The Ver­sa­ti­li­ty and Breadth of Ultra, Twin, Super­Bla­de®, Sto­rage, GPU Opti­mi­zed Sys­tems Pro­vi­des Exact­ly the Best Workload Per­for­mance for Cloud Dat­a­Cen­ters, Enter­pri­se, and AI and Machi­ne Learning

San Jose, Calif., March 15, 2021 — Super Micro Com­pu­ter, Inc. (Nasdaq: SMCI), a glo­bal lea­der in enter­pri­se com­pu­ting, sto­rage, net­wor­king solu­ti­ons, and green com­pu­ting tech­no­lo­gy, announ­ces the avai­la­bi­li­ty of the most com­ple­te ser­ver lin­e­up sup­port­ing the AMD EPYC™ 7003 Series Pro­ces­sors in the indus­try today. Supermicro’s Super­Bla­de on the SPEC­jbb 2015-Dis­tri­bu­ted achie­ved back-to-back world record bench­marks on the cri­ti­cal-jOPS and max-jOPS tests. The Super­Bla­de deli­ver­ed up to a 36% impro­ve­ment from the 2nd Gen to 3rd Gen of AMD EPYC CPUs¹, which is a signi­fi­cant boost to satis­fy per­for­mance-hun­gry enter­pri­se workloads

The Super­mi­cro A+ line includes ser­vers that incor­po­ra­te sin­gle-socket and dual-socket sys­tem solu­ti­ons desi­gned to redu­ce the time to results and dri­ve bet­ter busi­ness decis­i­ons. For exam­p­le, the recent­ly announ­ced new 2U 2‑node mul­ti-GPU ser­ver is the per­fect plat­form for video strea­ming, high-end cloud gam­ing, and count­less social net­wor­king appli­ca­ti­ons. It has mar­ket-lea­ding sys­tem fle­xi­bi­li­ty, and cost savings will deli­ver unin­ter­rupt­ed per­for­mance. With inno­va­ti­ve ser­ver designs that redu­ce the power requi­red while lea­ding the indus­try in per­for­mance, Super­mi­cro paves the way with appli­ca­ti­on-opti­mi­zed ser­vers, enab­ling modern busi­nesses to redu­ce cos­ts and enhan­ce their user’s experience.

“Super­mi­cro has always led the indus­try in desig­ning and manu­fac­tu­ring the lar­gest appli­ca­ti­on-opti­mi­zed port­fo­lio of ser­vers that meet the demands of our cus­to­mers,” said Charles Liang, pre­si­dent and CEO, Super­mi­cro. “Our buil­ding block archi­tec­tu­re allows us to deli­ver a ver­sa­ti­le port­fo­lio of sys­tems that maxi­mi­ze the bene­fits of the 3rd Gen AMD EPYC Pro­ces­sors for spe­ci­fic workloads be it our 2U 2 Node GPU Sys­tem with PCIe 4.0 for cloud gam­ing our 2U CloudDC sin­gle pro­ces­sor high core count sys­tem for sto­rage appli­ca­ti­ons The­se sys­tems redu­ce TCO and the Total Cost to the Envi­ron­ment (TCE), which is an essen­ti­al metric as we all have the respon­si­bi­li­ty to mini­mi­ze a data cen­ters effect on the environment.”

The new 3rd Gen AMD EPYC 7003 Series Pro­ces­sors are desi­gned with the “Zen3” core that deli­vers up to 19% more ins­truc­tions per cycle² than the pre­vious gene­ra­ti­on and con­ta­ins up to 64 cores per socket for excep­tio­nal per­for­mance on popu­lar bench­marks and real-world workloads. The new sys­tems from Super­mi­cro include a ran­ge of com­pu­te and sto­rage sys­tems desi­gned for many of the most deman­ding appli­ca­ti­ons, for AI, HPC, Enter­pri­se, and Cloud deployments.

“We desi­gned the EPYC 7003 Series pro­ces­sors to give our cus­to­mers exact­ly what they said they nee­ded, per­for­mance across all workloads, and the abili­ty to dri­ve more time to value, right out of the box,” said Ram Ped­dib­hot­la, cor­po­ra­te vice pre­si­dent, EPYC pro­duct manage­ment, AMD. “With lea­der­ship archi­tec­tu­re, per­for­mance, and modern secu­ri­ty fea­tures, EPYC 7003 Series pro­ces­sors are a supe­ri­or choice and con­ti­nue to dri­ve the stan­dard for the modern data center.”

