Schlagwort: Ryzen Embedded V2000

AMD and ECARX to Collaborate on Immersive Digital Cockpit In-Vehicle Computing Platform for Next-Generation Electric Vehicles

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Advanced digital cockpit will be powered by AMD Ryzen™ Embedded V2000 Processor and AMD Radeon™ RX 6000 Series GPUs

SANTA CLARA, Calif., Aug. 04, 2022 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced a stra­te­gic col­la­bo­ra­ti­on with ECARX, a glo­bal mobi­li­ty tech com­pa­ny. The com­pa­nies will work tog­e­ther on an in-vehic­le com­pu­ting plat­form for next-gene­ra­ti­on elec­tric vehic­les (EVs), expec­ted to be in mass pro­duc­tion for glo­bal roll­out in late 2023. The ECARX digi­tal cock­pit will be the first in-vehic­le plat­form to be offe­red with AMD Ryzen Embedded V2000 pro­ces­sors and AMD Rade­on RX 6000 Series GPUs along with ECARX hard­ware and software.

Com­bi­ning the exten­si­ve expe­ri­ence in auto­mo­ti­ve digi­tal cock­pit design of ECARX with AMD advan­ced com­pu­ting power and stun­ning visu­al gra­phic ren­de­ring capa­bi­li­ties, the com­pa­nies aim to deli­ver an inno­va­ti­ve in-car expe­ri­ence. The digi­tal cock­pit will launch with advan­ced fea­tures inclu­ding dri­ver infor­ma­ti­on mode, heads-up dis­play, rear seat enter­tain­ment, mul­ti­ple-dis­plays, mul­ti-zone voice reco­gni­ti­on, high-end gam­ing and a full 3D user experience.
(…) Wei­ter­le­sen »

Expandable Embedded System with AMD Ryzen Embedded V2000 Processor

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Tai­pei, Tai­wan, May 31, 2022 — IBASE Tech­no­lo­gy Inc. (TPEx: 8050), a world lea­der in embedded boards and com­pu­ting solu­ti­ons, unveils its CMI211-989 embedded sys­tem powered by AMD Ryzen Embedded V2000 pro­ces­sors based on the inno­va­ti­ve “Zen 2” x86 core archi­tec­tu­re using advan­ced 7nm manu­fac­tu­ring pro­cess. The sys­tem harnes­ses the power AMD Ryzen™ Embedded V2748/V2718 CPU with Rade­on™ Gra­phics to enable 25% more PCIe lanes and deli­ver 40 per­cent bet­ter gra­phics per­for­mance over the pre­vious gene­ra­ti­on SoC.

CMI211-989 hou­ses IBASE’s MI989 Mini-ITX mother­board sup­port­ing up to four inde­pen­dent 4K dis­plays via DP 1.4 ports to crea­te 3D immersi­ve expe­ri­en­ces in retail, gam­ing, and fac­to­ry auto­ma­ti­on appli­ca­ti­ons. Mea­su­ring 269(w) x 193(d) x 31.5(h) mm, it offers rich I/O con­nec­ti­vi­ty, sto­rage, expan­si­on capa­bi­li­ties and sup­ports 4x COM, 3x USB3.1, 2x USB2.0, a 2.5” dri­ve bay and a PCIe(x16) slot for riser cards expan­si­on. (…) Wei­ter­le­sen »

3.5” Single Board Computer with AMD Ryzen™ V2000 Processors

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Tai­pei, Tai­wan, Octo­ber 5, 2021 — IBASE Tech­no­lo­gy Inc. (TPEx: 8050), pro­vi­der of indus­tri­al mother­boards and embedded sys­tems, has rol­led out the IB952 3.5‑inch SBC that is based on AMD Ryzen™ Embedded V2000 pro­ces­sors built with inno­va­ti­ve 7nm pro­cess tech­no­lo­gy and fea­turing up to 8 cores and 16 threads to pro­vi­de the com­pu­ting per­for­mance and power effi­ci­en­cy for today’s IoT mar­ket. With the inte­gra­ted AMD Rade­on Vega gra­phics, the board can sup­port four dis­plays in 4K reso­lu­ti­on through the onboard inter­faces — dual Dis­play­Po­rt, an eDP, and a 24-bit LVDS dual-chan­nel interface.

