Schlagwort: CoWos

TSMC and Broadcom Enhance the CoWoS Platform with World셲 First 2X Reticle Size Interposer

Hsin짯chu, Tai짯wan, R.O.C., Mar. 3, 2020  TSMC (TWSE: 2330, NYSE: TSM) today announ짯ced it has col짯la짯bo짯ra짯ted with Broad짯com (NASDAQ: AVGO) on enhan짯cing the Chip-on-Wafer-on-Sub짯짯s짯tra짯짯te (CoWoS짰) plat짯form to sup짯port the industry셲 first and lar짯gest 2X retic짯le size inter짯po짯ser. With an area of appro짯xi짯m짯ate짯ly 1,700 mm짼, this next gene짯ra짯ti짯on CoWoS inter짯po짯ser tech짯no짯lo짯gy signi짯fi짯cant짯ly boosts com짯pu짯ting power for advan짯ced () Wei짯ter짯le짯sen 쨩

Pr채sentation Meet the experts AMD und TSMC

Im Rah짯men sei짯ner 쏮eet the Experts-Webinare hat AMD sei짯nen Auf짯trags짯fer짯ti짯ger TSMC ein짯ge짯la짯den, um 체ber die Zusam짯men짯ar짯beit zu refe짯rie짯ren. God짯frey Cheng Head of Glo짯bal Mar짯ke짯ting bei TSMC hat dabei erw채hnt, dass man in den kom짯men짯den Mona짯ten nicht nur mehr 체ber klei짯ne짯re Nodes bei den Fer짯ti짯gungs짯tech짯no짯lo짯gien, son짯dern vor allem auch Neu짯es zu den Pack짯a짯ging-Tech짯no짯lo짯gien h철ren wird. () Wei짯ter짯le짯sen 쨩

Arm and TSMC Demonstrate Industry셲 First 7nm Arm-based CoWoS짰 Chiplets for High-Performance Computing

Hsin짯chu, Tai짯wan R.O.C., Sep짯tem짯ber 26, 2019  Arm and TSMC, the High-Per짯짯for짯짯mance Com짯pu짯ting (HPC) indus짯try lea짯ders, today announ짯ced an indus짯짯try-first 7nm sili짯짯con-pro짯짯ven chip짯let sys짯tem based on mul짯ti짯ple Arm짰 cores and lever짯aging TSMC셲 Chip-on-Wafer-on-Sub짯짯s짯tra짯짯te (CoWoS짰) advan짯ced pack짯a짯ging solu짯ti짯on. This sin짯gle pro짯of-of-con짯cept chip짯let sys짯tem suc짯cessful짯ly demons짯tra짯tes the key tech짯no짯lo짯gies for buil짯ding an HPC Sys짯짯tem-On-Chip (SoC) with Arm-based cores () Wei짯ter짯le짯sen 쨩