Samsung Announces Availability of its Silicon-Proven 3D IC Technology for High-Performance Applications

Samsung ‘X‑Cube’ enables industry-first 3D SRAM-logic working silicon at 7nm and beyond.
Bandwidth and density can be scaled to suit diverse design requirements in emerging applications.

Korea on August 13, 2020 — Sam­sung Elec­tro­nics, a world lea­der in advan­ced semi­con­duc­tor tech­no­lo­gy, today announ­ced the immedia­te avai­la­bi­li­ty of its sili­con-pro­ven 3D IC pack­a­ging tech­no­lo­gy, eXten­ded-Cube (X‑Cube), for today’s most advan­ced pro­cess nodes. Lever­aging Samsung’s through-sili­con via (TSV) tech­no­lo­gy, X‑Cube enab­les signi­fi­cant leaps in speed and power effi­ci­en­cy to help address the rigo­rous per­for­mance deman­ds of next-genera­ti­on app­li­ca­ti­ons inclu­ding 5G, arti­fi­cial intel­li­gence, high-pe

Samsung’s new 3D inte­gra­ti­on tech­no­lo­gy ensu­res reli­able TSV inter­con­nec­tions even at the cut­ting-edge EUV pro­cess nodes,” said Moon­soo Kang, seni­or vice pre­si­dent of Found­ry Mar­ket Stra­te­gy at Sam­sung Elec­tro­nics. “We are com­mit­ted to brin­ging more 3D IC inno­va­ti­on that can push the bounda­ries of semiconductors.”

*The image shown is for illus­tra­ti­on pur­po­se only.

With Samsung’s X‑Cube, chip desi­gners can enjoy grea­ter fle­xi­bi­li­ty to build cus­tom solu­ti­ons that best suit their uni­que requi­re­ments. The X‑Cube test chip built on 7nm uses TSV tech­no­lo­gy to stack SRAM on top of a logic die, fre­eing up space to pack more memo­ry into a smal­ler foot­print. Enab­led by 3D inte­gra­ti­on, the ultra-thin packa­ge design fea­tures signi­fi­cant­ly shor­ter signal paths bet­ween the dies for maxi­mi­zed data trans­fer speed and ener­gy effi­ci­en­cy. Cus­to­mers can also sca­le the memo­ry band­width and den­si­ty to their desi­red specifications.

Sam­sung X‑Cube’s sili­con-pro­ven design metho­do­lo­gy and flow are avail­ab­le now for advan­ced nodes inclu­ding 7nm and 5nm. Buil­ding on the initi­al design, Sam­sung plans to con­ti­nue col­la­bo­ra­ting with glo­bal fabless cus­to­mers to faci­li­ta­te the deploy­ment of 3D IC solu­ti­ons in next-genera­ti­on high-per­for­mance applications.

More details on Sam­sung X‑Cube will be pre­sen­ted at Hot Chips, an annu­al con­fe­rence on high-per­for­mance com­pu­ting, which will be live­strea­med Aug. 16–18.