Sam­sung ‘X‑Cube’ enables indus­try-first 3D SRAM-logic working sili­con at 7nm and bey­ond. Band­width and den­si­ty can be sca­led to suit diver­se design requi­re­ments in emer­ging appli­ca­ti­ons. Korea on August 13, 2020 — Sam­sung Elec­tro­nics, a world lea­der in advan­ced semi­con­duc­tor tech­no­lo­gy, today announ­ced the imme­dia­te avai­la­bi­li­ty of its sili­­con-pro­­ven 3D IC pack­a­ging tech­no­lo­gy, eXten­­ded-Cube (X‑Cube), (…) Wei­ter­le­sen »