TYAN HPC, Cloud, and Sto­rage Ser­ver Plat­forms to Deli­ver Breakth­rough Per­for­mance and Modern Secu­ri­ty Fea­tures for Tech­ni­cal Com­pu­ting Workloads

Newark, Calif. – March 21, 2022 – TYAN®, an indus­try-lea­ding ser­ver plat­form design manu­fac­tu­rer and a MiT­AC Com­pu­ting Tech­no­lo­gy Cor­po­ra­ti­on sub­si­dia­ry, today announ­ced avai­la­bi­li­ty of high-per­for­mance ser­ver plat­forms sup­port­ing new 3rd Gen AMD EPYC™ Pro­ces­sors with AMD 3D V‑Cache™ tech­no­lo­gy for the modern data center.

“The modern data cen­ter requi­res a powerful foun­da­ti­on to balan­ce com­pu­te, sto­rage, memo­ry and IO that can effi­ci­ent­ly mana­ge gro­wing volu­mes in the digi­tal trans­for­ma­ti­on trend,” said Dan­ny Hsu, Vice Pre­si­dent of MiT­AC Com­pu­ting Tech­no­lo­gy Corporation’s Ser­ver Infra­struc­tu­re Busi­ness Unit. “TYAN’s indus­try-lea­ding ser­ver plat­forms powered by 3rd Gen AMD EPYC pro­ces­sors with AMD 3D V‑Cache tech­no­lo­gy give our cus­to­mers bet­ter ener­gy effi­ci­en­cy and increased per­for­mance for a cur­rent and future of high­ly com­plex workloads.”

“3rd Gen AMD EPYC pro­ces­sors with AMD 3D V‑Cache tech­no­lo­gy con­ti­nue to dri­ve a new stan­dard for the modern data cen­ter with breakth­rough per­for­mance for tech­ni­cal com­pu­ting workloads due to 768 MB of L3 cache, enab­ling fas­ter time-to-results on tar­ge­ted workloads. Ful­ly socket com­pa­ti­ble with our 3rd Gen AMD EPYC plat­forms, cus­to­mers can adopt the­se pro­ces­sors to trans­form their data cen­ter ope­ra­ti­ons to achie­ve fas­ter pro­duct deve­lo­p­ment along with excep­tio­nal ener­gy savings,” said Ram Ped­dib­hot­la, cor­po­ra­te vice pre­si­dent, EPYC pro­duct manage­ment, AMD.

Optimized for technical computing workloads to boost performance

Lever­aging breakth­rough per­for­mance of 3rd Gen AMD EPYC pro­ces­sors with AMD 3D V‑Cache tech­no­lo­gy, the TYAN Trans­port HX pro­duct line is built to opti­mi­ze workloads like EDA, CFD, and FEA soft­ware and solu­ti­ons. The Trans­port HX FT65T-B8030 is a 4U pedes­tal ser­ver plat­form fea­turing a sin­gle pro­ces­sor, eight DDR4-3200 DIMM slots, eight 3.5‑inch SATA, and two NVMe U.2 hot-swap, tool-less dri­ve bays. The FT65T-B8030 sup­ports four dou­ble-wide PCIe 4.0 x16 slots for pro­fes­sio­nal GPUs to acce­le­ra­te HPC applications.

The Trans­port HX TN83-B8251 is a 2U dual-socket ser­ver plat­form with eight 3.5‑inch hot-swap SATA or NVMe U.2 tool-less dri­ve bays. The plat­form sup­ports up to four dou­ble-wide GPU cards and two addi­tio­nal low-pro­fi­le PCIe 4.0 x16 slots that pro­vi­des opti­mi­zed topo­lo­gy to impro­ve HPC and deep lear­ning performance.

Opti­mi­zed for HPC and vir­tua­liza­ti­on appli­ca­ti­ons, the Trans­port HX TS75-B8252 and Trans­port HX TS75A-B8252 are 2U dual-socket ser­ver plat­forms with sup­port for 32 DIMM slots and two dou­ble-wide, acti­ve-coo­led GPU cards. The TS75-B8252 accom­mo­da­tes twel­ve hot-swap, tool-less 3.5‑inch dri­ve bays with up to four NVMe U.2 sup­port; TS75A-B8252 accom­mo­da­tes 26 hot-swap, tool-less 2.5‑inch dri­ve bays with up to eight NVMe U.2 devices.

