TYAN Drives Innovation in the Data Center with 3rd Gen AMD EPYC‚ĄĘ Processors with AMD 3D V‚ÄĎCache‚ĄĘ Technology

TYAN HPC, Cloud, and Sto­rage Ser­ver Plat­forms to Deli­ver Breakth­rough Per­for­mance and Modern Secu­ri­ty Fea­tures for Tech­ni­cal Com­pu­ting Workloads

Newark, Calif. ‚Äď March 21, 2022 ‚Äď TYAN¬ģ, an indus¬≠try-lea¬≠ding ser¬≠ver plat¬≠form design manu¬≠fac¬≠tu¬≠rer and a MiT¬≠AC Com¬≠pu¬≠ting Tech¬≠no¬≠lo¬≠gy Cor¬≠po¬≠ra¬≠ti¬≠on sub¬≠si¬≠dia¬≠ry, today announ¬≠ced avai¬≠la¬≠bi¬≠li¬≠ty of high-per¬≠for¬≠mance ser¬≠ver plat¬≠forms sup¬≠port¬≠ing new 3rd Gen AMD EPYC‚ĄĘ Pro¬≠ces¬≠sors with AMD 3D V‚ÄĎCache‚ĄĘ tech¬≠no¬≠lo¬≠gy for the modern data center.

‚ÄúThe modern data cen¬≠ter requi¬≠res a powerful foun¬≠da¬≠ti¬≠on to balan¬≠ce com¬≠pu¬≠te, sto¬≠rage, memo¬≠ry and IO that can effi¬≠ci¬≠ent¬≠ly mana¬≠ge gro¬≠wing volu¬≠mes in the digi¬≠tal trans¬≠for¬≠ma¬≠ti¬≠on trend,‚ÄĚ said Dan¬≠ny Hsu, Vice Pre¬≠si¬≠dent of MiT¬≠AC Com¬≠pu¬≠ting Tech¬≠no¬≠lo¬≠gy Corporation‚Äôs Ser¬≠ver Infra¬≠struc¬≠tu¬≠re Busi¬≠ness Unit. ‚ÄúTYAN‚Äôs indus¬≠try-lea¬≠ding ser¬≠ver plat¬≠forms powered by 3rd Gen AMD EPYC pro¬≠ces¬≠sors with AMD 3D V‚ÄĎCache tech¬≠no¬≠lo¬≠gy give our cus¬≠to¬≠mers bet¬≠ter ener¬≠gy effi¬≠ci¬≠en¬≠cy and increased per¬≠for¬≠mance for a cur¬≠rent and future of high¬≠ly com¬≠plex workloads.‚ÄĚ

‚Äú3rd Gen AMD EPYC pro¬≠ces¬≠sors with AMD 3D V‚ÄĎCache tech¬≠no¬≠lo¬≠gy con¬≠ti¬≠nue to dri¬≠ve a new stan¬≠dard for the modern data cen¬≠ter with breakth¬≠rough per¬≠for¬≠mance for tech¬≠ni¬≠cal com¬≠pu¬≠ting workloads due to 768 MB of L3 cache, enab¬≠ling fas¬≠ter time-to-results on tar¬≠ge¬≠ted workloads. Ful¬≠ly socket com¬≠pa¬≠ti¬≠ble with our 3rd Gen AMD EPYC plat¬≠forms, cus¬≠to¬≠mers can adopt the¬≠se pro¬≠ces¬≠sors to trans¬≠form their data cen¬≠ter ope¬≠ra¬≠ti¬≠ons to achie¬≠ve fas¬≠ter pro¬≠duct deve¬≠lo¬≠p¬≠ment along with excep¬≠tio¬≠nal ener¬≠gy savings,‚ÄĚ said Ram Ped¬≠dib¬≠hot¬≠la, cor¬≠po¬≠ra¬≠te vice pre¬≠si¬≠dent, EPYC pro¬≠duct manage¬≠ment, AMD.

