Schlagwort: CoWos
TSMC and Broadcom Enhance the CoWoS Platform with World’s First 2X Reticle Size Interposer
Hsinchu, Taiwan, R.O.C., Mar. 3, 2020 – TSMC (TWSE: 2330, NYSE: TSM) today announced it has collaborated with Broadcom (NASDAQ: AVGO) on enhancing the Chip-on-Wafer-on-Substrate (CoWoS®) platform to support the industry’s first and largest 2X reticle size interposer. With an area of approximately 1,700 mm², this next generation CoWoS interposer technology significantly boosts computing power for advanced (…) Weiterlesen »
Präsentation — Meet the experts — AMD und TSMC
Im Rahmen seiner “Meet the Experts“-Webinare hat AMD seinen Auftragsfertiger TSMC eingeladen, um über die Zusammenarbeit zu referieren. Godfrey Cheng — Head of Global Marketing bei TSMC — hat dabei erwähnt, dass man in den kommenden Monaten nicht nur mehr über kleinere Nodes bei den Fertigungstechnologien, sondern vor allem auch Neues zu den Packaging-Technologien hören wird. (…) Weiterlesen »
Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing
Hsinchu, Taiwan R.O.C., September 26, 2019 — Arm and TSMC, the High-Performance Computing (HPC) industry leaders, today announced an industry-first 7nm silicon-proven chiplet system based on multiple Arm® cores and leveraging TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging solution. This single proof-of-concept chiplet system successfully demonstrates the key technologies for building an HPC System-On-Chip (SoC) with Arm-based cores (…) Weiterlesen »