Kategorie: Pressemitteilungen

In die­ser Sek­ti­on wer­den Pres­se­mit­tei­lun­gen der Her­stel­ler 1:1 ver­öf­fent­licht. Pla­net 3DNow! über­nimmt weder für die Rich­tig­keit der Anga­ben noch für die Art der For­mu­lie­rung jed­we­de Ver­ant­wor­tung. Die Anga­ben kön­nen sub­jek­tiv sein und geben nicht not­wen­di­ger­wei­se die Mei­nung der auf Pla­net 3DNow! schrei­ben­den Autoren wieder.

U.S. Department of Defense Partners with GLOBALFOUNDRIES to Manufacture Secure Chips at Fab 8 in Upstate New York

Verfasst vonpipin

Now ful­ly ITAR com­pli­ant, GF’s most advan­ced manu­fac­tu­ring faci­li­ty will pro­du­ce semi­con­duc­tor solu­ti­ons for the nation’s most sen­si­ti­ve defen­se and aero­space applications

Mal­ta, N.Y., Febru­ary 15, 2021 – GLOBALFOUNDRIES® (GF®), the world’s lea­ding spe­cial­ty foundry, today announ­ced a stra­te­gic part­ner­ship with the U.S. Depart­ment of Defen­se (DoD) to pro­vi­de a secu­re and relia­ble sup­p­ly of semi­con­duc­tor solu­ti­ons manu­fac­tu­red at GF’s Fab 8 in Mal­ta, New York — the company’s most advan­ced semi­con­duc­tor manu­fac­tu­ring faci­li­ty. The­se semi­con­duc­tor chips will be used in some of the DoD’s most sen­si­ti­ve appli­ca­ti­ons for land, air, sea, and space systems.

Under the agree­ment, GF will pro­vi­de a sup­p­ly of chips built at Fab 8 on its dif­fe­ren­tia­ted 45nm SOI plat­form. The agree­ment is made pos­si­ble by Fab 8’s com­pli­ance with U.S. Inter­na­tio­nal Traf­fic in Arms Regu­la­ti­ons (ITAR) and high­ly rest­ric­ti­ve Export Con­trol Clas­si­fi­ca­ti­on Num­bers under the Export Admi­nis­tra­ti­on Regu­la­ti­ons (EAR). 

The new sup­p­ly agree­ment builds upon the long­stan­ding part­ner­ship bet­ween the DoD and GF to pro­vi­de chips for defen­se, aero­space, and other sen­si­ti­ve appli­ca­ti­ons. GF curr­ent­ly sup­pli­es the DoD with chips manu­fac­tu­red at GF’s other on-shore faci­li­ties, Fab 10 in East Fish­kill, New York, and Fab 9 in Bur­ling­ton, Ver­mont. (…) Wei­ter­le­sen »

Samsung Develops Industry’s First High Bandwidth Memory with AI Processing Power

Verfasst vonpipin

Korea on Febru­ary 17, 2021

The new archi­tec­tu­re will deli­ver over twice the sys­tem per­for­mance
and redu­ce ener­gy con­sump­ti­on by more than 70%

Sam­sung Elec­tro­nics, the world lea­der in advan­ced memo­ry tech­no­lo­gy, today announ­ced that it has deve­lo­ped the industry’s first High Band­width Memo­ry (HBM) inte­gra­ted with arti­fi­ci­al intel­li­gence (AI) pro­ces­sing power — the HBM-PIM. The new pro­ces­sing-in-memo­ry (PIM) archi­tec­tu­re brings powerful AI com­pu­ting capa­bi­li­ties insi­de high-per­for­mance memo­ry, to acce­le­ra­te lar­ge-sca­le pro­ces­sing in data cen­ters, high per­for­mance com­pu­ting (HPC) sys­tems and AI-enab­led mobi­le appli­ca­ti­ons. (…) Wei­ter­le­sen »

Success of the 2CRSi Group in CERN’s latest calls for tender with contracts worth over 15 million dollars

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Stras­bourg (France), 15 Febru­ary 2021 — 2CRSi (ISIN code: FR0013341781), desi­gner and manu­fac­tu­rer of high-per­for­mance ener­gy-effi­ci­ent IT ser­vers, won a num­ber of con­tracts in seve­ral calls for ten­der orga­nis­ed by CERN (Euro­pean orga­ni­sa­ti­on for nuclear research).

