Schlagwort: Epyc 9004

Pr채sentationen Launch Epyc 9004 und Zen 4 Architektur

F체r die am 10. Novem짯ber von AMD vor짯ge짯stell짯ten Epyc 9004 Ser짯ver짯pro짯zes짯so짯ren der vier짯ten Zen-Gene짯ra짯ti짯on rei짯chen wir hier die bei짯den Pr채짯sen짯ta짯ti짯on EPYC 9004 LAUNCH KEYNOTE PRESENTATION und 4TH GEN AMD EPYC CPU ARCHITECTURE noch nach. () Wei짯ter짯le짯sen 쨩

TYAN Introduces HPC, Cloud and Storage Server Platforms Featuring 4th Gen AMD EPYC꽓 Processors at SC22

New 2GPU pedestal design, high-density with front I/O and all-flash storage servers maximize performance and energy efficiency for the data center

[cap짯ti짯on id=쏿ttachment_67032 align=쏿ligncenter width=900] Pro짯ducts : S8050 FT65TB8050 GC68AB8056 TS70AB8056 TS70B8056[/caption]

Dal짯las, Texas Super짯com짯pu짯ting 2022 Nov 15, 2022  TYAN짰, an indus짯try-lea짯ding ser짯ver plat짯form design manu짯fac짯tu짯rer and a MiT짯AC Com짯pu짯ting Tech짯no짯lo짯gy Cor짯po짯ra짯ti짯on sub짯si짯dia짯ry, brings the latest HPC, cloud and sto짯rage plat짯forms powered by AMD EPYC꽓 9004 Series pro짯ces짯sors for the next gene짯ra짯ti짯on ser짯ver archi짯tec짯tu짯re and ener짯gy effi짯ci짯en짯cy at SC22, Booth #2000 in the Kay Bai짯ley Hut짯chison Con짯ven짯ti짯on Cen짯ter Dal짯las on Novem짯ber 1417.

Facing the post-COVID eco짯no짯my world, data cen짯ters are requi짯red to build on more envi짯ron짯men짯tal짯ly fri짯end짯ly, secu짯re and fle짯xi짯ble fea짯tures to respond to the gro짯wing of tele짯wor짯king, video strea짯ming, IoT and 5G, said Dan짯ny Hsu, Vice Pre짯si짯dent of MiT짯AC Com짯pu짯ting Tech짯no짯lo짯gy Corporation셲 Ser짯ver Infra짯struc짯tu짯re BU. TYAN셲 new ser짯ver plat짯forms, powered by 4th Gen AMD EPYC pro짯ces짯sors, effi짯ci짯ent짯ly enable data cen짯ters by doing more tasks with the same num짯ber of ser짯vers. () Wei짯ter짯le짯sen 쨩

ASUS Announces AMD EPYC 9004-Powered Rack Servers and Liquid-Cooling Solutions

Over 90%-lower fan power con짯sump짯ti짯on for huge saving on data cen짯ter ope짯ra짯ti짯on Supe짯ri짯or liquid-coo짯짯ling solu짯ti짯ons: Over 90%-lower fan power con짯sump짯ti짯on for huge saving on data-cen짯짯짯ter ope짯ra짯ti짯ons New ther짯mal design: Hard-dri짯짯ve tray design with 44%-wider ven짯ti짯la짯ti짯on holes, plus opti짯mi짯zed lay짯out to mini짯mi짯ze impe짯dance and enhan짯ce air짯flow No. 1 Bench짯mark: World-record-set짯짯ting per짯for짯mance with 24 results on the latest SPEC CPU2017 () Wei짯ter짯le짯sen 쨩