Schlagwort: AMD

AMD Radeon Software Adrenalin 23.2.1 WHQL

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Mit der Ver­si­on 23.2.1 der Rade­on Soft­ware Adre­na­lin hat AMD in die­ser Woche einen Uni­fied-Trei­ber ver­öf­fent­licht, der für alle älte­ren Kar­ten bis zur Rade­on RX 400 und den neu­en Rade­on RX 7900 ver­wend­bar ist. Dabei gab es anfangs wohl Pro­ble­me bei eini­gen Anwen­dern, die den Trei­ber mit der Ein­stel­lung “Reset auf Werks­ein­stel­lun­gen” instal­liert haben. Mitt­ler­wei­le hat AMD aber den Instal­ler des Trei­bers ange­passt und dar­über hin­aus bie­tet die­ser neben eini­gen Bug­fi­xes vor allem auch Per­for­mance­ver­bes­se­run­gen für Kar­ten der RX 6000 Serie. (…) Wei­ter­le­sen »

Atos to build Max Planck Society’s new BullSequana XH3000-based supercomputer

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Munich, February 9th, 2023

Atos today announ­ces a con­tract to build and install a new high-per­for­mance com­pu­ter for the Max Planck Socie­ty, a world-lea­ding sci­ence and tech­no­lo­gy rese­arch orga­niza­ti­on. The new sys­tem will be based on Atos’ latest Bull­Se­qua­na XH3000 plat­form, which is powered by AMD EPYC™ CPUs and Instinct™ acce­le­ra­tors. In its final con­fi­gu­ra­ti­on, the appli­ca­ti­on per­for­mance will be three times hig­her than the cur­rent “Cobra” sys­tem, which is also based on Atos technologies.

The new super­com­pu­ter, with a total order value of over 20 mil­li­on euros, will be ope­ra­ted by the Max Planck Com­pu­ting and Data Faci­li­ty (MPCDF) in Gar­ching near Munich and will pro­vi­de high-per­for­mance com­pu­ting (HPC) capa­ci­ty for many insti­tu­tes of the Max Planck Socie­ty. Par­ti­cu­lar­ly deman­ding sci­en­ti­fic pro­jects, such as tho­se in astro­phy­sics, life sci­ence rese­arch, mate­ri­als rese­arch, plas­ma phy­sics, and AI will bene­fit from the high-per­for­mance capa­bi­li­ties of the new sys­tem. (…) Wei­ter­le­sen »

Entry-level uCPE/SD-WAN Appliance with AMD Ryzen Embedded R1000/V1000 Processor

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Tai­pei, Tai­wan, Febru­ary 2nd, 2023 — IBASE Tech­no­lo­gy Inc. (TPEx: 8050), a lea­ding pro­vi­der of IPC pro­ducts and net­wor­king plat­forms, laun­ches its new INA1600 uCPE/SD-WAN appli­ance. Powered by AMD Ryzen Embedded R1000/V1000 pro­ces­sor, the ent­ry-level INA1600 sup­ports WiFi 6 and 5G LTE Cat20 con­nec­ti­vi­ty and is cer­ti­fied by Fle­xi­WAN, making it easy for sys­tem inte­gra­tors to deploy enter­pri­se net­works lever­aging uni­ver­sal cus­to­mer pre­mi­ses equip­ment (uCPE).

“With Soft­ware-defi­ned WAN (SD-WAN), enter­pri­ses can deli­ver more respon­si­ve and pre­dic­ta­ble appli­ca­ti­ons in less time and at lower cos­ts than tra­di­tio­nal MPLS ser­vices. Cloud-based SD-WAN adds value by pro­vi­ding an inte­gra­ted view of the net­work that can be easi­ly mana­ged at sca­le,” said Jes­se Chiang, seni­or direc­tor of IBASE’s Net­com Pro­ducts Busi­ness Divi­si­on. “The INA1600 is desi­gned to help enter­pri­ses cen­tra­li­ze manage­ment, and enable auto­ma­tic con­fi­gu­ra­ti­on and pro­vi­si­on with zero-touch pro­vi­sio­ning.” (…) Wei­ter­le­sen »

AMD Reports Fourth Quarter and Full Year 2022 Financial Results

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― Record full year reve­nue of $23.6 Bil­li­on up 44% year-over-year ―

SANTA CLARA, Calif., Jan. 31, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ:AMD) today announ­ced reve­nue for the fourth quar­ter of 2022 of $5.6 bil­li­on, gross mar­gin of 43%, ope­ra­ting loss of $149 mil­li­on, net inco­me of $21 mil­li­on and diluted ear­nings per share of $0.01. On a non-GAAP(*) basis, gross mar­gin was 51%, ope­ra­ting inco­me was $1.3 bil­li­on, net inco­me was $1.1 bil­li­on and diluted ear­nings per share was $0.69.