The 2CRSi Group has just signed new con­tracts with CERN, the lar­gest cent­re for par­tic­le phy­sics in the world, to sup­p­ly thou­sands of com­pu­te ser­vers equip­ped with AMD© EPYCTM pro­ces­sors and JBoD sto­rage sys­tems, in order to sup­port the orga­ni­sa­ti­on in its latest sci­en­ti­fic pro­jects. (…) Wei­ter­le­sen »

Pat Gelsinger Becomes CEO of Intel

Verfasst vonpipin

Today marks Intel’s offi­ci­al CEO tran­si­ti­on as Pat Gel­sin­ger beco­mes the company’s eighth chief exe­cu­ti­ve offi­cer in its histo­ry. Gel­sin­ger is an accom­plished CEO and indus­try vete­ran with more than four deca­des of tech­no­lo­gy and lea­der­ship expe­ri­ence – inclu­ding 30 years at Intel, whe­re he began his care­er. (…) Wei­ter­le­sen »

Lenovo to Power SURF Dutch National Supercomputer

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AMSTERDAM, Feb. 8, 2021 — Leno­vo Data Cen­ter Group (DCG) announ­ced it will deli­ver high-per­for­mance com­pu­ter (HPC) infra­struc­tu­re for SURF, the ICT coope­ra­ti­ve for edu­ca­ti­on and rese­arch in the Net­her­lands. The €20 mil­li­on pro­ject, which beg­ins in ear­ly 2021, will result in the crea­ti­on of the lar­gest and most powerful super­com­pu­ter in the country.

Sup­port­ing sci­en­tists from over 100 edu­ca­ti­on and rese­arch insti­tu­ti­ons throug­hout the Net­her­lands, the super­com­pu­ter will power high­ly com­plex cal­cu­la­ti­ons in life-enhan­cing work across all fields of sci­ence inclu­ding meteo­ro­lo­gy, astro­phy­sics, medi­cal and social sci­en­ces, and mate­ri­als and earth sci­en­ces, such as cli­ma­te chan­ge research.

Explai­ning the signi­fi­can­ce of this col­la­bo­ra­ti­on, and the bene­fits to be pas­sed on to rese­arch pro­jects, Wal­ter Lioen, Rese­arch Ser­vices Mana­ger at SURF, said: “The need of rese­ar­chers for com­pu­ting power, data sto­rage and pro­ces­sing is gro­wing expo­nen­ti­al­ly. In the design of the new super­com­pu­ter, the usa­bi­li­ty for sci­en­ti­fic rese­arch was para­mount. SURF has cho­sen Leno­vo becau­se of its qua­li­ty, per­for­mance and future fle­xi­bi­li­ty, as well as its con­side­ra­ti­ons for sus­taina­bi­li­ty.” (…) Wei­ter­le­sen »

LibreOffice 7.1 Community released by The Document Foundation

Verfasst vonpipin

A brand new ver­si­on of the best free open source office suite, based on the Libre­Of­fice Tech­no­lo­gy plat­form for desk­top, mobi­le and cloud productivity

Ber­lin, Febru­ary 3, 2021 – Libre­Of­fice 7.1 Com­mu­ni­ty, the vol­un­teer-sup­port­ed ver­si­on of the best open source office suite for desk­top pro­duc­ti­vi­ty, is available from https://www.libreoffice.org/download. The Com­mu­ni­ty label under­lines the fact that the soft­ware is not tar­ge­ted at enter­pri­ses, and not opti­mi­zed for their sup­port needs.

