Kategorie: Pressemitteilungen

In die­ser Sek­ti­on wer­den Pres­se­mit­tei­lun­gen der Her­stel­ler 1:1 ver­öf­fent­licht. Pla­net 3DNow! über­nimmt weder für die Rich­tig­keit der Anga­ben noch für die Art der For­mu­lie­rung jed­we­de Ver­ant­wor­tung. Die Anga­ben kön­nen sub­jek­tiv sein und geben nicht not­wen­di­ger­wei­se die Mei­nung der auf Pla­net 3DNow! schrei­ben­den Autoren wieder.

Samsung Introduces Game Changing Exynos 2200 Processor With Xclipse GPU Powered By AMD RDNA 2 Architecture

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The new pre­mi­um mobi­le pro­ces­sor comes with hard­ware-acce­le­ra­ted ray tra­cing and sta­te of the art Arm-based pro­ces­sing technology

Sam­sung Elec­tro­nics, a world lea­der in advan­ced semi­con­duc­tor tech­no­lo­gy, today announ­ced its new pre­mi­um mobi­le pro­ces­sor, the Exy­nos 2200. The Exy­nos 2200 is a fresh­ly desi­gned mobi­le pro­ces­sor with a powerful AMD RDNA 2 archi­tec­tu­re based Sam­sung Xclip­se gra­phics pro­ces­sing unit (GPU). With the most cut­ting-edge Arm®-based CPU cores available in the mar­ket today and an upgraded neu­ral pro­ces­sing unit (NPU), the Exy­nos 2200 will enable the ulti­ma­te mobi­le pho­ne gam­ing expe­ri­ence, as well as enhan­cing the over­all expe­ri­ence in social media apps and photography.

“Built on the most advan­ced 4‑nanometer (nm) EUV (extre­me ultra­vio­let litho­gra­phy) pro­cess, and com­bi­ned with cut­ting-edge mobi­le, GPU and NPU tech­no­lo­gy, Sam­sung has craf­ted the Exy­nos 2200 to pro­vi­de the finest expe­ri­ence for smart­phone users. With the Xclip­se, our new mobi­le GPU built with RDNA 2 gra­phics tech­no­lo­gy from the indus­try lea­der AMD, the Exy­nos 2200 will rede­fi­ne mobi­le gam­ing expe­ri­ence, aided by enhan­ced gra­phics and AI per­for­mance,” said Yon­gin Park, Pre­si­dent of Sys­tem LSI Busi­ness at Sam­sung Elec­tro­nics. “As well as brin­ging the best mobi­le expe­ri­ence to the users, Sam­sung will con­ti­nue its efforts to lead the jour­ney in logic chip inno­va­ti­on.” (…) Wei­ter­le­sen »

TSMC Reports Fourth Quarter EPS of NT$6.41

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Hsin­chu, Tai­wan, R.O.C., Janu­ary 13, 2022 — TSMC today announ­ced con­so­li­da­ted reve­nue of
NT$438.19 bil­li­on, net inco­me of NT$166.23 bil­li­on, and diluted ear­nings per share of NT$6.41
(US$1.15 per ADR unit) for the fourth quar­ter ended Decem­ber 31, 2021.

Year-over-year, fourth quar­ter reve­nue increased 21.2% while net inco­me and diluted EPS both
increased 16.4%. Com­pared to third quar­ter 2021, fourth quar­ter results repre­sen­ted a 5.7%
increase in reve­nue and a 6.4% increase in net inco­me. All figu­res were pre­pared in accordance
with TIFRS on a con­so­li­da­ted basis.

In US dol­lars, fourth quar­ter reve­nue was $15.74 bil­li­on, which increased 24.1% year-over-year and
increased 5.8% from the pre­vious quar­ter. (…) Wei­ter­le­sen »

AMD Highlights Growing Cloud Momentum With New Amazon EC2 Instances for High Performance Computing

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Ama­zon EC2 Hpc6a ins­tances powered by 3rd Gen AMD EPYC™ pro­ces­sors offer up to 65 per­cent bet­ter pri­ce-per­for­mance than simi­lar com­pu­te-opti­mi­zed Ama­zon EC2 instances

SANTA CLARA, Calif., Jan. 12, 2022 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) announ­ced Ama­zon Web Ser­vices, Inc. (AWS) has expan­ded its AMD EPYC™ pro­ces­sor-based offe­rings with the gene­ral avai­la­bi­li­ty of the new Ama­zon EC2 Hpc6a ins­tances, which are pur­po­se-built for high per­for­mance com­pu­ting (HPC) workloads in the cloud.