Mea­su­ring 102mm x 147mm, the IB952 is packed with fea­tures to dri­ve a diver­se ran­ge of space-limi­t­ed appli­ca­ti­ons in POS, kiosk, digi­tal signage and fac­to­ry auto­ma­ti­on. It comes with two DDR4 SO-DIMM sockets to fit up to 64MB RAM, a wide input vol­ta­ge ran­ge (12V ~ 24V) and two Giga­bit Ether­net for high net­work through­put. The board pro­ces­sor is moun­ted on the under­si­de to allow the heats­ink to occu­py the enti­re foot­print, hel­ping desi­gners crea­te sys­tem housings with effi­ci­ent heat dissipation.

Other fea­tures include a TPM (Trus­ted Plat­form Modu­le) chip for hard­ware-based secu­ri­ty and high-speed peri­phe­ral con­nec­ti­vi­ty with two USB 2.0, three USB 3.1, two SATA III, two seri­al ports, and two M.2 sockets (M‑key/E‑key). Both Win­dows 10 and Linux Ubun­tu ope­ra­ting sys­tems are supported.

IB952 FEATURES:

  • AMD Ryzen™ Embedded V2000 pro­ces­sor on board
  • 2x DDR4 SO-DIMM, Max. 64GB
  • 2x PCI‑E Giga­bit LAN
  • 4Supports 2x Dis­play­Po­rt (DP con­nec­tor and Type‑C), 1x eDP, 1x 24-bit LVDS dual-channel
  • 2x USB2.0, 3x USB3.1, 2x SATA III, 2x COM
  • 2x M.2 sockets (M‑key/ E‑key)

(…) Wei­ter­le­sen »

PROFIVE NUCE von E.E.P.D. – embedded-NUC Single-Board-Computer mit AMD Ryzen Embedded V2000 Prozessor

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25. Janu­ar 2021 – E.E.P.D., Lösungs­part­ner für kun­den­spe­zi­fi­sche und Stan­dard-Embedded-Com­pu­ter­bau­grup­pen und Sys­te­me auf ARM- und x86-Basis, bie­tet mit dem PROFIVE NUCE einen leis­tungs­fä­hi­gen Sin­gle-Board-Com­pu­ter (SBC) im embedded-NUC-For­mat. Der SBC basiert auf AMDs Ryzen Embedded V2000 Pro­zes­so­ren mit Takt­ra­ten bis zu 4,15 GHz, acht Ker­nen und 16 Threads sowie einer TDP (Ther­mal Design Power) von bis zu 54 W.

„Aus­ge­stat­tet mit den neu­en AMD-V2000-Pro­zes­so­ren lie­fert der NUCE eine noch nie dage­we­se­nes Per­for­mance-Niveau im embedded-Bereich und eine unglaub­li­che Ener­gie­ef­fi­zi­enz für Anwen­dun­gen wie KI- und medi­zi­ni­sche Sys­te­me, maschi­nel­les Ler­nen, Com­pu­ter-Visi­on, Robo­tik, Micro-Ser­ver, Hoch­leis­tungs-Work­sta­tions, indus­tri­el­le Sys­te­me sowie das IOT“, kom­men­tiert Chris­ti­an Blersch, Geschäfts­füh­rer von E.E.P.D..

