Kategorie: Pressemitteilungen

In die­ser Sek­ti­on wer­den Pres­se­mit­tei­lun­gen der Her­stel­ler 1:1 ver­öf­fent­licht. Pla­net 3DNow! über­nimmt weder für die Rich­tig­keit der Anga­ben noch für die Art der For­mu­lie­rung jed­we­de Ver­ant­wor­tung. Die Anga­ben kön­nen sub­jek­tiv sein und geben nicht not­wen­di­ger­wei­se die Mei­nung der auf Pla­net 3DNow! schrei­ben­den Autoren wieder.

Xilinx Reports Record Revenue in Fiscal Second Quarter 2022

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Xilinx Reports Record Reve­nue in Fis­cal Second Quar­ter 2022

  • Record reve­nue of $936 mil­li­on, repre­sen­ting 7% sequen­ti­al growth and 22% annu­al growth amidst con­ti­nuing indus­try-wide sup­p­ly chain challenges
  • Aero­space & Defen­se, Indus­tri­al and Test, Mea­su­re­ment & Emu­la­ti­on (AIT) reve­nue increased 20% sequen­ti­al­ly, with strong per­for­mance in all sub-mar­kets led by ano­ther record per­for­mance in the Indus­tri­al end mar­ket and impro­ve­ment in Aero­space & Defen­se business
  • Auto­mo­ti­ve, Broad­cast and Con­su­mer (ABC) reve­nue in the quar­ter increased 19% sequen­ti­al­ly, with record quar­ters in all sub-mar­kets, led by the Auto­mo­ti­ve end market
  • Wired and Wire­less Group (WWG) reve­nue increased 9% sequen­ti­al­ly and 42% year-over-year as robust glo­bal 5G deploy­ments con­ti­nue and strength from the Wired business
  • Data Cen­ter Group (DCG) reve­nue decli­ned mode­st­ly, down 3% quar­ter-over-quar­ter, as Net­wor­king strength was off­set by a decli­ne in Compute
  • Plat­form trans­for­ma­ti­on con­ti­nues with total Adap­ti­ve SoC reve­nue, which includes Zynq and Ver­sal plat­forms, up 9% sequen­ti­al­ly and 56% year-over-year, and repre­sen­ting 29% of total revenue

SAN JOSE, Calif.–(BUSINESS WIRE)–Oct. 27, 2021– Xilinx, Inc. (Nasdaq: XLNX), the lea­der in adap­ti­ve com­pu­ting, today announ­ced record reve­nues of $936 mil­li­on for the fis­cal second quar­ter, up 7% over the pre­vious quarter.

GAAP net inco­me for the fis­cal second quar­ter was $235 mil­li­on, or $0.94 per diluted share. Non-GAAP net inco­me for the quar­ter was $266 mil­li­on, or $1.06 per diluted share.

As per­mit­ted as of Octo­ber 27, 2021 under the terms of the Mer­ger Agree­ment bet­ween Xilinx and Advan­ced Micro Devices, Inc. (AMD), the Xilinx Board of Direc­tors voted unani­mously to decla­re a cash divi­dend of $0.37 per out­stan­ding share of com­mon stock paya­ble on Novem­ber 15, 2021 to all stock­hol­ders of record at the clo­se of busi­ness on Novem­ber 8, 2021. The divi­dend is con­di­tio­ned upon and will only be paya­ble if the mer­ger has not clo­sed on or befo­re the record date for such divi­dend. (…) Wei­ter­le­sen »

Xilinx and Leading Broadcast and AV System and IP Integrators Deliver Complete, Production-Ready Multimedia Streaming End-Point Solutions

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Oct 26, 2021 

Powered by Xilinx adap­ti­ve SoCs, high­ly inte­gra­ted strea­ming solu­ti­ons are rea­dy-to-ship or cus­to­mi­ze by cus­to­mers for a simp­ler, fas­ter time-to-mar­ket and deployment

SAN JOSE, Calif.–(BUSINESS WIRE)– Xilinx, Inc. (NASDAQ: XLNX), the lea­der in adap­ti­ve com­pu­ting, today announ­ced it is working with its IP and sys­tem inte­gra­tor eco­sys­tem to pro­vi­de the industry’s first and only pro­duc­tion-rea­dy mul­ti­me­dia strea­ming end­point solu­ti­ons for broad­cast and pro­fes­sio­nal audio/video (AV) appli­ca­ti­ons. The­se com­ple­te solu­ti­ons fea­ture powerful Xilinx® Zynq® UltraS­ca­le+™ EV Mul­ti-Pro­ces­sor (MP) sys­tem-on-a-chip (SoC) and Zynq-7000 SoC devices, with inte­gra­tors con­tri­bu­ting FPGA IP, media frame­work soft­ware and pro­duc­tion-rea­dy pro­ducts. The high­ly inte­gra­ted solu­ti­ons are rea­dy-to-ship, or rea­dy to cus­to­mi­ze, making it signi­fi­cant­ly fas­ter and easier for cus­to­mers to bring broad­cast and pro­fes­sio­nal AV pro­ducts to market.