Accor­ding to AWS, Ama­zon EC2 Hpc6a ins­tances deli­ver up to 65 per­cent bet­ter pri­ce-per­for­mance com­pared to simi­lar Ama­zon EC2 ins­tances. Hpc6a will help cus­to­mers run their most com­pu­te-inten­si­ve HPC workloads like, geno­mics, com­pu­ta­tio­nal flu­id dyna­mics, wea­ther fore­cas­ting, finan­cial risk mode­ling, EDA for semi­con­duc­tor design, com­pu­ter-aided engi­nee­ring, and seis­mic ima­ging. (…) Wei­ter­le­sen »

GIGABYTE stellt die AMD Radeon™ RX 6500 XT Grafikkarten vor

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Das WINDFORCE Kühl­sys­tem ermög­licht her­vor­ra­gen­de 1080p Gam­ing-Per­for­mance und erstaun­li­che Frameraten

GIGABYTE TECHNOLOGY Co. Ltd, einer der füh­ren­den Her­stel­ler von Pre­mi­um Gam­ing Hard­ware, hat die neu­en Gra­fik­kar­ten mit AMD Rade­on™ RX 6500 XT GPUs vor­ge­stellt. Die RX 6500 XT GAMING OC 4G und die Rade­on RX 6500 XT EAGLE 4G Gra­fik­kar­ten sind mit WINDFORCE Küh­lung aus­ge­stat­tet und wur­den ent­wi­ckelt, um groß­ar­ti­ge Leis­tung in Spie­len mit erstaun­li­cher Effi­zi­enz zu ver­ei­nen. Erle­be die Zukunft, genie­ße exzel­len­tes 1080p Gam­ing und stür­ze dich in beein­dru­cken­de vir­tu­el­le Wel­ten mit der Leis­tung der neu­en Grafikkarten-Generation.

Basie­rend auf der bahn­bre­chen­den AMD RDNA™ 2 Gam­ing-Archi­tek­tur, sind die neu­en Gra­fik­kar­ten spe­zi­ell ent­wi­ckelt wor­den, um ein unglaub­li­ches Erleb­nis in 1080p zu ermög­li­chen und mehr Spie­lern Zugang zu popu­lä­ren AAA und ESport Titeln zu ermög­li­chen. Die Gra­fik­kar­ten bie­ten hohe Band­brei­ten, gerin­ge Laten­zen dank AMD Infi­ni­ty Cache™ und extrem schnel­le 4GB GDDR6 Spei­cher. Dabei unter­stüt­zen sie auch Micro­soft Win­dows 11 und Micro­soft DirectX® 12 Ulti­ma­te, sowie AMD Smart Access Memo­ry™ Tech­no­lo­gie, AMD Fide­li­ty­FX™ Ups­ca­ling und wei­te­re fort­schritt­li­che Funk­tio­nen, die ein visu­ell beein­dru­cken­des Spiel­erleb­nis mit hohen Bild­wie­der­hol­ra­ten erlauben.

Die Rade­on RX 6500 XT GAMING OC 4G Gra­fik­kar­te nutzt das WINDFORCE Kühl­sys­tem, Screen Coo­ling Tech­no­lo­gie und eine schüt­zen­de Back Pla­te, was sie zur idea­len Wahl für Spie­ler macht, denen Per­for­mance wich­tig ist. Auch die Rade­on RX 6500 XT EAGLE 4G ver­fügt über WINDFORCE Küh­lung und ver­eint ein ein­zig­ar­ti­ges Design mit hoher Effi­zi­enz und Lang­le­big­keit. (…) Wei­ter­le­sen »

BIOSTAR INTRODUCES NEW AMD RADEON™ RX 6500 XT GRAPHICS CARD

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UNLEASH SMOOTH 1080P GAMING WITH BREATHTAKING VISUALS

Janu­ary 6th, 2022, Tai­pei, Tai­wan - BIOSTAR, a lea­ding manu­fac­tu­rer of mother­boards, gra­phics cards, and sto­rage devices, today intro­du­ced the new BIOSTAR AMD Rade­on™ RX 6500 XT gra­phics card.
 
