo짯gies the buil짯ding blocks for gam짯ing, immersi짯ve plat짯forms and the dat짯a짯cen짯ter. Hundreds of mil짯li짯ons of con짯su짯mers, lea짯ding For짯tu짯ne 500 busi짯nesses and cut짯ting-edge sci짯en짯ti짯fic rese짯arch faci짯li짯ties around the world rely on AMD tech짯no짯lo짯gy dai짯ly to impro짯ve how they live, work and play. AMD employees around the world are focu짯sed on buil짯ding gre짯at pro짯ducts that push the boun짯da짯ries of what is pos짯si짯ble. For more infor짯ma짯ti짯on about how AMD is enab짯ling today and inspi짯ring tomor짯row, visit the AMD (NASDAQ:AMDweb짯siteblogFace짯book and Twit짯ter pages. 

Cautionary Statement

This press release con짯ta짯ins for짯ward-loo짯king state짯ments con짯cer짯ning Advan짯ced Micro Devices, Inc. (AMD) inclu짯ding the fea짯tures, func짯tion짯a짯li짯ty, avai짯la짯bi짯li짯ty, timing, deploy짯ment and expec짯ta짯ti짯ons of AMD셲 future pro짯ducts, inclu짯ding 3rd Gen AMD Ryzen desk짯top pro짯ces짯sors, 7nm AMD Rade짯on RX 5700-series gra짯phics cards and the 2nd Gen AMD EPYC ser짯ver pro짯ces짯sor fami짯ly, which are made pur짯su짯ant to the Safe Har짯bor pro짯vi짯si짯ons of the Pri짯va짯te Secu짯ri짯ties Liti짯ga짯ti짯on Reform Act of 1995. For짯ward-loo짯king state짯ments are com짯mon짯ly iden짯ti짯fied by words such as 쐗ould, 쐇ntends, 쐀elie짯ves, 쐃xpects, 쐌ay, 쐗ill, 쐓hould, 쐓eeks, 쐇ntends, 쐏lans, 쐏ro for짯ma, 쐃sti짯ma짯tes, 쏿nti짯ci짯pa짯tes, or the nega짯ti짯ve of the짯se words and phra짯ses, other varia짯ti짯ons of the짯se words and phra짯ses or com짯pa짯ra짯ble ter짯mi짯no짯lo짯gy. Inves짯tors are cau짯tio짯ned that the for짯ward-loo짯king state짯ments in this docu짯ment are based on cur짯rent beliefs, assump짯ti짯ons and expec짯ta짯ti짯ons, speak only as of the date of this docu짯ment and invol짯ve risks and uncer짯tain짯ties that could cau짯se actu짯al results to dif짯fer mate짯ri짯al짯ly from cur짯rent expec짯ta짯ti짯ons. Such state짯ments are sub짯ject to cer짯tain known and unknown risks and uncer짯tain짯ties, many of which are dif짯fi짯cult to pre짯dict and gene짯ral짯ly bey짯ond AMD셲 con짯trol, that could cau짯se actu짯al results and other future events to dif짯fer mate짯ri짯al짯ly from tho짯se expres짯sed in, or impli짯ed or pro짯jec짯ted by, the for짯ward-loo짯king infor짯ma짯ti짯on and state짯ments. Mate짯ri짯al fac짯tors that could cau짯se actu짯al results to dif짯fer mate짯ri짯al짯ly from cur짯rent expec짯ta짯ti짯ons include, wit짯hout limi짯ta짯ti짯on, the fol짯lo짯wing: Intel Corporation셲 domi짯nan짯ce of the micro짯pro짯ces짯sor mar짯ket and its aggres짯si짯ve busi짯ness prac짯ti짯ces may limit AMD셲 abili짯ty to com짯pe짯te effec짯tively; AMD has a wafer sup짯p짯ly agree짯ment with GLOBALFOUNDRIES Inc. (GF) with obli짯ga짯ti짯ons to purcha짯se all of its micro짯pro짯ces짯sor and APU pro짯duct requi짯re짯ments, and a cer짯tain por짯ti짯on of its GPU pro짯duct requi짯re짯ments, manu짯fac짯tu짯red at pro짯cess nodes lar짯ger than 7 nano짯me짯ter from GF with limi짯t짯ed excep짯ti짯ons. If GF is not able to satis짯fy AMD셲 manu짯fac짯tu짯ring requi짯re짯ments, AMD셲 busi짯ness could be adver짯se짯ly impac짯ted; AMD reli짯es on third par짯ties