Mul­ti­me­dia strea­ming requi­res fle­xi­ble AV inter­faces, real-time video pro­ces­sing, sup­port for dif­fe­rent pro­fes­sio­nal-gra­de video codecs, and a relia­ble high-band­width Ether­net trans­port lay­er for AV-over-IP, all of which are pro­vi­ded by Xilinx Zynq devices. AV-over-IP is at the heart of broad­cast end­points and infra­struc­tu­re, key­board-video-mou­se tech­no­lo­gies, strea­ming end­points, AV rou­ters and swit­chers, video wall con­trol­lers and col­la­bo­ra­ti­on equip­ment. (…) Wei­ter­le­sen »

AMD Reports Third Quarter 2021 Financial Results

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— Reve­nue increased 54 per­cent year-over-year — Gross Mar­gin grew more than 4 per­cen­ta­ge points year-over-year to 48 percent —

SANTA CLARA, Calif., Oct. 26, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced reve­nue for the third quar­ter of 2021 of $4.3 bil­li­on, ope­ra­ting inco­me of $948 mil­li­on, net inco­me of $923 mil­li­on and diluted ear­nings per share of $0.75. On a non-GAAP* basis, ope­ra­ting inco­me was $1.1 bil­li­on, net inco­me was $893 mil­li­on and diluted ear­nings per share were $0.73.

(…) Wei­ter­le­sen »

AMD to Host Accelerated Data Center Premiere Virtual Event on November 8, 2021

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SANTA CLARA, Calif. 10/25/2021 -AMD (NASDAQ: AMD) will host its Acce­le­ra­ted Data Cen­ter Pre­mie­re on Novem­ber 8, 2021 at 11 a.m. ET, show­ca­sing the company’s upco­ming inno­va­tions with AMD EPYC™ pro­ces­sors and AMD Instinct™ acce­le­ra­tors.

The vir­tu­al event is sla­ted to fea­ture pre­sen­ta­ti­ons from AMD Pre­si­dent and CEO Dr. Lisa Su, Seni­or Vice Pre­si­dent and Gene­ral Mana­ger, Data Cen­ter and Embedded Solu­ti­ons Busi­ness Group For­rest Nor­rod, and Seni­or Vice Pre­si­dent and Gene­ral Mana­ger, Ser­ver Busi­ness Unit Dan McNamara.

The event will be acces­si­ble to the public at www.amd.com/en/events/data-center start­ing at 11 a.m. ET. A replay will be available and can be acces­sed after the con­clu­si­on of the live­stream event.

Supporting Resources:

(…) Wei­ter­le­sen »

Intel Reports Third-Quarter 2021 Financial Results

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News Sum­ma­ry

▪       Third-quar­ter GAAP reve­nue of $19.2 bil­li­on, up 5% year over year (YoY), and non-GAAP reve­nue of $18.1 bil­li­on, up 5% YoY.  Achie­ved all-time record reve­nue in Intel’s Inter­net of Things Group (IOTG) and record third-quar­ter reve­nue in the Data Cen­ter Group (DCG) and Mobi­leye businesses. 

▪       Third-quar­ter GAAP ear­nings-per-share (EPS) was $1.67; non-GAAP EPS was $1.71, which excee­ded July gui­dance by $0.61. Excee­ded July gui­dance for EPS and gross margin.

▪      Rai­sing full-year 2021 EPS and gross mar­gin gui­dance. Now expec­ting GAAP EPS of $4.50 and non-GAAP EPS of $5.28 and GAAP gross mar­gin of 55% and non-GAAP gross mar­gin of 57%1.

▪       Intel CFO Geor­ge Davis announ­ced plans to reti­re in May 2022.

 

SANTA CLARA, Calif., Octo­ber 21, 2021 — Intel Cor­po­ra­ti­on today repor­ted third-quar­ter 2021 finan­cial results.