Der Arbeits­spei­cher des NUCE beträgt bis zu 32 GByte Dual-Chan­nel-DDR4-3200-SO-DIMM mit ECC-Sup­port (Error Cor­rec­tion Code). Wei­te­re Spe­zi­fi­ka­tio­nen sind zwei Giga­bit-Ether­net-Schnitt­stel­len mit 2,5 Gbit/s, TSN-Sup­port und Wake-on-LAN, zwei USB‑3.1‑Gen2‑, zwei inter­ne USB‑2.0- und zwei seri­el­le RS232/485-Ports (HDX/FDX) sowie HD-Audio mit Anschlüs­sen für Mikro­fon und Kopf­hö­rer. Dar­über hin­aus gibt es einen USB-C-Con­nec­tor für USB‑3.1‑Gen2 oder DP++-Ausgang mit Auf­lö­sun­gen von bis zu 4096 x 2160 Pixel bei 60 Hz. Die Gra­fik­aus­ga­be erfolgt über zwei Mini-DP++-Anschlüsse für Auf­lö­sun­gen von bis zu 4096 x 2160 Pixel bei 60 Hz sowie über einen eDP-Aus­gang mit maxi­mal 3840 x 2160 Pixeln und steu­er­ba­rer Hin­ter­grund­be­leuch­tung. (…) Wei­ter­le­sen »

ASRock Industrial Brings Reliable and Versatile iBOX-V2000 Series Mini PC with AMD Ryzen™ Embedded V2000 Series Processor

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Tai­pei, Tai­wan (Nov. 11, 2020) ASRock Indus­tri­al Com­pu­ter unleas­hed the iBOX-V2000M and iBOX-V2000V Fan­less Embedded BOX PC, powered by new AMD Ryzen™ Embedded V2718 and V2516 pro­ces­sors, with up to 8 cores and 16 threads for enhan­ced and relia­ble per­for­mance. With the Ryzen V2000’s embedded AMD Rade­on™ Gra­phics, the iBOX-V2000 Mini PCs can sup­port up (…) Wei­ter­le­sen »

Next-Gen Computing Solutions Powered by AMD Ryzen™ Embedded V2000 Series Processors

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  Tai­pei, Tai­wan, Novem­ber 11, 2020 — IBASE Tech­no­lo­gy Inc. (TPEx: 08050), a world lea­der in the manu­fac­tu­re of indus­tri­al mother­boards and embedded sys­tems, has laun­ched its next-gene­ra­­ti­on com­pu­ting solu­ti­ons powered by “Zen 2”-based AMD Ryzen™ Embedded V2000 Series pro­ces­sors with out­stan­ding power effi­ci­en­cy tar­ge­ting various edge appli­ca­ti­ons. “Based on a new class of per­for­mance (…) Wei­ter­le­sen »

AMD stellt Ryzen Embedded V2000 auf Basis von Zen 2 vor

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In einer Pres­se­mit­tei­lung hat AMD vier neue Ryzen Embedded Pro­zes­so­ren der V2000-Serie mit Zen-2-Ker­nen (“Grey Hawk”) vor­ge­stellt, die mit bis zu 8 Ker­nen und 16 Threads aus­ge­stat­tet sind. Nach Anga­ben von AMD bie­ten die neu­en Model­le auf Grund der 7nm-Tech­no­lo­gie eine neue Klas­se von Leis­tung und Ener­gie­ef­fi­zi­enz für Embedded-Anwen­dun­gen wie Thin-Cli­ent‑, MiniPC- und Edge-Systeme.
(…) Wei­ter­le­sen »

AMD Unveils AMD Ryzen™ Embedded V2000 Processors with Enhanced Performance and Power Efficiency

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AMD Ryzen Embedded V2000 Series pro­ces­sors deli­ver dou­ble the cores1, up to 2x the per­­for­­mance-per-wat­t2 and an esti­ma­ted 15 per­cent IPC uplift3 over the pre­vious gene­ra­ti­on SANTA CLARA, Calif.  11/10/2020 AMD (NASDAQ: AMD) today laun­ched a new pro­duct in its high-per­­for­­mance Embedded pro­ces­sor fami­ly, the AMD Ryzen™ Embedded V2000 Series pro­ces­sor. Built on the inno­va­ti­ve 7nm pro­cess tech­no­lo­gy, (…) Wei­ter­le­sen »