The new BIOSTAR Rade­on™ RX 6500 XT gra­phics card is built on the breakth­rough AMD RDNA™ 2 gam­ing archi­tec­tu­re, engi­nee­red to deli­ver incre­di­ble gam­ing per­for­mance with remar­kab­le effi­ci­en­cy. (…) Wei­ter­le­sen »

ThinkPad Z Series Ushers in a New Look and Recycled Materials for the Iconic Brand

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LAS VEGAS – Janu­ary 4, 2022 – Leno­vo™ is thril­led to announ­ce a new series of Think­Pad lap­tops fea­turing stun­ning pro­gres­si­ve designs that break the mold and intro­du­ce new colors and mate­ri­als for our pre­mi­um busi­ness lap­top portfolio.

The all-new Think­Pad Z13 and Z16 embark on a con­tem­po­ra­ry design phi­lo­so­phy tar­ge­ting a dif­fe­rent busi­ness user audi­ence. The new striking design reflects chan­ging atti­tu­des towards tech­no­lo­gy, its impact on the envi­ron­ment and the ori­g­ins of raw com­pon­ents. Not only is the design meant to pro­vi­de indi­vi­dua­li­stic pre­mi­um color accents such as bron­ze and arc­tic grey, but it also fea­tures more sus­tainable mate­ri­als such as recy­cled alu­mi­num1, or recy­cled black vegan lea­ther2. Sus­taina­bi­li­ty extends to the pack­a­ging which is made from 100% recy­clable and com­post­a­ble bam­boo and sug­ar­ca­ne, and the AC power adap­ter uses 90% Post-Con­su­mer Con­tent (PCC). (…) Wei­ter­le­sen »

ASRock Announces AMD Radeon™ RX 6500 XT Graphics Cards Intense 1080p Gaming Performance

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TAIPEI, TAIWAN, Janu­ary 5, 2022 – ASRock, the lea­ding glo­bal mother­board, gra­phics card and mini PC manu­fac­tu­rer, today announ­ced the new Phan­tom Gam­ing and Chal­len­ger series gra­phics cards based on AMD Rade­on™ RX 6500 XT GPUs.

Built on the 6nm manu­fac­tu­ring pro­cess and the breakth­rough AMD RDNA™ 2 gam­ing archi­tec­tu­re, the new ASRock gra­phics cards are desi­gned to make incre­di­ble 1080p gam­ing expe­ri­en­ces for popu­lar AAA and esports titles acces­si­ble to more gamers. They offer high-band­width, low-laten­cy AMD Infi­ni­ty Cache™ and high-speed 4GB GDDR6 memo­ry. They also sup­port Micro­soft® Win­dows® 11 and Micro­soft® DirectX® 12 Ulti­ma­te, AMD Smart Access Memo­ry™ tech­no­lo­gy, AMD Fide­li­ty­FX™ Super Reso­lu­ti­on ups­ca­ling tech­no­lo­gy and other advan­ced fea­tures that pro­vi­de visual­ly stun­ning, high-refresh rate gam­ing expe­ri­en­ces. (…) Wei­ter­le­sen »

AMD Unveils New Power-Efficient, High-Performance Mobile Graphics for Premium and Thin-and-Light Laptops, and New Desktop Graphics Cards

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– Expan­ded AMD Rade­on RX 6000M Series mobi­le gra­phics offer 20 per­cent fas­ter per­for­mance on avera­ge than cur­rent lin­e­up1; New AMD Rade­on RX 6000S Series mobi­le gra­phics deli­ver world-class, high-per­­for­­mance gam­ing for next-gen thin-and-light lap­tops – AMD Rade­on RX 6500 XT desk­top gra­phics cards, start­ing at $199 SEP USD, make incre­di­ble 1080p gam­ing acces­si­ble to more (…) Wei­ter­le­sen »

AMD Unveils New Ryzen Mobile Processors Uniting “Zen 3+” core with AMD RDNA 2 Graphics in Powerhouse Design

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— Ryzen 6000 Series pro­ces­sors offer huge gene­ra­tio­nal uplift with up to 11% more sin­gle threa­ded per­for­mance, up to 28% more mul­ti-threa­ded per­for­mance, and up to 2x more gra­phics per­for­mance com­pared to the Ryzen 5000 Series — 

— New AMD Ryzen 7 5800X3D desk­top pro­ces­sors with powerful 3D V‑Cache tech­no­lo­gy ele­va­te gam­ing performance — 