The new A+ pro­duct lin­e­up with AMD EPYC Series 7003 Pro­ces­sors helps lea­ding enter­pri­ses redu­ce time to solu­ti­on for a wide ran­ge of appli­ca­ti­ons, add enhan­ced secu­ri­ty fea­tures, and allow all workloads to be run in the cloud, on-prem, or a pri­va­te cloud. Super­mi­cro has cer­ti­fied many solu­ti­ons and refe­rence archi­tec­tures that enable orga­niza­ti­ons to gain insight from their data fas­ter than ever befo­re with easy deploy­ments. The­se solu­ti­ons include: AI/ML/DL trai­ning infe­rence workload-opti­mi­zed, cer­ti­fied ser­vers, HCI/SDI, or soft­ware-defi­ned sto­rage such as VMWare vSAN, Red­Hat CEPH, and Weka.IO. Data Manage­ment such as Ora­cle 19c, Apa­che Hadoop, and Cas­san­dra and HPC appli­ca­ti­on opti­miza­ti­on such Ansys Flu­ent, Open­FOAM, and WRF all show increased performance.

A+ Port­fo­lio, Super­mi­cro Key­note and Vir­tu­al Booth – March 16th

Super­mi­cro will be hos­ting a vir­tu­al booth with a key­note address from a Seni­or Vice pre­si­dent and con­duc­ting pro­duct demons­tra­ti­ons on the latest AMD pro­ducts and tech­no­lo­gies for modern data cen­ter appli­ca­ti­ons and workloads. The vir­tu­al expe­ri­ence brings tog­e­ther Supermicro’s pro­duct experts and tech­no­lo­gy lea­ders, dis­cus­sing per­for­mance and effi­ci­en­cy leaps for cloud, AI, and sto­rage workloads, trends in the modern data cen­ter, and reve­al­ing our latest pro­ducts in an inter­ac­ti­ve environment.

About Super Micro Com­pu­ter, Inc.

Super­mi­cro (SMCI), the lea­ding inno­va­tor in high-per­for­mance, high-effi­ci­en­cy ser­ver tech­no­lo­gy is a pre­mier pro­vi­der of advan­ced ser­ver Buil­ding Block Solu­ti­ons® for Enter­pri­se Data Cen­ter, Cloud Com­pu­ting, Arti­fi­ci­al Intel­li­gence, and Edge Com­pu­ting Sys­tems world­wi­de. Super­mi­cro is com­mit­ted to pro­tec­ting the envi­ron­ment through its “We Keep IT Green®” initia­ti­ve and pro­vi­des cus­to­mers with the most ener­gy-effi­ci­ent, envi­ron­men­tal­ly-fri­end­ly solu­ti­ons available on the market.

Super­mi­cro, Ser­ver Buil­ding Block Solu­ti­ons, and We Keep IT Green are trade­marks and/or regis­tered trade­marks of Super Micro Com­pu­ter, Inc.

AMD, the AMD Arrow logo, EPYC, and com­bi­na­ti­ons the­reof are trade­marks of Advan­ced Micro Devices, Inc.

All other brands, names and trade­marks are the pro­per­ty of their respec­ti­ve owners.

Media Cont­act:
Greg Kaufman
Super Micro Com­pu­ter, Inc.
PR@supermicro.com

¹MLNWR-115 SPECjbb®2015-Distributed cri­ti­cal-jOPS com­pa­ri­son based on hig­hest sys­tem results published as of 03/12/2021. Con­fi­gu­ra­ti­ons: 20-node, 1x AMD EPYC 7763 (2561044 SPEC­jb­b2015-Dis­tri­bu­ted cri­ti­cal-jOPS, 2919887 SPEC­jb­b2015-Dis­tri­bu­ted max-jOPS, https://spec.org/jbb2015/results/res2021q1/jbb2015-20210225–00615.html) ver­sus 2‑node, 1x AMD EPYC 7702P (1877397 SPEC­jb­b2015-Dis­tri­bu­ted cri­ti­cal-jOPS, 2656878 SPEC­jbb-Dis­tri­bu­ted max jOPS, https://spec.org/jbb2015/results/res2020q2/jbb2015-20200402–00533.html) for ~1.36x the performance.

²MLN-003: Based on AMD inter­nal test­ing as of 02/1/2021, avera­ge per­for­mance impro­ve­ment at ISO-fre­quen­cy on an AMD EPYC™ 72F3 (8C/8T, 3.7GHz) com­pared to an AMD EPYC™ 7F32 (8C/8T, 3.7GHz), per-core, sin­gle thread, using a sel­ect set of workloads inclu­ding SPECrate®2017_int_base,SPECrate®2017_fp_base, and repre­sen­ta­ti­ve ser­ver workloads. SPEC® and SPE­Cra­te® are regis­tered trade­marks of Stan­dard Per­for­mance Eva­lua­ti­on Cor­po­ra­ti­on. Learn more at spec.org.