For enter­pri­se-class deploy­ments, TDF has stron­gly recom­men­ded the Libre­Of­fice Enter­pri­se fami­ly of appli­ca­ti­ons from eco­sys­tem part­ners – for desk­top, mobi­le and cloud – with long-term sup­port opti­ons, pro­fes­sio­nal assis­tance, cus­tom fea­tures and other bene­fits, inclu­ding SLA (Ser­vice Level Agree­ments): https://www.libreoffice.org/download/libreoffice-in-business/. (…) Wei­ter­le­sen »

AMD, GIGABYTE and SpaceBelt Collaborate to Support Secured Data Communication and Storage Services Globally

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Space­Belt Brings Indus­try Lea­ders Tog­e­ther to Sup­port its Mission

SINGAPORE, Febru­ary 2, 2021 /EINPresswire.com/ — Space­Belt Pte. Ltd., a sub­si­dia­ry of Cloud Con­stel­la­ti­on Cor­po­ra­ti­on, Advan­ced Micro Devices, Inc. (AMD), and GIGABYTE Tech­no­lo­gy, have announ­ced a part­ner­ship intro­du­cing high per­for­mance pro­ces­sors and ser­ver hard­ware that aims to sup­port secu­red data sto­rage and com­mu­ni­ca­ti­on ser­vices through the Cloud Con­stel­la­ti­on SpaceBeltTM Data Secu­ri­ty-as-a-Ser­vice (DSaaS) platform.

AMD is one of the world lea­ding mul­ti­na­tio­nal semi­con­duc­tor com­pa­ny that deve­lo­ps com­pu­ter pro­ces­sors and rela­ted tech­no­lo­gies for busi­ness and con­su­mer mar­kets. It has ope­ra­ti­ons around the world, inclu­ding R&D faci­li­ties, inter­na­tio­nal sales offices, and joint ven­tures with assembly/test manu­fac­tu­ring faci­li­ties in Malay­sia and Chi­na. Space­Belt is extre­me­ly thril­led to announ­ce that AMD will be col­la­bo­ra­ting with Space­Belt and GIGABYTE by pro­vi­ding its 2nd Gene­ra­ti­on AMD EPYC™ 7002 Pro­ces­sors that will be used to power GIGABYTE ser­vers sup­port­ing Space­Belt Data Secu­ri­ty-as-a-Ser­vice (DSaaS) plat­form. (…) Wei­ter­le­sen »

ASUS kündigt das WRX80 Workstation-Mainboard für AMD Ryzen Threadripper PRO Prozessoren an

Verfasst vonpipin

Ulti­ma­ti­ve Leis­tung für pro­fes­sio­nel­le Anwen­dun­gen und eine zuver­läs­si­ge Platt­form für anspruchs­vol­le krea­ti­ve Workloads, die von Mul­ti-Core-CPUs pro­fi­tie­ren
 

  • Das ASUS Pro WS WRX80E-SAGE SE WIFI ist ein AMD WRX80-Work­sta­tion-Main­board, das für die Nut­zung des vol­len Poten­zi­als von AMD Ryzen Thre­ad­rip­per PRO-Pro­zes­so­ren ent­wi­ckelt wurde
  • Ultra­schnel­le Kon­nek­ti­vi­tät: USB 3.2 Gen 2×2 Typ‑C, 10 x USB 3.2 Gen 2, 3 x M.2 PCIe 4.0, HYPER M.2 x16 Gen 4 und Intel® X550-AT2 Dual 10Gb Ethernet
  • ASMB9-iKVM Fern­ver­wal­tung: Der BMC-Chip bie­tet Out-of-Band-Manage­ment mit der IPMI-Archi­tek­tur zur Ver­bes­se­rung der Ver­wal­tung auf Hardware-Ebene
  • Star­ke Leis­tung: 16 Leis­tungs­stu­fen, Mul­ti-GPU-Unter­stüt­zung und R‑DIMM-Spei­cher­un­ter­stüt­zung
  • Bewähr­te Sta­bi­li­tät: Getes­tet für 24/7‑Zuverlässigkeit, vali­diert für hohe Kom­pa­ti­bi­li­tät und aus­ge­stat­tet mit SafeS­lot für ulti­ma­ti­ve Sicherheit