SANTA CLARA, Calif. 01/04/2022

Today, during the 2022 Pro­duct Pre­mie­re live­stream event,  AMD (NASDAQ: AMD) announ­ced the full lin­e­up of new AMD Ryzen™ 6000 Series pro­ces­sors for lap­tops, brin­ging the new, high­ly-effi­ci­ent and extre­me­ly powerful, “Zen 3+” core archi­tec­tu­re tog­e­ther with all-new AMD RDNA™ 2 archi­tec­tu­re-based on-chip gra­phics. The new AMD Ryzen 6000 Series pro­ces­sors are built using TSMC’s 6nm pro­cess tech­no­lo­gy and deli­ver unpre­ce­den­ted levels of built-in gra­phics per­for­mance, offe­ring revo­lu­tio­na­ry 1080p AAA gam­ing, along with cut­ting-edge fea­tures and superb bat­tery life. AMD also announ­ced the new Ryzen™ 7 5800X3D desk­top pro­ces­sor with AMD 3D V‑Cache™ tech­no­lo­gy for eli­te-level gam­ing pe (…) Wei­ter­le­sen »

AMD and Xilinx Provide Update Regarding Expected Timing of Acquisition Close

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SILICON VALLEY, Calif., Dec. 30, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) and Xilinx, Inc. (NASDAQ: XLNX) today released the fol­lo­wing state­ment rela­ted to the sta­tus of glo­bal regu­la­to­ry appr­ovals for AMD’s pro­po­sed acqui­si­ti­on of Xilinx.

“We con­ti­nue making good pro­gress on the requi­red regu­la­to­ry appr­ovals to clo­se our tran­sac­tion. While we had pre­vious­ly expec­ted that we would secu­re all appr­ovals by the end of 2021, we have not yet com­ple­ted the pro­cess and we now expect the tran­sac­tion to clo­se in the first quar­ter of 2022. Our con­ver­sa­ti­ons with regu­la­tors con­ti­nue to pro­gress pro­duc­tively, and we expect to secu­re all requi­red appr­ovals.” (…) Wei­ter­le­sen »

AMD and MediaTek Develop AMD RZ600 Series Wi-Fi 6E Modules to Enhance Laptop and Desktop PC Connectivity Experiences

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New Media­Tek Filo­gic 330P Wi-Fi 6E chip­set deli­vers seam­less con­nec­ti­vi­ty and lon­ger bat­tery life

LAGUNA BEACH, Calif., Nov.18, 2021 /PRNewswire/ — Media­Tek (TWSE: 2454) and AMD (NASDAQ: AMD) today announ­ced a col­la­bo­ra­ti­on to co-engi­neer indus­try lea­ding Wi-Fi® solu­ti­ons, start­ing with the AMD RZ600 Series Wi-Fi 6E modu­les con­tai­ning MediaTek’s new Filo­gic 330P chip­set. The Filo­gic 330P chip­set will power next-gene­ra­ti­on AMD Ryzen-series lap­top and desk­top PCs in 2022 and bey­ond, deli­ve­ring fast Wi-Fi speeds with low laten­cy and less inter­fe­rence from other signals.

To opti­mi­ze the AMD RZ600 Series Wi-Fi 6E modu­les with a focus on deli­ve­ring seam­less con­nec­ti­vi­ty expe­ri­en­ces for cus­to­mers, AMD and Media­Tek deve­lo­ped and cer­ti­fied PCIe® and USB inter­faces for modern sleep sta­tes and power manage­ment, which are vital ele­ments of modern cus­to­mer expe­ri­en­ces. Fur­ther, the opti­miza­ti­on pro­cess included stress test­ing and ensu­ring com­pa­ti­bi­li­ty stan­dards, which may ulti­m­ate­ly redu­ce deve­lo­p­ment time for OEM cus­to­mers. (…) Wei­ter­le­sen »

NVIDIA Announces Financial Results for Third Quarter Fiscal 2022

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Wed­nes­day, Novem­ber 17, 2021

  • Record reve­nue of $7.10 bil­li­on, up 50 per­cent from a year earlier
  • Record Data Cen­ter reve­nue of $2.94 bil­li­on, up 55 per­cent from a year earlier
  • Record Gam­ing reve­nue of $3.22 bil­li­on, up 42 per­cent from a year earlier

SANTA CLARA, Calif., Nov. 17, 2021 (GLOBE NEWSWIRE) — NVIDIA (NASDAQ: NVDA) today repor­ted record reve­nue for the third quar­ter ended Octo­ber 31, 2021, of $7.10 bil­li­on, up 50 per­cent from a year ear­lier and up 9 per­cent from the pre­vious quar­ter, with record reve­nue from the company’s Gam­ing, Data Cen­ter and Pro­fes­sio­nal Visua­liza­ti­on mar­ket platforms.