Optimized for technical computing workloads to boost performance

Lever¬≠aging breakth¬≠rough per¬≠for¬≠mance of 3rd Gen AMD EPYC pro¬≠ces¬≠sors with AMD 3D V‚ÄĎCache tech¬≠no¬≠lo¬≠gy, the TYAN Trans¬≠port HX pro¬≠duct line is built to opti¬≠mi¬≠ze workloads like EDA, CFD, and FEA soft¬≠ware and solu¬≠ti¬≠ons. The Trans¬≠port HX FT65T-B8030 is a 4U pedes¬≠tal ser¬≠ver plat¬≠form fea¬≠turing a sin¬≠gle pro¬≠ces¬≠sor, eight DDR4-3200 DIMM slots, eight 3.5‚ÄĎinch SATA, and two NVMe U.2 hot-swap, tool-less dri¬≠ve bays. The FT65T-B8030 sup¬≠ports four dou¬≠ble-wide PCIe 4.0 x16 slots for pro¬≠fes¬≠sio¬≠nal GPUs to acce¬≠le¬≠ra¬≠te HPC applications.

The Trans¬≠port HX TN83-B8251 is a 2U dual-socket ser¬≠ver plat¬≠form with eight 3.5‚ÄĎinch hot-swap SATA or NVMe U.2 tool-less dri¬≠ve bays. The plat¬≠form sup¬≠ports up to four dou¬≠ble-wide GPU cards and two addi¬≠tio¬≠nal low-pro¬≠fi¬≠le PCIe 4.0 x16 slots that pro¬≠vi¬≠des opti¬≠mi¬≠zed topo¬≠lo¬≠gy to impro¬≠ve HPC and deep lear¬≠ning performance.

Opti¬≠mi¬≠zed for HPC and vir¬≠tua¬≠liza¬≠ti¬≠on appli¬≠ca¬≠ti¬≠ons, the Trans¬≠port HX TS75-B8252 and Trans¬≠port HX TS75A-B8252 are 2U dual-socket ser¬≠ver plat¬≠forms with sup¬≠port for 32 DIMM slots and two dou¬≠ble-wide, acti¬≠ve-coo¬≠led GPU cards. The TS75-B8252 accom¬≠mo¬≠da¬≠tes twel¬≠ve hot-swap, tool-less 3.5‚ÄĎinch dri¬≠ve bays with up to four NVMe U.2 sup¬≠port; TS75A-B8252 accom¬≠mo¬≠da¬≠tes 26 hot-swap, tool-less 2.5‚ÄĎinch dri¬≠ve bays with up to eight NVMe U.2 devices.

High memory footprints, multi-node servers to power big data computing

TYAN‚Äôs Trans¬≠port CX lin¬≠e¬≠up is desi¬≠gned for cloud and data ana¬≠ly¬≠tics that requi¬≠re lar¬≠ge memo¬≠ry capa¬≠ci¬≠ty and fast data pro¬≠ces¬≠sing. The Trans¬≠port CX GC79-B8252 and Trans¬≠port CX GC79A-B8252 are 1U dual-socket ser¬≠ver plat¬≠forms that are ide¬≠al for high-den¬≠si¬≠ty data cen¬≠ter deploy¬≠ment with a varie¬≠ty of memo¬≠ry-based com¬≠pu¬≠ting appli¬≠ca¬≠ti¬≠ons. The¬≠se sys¬≠tems fea¬≠ture 32 DDR4 DIMM slots, two stan¬≠dard PCIe Gen.4 x16 expan¬≠si¬≠on slots, and one OCP 3.0 LAN mez¬≠za¬≠ni¬≠ne slot. The GC79-B8252 plat¬≠form offers four 3.5‚ÄĎinch SATA dri¬≠ve bays and four 2.5‚ÄĎinch NVMe dri¬≠ve bays with tool-less car¬≠ri¬≠ers, while the GC79A-B8252 plat¬≠form offers twel¬≠ve 2.5‚ÄĎinch dri¬≠ve bays with all NVMe U.2 support.

