HSINCHU, Tai­wan, R.O.C., Feb. 3, 2023 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced the launch of its “TSMC Uni­ver­si­ty Fin­FET Pro­gram”, aimed at deve­lo­ping future IC design talent for the indus­try and empowe­ring aca­de­mic inno­va­ti­on around the world. The pro­gram will pro­vi­de broad edu­ca­tio­nal access for uni­ver­si­ty stu­dents, facul­ty, and aca­de­mic rese­ar­chers to the pro­cess design kit (PDK) of the industry’s most suc­cessful fin field-effect tran­sis­tor (Fin­FET) tech­no­lo­gy at 16nm, brin­ging the IC design lear­ning expe­ri­ence to the advan­ced Fin­FET level. The pro­gram will also pro­vi­de access for lea­ding IC rese­ar­chers in uni­ver­si­ties to both 16nm (N16) and 7nm (N7) sili­con through mul­ti-pro­ject wafer (MPW) ser­vices to acce­le­ra­te impactful rese­arch inno­va­tions towards real-world appli­ca­ti­ons. (…) Wei­ter­le­sen »