“Q3 sho­ne an even grea­ter spot­light on the glo­bal demand for semi­con­duc­tors, whe­re Intel has the uni­que breadth and sca­le to lead. Our focus on exe­cu­ti­on con­tin­ued as we star­ted deli­ve­ring on our IDM 2.0 com­mit­ments. We bro­ke ground on new fabs, shared our acce­le­ra­ted path to regain pro­cess per­for­mance lea­der­ship, and unvei­led our most dra­ma­tic archi­tec­tu­ral inno­va­tions in a deca­de. We also announ­ced major cus­to­mer wins across every part of our busi­ness,” said Pat Gel­sin­ger, Intel CEO. “We are still in the ear­ly stages of our jour­ney, but I see the enorm­ous oppor­tu­ni­ty ahead, and I couldn’t be prou­der of the pro­gress we are making towards that opportunity.”

Q3 2021 Finan­cial Highlights

  GAAP   Non-GAAP
  Q3 2021 Q3 2020 vs. Q3 2020   Q3 2021 Q3 2020 vs. Q3 2020
Reve­nue ($B) $19.2 $18.3 up 5%   $18.1 $17.3 up 5%
Gross Mar­gin 56.0% 53.1% up 2.9 ppt   57.8% 56.5% up 1.3 ppt
R&D and MG&A ($B) $5.5 $4.7 up 16%   $5.3 $4.5 up 17%
Ope­ra­ting Margin 27.2% 27.6% down 0.4 ppt   28.8% 30.4% down 1.7 ppt
Tax Rate 0.5% 15.2% down 14.7 ppt   0.4% 15.4% down 15 ppt
Net Inco­me ($B) $6.8 $4.3 up 60%   $7.0 $4.5 up 54%
Ear­nings Per Share $1.67 $1.02 up 64%   $1.71 $1.08 up 59%

In the third quar­ter, the com­pa­ny gene­ra­ted $9.9 bil­li­on in cash from ope­ra­ti­ons and paid divi­dends of $1.4 billion.

(…) Wei­ter­le­sen »

AMD Ryzen™ Threadripper™ PRO Processors Selected for Next-Generation NVIDIA GeForce NOW Cloud Gaming Platform

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ANTA CLARA, Calif., Oct. 21, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced Ryzen™ Thre­ad­rip­per™ PRO pro­ces­sors will help power the new GeForce NOW RTX 3080 mem­ber­ship tier from NVIDIA. Dri­ven by AMD Ryzen Thre­ad­rip­per PRO pro­ces­sors, the new GeForce NOW RTX 3080 mem­ber­ship gives next-gene­ra­ti­on cloud gam­ing expe­ri­en­ces to play­ers everywhere.

NVIDIA’s GeForce Super­Pods harness the class-lea­ding per­for­mance of AMD Ryzen Thre­ad­rip­per PRO with unpar­al­le­led core counts and high-fre­quen­cy clock speeds to sup­port over 39 peta­flops of gra­phics per­for­mance. Each pro­ces­sor also fea­tures 128 PCIe® Gen 4 lanes, indus­try-lea­ding con­nec­ti­vi­ty, and unmat­ched memo­ry band­width1 to ensu­re GeForce NOW RTX 3080 mem­bers have the tech­no­lo­gy requi­red for a smooth, relia­ble experience.

“The Ryzen Thre­ad­rip­per PRO lin­e­up was desi­gned to offer users incre­di­ble per­for­mance and unri­va­led band­width and sets the indus­try stan­dard for extre­me com­pu­ting per­for­mance across a ran­ge of use cases, inclu­ding the rapidly-gro­wing cloud gam­ing space,” said Chris Kilb­urn, cor­po­ra­te vice pre­si­dent and gene­ral mana­ger, cli­ent com­po­nent busi­ness, AMD. “Working with NVIDIA, it is clear that the expan­si­ve fea­ture set of Ryzen Thre­ad­rip­per PRO is the per­fect plat­form to power their next-gene­ra­ti­on cloud gam­ing expe­ri­ence.” (…) Wei­ter­le­sen »

Blacknut Cloud Gaming Solution Powered by Radian Arc’s Latest GPU Edge Computing Platform and AMD Radeon™ PRO V520 Graphics plus AMD EPYC™ Series Processors

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LOS ANGELES – Octo­ber 20, 2021 – Black­nut will be pre­sen­ting its cloud gam­ing solu­ti­on, built on Radi­an Arc’s turn­key Infra­struc­tu­re as a Ser­vice (IaaS) GPU-Edge plat­form which is powered by AMD Rade­on™ PRO V520 GPUs and AMD EPYC™ CPUs, at Mobi­le World Con­gress Los Ange­les 2021 in the AMD booth #1820.