The Trans¬≠port CX TN73-B8037-X4S is a 2U mul¬≠ti-node ser¬≠ver plat¬≠form with four front-ser¬≠viced com¬≠pu¬≠te nodes. Each node sup¬≠ports one AMD EPYC 7003 Series pro¬≠ces¬≠sor with AMD 3D V‚ÄĎCache tech¬≠no¬≠lo¬≠gy, four 2.5‚ÄĎinch tool-less NVMe/SATA dri¬≠ve bays, eight DDR4 DIMM slots, three inter¬≠nal coo¬≠ling fans, two stan¬≠dard PCIe Gen.4 x16 expan¬≠si¬≠on slots, two inter¬≠nal NVMe M.2 and one OCP 2.0 LAN mez¬≠za¬≠ni¬≠ne slot. The plat¬≠form is sui¬≠ted for high-den¬≠si¬≠ty data cen¬≠ter deploy¬≠ments and tar¬≠gets sca¬≠le-out appli¬≠ca¬≠ti¬≠ons with lar¬≠ge num¬≠bers of nodes.

Hybrid storage servers to drive outstanding performance

TYAN Trans¬≠port SX lin¬≠e¬≠up is desi¬≠gned to deli¬≠ver mas¬≠si¬≠ve I/O and memo¬≠ry band¬≠width for sto¬≠rage appli¬≠ca¬≠ti¬≠ons. The Trans¬≠port SX TS65-B8253 is a 2U hybrid soft¬≠ware sto¬≠rage ser¬≠ver for various data cen¬≠ter and enter¬≠pri¬≠se deploy¬≠ment fea¬≠turing dual-socket CPUs, 16 DDR4 DIMM slots and seven stan¬≠dard PCIe 4.0 slots. The plat¬≠form is equip¬≠ped with up to two 10GbE and two GbE onboard net¬≠work con¬≠nec¬≠tions, twel¬≠ve front 3.5‚ÄĎinch tool-less SATA dri¬≠ve bays with up to four NVMe U.2 sup¬≠port, and two rear 2.5‚ÄĎinch tool-less SATA dri¬≠ve bays for boot dri¬≠ve deployment.

TYAN‚Äôs Trans¬≠port SX TS65-B8036 and Trans¬≠port SX TS65A-B8036 are 2U sin¬≠gle-socket sto¬≠rage ser¬≠vers with sup¬≠port for 16 DDR4 DIMM slots, five PCIe 4.0 and one OCP 2.0 LAN mez¬≠za¬≠ni¬≠ne slots. The TS65-S8036 accom¬≠mo¬≠da¬≠tes twel¬≠ve front 3.5‚ÄĎinch with up to four NVMe U.2 sup¬≠port, and two rear 2.5‚ÄĎinch hot-swap, tool-less SATA dri¬≠ve bays for boot dri¬≠ve deploy¬≠ment; the TS65A-S8036 offers 26 front and two rear 2.5‚ÄĎinch hot-swap, tool-less dri¬≠ve bays for high-per¬≠for¬≠mance data strea¬≠ming appli¬≠ca¬≠ti¬≠ons, the 26 front dri¬≠ve bays can sup¬≠port up to 24 NVMe U.2 devices by configuration.

AMD EPYC 7003 pro¬≠ces¬≠sors with AMD 3D V‚ÄĎCache tech¬≠no¬≠lo¬≠gy can run on TYAN‚Äôs exis¬≠ting AMD EPYC 7003 plat¬≠forms through a BIOS update. Cus¬≠to¬≠mers can enjoy fas¬≠ter time-to-results on tar¬≠ge¬≠ted workloads powered by new AMD EPYC 7773X, 7573X, 7473X, and 7373X processors.