Kategorie: Pressemitteilungen

£1.2 billion for the world’s most powerful weather and climate supercomputer

Pre­dic­ting seve­re wea­ther and the impacts of cli­ma­te chan­ge will be fas­ter and more accu­ra­te than ever befo­re. Published 17 Febru­ary 2020 From: Depart­ment for Busi­ness, Ener­gy & Indus­tri­al Stra­tegy, Met Office, UK Rese­arch and Inno­va­ti­on, and The Rt Hon Alok Shar­ma MP £1.2 bil­li­on invest­ment con­firm­ed for sta­­te-of-the-art super­com­pu­ter to impro­ve seve­re wea­ther and cli­ma­te fore­cas­ting the latest super­com­pu­ting (…) Wei­ter­le­sen »

NVIDIA Announces Upcoming Event for Financial Community

NVIDIA will pre­sent at the fol­lo­wing event for the finan­cial com­mu­ni­ty: Mor­gan Stan­ley Tech­no­lo­gy, Media and Tele­com­mu­ni­ca­ti­ons Con­fe­rence Mon­day, March 2, at 11:45 a.m. Paci­fic time Inte­res­ted par­ties can lis­ten to the live audio web­cast of NVIDIA’s pre­sen­ta­ti­on at this event, available at investor.nvidia.com. Replay of the web­cast will be available for 90 days after­ward. About NVIDIA (…) Wei­ter­le­sen »

Shadow Rock 3: Asymmetrischer CPU-Kühler für Mainstream-Prozessoren

Ver­bes­ser­te Kühl­leis­tung und her­vor­ra­gen­de RAM-Unter­stüt­zung Glin­de, 18. Febru­ar 2020 — be quiet!, seit 2007 Markt­füh­rer für PC-Net­z­­tei­­le in Deutsch­land*, prä­sen­tiert den Shadow Rock 3. Die­ser Neu­zu­gang zur CPU-Küh­­ler-Mit­­tel­klas­­se von be quiet! ver­fügt über ein neu gestal­te­tes Kühl­­kör­­per- und Hea­t­pi­­pe-Lay­out sowie einen Shadow Wings 2‑Lüfter, um die Nenn­kühl­leis­tung auf 190 Watt TDP zu erhö­hen, wäh­rend das asym­me­tri­sche (…) Wei­ter­le­sen »

AMD EPYC Cloud Adoption Grows with Google Cloud

New Goog­le Com­pu­te Engi­ne N2D vir­tu­al machi­nes (VMs) based on 2nd Gen AMD EPYC™ pro­ces­sors pro­vi­de dou­ble digit savings and per­for­mance impro­ve­ments over exis­ting N‑series ins­tances SANTA CLARA, Calif., Feb. 18, 2020 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) and Goog­le Cloud today announ­ced the beta avai­la­bi­li­ty of N2D VMs on Goog­le Com­pu­te Engi­ne powered by 2nd Gen AMD EPYC™ pro­ces­sors. The N2D (…) Wei­ter­le­sen »

Navy to Host Most Powerful Supercomputer in the DoD HPCMP

11 — Feb — 2020 STENNIS SPACE CENTER, Miss. — The Navy Depart­ment of Defen­se Super­com­pu­ting Resour­ce Cen­ter (DSRC) is plea­sed to announ­ce that it will recei­ve the lar­gest, most capa­ble super­com­pu­ting sys­tem pro­cu­red to date in the Depart­ment of Defen­se (DoD) High Per­for­mance Com­pu­ting Moder­niza­ti­on Pro­gram (HPCMP). At a peak theo­re­ti­cal com­pu­ting capa­bi­li­ty of 12.8 Peta­FLOPS, (…) Wei­ter­le­sen »

GIGABYTE TRX40 Motherboards bieten volle Unterstützung der AMD Ryzen™ Threadripper™3990X CPU