Cloud gam­ing is an emer­ging cate­go­ry in the games indus­try with mar­ket pro­jec­tions esti­ma­ted to exceed $6 bil­li­on in reve­nue by 2024. Black­nut is the lea­ding cloud gam­ing solu­ti­on dis­tri­bu­ted to con­su­mers and busi­nesses through ISPs, device manu­fac­tu­r­ers, over the top ser­vices and media companies.

Radi­an Arc and Black­nut have deve­lo­ped a turn­key solu­ti­on for cloud gam­ing uti­li­zing AMD Rade­on PRO V520 GPUs and AMD EPYC CPUs to harness a high-per­for­mance gam­ing archi­tec­tu­re, deli­ver­ed across ISPs inclu­ding 5G net­works. (…) Wei­ter­le­sen »

AIDA64 v6.50 Press Release

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GeForce RTX LHR Monitoring and Windows 11 Support

BUDAPEST, Hun­ga­ry — Oct 19, 2021 — Final­Wire Ltd. today announ­ced the imme­dia­te avai­la­bi­li­ty of AIDA64 Extre­me 6.50 soft­ware, a stream­li­ned dia­gno­stic and bench­mar­king tool for home users; the imme­dia­te avai­la­bi­li­ty of AIDA64 Engi­neer 6.50 soft­ware, a pro­fes­sio­nal dia­gno­stic and bench­mar­king solu­ti­on for cor­po­ra­te IT tech­ni­ci­ans and engi­neers; the imme­dia­te avai­la­bi­li­ty of AIDA64 Busi­ness 6.50 soft­ware, an essen­ti­al net­work manage­ment solu­ti­on for small and medi­um sca­le enter­pri­ses; and the imme­dia­te avai­la­bi­li­ty of AIDA64 Net­work Audit 6.50 soft­ware, a dedi­ca­ted net­work audit tool­set to coll­ect and mana­ge cor­po­ra­te net­work inventories.

The new AIDA64 update intro­du­ces sup­port for Win­dows 11 and AMD 4700S pro­ces­sor, moni­to­ring of sen­sor values on VoCo­re LCD dis­plays, and sup­ports the latest AMD and Intel CPU plat­forms as well as the new gra­phics and GPGPU com­pu­ting tech­no­lo­gies by both AMD and nVIDIA.

New features & improvements

  • Micro­soft Win­dows 11 and Win­dows Ser­ver 2022 support
  • AVX2 and FMA acce­le­ra­ted 64-bit bench­marks for AMD 4700S Car­di­nal CPU
  • Impro­ved sup­port for Intel Alder Lake CPU
  • Aqua Com­pu­ter Leak­S­hield sen­sor support
  • Impro­ved sup­port for pro­ces­sors with 64 or more cores
  • Matrix Orbi­tal EVE4 and VoCo­re LCD support
  • Enhan­ced sup­port for LGA-1700 motherboards
  • Sup­port for VMware Work­sta­tion v16
  • Rama­xel AM620 and AV310 SSD support
  • GPU details for AMD Rade­on RX 6600M and 6700M Series
  • GPU details for nVI­DIA CMP 50HX, CMP 170HX, GeForce RTX 3000 LHR Series

(…) Wei­ter­le­sen »

Oski Technology, an Expert in Formal Verification, Joins NVIDIA

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We are exci­ted to announ­ce that Oski Tech­no­lo­gy, a com­pa­ny spe­cia­li­zing in for­mal veri­fi­ca­ti­on methods, will be joi­ning NVIDIA.

Modern pro­ces­sors pack tens of bil­li­ons of tran­sis­tors, tiny on/off swit­ches con­nec­ted by bil­li­ons of micro­sco­pic pathways. A bug in a sin­gle tran­sis­tor can pre­vent a chip from ope­ra­ting cor­rect­ly, requi­ring cos­t­ly revi­si­ons to fix.

Today, veri­fi­ca­ti­on engi­neers rely on two very dif­fe­rent methods to make sure bugs don’t make it into sili­con — simu­la­ti­on and for­mal verification.

The first approach reli­es on mil­li­ons of simu­la­ti­ons that search for bugs, exer­cis­ing cor­ner cases in careful­ly desi­gned tests.

For­mal veri­fi­ca­ti­on, Oski’s spe­cial­ty, is a powerful alter­na­ti­ve that uses mathe­ma­ti­cal ana­ly­sis of a design ins­tead of simu­la­ti­ons to pro­ve that a par­ti­cu­lar fea­ture beha­ves cor­rect­ly for all pos­si­ble inputs.