 

Ratin­gen, der 28. Janu­ar 2021 — ASUS stellt heu­te das Pro WS WRX80E-SAGE SE WIFI vor, ein neu­es Work­sta­tion-Main­board für den pro­fes­sio­nel­len Ein­satz, das die neu­es­ten AMD Ryzen™ Thre­ad­rip­per™ PRO-Pro­zes­so­ren unter­stützt und die Rechen­leis­tung der AMD WRX80-Platt­form ent­fes­selt. Das Pro WS WRX80E-SAGE SE WIFI ist ide­al für die pro­fes­sio­nel­le Erstel­lung von Inhal­ten und für Inge­nieur­bü­ros, die auf die ulti­ma­ti­ve pro­fes­sio­nel­le Work­sta­tion auf­rüs­ten möch­ten, um mehr in kür­ze­rer Zeit zu erle­di­gen, wobei das gesam­te Poten­zi­al der Rechen­leis­tung genutzt wird, um einen enor­men Pro­duk­ti­vi­täts­schub beim Mul­ti­tas­king zu erzie­len. (…) Wei­ter­le­sen »

ROG Strix SCAR 17 mit aktuellsten AMD Ryzen Prozessoren und NVIDIA GeForce RTX 30er Grafik ab sofort verfügbar

Verfasst vonNero24

ROG Strix SCAR 17 mit aktu­ells­ten AMD Ryzen Pro­zes­so­ren und NVIDIA GeForce RTX 30er Gra­fik ab sofort verfügbar

Neu­es Gam­ing-Note­book mit Leis­tung auf E‑S­port-Niveau mit neu­es­ter RTX 30er Lap­top GPU und beson­ders lan­ger Akku­lauf­zeit (…) Wei­ter­le­sen »

Xilinx Reports Third Quarter Fiscal Year 2021 Results

Verfasst vonpipin
  • Reve­nues of $803 mil­li­on excee­ded the high end of gui­dance, repre­sen­ting 5% sequen­ti­al and 11% year over year growth
  • Wired and Wire­less Group (WWG) reve­nue increased 14% sequen­ti­al­ly due to strength in the Wire­less mar­kets as 5G deploy­ments ram­ped in mul­ti­ple regions
  • Auto­mo­ti­ve, Broad­cast & Con­su­mer (ABC) reve­nue increased 27% sequen­ti­al­ly, dri­ven by record quar­ters in the Auto­mo­ti­ve and Broad­cast end markets
  • Aero­space & Defen­se, Indus­tri­al and Test, Mea­su­re­ment & Emu­la­ti­on (AIT) reve­nue increased 7% sequen­ti­al­ly, dri­ven by strong per­for­mance in the Test, Mea­su­re­ment and Emu­la­ti­on market
  • Data Cen­ter Group (DCG) reve­nue decli­ned 45% sequen­ti­al­ly, in line with expec­ta­ti­ons, com­pared to a record second quar­ter which bene­fi­ted from trade-rela­ted order acceleration
  • Free cash flow of $354 mil­li­on, repre­sen­ting 44% of revenue
  • Retur­ned $93 mil­li­on to stock­hol­ders through dividends

(…) Wei­ter­le­sen »

PROFIVE NUCE von E.E.P.D. – embedded-NUC Single-Board-Computer mit AMD Ryzen Embedded V2000 Prozessor

