Synopsys and TSMC Accelerate 2.5D/3DIC Designs with CoWoS‑S and Integrated Fan-Out Certified Design Flows

MOUNTAIN VIEW, Calif.Aug. 25, 2020 — Syn­op­sys, Inc. announ­ced that Syn­op­sys and TSMC have col­la­bo­ra­ted to deli­ver cer­ti­fied design flows for advan­ced pack­a­ging solu­ti­ons using the Syn­op­sys 3DIC Com­pi­ler pro­duct for both sili­con inter­po­ser based Chip-on-Wafer-on-Sub­stra­te (CoWoS‑S) and high-den­si­ty wafer-level RDL-based Inte­gra­ted Fan-Out (InFO‑R) designs. 3DIC Com­pi­ler pro­vi­des pack­a­ging design solu­ti­ons requi­red by today’s com­plex mul­ti-die sys­tems for app­li­ca­ti­ons like high-per­for­mance com­pu­ting (HPC), auto­mo­ti­ve and mobile.

App­li­ca­ti­ons such as AI and 5G net­wor­king incre­a­singly requi­re hig­her levels of inte­gra­ti­on, lower power con­sump­ti­on, smal­ler form fac­tors, and fas­ter time to pro­duc­tion, and this is dri­ving the demand for advan­ced-pack­a­ging tech­no­lo­gies,” said Suk Lee, seni­or direc­tor of the Design Infra­st­ruc­tu­re Manage­ment Divi­si­on at TSMC. “TSMC’s Inno­va­ti­ve 3DIC tech­no­lo­gies such as CoWoS and InFO enab­le cus­to­mer inno­va­ti­on with grea­ter func­tio­n­a­li­ty and enhan­ced sys­tem per­for­mance at incre­a­singly com­pe­ti­ti­ve cos­ts. Our col­la­bo­ra­ti­on with Syn­op­sys pro­vi­des cus­to­mers with a cer­ti­fied solu­ti­on for designing with TSMC’s CoWoS and InFO pack­a­ging tech­no­lo­gies to enab­le high pro­duc­ti­vi­ty and fas­ter time to func­tio­n­al silicon.”

The Syn­op­sys 3DIC Com­pi­ler solu­ti­on pro­vi­des a uni­fied chip-packa­ge co-design and ana­ly­sis envi­ron­ment for crea­ting an opti­mal 2.5D/3D mul­ti-die sys­tem in a packa­ge. The solu­ti­on inclu­des fea­tures such as TSMC design macro sup­port and auto-rou­ting of high-den­si­ty inter­po­ser based inter­con­nects using CoWoS tech­no­lo­gy. For RDL-based InFO designs, sche­du­les are redu­ced from mon­ths to a few weeks through auto­ma­ted DRC-awa­re, all-ang­le mul­ti­lay­er signal and power/ground rou­ting, power/ground pla­ne crea­ti­on, and dum­my metal inser­ti­on, along with the sup­port for TSMC design macros.

For CoWoS‑S and InFO‑R designs, dies need to be ana­ly­zed in the con­text of the packa­ge and the over­all sys­tem.  Die-awa­re packa­ge and packa­ge-awa­re die power inte­gri­ty, signal inte­gri­ty, and ther­mal ana­ly­sis are cri­ti­cal for design vali­da­ti­on and sign­off. Inte­gra­ti­on of Ansys’ Red­Hawk fami­ly of chip-packa­ge co-ana­ly­sis solu­ti­ons in 3DIC Com­pi­ler meets this cri­ti­cal need, enab­ling seam­less ana­ly­sis and fas­ter con­ver­gence to an opti­mal solu­ti­on. Cus­to­mers can achie­ve smal­ler designs and hig­her per­for­mance by eli­mi­na­ting overdesign.

Syn­op­sys and TSMC reco­gni­ze the design chal­len­ges being faced by our cus­to­mers loo­king to crea­te next-genera­ti­on pro­ducts using mul­ti-die solu­ti­ons, and our col­la­bo­ra­ti­on pro­vi­des our mutu­al cus­to­mers with an opti­mi­zed path to imple­men­ta­ti­on,” said Charles Matar, seni­or vice pre­si­dent of Sys­tem Solu­ti­ons and Eco­sys­tem Ena­b­le­ment for the Design Group at Syn­op­sys. “By pro­vi­ding natively imple­men­ted sili­con inter­po­ser and fan-out lay­outs, phy­si­cal veri­fi­ca­ti­on, co-simu­la­ti­on and ana­ly­sis capa­bi­li­ties in a sin­gle uni­fied plat­form, we enab­le our cus­to­mers to address today’s com­plex archi­tec­tures and pack­a­ging requi­re­ments, in addi­ti­on, to incre­a­sed pro­duc­ti­vi­ty and fas­ter tur­naround time.”

For more infor­ma­ti­on, plea­se visit Syn­op­sys’ 3DIC Compiler’s web­page at www.synopsys.com/3DIC.

About Syn­op­sys

Syn­op­sys, Inc. is the Sili­con to Soft­ware\ part­ner for inno­va­ti­ve com­pa­nies deve­lo­ping the elec­tro­nic pro­ducts and soft­ware app­li­ca­ti­ons we rely on every day. As the world’s 15th lar­gest soft­ware com­pa­ny, Syn­op­sys has a long histo­ry of being a glo­bal lea­der in elec­tro­nic design auto­ma­ti­on (EDA) and semi­con­duc­tor IP and is also gro­wing its lea­ders­hip in soft­ware secu­ri­ty and qua­li­ty solu­ti­ons. Whe­ther you’re a sys­tem-on-chip (SoC) desi­gner crea­ting advan­ced semi­con­duc­tors, or a soft­ware deve­lo­per wri­ting app­li­ca­ti­ons that requi­re the hig­hest secu­ri­ty and qua­li­ty, Syn­op­sys has the solu­ti­ons nee­ded to deli­ver inno­va­ti­ve, high-qua­li­ty, secu­re pro­ducts. Learn more at www.synopsys.com.

Durch die weitere Nutzung der Seite stimmst du der Verwendung von Cookies zu. Weitere Informationen

Die Cookie-Einstellungen auf dieser Website sind auf "Cookies zulassen" eingestellt, um das beste Surferlebnis zu ermöglichen. Wenn du diese Website ohne Änderung der Cookie-Einstellungen verwendest oder auf "Akzeptieren" klickst, erklärst du dich damit einverstanden.

Schließen