Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor

USA on August 9, 2019
 

Sam­sung Elec­tro­nics has taken its lea­dership posi­ti­on in the memo­ry mar­ket a step fur­ther today by announ­cing sup­port of the Sam­sung PM1733 PCIe Gen4 Solid Sta­te Dri­ve (SSD) and high den­si­ty RDIMM1 and LRDIMM2 dyna­mic ran­dom access memo­ry (DRAM) for the AMD EPYC™ 7002 Genera­ti­on Pro­ces­sors. AMD laun­ched the 2nd Gen AMD EPYC™ pro­ces­sor in San Fran­cis­co yes­ter­day.

AMD has lis­tened to the needs of its custo­mers in deve­lo­ping the 2nd Gen AMD EPYC pro­ces­sors and has worked clo­se­ly with us to inte­gra­te the best of our cut­ting-edge memo­ry and sto­rage pro­duc­ts,” said Jin­man Han, seni­or VP of Memo­ry Pro­duct Plan­ning, Sam­sung Elec­tro­nics. “With the­se new dat­a­cen­ter pro­ces­sors, AMD is pro­vi­ding custo­mers with a pro­ces­sor that enab­les a new stan­dard for the modern dat­a­cen­ter.”

We’re exci­ted and thank­ful to have part­ners like Sam­sung sup­por­ting the launch of our 2nd Gen AMD EPYC pro­ces­sors,” said Scott Aylor, cor­po­ra­te vice pre­si­dent and gene­ral mana­ger, Dat­a­cen­ter Solu­ti­ons Group, AMD. “With twice the cores, bre­akth­rough per­for­mance and embed­ded secu­ri­ty fea­tures, all opti­mi­zed by lea­dership archi­tec­tu­re, custo­mers can now trans­form their dat­a­cen­ter ope­ra­ti­ons at the pace of their busi­ness growth.”

The AMD EPYC™ 7002 Genera­ti­on Pro­ces­sors are expec­ted to deli­ver up to 2X the per­for­mance per socket3 and up to 4X peak FLOPS per socket4 over the pre­vious genera­ti­on.  The new pro­ces­sors deli­ver a con­sis­tent, com­pre­hen­si­ve set of I/O, memo­ry and secu­ri­ty fea­tures across 8–64 ‘Zen 2’ cores.

Samsung’s PCIe Gen 4‑enabled PM1733 SSD will have dou­ble the through­put capa­bi­li­ties of cur­rent Gen 3 SSDs, giving it the hig­hest per­for­mance of any SSD on the mar­ket today. It reads sequen­ti­al­ly at 8.0GB/s and ran­dom­ly at 1500K IOPS, while offe­ring capa­ci­ties up to 30.72TB for U.2 (Gen 4 x4) con­fi­gu­ra­ti­ons and 15.36TB for the HHHL (Gen 4 x8) form fac­tor. The dri­ve is pro­du­ced with Gen5 512Gb TLC V‑NAND.

The PM1733 dri­ve will be avail­ab­le indus­try-wide this quar­ter in both U.2 and HHHL vari­ants, and will be back­ward com­pa­ti­ble with PCIe Gen 3 archi­tec­tures, pro­vi­ding excep­tio­nal fle­xi­bi­li­ty for exis­ting and future ser­ver app­li­ca­ti­ons.  The dri­ve also fea­tures Dual Port capa­bi­li­ties to sup­port sto­rage as well as ser­ver app­li­ca­ti­ons.

In addi­ti­on to Samsung’s PM1733 SSD, Sam­sung has pro­vi­ded its full lin­eup of RDIMM and LRDIMM DRAM pro­duc­ts for AMD EPYC 7002 Series Pro­ces­sors. Using com­po­nent archi­tec­tures of 8Gb and 16Gb DDR4, Sam­sung is able to offer DIMM capa­ci­ties ran­ging from 8GB to 256GB. With Sam­sung high den­si­ty DIMMs, users can tap into as much as 4TB of memo­ry per CPU.

 

1 Regis­te­red dual in-line memo­ry modu­le

2 Load-redu­ced dual in-line memo­ry modu­le

3 Pro­jec­tions as of July 3, 2019 for AMD EPYC pro­ces­sors using com­pu­ter mode­ling of pre­pro­duc­tion parts and SPE­Cra­te®2017_int_base inter­nal tes­ting results. Results may vary with pro­duc­tion sili­con tes­ting. EPYC 7601 results as of June 2019 http://spec.org/cpu2017/results/res2019q2/cpu2017-20190411–11817.pdf. SPEC®, SPE­Cra­te® and SPEC CPU® are regis­te­red trade­marks of the Stan­dard Per­for­mance Eva­lua­ti­on Cor­po­ra­ti­on. See www.spec.org for more infor­ma­ti­on.

4 A “Zen2” based pro­ces­sor has a theo­re­ti­cal peak of ~4X Floa­ting Point Per Socket (FLOPS) more than a “Zen1” based pro­ces­sor