Verfasst vonpipin

25. Janu­ar 2021 – E.E.P.D., Lösungs­part­ner für kun­den­spe­zi­fi­sche und Stan­dard-Embedded-Com­pu­ter­bau­grup­pen und Sys­te­me auf ARM- und x86-Basis, bie­tet mit dem PROFIVE NUCE einen leis­tungs­fä­hi­gen Sin­gle-Board-Com­pu­ter (SBC) im embedded-NUC-For­mat. Der SBC basiert auf AMDs Ryzen Embedded V2000 Pro­zes­so­ren mit Takt­ra­ten bis zu 4,15 GHz, acht Ker­nen und 16 Threads sowie einer TDP (Ther­mal Design Power) von bis zu 54 W.

„Aus­ge­stat­tet mit den neu­en AMD-V2000-Pro­zes­so­ren lie­fert der NUCE eine noch nie dage­we­se­nes Per­for­mance-Niveau im embedded-Bereich und eine unglaub­li­che Ener­gie­ef­fi­zi­enz für Anwen­dun­gen wie KI- und medi­zi­ni­sche Sys­te­me, maschi­nel­les Ler­nen, Com­pu­ter-Visi­on, Robo­tik, Micro-Ser­ver, Hoch­leis­tungs-Work­sta­tions, indus­tri­el­le Sys­te­me sowie das IOT“, kom­men­tiert Chris­ti­an Blersch, Geschäfts­füh­rer von E.E.P.D..

Der Arbeits­spei­cher des NUCE beträgt bis zu 32 GByte Dual-Chan­nel-DDR4-3200-SO-DIMM mit ECC-Sup­port (Error Cor­rec­tion Code). Wei­te­re Spe­zi­fi­ka­tio­nen sind zwei Giga­bit-Ether­net-Schnitt­stel­len mit 2,5 Gbit/s, TSN-Sup­port und Wake-on-LAN, zwei USB‑3.1‑Gen2‑, zwei inter­ne USB‑2.0- und zwei seri­el­le RS232/485-Ports (HDX/FDX) sowie HD-Audio mit Anschlüs­sen für Mikro­fon und Kopf­hö­rer. Dar­über hin­aus gibt es einen USB-C-Con­nec­tor für USB‑3.1‑Gen2 oder DP++-Ausgang mit Auf­lö­sun­gen von bis zu 4096 x 2160 Pixel bei 60 Hz. Die Gra­fik­aus­ga­be erfolgt über zwei Mini-DP++-Anschlüsse für Auf­lö­sun­gen von bis zu 4096 x 2160 Pixel bei 60 Hz sowie über einen eDP-Aus­gang mit maxi­mal 3840 x 2160 Pixeln und steu­er­ba­rer Hin­ter­grund­be­leuch­tung. (…) Wei­ter­le­sen »

AMD Reports Fourth Quarter and Full Year 2020 Financial Results

Verfasst vonpipin

― Quar­ter­ly reve­nue of $3.24B up 53% year-over-year; Full year reve­nue of $9.76B up 45%; quar­ter­ly and full year net inco­me more than dou­bled from pri­or year ―

SANTA CLARA, Calif., Jan. 26, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ:AMD) today announ­ced reve­nue for the fourth quar­ter of 2020 of $3.24 bil­li­on, ope­ra­ting inco­me of $570 mil­li­on, net inco­me of $1.78 bil­li­on and diluted ear­nings per share of $1.45. Fourth quar­ter net inco­me included an inco­me tax bene­fit of $1.30 bil­li­on asso­cia­ted with a valua­ti­on allo­wan­ce release, which con­tri­bu­ted $1.06 to EPS. On a non-GAAP(*) basis, ope­ra­ting inco­me was $663 mil­li­on, net inco­me was $636 mil­li­on and diluted ear­nings per share was $0.52. (…) Wei­ter­le­sen »