to manu짯fac짯tu짯re its pro짯ducts, and if they are unable to do so on a time짯ly basis in suf짯fi짯ci짯ent quan짯ti짯ties and using com짯pe짯ti짯ti짯ve tech짯no짯lo짯gies, AMD셲 busi짯ness could be mate짯ri짯al짯ly adver짯se짯ly affec짯ted; fail짯ure to achie짯ve expec짯ted manu짯fac짯tu짯ring yields for AMD셲 pro짯ducts could nega짯tively impact its finan짯cial results; the suc짯cess of AMD셲 busi짯ness is depen짯dent upon its abili짯ty to intro짯du짯ce pro짯ducts on a time짯ly basis with fea짯tures and per짯for짯mance levels that pro짯vi짯de value to its cus짯to짯mers while sup짯port짯ing and coin짯ci짯ding with signi짯fi짯cant indus짯try tran짯si짯ti짯ons; if AMD can짯not gene짯ra짯te suf짯fi짯ci짯ent reve짯nue and ope짯ra짯ting cash flow or obtain exter짯nal finan짯cing, it may face a cash short짯fall and be unable to make all of its plan짯ned invest짯ments in rese짯arch and deve짯lo짯p짯ment or other stra짯te짯gic invest짯ments; the loss of a signi짯fi짯cant cus짯to짯mer may have a mate짯ri짯al adver짯se effect on AMD; AMD셲 receipt of reve짯nue from its semi-cus짯tom SoC pro짯ducts is depen짯dent upon its tech짯no짯lo짯gy being desi짯gned into third-par짯ty pro짯ducts and the suc짯cess of tho짯se pro짯ducts; glo짯bal eco짯no짯mic and mar짯ket uncer짯tain짯ty may adver짯se짯ly impact AMD셲 busi짯ness and ope짯ra짯ting results; AMD셲 pro짯ducts may be sub짯ject to secu짯ri짯ty vul짯nerabi짯li짯ties that could have a mate짯ri짯al adver짯se effect on AMD; IT outa짯ges, data loss, data brea짯ches and cyber-attacks could com짯pro짯mi짯se AMD셲 intellec짯tu짯al pro짯per짯ty or other sen짯si짯ti짯ve infor짯ma짯ti짯on, be cos짯t짯ly to reme짯dia짯te and cau짯se signi짯fi짯cant dama짯ge to its busi짯ness, repu짯ta짯ti짯on and ope짯ra짯ti짯ons; AMD셲 ope짯ra짯ting results are sub짯ject to quar짯ter짯ly and sea짯so짯nal sales pat짯terns; AMD may not be able to gene짯ra짯te suf짯fi짯ci짯ent cash to ser짯vice its debt obli짯ga짯ti짯ons or meet its working capi짯tal requi짯re짯ments; AMD has a lar짯ge amount of indeb짯ted짯ness which could adver짯se짯ly affect its finan짯cial posi짯ti짯on and pre짯vent it from imple짯men짯ting its stra짯tegy or ful짯fil짯ling its con짯trac짯tu짯al obli짯ga짯ti짯ons; the agree짯ments gover짯ning AMD셲 notes and the Secu짯red Revol짯ving Line of Cre짯dit impo짯se rest짯ric짯tions on AMD that may adver짯se짯ly affect AMD셲 abili짯ty to ope짯ra짯te its busi짯ness; the mar짯kets in which AMD셲 pro짯ducts are sold are high짯ly com짯pe짯ti짯ti짯ve; AMD셲 world짯wi짯de ope짯ra짯ti짯ons are sub짯ject to poli짯ti짯cal, legal and eco짯no짯mic risks and natu짯ral dis짯as짯ters, which could have a mate짯ri짯al adver짯se effect on it; the con짯ver짯si짯on of the 2.125% Con짯ver짯ti짯ble Seni짯or Notes due 2026 may dilute the owner짯ship inte짯rest of AMD셲 exis짯ting stock짯hol짯ders, or may other짯wi짯se depress the pri짯ce of its com짯mon stock; uncer짯tain짯ties invol짯ving the orde짯ring and ship짯ment of AMD셲 pro짯ducts could mate짯ri짯al짯ly adver짯se짯ly affect it; the demand for AMD셲 pro짯ducts depends in part on the mar짯ket con짯di짯ti짯ons in the indus짯tries into which they are sold. Fluc짯tua짯tions