GAAP ear­nings per diluted share for the quar­ter were $0.97, up 83 per­cent from a year ago and up 3 per­cent from the pre­vious quar­ter. Non-GAAP ear­nings per diluted share were $1.17, up 60 per­cent from a year ago and up 13 per­cent from the pre­vious quarter.

“The third quar­ter was out­stan­ding, with record reve­nue,” said Jen­sen Huang, foun­der and CEO of NVIDIA. “Demand for NVIDIA AI is sur­ging, dri­ven by hypers­ca­le and cloud sca­le-out, and broa­de­ning adop­ti­on by more than 25,000 com­pa­nies. NVIDIA RTX has reinven­ted com­pu­ter gra­phics with ray tra­cing and AI, and is the ide­al upgrade for the lar­ge, gro­wing mar­ket of gamers and crea­tors, as well as desi­gners and pro­fes­sio­nals buil­ding home workstations.

“Our GTC event series show­ca­ses the expan­ding uni­ver­se of NVIDIA acce­le­ra­ted com­pu­ting. Last week’s event was our most suc­cessful yet, high­light­ing diver­se appli­ca­ti­ons, inclu­ding sup­p­ly-chain logi­stics, cyber­se­cu­ri­ty, natu­ral lan­guage pro­ces­sing, quan­tum com­pu­ting rese­arch, robo­tics, self-dri­ving cars, cli­ma­te sci­ence and digi­tal biology.

“Omni­ver­se was a major the­me at GTC. We show­ed what is pos­si­ble when we can jump into vir­tu­al worlds. Omni­ver­se will be used from col­la­bo­ra­ti­ve design, cus­to­mer ser­vice ava­tars and video con­fe­ren­cing, to digi­tal twins of fac­to­ries, pro­ces­sing plants, even enti­re cities. Omni­ver­se brings tog­e­ther NVIDIA’s exper­ti­se in AI, simu­la­ti­on, gra­phics and com­pu­ting infra­struc­tu­re. This is the tip of the ice­berg of what’s to come,” he said.

NVIDIA paid quar­ter­ly cash divi­dends of $100 mil­li­on in the third quar­ter. It will pay its next quar­ter­ly cash divi­dend of $0.04 per share on Decem­ber 23, 2021, to all share­hol­ders of record on Decem­ber 2, 2021. (…) Wei­ter­le­sen »

AMD Processors Accelerating Performance of Top Supercomputers Worldwide

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Growing preference for EPYC™ processors resulted in the number of AMD-powered supercomputers growing 3.5x year-over-year

SANTA CLARA, Calif., Nov. 16, 2021 (GLOBE NEWSWIRE) — During this year’s Super­com­pu­ting Con­fe­rence 2021 (SC21), AMD (NASDAQ: AMD) is show­ca­sing its expan­ded pre­sence and gro­wing pre­fe­rence in the high per­for­mance com­pu­ting (HPC) indus­try with the excep­tio­nal inno­va­ti­on and adop­ti­on of AMD data cen­ter pro­ces­sors and acce­le­ra­tors. Cus­to­mers across the indus­try con­ti­nue to expand their use of AMD EPYC™ pro­ces­sors and AMD Instinct™ acce­le­ra­tors to power cut­ting-edge rese­arch nee­ded to address some of the world’s big­gest chal­lenges in cli­ma­te, life sci­en­ces, medi­ci­ne, and more.

Gro­wing pre­fe­rence for AMD is show­ca­sed in the latest Top500 list. AMD now powers 73 super­com­pu­ters, com­pared to 21 in the Novem­ber 2020 list, a more than 3x year-over-year increase. Addi­tio­nal­ly, AMD powers four out of the top ten most powerful super­com­pu­ters in the world, as well as the most powerful super­com­pu­ter in EMEA. Final­ly, AMD EPYC 7003 series pro­ces­sors, which laun­ched eight months ago, are uti­li­zed by 17 of the 75 AMD powered super­com­pu­ters in the list, demons­t­ra­ting the rapid adop­ti­on of the latest gene­ra­ti­on of EPYC processors.

“The demands of super­com­pu­ting users have increased expo­nen­ti­al­ly as the world seeks to acce­le­ra­te rese­arch, redu­cing the time to dis­co­very of valuable infor­ma­ti­on,” said For­rest Nor­rod, seni­or vice pre­si­dent and gene­ral mana­ger, Data Cen­ter and Embedded Solu­ti­ons Busi­ness Group, AMD. “With AMD EPYC CPUs and Instinct acce­le­ra­tors, we con­ti­nue to evol­ve our pro­duct offe­ring to push the boun­da­ries of data cen­ter tech­no­lo­gies enab­ling fas­ter rese­arch, bet­ter out­co­mes and more impact on the world.”