High memory footprints, multi-node servers to power big data computing

TYAN’s Trans­port CX lin­e­up is desi­gned for cloud and data ana­ly­tics that requi­re lar­ge memo­ry capa­ci­ty and fast data pro­ces­sing. The Trans­port CX GC79-B8252 and Trans­port CX GC79A-B8252 are 1U dual-socket ser­ver plat­forms that are ide­al for high-den­si­ty data cen­ter deploy­ment with a varie­ty of memo­ry-based com­pu­ting appli­ca­ti­ons. The­se sys­tems fea­ture 32 DDR4 DIMM slots, two stan­dard PCIe Gen.4 x16 expan­si­on slots, and one OCP 3.0 LAN mez­za­ni­ne slot. The GC79-B8252 plat­form offers four 3.5‑inch SATA dri­ve bays and four 2.5‑inch NVMe dri­ve bays with tool-less car­ri­ers, while the GC79A-B8252 plat­form offers twel­ve 2.5‑inch dri­ve bays with all NVMe U.2 support.

The Trans­port CX TN73-B8037-X4S is a 2U mul­ti-node ser­ver plat­form with four front-ser­viced com­pu­te nodes. Each node sup­ports one AMD EPYC 7003 Series pro­ces­sor with AMD 3D V‑Cache tech­no­lo­gy, four 2.5‑inch tool-less NVMe/SATA dri­ve bays, eight DDR4 DIMM slots, three inter­nal coo­ling fans, two stan­dard PCIe Gen.4 x16 expan­si­on slots, two inter­nal NVMe M.2 and one OCP 2.0 LAN mez­za­ni­ne slot. The plat­form is sui­ted for high-den­si­ty data cen­ter deploy­ments and tar­gets sca­le-out appli­ca­ti­ons with lar­ge num­bers of nodes.

Hybrid storage servers to drive outstanding performance

TYAN Trans­port SX lin­e­up is desi­gned to deli­ver mas­si­ve I/O and memo­ry band­width for sto­rage appli­ca­ti­ons. The Trans­port SX TS65-B8253 is a 2U hybrid soft­ware sto­rage ser­ver for various data cen­ter and enter­pri­se deploy­ment fea­turing dual-socket CPUs, 16 DDR4 DIMM slots and seven stan­dard PCIe 4.0 slots. The plat­form is equip­ped with up to two 10GbE and two GbE onboard net­work con­nec­tions, twel­ve front 3.5‑inch tool-less SATA dri­ve bays with up to four NVMe U.2 sup­port, and two rear 2.5‑inch tool-less SATA dri­ve bays for boot dri­ve deployment.

TYAN’s Trans­port SX TS65-B8036 and Trans­port SX TS65A-B8036 are 2U sin­gle-socket sto­rage ser­vers with sup­port for 16 DDR4 DIMM slots, five PCIe 4.0 and one OCP 2.0 LAN mez­za­ni­ne slots. The TS65-S8036 accom­mo­da­tes twel­ve front 3.5‑inch with up to four NVMe U.2 sup­port, and two rear 2.5‑inch hot-swap, tool-less SATA dri­ve bays for boot dri­ve deploy­ment; the TS65A-S8036 offers 26 front and two rear 2.5‑inch hot-swap, tool-less dri­ve bays for high-per­for­mance data strea­ming appli­ca­ti­ons, the 26 front dri­ve bays can sup­port up to 24 NVMe U.2 devices by configuration.

AMD EPYC 7003 pro­ces­sors with AMD 3D V‑Cache tech­no­lo­gy can run on TYAN’s exis­ting AMD EPYC 7003 plat­forms through a BIOS update. Cus­to­mers can enjoy fas­ter time-to-results on tar­ge­ted workloads powered by new AMD EPYC 7773X, 7573X, 7473X, and 7373X processors.