in demand for AMD셲 pro짯ducts or a mar짯ket decli짯ne in any of the짯se indus짯tries could have a mate짯ri짯al adver짯se effect on its results of ope짯ra짯ti짯ons; AMD셲 abili짯ty to design and intro짯du짯ce new pro짯ducts in a time짯ly man짯ner is depen짯dent upon third-par짯ty intellec짯tu짯al pro짯per짯ty; AMD depends on third-par짯ty com짯pa짯nies for the design, manu짯fac짯tu짯re and sup짯p짯ly of mother짯boards, soft짯ware and other com짯pu짯ter plat짯form com짯pon짯ents to sup짯port its busi짯ness; if AMD loses Micro짯soft Corporation셲 sup짯port for its pro짯ducts or other soft짯ware ven짯dors do not design and deve짯lop soft짯ware to run on AMD셲 pro짯ducts, its abili짯ty to sell its pro짯ducts could be mate짯ri짯al짯ly adver짯se짯ly affec짯ted; and AMD셲 reli짯ance on third-par짯ty dis짯tri짯bu짯tors and add-in-board part짯ners sub짯jects it to cer짯tain risks.  Inves짯tors are urged to review in detail the risks and uncer짯tain짯ties in AMD셲 Secu짯ri짯ties and Exch짯an짯ge Com짯mis짯si짯on filings, inclu짯ding but not limi짯t짯ed to AMD셲 Quar짯ter짯ly Report on Form 10멡 for the quar짯ter ended March 30, 2019.


AMD, the AMD Arrow logo, EPYC, Ryzen, Rade짯on and com짯bi짯na짯ti짯ons the짯reof, are trade짯marks of Advan짯ced Micro Devices, Inc. Other names are for infor짯ma짯tio짯nal pur짯po짯ses only and may be trade짯marks of their respec짯ti짯ve owners.

  1. Test짯ing by AMD Per짯for짯mance Labs as of 05/26/2019 uti짯li짯zing the Ryzen 9 3900X vs. Core i9-9920X in Cine짯bench R20 nT. Results may vary. RZ3-13
  2. Test짯ing by AMD Per짯for짯mance Labs as of 5/23.2918 AMD 쏾en2 CPU-based sys짯tem scored an esti짯ma짯ted 15% hig짯her than pre짯vious gene짯ra짯ti짯on AMD 쏾en based sys짯tem using esti짯ma짯ted SPECint짰_rate_base2006 results. SPEC and SPE짯C짯int are regis짯tered trade짯marks of the Stan짯dard Per짯for짯mance Eva짯lua짯ti짯on Cor짯po짯ra짯ti짯on. See GD-141
  3. Advan짯ced defi짯ned as supe짯ri짯or pro짯cess tech짯no짯lo짯gy in a smal짯ler node and uni짯que sup짯port for PCIe짰 Gen 4 in the gam짯ing mar짯ket as of 05/26/2019. RZ3-14
  4. Test짯ing by AMD Per짯for짯mance Labs as of 05/26/2019 uti짯li짯zing the Ryzen 7 3700X vs. Core i7-9700K in Cine짯bench R20 1T and nT. Results may vary. RZ3-15
  5. Test짯ing by AMD Per짯for짯mance Labs as of 05/26/2019 uti짯li짯zing the Ryzen 7 3800X and Core i9-9900K in PUBG. Results may vary. RZ3-16
  6. Test짯ing by AMD Per짯for짯mance Labs as of 05/26/2019 uti짯li짯zing the Ryzen 9 3900X vs. Core i9-9920X in Cine짯bench R20 nT. Results may vary. RZ3-17
  7. Though both are often mea짯su짯red in watts, it is important to distin짯gu짯ish bet짯ween ther짯mal and elec짯tri짯cal watts. Ther짯mal wat짯ta짯ge for pro짯ces짯sors is con짯vey짯ed via ther짯mal design power (TDP). TDP is a cal짯cu짯la짯ted value that con짯veys an appro짯pria짯te ther짯mal solu짯ti짯on to achie짯ve the inten짯ded ope짯ra짯ti짯on of a pro짯ces짯sor. Elec짯tri짯cal watts are not a varia짯ble in the TDP cal짯cu짯la짯ti짯on. By design, elec짯tri짯cal watts can vary from workload to workload and may exceed ther짯mal watts. GD-109