GIGABYTE Joins NVIDIA Certified Server and Releases Server: R282-Z96

Verfasst vonpipin

Tai­pei, Tai­wan, Janu­ary 26th 2021 – GIGABYTE Tech­no­lo­gy, (TWSE: 2376), an indus­try lea­der in high-per­for­mance ser­vers and work­sta­tions, today announ­ced the R282-Z96, which is a well balan­ced approach for fast sto­rage and high com­pu­te that is also one of five ser­vers by GIGABYTE in the new­ly announ­ced NVIDIA pro­gram named NVIDIA Cer­ti­fied. The pro­gram will help to ensu­re GIGABYTE ser­vers are up and run­ning quick­ly for AI workloads. (…) Wei­ter­le­sen »

ASRock Launches 1L Jupiter X300 Mini PC

Verfasst vonpipin

TAIPEI, Tai­wan, Janu­ary 26, 2021 – The lea­ding glo­bal mother­board manu­fac­tu­rer, gra­phics card, and small form fac­tor PC manu­fac­tu­rer, ASRock, proud­ly announ­ces the com­pact Mini PC – Jupi­ter X300. This pro­duct sup­ports AMD Ryzen™ 4000G Series pro­ces­sors and up to 64GB fast DDR4-3200MHz memo­ry. This deli­vers decent per­for­mance for a wide ran­ge of home enter­tain­ment and busi­ness use. Jupi­ter X300 pro­vi­des per­fect expan­da­bili­ty with only 1L of size, a PCIe Gen3 Ultra M.2(2280) SSD slot, a 2.5‑inch SATA6Gb/s hard dri­ve bay, and a M.2 Key‑E slot for Wi-Fi modu­le. (…) Wei­ter­le­sen »

Intel Reports Fourth-Quarter and Full-Year 2020 Financial Results

Verfasst vonpipin

News Sum­ma­ry

  • Fourth-quar­ter reve­nue was $20.0 bil­li­on, excee­ding Octo­ber gui­dance by $2.6 bil­li­on and down 1 per­cent year-over-year (YoY). Full-year reve­nue set an all-time Intel record of $77.9 bil­li­on, up 8 per­cent YoY.
  • Deli­ver­ed out­stan­ding fourth-quar­ter ear­nings per share (EPS) of $1.42 ($1.52 on a non-GAAP basis, excee­ding Octo­ber gui­dance by 42 cents).
  • In 2020, Intel gene­ra­ted a record $35.4 bil­li­on cash from ope­ra­ti­ons and $21.1 bil­li­on of free cash flow (FCF) and retur­ned $19.8 bil­li­on to shareholders.
  • Fore­cas­ting first-quar­ter 2021 reve­nue of appro­xi­m­ate­ly $18.6 bil­li­on (non-GAAP reve­nue of $17.5 bil­li­on); expec­ting first-quar­ter EPS of $1.03 (non-GAAP EPS of $1.10).

SANTA CLARA, Calif., Janu­ary 21, 2021 — Intel Cor­po­ra­ti­on today repor­ted fourth-quar­ter and full-year 2020 finan­cial results. The com­pa­ny also announ­ced that its board of direc­tors appro­ved a cash divi­dend increase of five per­cent to $1.39 per share on an annu­al basis. The board declared a quar­ter­ly divi­dend of $0.3475 per share on the company’s com­mon stock, which will be paya­ble on March 1 to share­hol­ders of record on Febru­ary 7.

“We signi­fi­cant­ly excee­ded our expec­ta­ti­ons for the quar­ter, cap­ping off our fifth con­se­cu­ti­ve record year,” said Bob Swan, Intel CEO. “Demand for the com­pu­ting per­for­mance Intel deli­vers remains very strong and our focus on growth oppor­tu­ni­ties is pay­ing off. It has been an honor to lead this won­derful com­pa­ny, and I am proud of what we have achie­ved as a team. Intel is in a strong stra­te­gic and finan­cial posi­ti­on as we make this lea­der­ship tran­si­ti­on and take Intel to the next level.”
(…) Wei­ter­le­sen »