For full year 2022, the com­pa­ny repor­ted reve­nue of $23.6 bil­li­on, gross mar­gin of 45%, ope­ra­ting inco­me of $1.3 bil­li­on, net inco­me of $1.3 bil­li­on and diluted ear­nings per share of $0.84. On a non-GAAP(*) basis, gross mar­gin was 52%, ope­ra­ting inco­me was $6.3 bil­li­on, net inco­me was $5.5 bil­li­on and diluted ear­nings per share was $3.50.

GAAP Quar­ter­ly Finan­cial Results

(…) Wei­ter­le­sen »

Noctua präsentiert NH-L9a-AM5 Low-Profile Kühler für AMD Ryzen Prozessoren

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Wien, 24. Janu­ar 2023 – Noc­tua prä­sen­tier­te heu­te die jüngs­ten Model­le sei­ner erfolg­rei­chen Low-Pro­fi­le-Küh­ler­se­rie NH-L9: Mit einer Bau­hö­he von nur 37mm stel­len die neu­en NH-L9a-AM5 und NH-L9a-AM5 chromax.black eine her­vor­ra­gen­de Wahl für lei­se, hoch­kom­pak­te HTPCs und Small Form Fac­tor (SFF) Sys­te­me auf der Basis von AMDs neu­es­ten, AM5-basier­ten Ryzen Pro­zes­so­ren dar.

„AMDs gera­de vor­ge­stell­ten Ryzen Pro­zes­so­ren mit 65W eig­nen sich ide­al für kom­pak­te aber den­noch leis­tungs­fä­hi­ge Sys­te­me und unser neu­er NH-L9a-AM5 ist der per­fek­te Küh­ler dafür,“ erklärt Roland Mos­sig (Noc­tua CEO). „Er kühlt die neu­en Model­le 7900, 7700 und 7600 pro­blem­los bei flüs­ter­lei­sen Dreh­zahl­ein­stel­lun­gen und bie­tet aus­rei­chend Leis­tungs­re­ser­ven, falls Kun­den sie mit mehr als 65W betrei­ben möch­ten – wir haben auf dem Ryzen 7950X und 7900X bis zu 130W erzielt.“ (…) Wei­ter­le­sen »

AMD Adaptive Computing Technology Enables Next-Generation DENSO LiDAR System, Delivering 20X Improvement in Resolution

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── AMD Xilinx Auto­mo­ti­ve Zynq UltraS­ca­le+ MPSoC in DENSO plat­form pro­vi­des hig­hest point-cloud den­si­ty level of any SPAD LiDAR sys­tem in mar­ket today ──

SANTA CLARA, Calif., Jan. 19, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that its adap­ti­ve com­pu­ting tech­no­lo­gy is powe­ring lea­ding mobi­li­ty sup­pli­er DENSO Corporation’s next-gene­ra­ti­on LiDAR plat­form. The new plat­form will enable over 20X1 impro­ve­ment in reso­lu­ti­on with extre­me­ly low laten­cy for increased pre­cis­i­on in detec­ting pede­stri­ans, vehic­les, free space and more. The DENSO LiDAR plat­form, tar­ge­ted to begin ship­ping in 2025, will levera­ge the AMD Xilinx Auto­mo­ti­ve (XA) Zynq™ UltraS­ca­le+™ adap­ti­ve SoC and its func­tion­al safe­ty suite of deve­lo­per tools to enable ISO 26262 ASIL‑B cer­ti­fi­ca­ti­on. (…) Wei­ter­le­sen »

AMD Promotes Forrest Norrod to Executive Vice President of Data Center Solutions Business

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SANTA CLARA, Calif., Jan. 16, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that For­rest Nor­rod has been pro­mo­ted to exe­cu­ti­ve vice pre­si­dent and gene­ral mana­ger of the Data Cen­ter Solu­ti­ons busi­ness group at AMD. The appoint­ment reflects his record of lea­der­ship and mar­ket growth throug­hout his ten­ure with AMD and the stra­te­gic role of the data cen­ter busi­ness to the company’s con­tin­ued growth strategy.