AMD has also been reco­gni­zed in the annu­al HPC­wire Rea­ders’ and Edi­tors’ Choice Awards at SC21. The com­pa­ny won ten awards inclu­ding Best Sus­taina­bi­li­ty Inno­va­ti­on in HPC, Best HPC Ser­ver Pro­duct and the Out­stan­ding Lea­der­ship in HPC award pre­sen­ted to Pre­si­dent and CEO Dr. Lisa Su. (…) Wei­ter­le­sen »

Still waiting for Exascale: Japan’s Fugaku outperforms all competition once again

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FRANKFURT, Ger­ma­ny; BERKELEY, Calif.; and KNOXVILLE, Tenn.— The 58th annu­al edi­ti­on of the TOP500 saw litt­le chan­ge in the Top10. The Micro­soft Azu­re sys­tem cal­led Voy­a­ger-EUS2 was the only machi­ne to shake up the top spots, clai­ming No. 10. Based on an AMD EPYC pro­ces­sor with 48 cores and 2.45GHz working tog­e­ther with an NVIDIA A100 GPU and 80 GB of memo­ry, Voy­a­ger-EUS2 also uti­li­zes a Mel­lan­ox HDR Infi­ni­band for data transfer. 

While the­re were no other chan­ges to the posi­ti­ons of the sys­tems in the Top10, Perl­mut­ter at NERSC impro­ved its per­for­mance to 70.9 Pflop/s. Housed at the Law­rence Ber­ke­ley Natio­nal Labo­ra­to­ry, Perlmutter’s increased per­for­mance couldn’t move it from its pre­vious­ly held No. 5 spot. 

Fug­a­ku con­ti­nues to hold the No. 1 posi­ti­on that it first ear­ned in June 2020. Its HPL bench­mark score is 442 Pflop/s, which excee­ded the per­for­mance of Sum­mit at No. 2 by 3x. Instal­led at the Riken Cen­ter for Com­pu­ta­tio­nal Sci­ence (R‑CCS) in Kobe, Japan, it was co-deve­lo­ped by Riken and Fuji­tsu and is based on Fujitsu’s cus­tom ARM A64FX pro­ces­sor. Fug­a­ku also uses Fujitsu’s Tofu D inter­con­nect to trans­fer data bet­ween nodes. 

In sin­gle or fur­ther-redu­ced pre­cis­i­on, which are often used in machi­ne lear­ning and A.I. appli­ca­ti­on, Fug­a­ku has a peak per­for­mance abo­ve 1,000 PFlop/s (1 Exaflop/s). As a result, Fug­a­ku is often intro­du­ced as the first “Exas­ca­le” super­com­pu­ter. (…) Wei­ter­le­sen »

Xilinx Launches Alveo U55C, Its Most Powerful Accelerator Card Ever, Purpose-Built for HPC and Big Data Workloads

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Breakthrough HPC clustering solution and simplified programmability enable massive scale-out of cutting-edge compute across existing customer infrastructure and network

ST. LOUIS–(BUSINESS WIRE)–SC21 – Xilinx, Inc. (NASDAQ: XLNX), the lea­der in adap­ti­ve com­pu­ting, today at the SC21 super­com­pu­ting con­fe­rence intro­du­ced the Alveo™ U55C data cen­ter acce­le­ra­tor card and a new stan­dards-based, API-dri­ven clus­te­ring solu­ti­on for deploy­ing FPGAs at mas­si­ve sca­le. The Alveo U55C acce­le­ra­tor brings supe­ri­or per­for­mance-per-watt to high per­for­mance com­pu­ting (HPC) and data­ba­se workloads and easi­ly sca­les through the Xilinx® HPC clus­te­ring solution.

Pur­po­se-built for HPC and big data workloads, the new Alveo U55C card is the company’s most powerful Alveo acce­le­ra­tor card ever, offe­ring the hig­hest com­pu­te den­si­ty and HBM capa­ci­ty in the Alveo acce­le­ra­tor port­fo­lio. Tog­e­ther with the new Xilinx RoCE v2-based clus­te­ring solu­ti­on, a broad spec­trum of cus­to­mers with lar­ge-sca­le com­pu­te workloads can now imple­ment powerful FPGA-based HPC clus­te­ring using their exis­ting data cen­ter infra­struc­tu­re and net­work. (…) Wei­ter­le­sen »