Samsung Announces Availability of its Silicon-Proven 3D IC Technology for High-Performance Applications

Samsung 쁙멌ube enables industry-first 3D SRAM-logic working silicon at 7nm and beyond.
Bandwidth and density can be scaled to suit diverse design requirements in emerging applications.

Korea on August 13, 2020 Sam짯sung Elec짯tro짯nics, a world lea짯der in advan짯ced semi짯con짯duc짯tor tech짯no짯lo짯gy, today announ짯ced the imme짯dia짯te avai짯la짯bi짯li짯ty of its sili짯con-pro짯ven 3D IC pack짯a짯ging tech짯no짯lo짯gy, eXten짯ded-Cube (X멌ube), for today셲 most advan짯ced pro짯cess nodes. Lever짯aging Samsung셲 through-sili짯con via (TSV) tech짯no짯lo짯gy, X멌ube enables signi짯fi짯cant leaps in speed and power effi짯ci짯en짯cy to help address the rigo짯rous per짯for짯mance demands of next-gene짯ra짯ti짯on appli짯ca짯ti짯ons inclu짯ding 5G, arti짯fi짯ci짯al intel짯li짯gence, high-pe

Samsung셲 new 3D inte짯gra짯ti짯on tech짯no짯lo짯gy ensu짯res relia짯ble TSV inter짯con짯nec짯tions even at the cut짯ting-edge EUV pro짯cess nodes, said Moon짯soo Kang, seni짯or vice pre짯si짯dent of Foundry Mar짯ket Stra짯tegy at Sam짯sung Elec짯tro짯nics. 쏻e are com짯mit짯ted to brin짯ging more 3D IC inno짯va짯ti짯on that can push the boun짯da짯ries of semiconductors.

*The image shown is for illus짯tra짯ti짯on pur짯po짯se only.

With Samsung셲 X멌ube, chip desi짯gners can enjoy grea짯ter fle짯xi짯bi짯li짯ty to build cus짯tom solu짯ti짯ons that best suit their uni짯que requi짯re짯ments. The X멌ube test chip built on 7nm uses TSV tech짯no짯lo짯gy to stack SRAM on top of a logic die, free짯ing up space to pack more memo짯ry into a smal짯ler foot짯print. Enab짯led by 3D inte짯gra짯ti짯on, the ultra-thin packa짯ge design fea짯tures signi짯fi짯cant짯ly shorter signal paths bet짯ween the dies for maxi짯mi짯zed data trans짯fer speed and ener짯gy effi짯ci짯en짯cy. Cus짯to짯mers can also sca짯le the memo짯ry band짯width and den짯si짯ty to their desi짯red specifications.

Sam짯sung X멌ube셲 sili짯con-pro짯ven design metho짯do짯lo짯gy and flow are available now for advan짯ced nodes inclu짯ding 7nm and 5nm. Buil짯ding on the initi짯al design, Sam짯sung plans to con짯ti짯nue col짯la짯bo짯ra짯ting with glo짯bal fab짯less cus짯to짯mers to faci짯li짯ta짯te the deploy짯ment of 3D IC solu짯ti짯ons in next-gene짯ra짯ti짯on high-per짯for짯mance applications.

More details on Sam짯sung X멌ube will be pre짯sen짯ted at Hot Chips, an annu짯al con짯fe짯rence on high-per짯for짯mance com짯pu짯ting, which will be live짯strea짯med Aug. 1618.