“Under Forrest’s lea­der­ship, we have signi­fi­cant­ly grown our data cen­ter busi­ness and deli­ver­ed mul­ti­ple gene­ra­ti­ons of AMD EPYC pro­ces­sors that com­bi­ne lea­der­ship per­for­mance and ener­gy effi­ci­en­cy,” said AMD Chair and CEO Dr. Lisa Su. “The data cen­ter is our lar­gest growth oppor­tu­ni­ty, and we look for­ward to fur­ther expan­ding our pre­sence with cloud, enter­pri­se and edge cus­to­mers dri­ven by the industry’s stron­gest data cen­ter port­fo­lio and Forrest’s lea­der­ship.” (…) Wei­ter­le­sen »

AMD Radeon Software Adrenalin 23.1.1 WHQL für RX 7900

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Für Gra­fik­kar­ten der 7900er Serie hat AMD die Ver­si­on 23.1.1 der Rade­on Soft­ware Adre­na­lin — also des Trei­bers für AMD-Gra­fik­kar­ten — für Win­dows 10 und 11 ver­öf­fent­licht. Die­se Ver­si­on behebt unter ande­rem Feh­ler bei den Spie­len Val­heim und “The Wit­cher 3: The Wild Hunt”. Zusätz­lich wur­den Pro­ble­me beim Ein­stel­len der Werks­ein­stel­lun­gen und des Auto-Over­clo­ckings (…) Wei­ter­le­sen »

AMD Announces CFO Transition

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— AMD Chief Finan­cial Offi­cer Devin­der Kumar reti­ring and for­mer Mar­vell CFO Jean Hu to join AMD as exe­cu­ti­ve vice pre­si­dent and CFO —

SANTA CLARA, Calif., Jan. 11, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that chief finan­cial offi­cer and tre­asurer Devin­der Kumar will be reti­ring from the com­pa­ny and that Jean Hu will join on Janu­ary 23 as exe­cu­ti­ve vice pre­si­dent and chief finan­cial offi­cer. Kumar will remain at AMD through April 2023 to ensu­re a smooth tran­si­ti­on. (…) Wei­ter­le­sen »

CES 2023: AMD Präsentation Mobile Graphics

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Zur CES-2023-Key­note von Dr. Lisa Su hat AMD auch Infor­ma­tio­nen zu den vor­ge­stell­ten Mobi­le Gra­fik­lö­sun­gen bereit­ge­stellt. In der fol­gen­den Prä­sen­ta­ti­on wer­den Spe­zi­fi­ka­tio­nen zu den RDNA3-Mobi­le-Gra­fik­chips in Form der Rade­on RX 7600M, der RX 7600M XT, der RX 7700S und RX 7600S gege­ben. Lap­tops mit die­sen mobi­len Gra­fik­lö­sun­gen sol­len ab Febru­ar 2023 erhält­lich sein (…) Wei­ter­le­sen »

CES 2023: AMD Präsentation Client Processors

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Zur CES-2023-Key­note von Dr. Lisa Su hat AMD wei­te­re Infor­ma­tio­nen zu den vor­ge­stell­ten Pro­zes­so­ren bereit­ge­stellt. In der fol­gen­den Prä­sen­ta­ti­on wer­den Spe­zi­fi­ka­tio­nen zu den Mobi­le Pro­zes­so­ren “Dra­gon Ran­ge”, “Phoe­nix” und AMDs XDNA AI Engi­ne auf­ge­führt. Letz­te­re kommt als AMD Ryzen AI in AMDs Ryzen 7040er Serie zum Ein­satz, die ab März in ers­ten Lap­tops erhält­lich sein soll. (…) Wei­ter­le­sen »

Präsentation CES 2023 AMD Keynote

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Im Rah­men der CES 2023 hat Dr. Lisa Su — CEO und Prä­si­den­tin von AMD — eine der Key­notes abge­hal­ten. In die­ser wur­den nicht nur The­men im Bereich der Unter­hal­tungs­elek­tro­nik, son­dern auch AI, Health­ca­re und der Ein­satz von FPGAs für NASA-Mis­sio­nen behan­delt. Zu guter Letzt wur­de mit der AMD Instinct MI300 die welt­weit ers­te Ser­ver-APU mit inte­grier­ten CPU- und GPU-Dies gezeigt. Im Anschluss fin­det Ihr die kom­plet­te Prä­sen­ta­ti­on. (…) Wei­ter­le­sen »

AMD Unveils Suite of New Radeon GPUs to Power High-Performance, Power-Efficient Gaming Laptops

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AMD Rade­on RX 7000M Series Gra­phics deli­ver out­stan­ding per­for­mance-per-watt, sta­te-of-the-art visu­als and high-frame­ra­te gam­ing, with 26% hig­her per­for­mance on avera­ge than pre­vious gene­ra­ti­on; AMD Rade­on RX 7000S Series Gra­phics rede­fi­ne gam­ing per­for­mance for thin and light laptops

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023, AMD (NASDAQ: AMD) announ­ced the AMD Rade­on™ RX 7000 Series Gra­phics for Lap­tops. Built on the ground­brea­king AMD RDNA™ 3 archi­tec­tu­re, the new GPUs are desi­gned to deli­ver excep­tio­nal ener­gy effi­ci­en­cy and per­for­mance to power 1080p gam­ing at ultra set­tings and advan­ced con­tent crea­ti­on appli­ca­ti­ons on next-gene­ra­ti­on pre­mi­um laptops.