  8. Sug짯gest online retail짯er pri짯ce in US dol짯lars as of 5/23/2019.
  9. Test짯ing as of 05/20/2019 by AMD Per짯for짯mance Labs using a 3rd Gen AMD Ryzen꽓 Pro짯ces짯sor in Crys짯tal Disk짯Mark 6.0.2. Results may vary with con짯fi짯gu짯ra짯ti짯on. RZ3-12 
  10. AMD APUs and GPUs based on the Gra짯phics Core Next and RDNA archi짯tec짯tures con짯tain GPU Cores com짯pri짯sed of com짯pu짯te units, which are defi짯ned as 64 shaders (or stream pro짯ces짯sors) working tog짯e짯ther. GD-142
  11. Test짯ing done by AMD per짯for짯mance labs 5/23/19, show짯ing a geo짯me짯an of 1.25x per/clock across 30 dif짯fe짯rent games @ 4K Ultra, 4xAA set짯tings. Per짯for짯mance may vary based on use of latest dri짯vers. RX-327
  12. Test짯ing done by AMD per짯for짯mance labs 5/23/19, using the Divi짯si짯on 2 @ 25x14 Ultra set짯tings.  Per짯for짯mance may vary based on use of latest dri짯vers. RX-325
  13. Test짯ing done by AMD per짯for짯mance labs 5/23/19, using the Stran짯ge Bri짯ga짯de @ 25x14 Ultra set짯tings. Per짯for짯mance may vary based on use of latest dri짯vers. RX-328
  14. Pre짯pro짯duc짯tion 7nm 2nd Gene짯ra짯ti짯on EPYC꽓 powered ser짯ver CPU in a 2P ser짯ver con짯fi짯gu짯ra짯ti짯on out짯per짯for짯med 2P Intel Xeon 8280 powered ser짯ver by an avera짯ge of up to 2X on the NAMD bench짯mark. AMD inter짯nal test짯ing as of May 21, 2019. Pro짯duc짯tion sili짯con results may vary. ROM-05
  15. Test짯ing per짯for짯med by AMD Engi짯nee짯ring as of Octo짯ber 2018 using AMD refe짯rence sys짯tem with a pre짯pro짯duc짯tion 쏳ome engi짯nee짯ring sam짯ple, whe짯re 쏳ome scored appro짯xi짯m짯ate짯ly 2x hig짯her com짯pared to 쏯ap짯les Sys짯tem. Actu짯al results with pro짯duc짯tion sili짯con may vary. ROM-03
  16. Esti짯ma짯ted gene짯ra짯tio짯nal increase based upon AMD inter짯nal design spe짯ci짯fi짯ca짯ti짯ons for 쏾en 2 com짯pared to 쏾en 1.  쏾en 2 has 2X the core den짯si짯ty of 쏾en 1, and when mul짯ti짯pli짯ed by 2X peak FLOPs per core, at the same fre짯quen짯cy, results in 4X the FLOPs in through짯put. Actu짯al results with pro짯duc짯tion sili짯con may vary. ROM-04