Fort­schritt­li­che Power und Ther­mal Designs + neu­es BIOS Update zur Ver­bes­se­rung der Pro­­zes­­sor-Kom­­pa­­ti­­bi­­li­­tät und Leis­tung Tai­peh, Tai­wan, GIGABYTE TECHNOLOGY Co. Ltd, einer der füh­ren­den Her­stel­ler von Mother­boards und Gra­fik­kar­ten, hat heu­te ange­kün­digt, dass die Mother­boards der TRX40 Serie vol­le Unter­stüt­zung der neu­en AMD Ryzen™ Thre­ad­rip­per™ 3990X CPU bie­ten. Mit ihren fort­schritt­li­chen Power und Ther­mal Designs, (…) Wei­ter­le­sen »

Broadcom Announces World’s First Wi-Fi 6E Chip for Mobile Devices

Broad­com BCM4389 bla­zes trail with mul­ti-giga­bit, low laten­cy Wi-Fi and supe­ri­or Blue­tooth audio expe­ri­ence SAN JOSE, Calif., Feb. 13, 2020 (GLOBE NEWSWIRE) — Broad­com Inc. (NASDAQ: AVGO) today announ­ced the world’s first Wi-Fi 6E cli­ent device, the BCM4389. Wi-Fi 6E extends the Wi-Fi 6 stan­dard to sup­port the soon-to-be-ope­ra­­tio­nal 6 GHz band with wider 160 MHz chan­nel (…) Wei­ter­le­sen »

TSMC Board of Directors Meeting Resolutions

Hsin­chu, Tai­wan, R.O.C., Feb. 11, 2020 – TSMC (TWSE: 2330, NYSE: TSM) today held a mee­ting of the Board of Direc­tors, which pas­sed the fol­lo­wing reso­lu­ti­ons: 1. Appro­ved the 2019 Busi­ness Report and Finan­cial State­ments. Con­so­li­da­ted reve­nue tota­led NT$1,069.99 bil­li­on and net inco­me was NT$345.26 bil­li­on, with diluted ear­nings per share of NT$13.32. 2. Appro­ved the (…) Wei­ter­le­sen »

ADLINK präsentiert auf der Embedded World das weltweit erste auf der NVIDIA Turing Technologie basierende MXM-GPU-Modul

MANNHEIM – 11. Febru­ar 2020 – ADLINK Tech­no­lo­gy, einer der welt­weit füh­ren­den Anbie­ter von Edge Com­pu­ting, prä­sen­tiert die welt­weit ers­ten MXM-GPU-Modu­­le mit NVIDIA® Qua­dro® RTX™ Embedded-GPUs mit der NVIDIA Turing™ Archi­tek­tur, die Embedded-Anwen­­dun­­gen eine lan­ge Lebens­dau­er gewähr­leis­ten. Die ADLINK MXM-GPU-Modu­­le ver­bes­sern dank der leis­tungs­fä­hi­gen Turing Archi­tek­tur High-Per­­for­­mance-Com­­pu­­ting, Com­pu­ter­gra­fik sowie künst­li­che Intel­li­genz (KI). Dar­über hin­aus adres­siert (…) Wei­ter­le­sen »

Introducing AMD Radeon™ Pro W5500 Workstation Graphics: Groundbreaking Technology for Modern Design and Engineering Professionals

AMD RDNA archi­tec­tu­re, indus­­try-lea­­ding 7nm pro­cess tech­no­lo­gy and advan­ced soft­ware fea­tures deli­ver lea­der­ship mul­ti­tas­king per­for­mance, ener­gy effi­ci­en­cy, and rock-solid sta­bi­li­ty to power deman­ding 2D and 3D pro­fes­sio­nal design appli­ca­ti­ons — — AMD Rade­on™ Pro W5500 gra­phics offer supe­ri­or per­for­mance in real-world appli­ca­ti­ons and up to 32 per­cent lower power con­sump­ti­on1 than the com­pe­ti­ti­on — San­ta Cla­ra, Calif. (…) Wei­ter­le­sen »