The new GPUs expand the recent­ly announ­ced AMD Rade­on RX 7000 Series Gra­phics fami­ly. The new AMD Rade­on RX 7000M Series Gra­phics offer out­stan­ding per­for­mance-per-watt while deli­ve­ring sta­te-of-the-art visu­als and high-FPS gam­ing, while the new AMD Rade­on RX 7000S Series Gra­phics maxi­mi­ze the effi­ci­en­ci­es of AMD RDNA 3 archi­tec­tu­re to deli­ver out­stan­ding per­for­mance at low power levels ide­al­ly sui­ted for thin and light lap­tops. (…) Wei­ter­le­sen »

AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop

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— AMD Ryzen™ 7000X3D Series Desk­top pro­ces­sors bring the power of AMD 3D V‑Cache™ tech­no­lo­gy to gamers and creators —

— AMD Ryzen 7000 Series Mobi­le pro­ces­sors deli­ver unpar­al­le­led per­for­mance for deman­ding workloads with up to 16 powerful “Zen 4” cores and bring new Ryzen AI tech­no­lo­gy to sel­ect lap­top devices—

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023, AMD (NASDAQ: AMD) announ­ced a varie­ty of new com­pu­ting pro­ducts across desk­top and mobi­le, brin­ging new levels of per­for­mance for gamers, crea­tors, pro­fes­sio­nals, and main­stream users. AMD is sub­stan­ti­al­ly expan­ding the ran­ge of opti­ons for Socket AM5 users with the new Ryzen 7000X3D Series Desk­top pro­ces­sors and 65W Ryzen 7000 Series Desk­top pro­ces­sors. AMD also announ­ced a new lin­e­up of Ryzen 7000 Series Mobi­le pro­ces­sors, inclu­ding the AMD Ryzen 7045HX Series Mobi­le pro­ces­sors, which deli­ver on avera­ge over 50% more per­for­mance across a wide ran­ge of appli­ca­ti­ons to enable gamers and crea­tors on the go 1. AMD is also intro­du­cing the Ryzen 7040 Series Mobi­le pro­ces­sors, which fea­ture the first dedi­ca­ted arti­fi­ci­al intel­li­gence hard­ware in an x86 pro­ces­sor on sel­ect models. (…) Wei­ter­le­sen »

AMD Highlights Future of High-Performance and Adaptive Computing During Opening Keynote of CES 2023

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— AMD CEO and part­ners inclu­ding Micro­soft, HP, Leno­vo, Magic Leap and Intui­ti­ve Sur­gi­cal show­ca­se AMD tech­no­lo­gies advan­cing AI, hybrid work, gam­ing, health­ca­re, aero­space and sus­tainable computing —

— Unveils new mobi­le CPUs and GPUs, inclu­ding first x86 PC CPU with dedi­ca­ted AI engi­ne and new 3D sta­cked desk­top pro­ces­sors with lea­der­ship gam­ing per­for­mance, and pre­views lea­der­ship AI infe­rence acce­le­ra­tor and data cen­ter APU —

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023, AMD (NASDAQ: AMD) Chair and CEO Dr. Lisa Su detail­ed the signi­fi­cant role high-per­for­mance and adap­ti­ve com­pu­ting plays in crea­ting solu­ti­ons to the world’s most important chal­lenges. During her live key­note, Dr. Su show­ca­sed next-gene­ra­ti­on AMD lea­der­ship pro­ducts rede­fi­ning what’s pos­si­ble across the broad mar­kets AMD ser­ves today.

“It is an honor to kick off CES 2023 and high­light all the ways AMD is pushing the enve­lo­pe in high-per­for­mance and adap­ti­ve com­pu­ting to help sol­ve the world’s most important chal­lenges,” said Dr. Su.  “Tog­e­ther with our part­ners, we high­ligh­ted how AMD tech­no­lo­gy is advan­cing what is pos­si­ble in AI, hybrid work, gam­ing, health­ca­re, aero­space and sus­tainable com­pu­ting. We also laun­ched mul­ti­ple new mobi­le, gam­ing and AI chips that will make 2023 an exci­ting year for AMD and the indus­try.” (…) Wei­ter­le­sen »