Kategorie: Pressemitteilungen

In die­ser Sek­ti­on wer­den Pres­se­mit­tei­lun­gen der Her­stel­ler 1:1 ver­öf­fent­licht. Pla­net 3DNow! über­nimmt weder für die Rich­tig­keit der Anga­ben noch für die Art der For­mu­lie­rung jed­we­de Ver­ant­wor­tung. Die Anga­ben kön­nen sub­jek­tiv sein und geben nicht not­wen­di­ger­wei­se die Mei­nung der auf Pla­net 3DNow! schrei­ben­den Autoren wieder.

AMD Promotes Forrest Norrod to Executive Vice President of Data Center Solutions Business

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SANTA CLARA, Calif., Jan. 16, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that For­rest Nor­rod has been pro­mo­ted to exe­cu­ti­ve vice pre­si­dent and gene­ral mana­ger of the Data Cen­ter Solu­ti­ons busi­ness group at AMD. The appoint­ment reflects his record of lea­der­ship and mar­ket growth throug­hout his ten­ure with AMD and the stra­te­gic role of the data cen­ter busi­ness to the company’s con­tin­ued growth strategy.

“Under Forrest’s lea­der­ship, we have signi­fi­cant­ly grown our data cen­ter busi­ness and deli­ver­ed mul­ti­ple gene­ra­ti­ons of AMD EPYC pro­ces­sors that com­bi­ne lea­der­ship per­for­mance and ener­gy effi­ci­en­cy,” said AMD Chair and CEO Dr. Lisa Su. “The data cen­ter is our lar­gest growth oppor­tu­ni­ty, and we look for­ward to fur­ther expan­ding our pre­sence with cloud, enter­pri­se and edge cus­to­mers dri­ven by the industry’s stron­gest data cen­ter port­fo­lio and Forrest’s lea­der­ship.” (…) Wei­ter­le­sen »

AMD Announces CFO Transition

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— AMD Chief Finan­cial Offi­cer Devin­der Kumar reti­ring and for­mer Mar­vell CFO Jean Hu to join AMD as exe­cu­ti­ve vice pre­si­dent and CFO —

SANTA CLARA, Calif., Jan. 11, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that chief finan­cial offi­cer and tre­asurer Devin­der Kumar will be reti­ring from the com­pa­ny and that Jean Hu will join on Janu­ary 23 as exe­cu­ti­ve vice pre­si­dent and chief finan­cial offi­cer. Kumar will remain at AMD through April 2023 to ensu­re a smooth tran­si­ti­on. (…) Wei­ter­le­sen »

Intel Launches 4th Gen Xeon Scalable Processors, Max Series CPUs

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Intel high­lights broad indus­try adop­ti­on across all major CSPs, OEMs, ODMs and ISVs, and show­ca­ses increased per­for­mance in AI, net­wor­king and high per­for­mance computing.

NEWS HIGHLIGHTS
 

  • Expan­si­ve cus­to­mer and part­ner adop­ti­on from AWS, Cis­co, Clou­de­ra, Core­Wea­ve, Dell Tech­no­lo­gies, Drop­box, Erics­son, Fuji­tsu, Goog­le Cloud, Hew­lett Packard Enter­pri­se, IBM Cloud, Inspur Infor­ma­ti­on, IONOS, Leno­vo, Los Ala­mos Natio­nal Labo­ra­to­ry, Micro­soft Azu­re, NVIDIA, Ora­cle Cloud, OVH­cloud, phoe­nix­NAP, Red­Hat, SAP, Super­Mi­cro, Tele­fo­ni­ca and VMware, among others.
  • With the most built-in acce­le­ra­tors of any CPU in the world for key workloads such as AI, ana­ly­tics, net­wor­king, secu­ri­ty, sto­rage and high per­for­mance com­pu­ting (HPC), 4th Gen Intel Xeon Sca­lable and Intel Max Series fami­lies deli­ver lea­der­ship per­for­mance in a pur­po­se-built workload-first approach.
  • 4th Gen Intel Xeon Sca­lable pro­ces­sors are Intel’s most sus­tainable data cen­ter pro­ces­sors, deli­ve­ring a ran­ge of fea­tures for opti­mi­zing power and per­for­mance, making opti­mal use of CPU resour­ces to help achie­ve cus­to­mers’ sus­taina­bi­li­ty goals.
  • When com­pared with pri­or gene­ra­ti­ons, 4th Gen Xeon cus­to­mers can expect a 2.9x1 avera­ge per­for­mance per watt effi­ci­en­cy impro­ve­ment for tar­ge­ted workloads when uti­li­zing built-in acce­le­ra­tors, up to 70-watt2 power savings per CPU in opti­mi­zed power mode with mini­mal per­for­mance loss for sel­ect workloads and a 52% to 66% lower total cost of owner­ship (TCO)3.

