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Schlagwort: HBM-PIM
Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power
Korea on February 17, 2021
The new architecture will deliver over twice the system performance
and reduce energy consumption by more than 70%
Samsung Electronics, the world leader in advanced memory technology, today announced that it has developed the industry’s first High Bandwidth Memory (HBM) integrated with artificial intelligence (AI) processing power — the HBM-PIM. The new processing-in-memory (PIM) architecture brings powerful AI computing capabilities inside high-performance memory, to accelerate large-scale processing in data centers, high performance computing (HPC) systems and AI-enabled mobile applications. (…) Weiterlesen »