G.SKILL Announces High-Performance, High-Capacity DDR4-3600 C16 256GB (32GBx8) Memory Kit

(10 Febru­ary 2020) – G.SKILL Inter­na­tio­nal Enter­pri­se Co., Ltd., the world’s lea­ding manu­fac­tu­rer of extre­me per­for­mance memo­ry and gam­ing peri­pherals, is thril­led to announ­ce an all-new high capa­ci­ty, low-laten­­cy memo­ry kit, Trident Z Neo DDR4-3600 CL16-20–20 256GB (32GBx8) 1.35V, for the latest AMD Ryzen™ Thre­ad­rip­per™ 3990X pro­ces­sor. Built with the latest high-den­­si­­ty 16Gb com­pon­ents, this new DDR4 (…) Wei­ter­le­sen »

GIGABYTE Launches Content Creation Focused DESIGNARE DDR4 Memory

Fea­turing 32GB Per DIMM with a Pro­fes­sio­nal Loo­king Design and Alu­mi­num Heats­inks   Tai­pei, Tai­wan, Febru­ary 6th, 2020 – GIGABYTE TECHNOLOGY Co. Ltd, a lea­ding manu­fac­tu­rer of mother­boards and gra­phics cards, today laun­ched the DESIGNARE Series DDR4 3200MHz 64GB memo­ry kit. With its inno­va­ti­ve mother­board line, the DESIGNARE label has beco­me syn­ony­mous with effi­ci­ent con­tent (…) Wei­ter­le­sen »

The First Thunderbolt Certified AMD Motherboard — ASRock X570 Phantom Gaming-ITX/TB3

TAIPEI, Tai­wan, Febru­ary 6th , 2020 –The lea­ding glo­bal mother­board, gra­phics card and mini PC manu­fac­tu­rer, ASRock, announ­ces X570 Phan­tom Gaming–ITX/TB3 recei­ves the Thun­der­bolt™ Host cer­ti­fi­ca­ti­on from Intel. It is the first Thun­der­bolt Cer­ti­fied AMD mother­board. X570 Phan­tom Gam­ing-ITX/­T­­B3 is the high-end Mini-ITX model in the ASRock X570 series mother­board which sup­ports AMD Ryzen™ 2000 and (…) Wei­ter­le­sen »

IGEL Teams with AMD to Enhance Performance of UD7 Series

New optio­nal AMD Embedded Rade­on dis­crete GPU and the addi­ti­on of a fourth Dis­play­Po­rt enables the par­al­lel use of up to four moni­tors at 60Hz, inclu­ding two with 4K reso­lu­ti­on SAN FRANCISCO, Aug. 16, 2018 – IGEL, a world lea­der in end­point secu­ri­ty and opti­miza­ti­on soft­ware for the secu­re enter­pri­se, today announ­ced that it is team­ing with (…) Wei­ter­le­sen »

Neu bei Kontron: SMARTCASE™ Lösungen für Box-PCs „Designed by Fujitsu“

Augs­burg, 02.02.2020 – Kon­tron, ein welt­weit füh­ren­der Anbie­ter von IoT/Embedded Com­pu­ter Tech­no­lo­gie (ECT), nimmt die bewähr­ten SMARTCASE™ Chas­­sis-Kits von Fuji­tsu in sein Port­fo­lio auf und erwei­tert damit die Ange­bots­pa­let­te. Aktu­ell sind vom Kon­tron SMARTCASE™ fünf Vari­an­ten ver­füg­bar: S500, S520, S700, S710 und S720. Die­se die­nen als Basis für fer­tig mon­tier­te Box-PCs bestehend aus Kon­tron Mother­boards “Desi­gned by Fuji­tsu”, inklu­si­ve (…) Wei­ter­le­sen »