(…) Wei­ter­le­sen »

The Greenest Generation: NVIDIA, Intel and Partners Supercharge AI Computing Efficiency

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Acce­le­ra­ted NVIDIA Hop­per sys­tems with 4th Gen Intel Xeon Sca­lable pro­ces­sors — inclu­ding NVIDIA DGX H100 and 60+ sys­tems from NVIDIA part­ners — pro­vi­de 25x more effi­ci­en­cy than tra­di­tio­nal data cen­ter ser­vers to save big on ener­gy costs.
(…) Wei­ter­le­sen »

Microsoft announces acquisition of Fungible to accelerate datacenter innovation

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Jan 9, 2023 — Today, Micro­soft is announ­cing the acqui­si­ti­on of Fun­gi­ble Inc., a pro­vi­der of com­posable infra­struc­tu­re aimed at acce­le­ra­ting net­wor­king and sto­rage per­for­mance in dat­a­cen­ters with high-effi­ci­en­cy, low-power data pro­ces­sing units (DPUs).

Fungible’s tech­no­lo­gies help enable high-per­for­mance, sca­lable, dis­ag­gre­ga­ted, sca­led-out dat­a­cen­ter infra­struc­tu­re with relia­bi­li­ty and secu­ri­ty. (…) Wei­ter­le­sen »

AMD Unveils Suite of New Radeon GPUs to Power High-Performance, Power-Efficient Gaming Laptops

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AMD Rade­on RX 7000M Series Gra­phics deli­ver out­stan­ding per­for­mance-per-watt, sta­te-of-the-art visu­als and high-frame­ra­te gam­ing, with 26% hig­her per­for­mance on avera­ge than pre­vious gene­ra­ti­on; AMD Rade­on RX 7000S Series Gra­phics rede­fi­ne gam­ing per­for­mance for thin and light laptops

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023, AMD (NASDAQ: AMD) announ­ced the AMD Rade­on™ RX 7000 Series Gra­phics for Lap­tops. Built on the ground­brea­king AMD RDNA™ 3 archi­tec­tu­re, the new GPUs are desi­gned to deli­ver excep­tio­nal ener­gy effi­ci­en­cy and per­for­mance to power 1080p gam­ing at ultra set­tings and advan­ced con­tent crea­ti­on appli­ca­ti­ons on next-gene­ra­ti­on pre­mi­um laptops.

The new GPUs expand the recent­ly announ­ced AMD Rade­on RX 7000 Series Gra­phics fami­ly. The new AMD Rade­on RX 7000M Series Gra­phics offer out­stan­ding per­for­mance-per-watt while deli­ve­ring sta­te-of-the-art visu­als and high-FPS gam­ing, while the new AMD Rade­on RX 7000S Series Gra­phics maxi­mi­ze the effi­ci­en­ci­es of AMD RDNA 3 archi­tec­tu­re to deli­ver out­stan­ding per­for­mance at low power levels ide­al­ly sui­ted for thin and light lap­tops. (…) Wei­ter­le­sen »

AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop

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— AMD Ryzen™ 7000X3D Series Desk­top pro­ces­sors bring the power of AMD 3D V‑Cache™ tech­no­lo­gy to gamers and creators —

— AMD Ryzen 7000 Series Mobi­le pro­ces­sors deli­ver unpar­al­le­led per­for­mance for deman­ding workloads with up to 16 powerful “Zen 4” cores and bring new Ryzen AI tech­no­lo­gy to sel­ect lap­top devices—

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023, AMD (NASDAQ: AMD) announ­ced a varie­ty of new com­pu­ting pro­ducts across desk­top and mobi­le, brin­ging new levels of per­for­mance for gamers, crea­tors, pro­fes­sio­nals, and main­stream users. AMD is sub­stan­ti­al­ly expan­ding the ran­ge of opti­ons for Socket AM5 users with the new Ryzen 7000X3D Series Desk­top pro­ces­sors and 65W Ryzen 7000 Series Desk­top pro­ces­sors. AMD also announ­ced a new lin­e­up of Ryzen 7000 Series Mobi­le pro­ces­sors, inclu­ding the AMD Ryzen 7045HX Series Mobi­le pro­ces­sors, which deli­ver on avera­ge over 50% more per­for­mance across a wide ran­ge of appli­ca­ti­ons to enable gamers and crea­tors on the go 1. AMD is also intro­du­cing the Ryzen 7040 Series Mobi­le pro­ces­sors, which fea­ture the first dedi­ca­ted arti­fi­ci­al intel­li­gence hard­ware in an x86 pro­ces­sor on sel­ect models. (…) Wei­ter­le­sen »

AMD Highlights Future of High-Performance and Adaptive Computing During Opening Keynote of CES 2023

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— AMD CEO and part­ners inclu­ding Micro­soft, HP, Leno­vo, Magic Leap and Intui­ti­ve Sur­gi­cal show­ca­se AMD tech­no­lo­gies advan­cing AI, hybrid work, gam­ing, health­ca­re, aero­space and sus­tainable computing —

— Unveils new mobi­le CPUs and GPUs, inclu­ding first x86 PC CPU with dedi­ca­ted AI engi­ne and new 3D sta­cked desk­top pro­ces­sors with lea­der­ship gam­ing per­for­mance, and pre­views lea­der­ship AI infe­rence acce­le­ra­tor and data cen­ter APU —

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023, AMD (NASDAQ: AMD) Chair and CEO Dr. Lisa Su detail­ed the signi­fi­cant role high-per­for­mance and adap­ti­ve com­pu­ting plays in crea­ting solu­ti­ons to the world’s most important chal­lenges. During her live key­note, Dr. Su show­ca­sed next-gene­ra­ti­on AMD lea­der­ship pro­ducts rede­fi­ning what’s pos­si­ble across the broad mar­kets AMD ser­ves today.

“It is an honor to kick off CES 2023 and high­light all the ways AMD is pushing the enve­lo­pe in high-per­for­mance and adap­ti­ve com­pu­ting to help sol­ve the world’s most important chal­lenges,” said Dr. Su.  “Tog­e­ther with our part­ners, we high­ligh­ted how AMD tech­no­lo­gy is advan­cing what is pos­si­ble in AI, hybrid work, gam­ing, health­ca­re, aero­space and sus­tainable com­pu­ting. We also laun­ched mul­ti­ple new mobi­le, gam­ing and AI chips that will make 2023 an exci­ting year for AMD and the indus­try.” (…) Wei­ter­le­sen »

TSMC November 2022 Revenue Report

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HSINCHU, Tai­wan, R.O.C. – Dec. 9, 2022 - TSMC (TWSE: 2330, NYSE: TSM) today announ­ced its net reve­nue for Novem­ber 2022: On a con­so­li­da­ted basis, reve­nue for Novem­ber 2022 was appro­xi­m­ate­ly NT$222.71 bil­li­on, an increase of 5.9 per­cent from Octo­ber 2022 and an increase of 50.2 per­cent from Novem­ber 2021. Reve­nue for Janu­ary through Novem­ber 2022 tota­led NT$2,071.33 bil­li­on, an increase of 44.6 per­cent com­pared to the same peri­od in 2021. (…) Wei­ter­le­sen »

TSMC Announces Updates for TSMC Arizona

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PHOENIX, Ari­zo­na, Dec. 6, 2022 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced that in addi­ti­on to TSMC Arizona’s first fab, which is sche­du­led to begin pro­duc­tion of N4 pro­cess tech­no­lo­gy in 2024, TSMC has also star­ted the con­s­truc­tion of a second fab which is sche­du­led to begin pro­duc­tion of 3nm pro­cess tech­no­lo­gy in 2026. The over­all invest­ment for the­se two fabs will be appro­xi­m­ate­ly US$40 bil­li­on, repre­sen­ting the lar­gest for­eign direct invest­ment in Ari­zo­na histo­ry and one of the lar­gest for­eign direct invest­ments in the histo­ry of the United Sta­tes. (…) Wei­ter­le­sen »

AMD and Viettel Collaborate on 5G Mobile Network Expansion

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── Viettel selects Xilinx Zynq MPSoC and RFSoC adaptive platforms to enable its next-generation 5G systems serving more than 130 million mobile customers globally ──

SANTA CLARA, Calif., Dec. 01, 2022 — AMD (NASDAQ: AMD) and Viet­tel High Tech (Mem­ber of Viet­tel Group) today announ­ced the suc­cessful com­ple­ti­on of a 5G mobi­le net­work field tri­al deploy­ment con­duc­ted by Viet­tel and powered by AMD Xilinx Zynq™ UltraS­ca­le+™ MPSoC devices. As the lar­gest tele­com ope­ra­tor in Viet­nam ser­ving more than 130 mil­li­on mobi­le cus­to­mers, Viet­tel High Tech has a rich histo­ry of using AMD radio tech­no­lo­gy with pri­or 4G deploy­ments and is now acce­le­ra­ting new net­works via new 5G remo­te radio heads. Desi­gned to meet the gro­wing capa­ci­ty and per­for­mance requi­re­ments of mobi­le users glo­bal­ly, the Viet­tel 5G mobi­le net­work is expec­ted to be com­ple­ted by the end of 2022.

(…) Wei­ter­le­sen »

AMD to Present at Arete’s Tech Conference

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SANTA CLARA, Calif., Nov. 30, 2022 — Today, AMD (NASDAQ: AMD) announ­ced that Mark Paper­mas­ter, chief tech­no­lo­gy offi­cer and exe­cu­ti­ve vice pre­si­dent, Tech­no­lo­gy and Engi­nee­ring, will pre­sent at the vir­tu­al Are­te Tech Con­fe­rence (ATC) on Tues­day, Dec. 6 at 10:10 AM ET/7:10 AM PT.

A real-time web­cast of the pre­sen­ta­ti­on can be acces­sed on AMD’s Inves­tor Rela­ti­ons web­site ir.amd.com. A replay of the web­cast can be acces­sed after the con­clu­si­on of the live event and will be available for one year after the conference.
(…) Wei­ter­le­sen »

AMD and Analog Devices Resolve Patent Infringement Lawsuits

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SANTA CLARA, Calif., Nov. 17, 2022
AMD (NASDAQ: AMD) and Ana­log Devices, Inc. (NASDAQ: ADI) today announ­ced that they have resol­ved all their ongo­ing patent liti­ga­ti­ons, based on mutual­ly agreed upon terms. As part of this reso­lu­ti­on, the two com­pa­nies have com­mit­ted to pur­sue tech­no­lo­gy col­la­bo­ra­ti­ons to bring next gene­ra­ti­on solu­ti­ons to their com­mu­ni­ca­ti­ons and data cen­ter customers.

(…) Wei­ter­le­sen »

AMD Announces Retirement of John Caldwell from Board of Directors and Appointment of Nora Denzel as Lead Independent Director

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SANTA CLARA, Calif., Nov. 16, 2022 — AMD (NASDAQ: AMD) announ­ced that John Cald­well is reti­ring from the AMD board of direc­tors after 16 years of ser­vice. Nora Den­zel will suc­ceed Cald­well as lead inde­pen­dent direc­tor, effec­ti­ve immediately.

Cald­well joi­n­ed the AMD board of direc­tors in 2006. He ser­ved as chair­man from 2016 to 2022 and was named lead inde­pen­dent direc­tor ear­lier this year. He held a varie­ty of com­mit­tee posi­ti­ons throug­hout his ten­ure, inclu­ding chair of the com­pen­sa­ti­on and lea­der­ship resour­ces com­mit­tee and ser­ving on the nomi­na­ting and cor­po­ra­te gover­nan­ce com­mit­tee. (…) Wei­ter­le­sen »

AMD Powers Aisin Next-Generation Automated Parking Assist System

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── AMD Zynq UltraScale+ MPSoC automotive platform with deep learning processor advances low-latency, AI-based image processing for automated parking system ──

SANTA CLARA, Calif., Nov. 16, 2022 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) announ­ced today that the AMD Xilinx Auto­mo­ti­ve (XA) Zynq® UltraS­ca­le+™ MPSoC plat­form has been sel­ec­ted to power the Aisin Auto­ma­ted Par­king-Assist (APA) sys­tem. The high­ly adap­ta­ble XA Zynq UltraS­ca­le+ MPSoC plat­form enables the next-gene­ra­ti­on Aisin APA sys­tem to detect pede­stri­ans, vehic­les and free space effi­ci­ent­ly and at extre­me­ly low laten­cy. The Aisin APA sys­tem will begin ship­ping in model year 2024.

The XA Zynq UltraS­ca­le+ MPSoC plat­form — deploy­ed in the came­ras within the Aisin APA sys­tem — com­bi­nes a high-per­for­mance Arm®-based mul­ti­co­re, mul­tipro­ces­sing sys­tem with ASIC-class pro­gramma­ble logic con­tai­ning cus­tom co-pro­ces­sors that can be opti­mi­zed to meet sys­tem needs, inclu­ding a deep lear­ning pro­ces­sor unit for con­vo­lu­tio­nal neu­ral net­work (CNN) pro­ces­sing. This enables machi­ne lear­ning-based sce­ne seg­men­ta­ti­on and object detec­tion for the Aisin APA sys­tem. The XA Zynq MPSoC plat­form deli­vers maxi­mum pro­ces­sing effi­ci­en­cy and is capa­ble of off­loa­ding cri­ti­cal func­tions, such as gra­phics and video pipe­lining, to dedi­ca­ted pro­ces­sing blocks to enable low-laten­cy image processing.
(…) Wei­ter­le­sen »