Whe­re­as simu­la­ti­on injects 1’s and 0’s into a design to test whe­ther num­bers are added pro­per­ly, Oski’s approach for­mal­ly veri­fies that “c = a + b.” (…) Wei­ter­le­sen »

TSMC Reports Third Quarter EPS of NT$6.03

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Hsin­chu, Tai­wan, R.O.C., Oct. 14, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced con­so­li­da­ted reve­nue of NT$414.67 bil­li­on, net inco­me of NT$156.26 bil­li­on, and diluted ear­nings per share of NT$6.03 (US$1.08 per ADR unit) for the third quar­ter ended Sep­tem­ber 30, 2021.

Year-over-year, third quar­ter reve­nue increased 16.3% while net inco­me and diluted EPS both increased 13.8%. Com­pared to second quar­ter 2021, third quar­ter results repre­sen­ted a 11.4% increase in reve­nue and a 16.3% increase in net inco­me. All figu­res were pre­pared in accordance with TIFRS on a con­so­li­da­ted basis.

In US dol­lars, third quar­ter reve­nue was $14.88 bil­li­on, which increased 22.6% year-over-year and increased 12.0% from the pre­vious quarter.

Gross mar­gin for the quar­ter was 51.3%, ope­ra­ting mar­gin was 41.2%, and net pro­fit mar­gin was 37.7%. (…) Wei­ter­le­sen »

AMD to Report Fiscal Third Quarter 2021 Financial Results

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SANTA CLARA, Calif., Oct. 13, 2021 — AMD (NASDAQ: AMD) announ­ced today that it will report third quar­ter 2021 finan­cial results on Tues­day, Octo­ber 26, 2021 after the clo­se of mar­ket. Manage­ment will con­duct a con­fe­rence call to dis­cuss the­se results at 5:00 p.m. EDT / 2:00 p.m. PDT. Inte­res­ted par­ties are invi­ted to lis­ten to the web­cast of the con­fe­rence call via AMD’s Inves­tor Rela­ti­ons web­site ir.amd.com.

(…) Wei­ter­le­sen »

AMD Radeon™ RX 6600 Graphics Card Delivers Incredible High-Refresh Rate 1080p Gaming

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– Up to 1.3X bet­ter per­for­mance-per-watt than the com­pe­ti­ti­on in sel­ect titles at 1080p max settings –

– Harnes­ses AMD RDNA 2 gam­ing archi­tec­tu­re, AMD Fide­li­ty­FX Super Reso­lu­ti­on, AMD Infi­ni­ty Cache, AMD Smart Access Memo­ry tech­no­lo­gy and other powerful fea­tures to pro­vi­de enthu­si­ast-level per­for­mance and stun­ning visu­al fidelity –

SANTA CLARA, Calif. 

AMD (NASDAQ: AMD) today laun­ched the AMD Rade­on™ RX 6600 gra­phics card, desi­gned to pro­vi­de visual­ly stun­ning, high-refresh rate 1080p gam­ing expe­ri­en­ces to the midran­ge market.

The AMD Rade­on RX 6600 gra­phics card lever­a­ges breakth­rough AMD RDNA™ 2 archi­tec­tu­re, the only gam­ing archi­tec­tu­re that spans from desk­top PCs, lap­tops and con­so­les to mobi­le devices and auto­mo­ti­ve info­tain­ment sys­tems. Offe­ring 32 MB of high-per­for­mance AMD Infi­ni­ty Cache, 8GB of GDDR6 memo­ry, AMD Smart Access Memo­ry™ tech­no­lo­gy and sup­port for the Micro­soft Win­dows 11 ope­ra­ting sys­tem, the AMD Rade­on RX 6600 gra­phics card is desi­gned to bring next-gene­ra­ti­on desk­top-level expe­ri­en­ces to PC gamers. It also sup­ports the AMD Fide­li­ty­FX™ Super Reso­lu­ti­on open-source spa­ti­al ups­ca­ling solu­ti­on, which is desi­gned to increase frame­ra­tes in sel­ect titles while deli­ve­ring high-reso­lu­ti­on gam­ing expe­ri­en­ces. (…) Wei­ter­le­sen »

TSMC September 2021 Revenue Report

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Hsin­chu, Tai­wan, R.O.C. – Oct. 8, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced its net reve­nue for Sep­tem­ber 2021: On a con­so­li­da­ted basis, reve­nue for Sep­tem­ber 2021 was appro­xi­m­ate­ly NT$152.69 bil­li­on, an increase of 11.1 per­cent from August 2021 and an increase of 19.7 per­cent from Sep­tem­ber 2020. Reve­nue for Janu­ary through Sep­tem­ber 2021 tota­led NT$1,149.23 bil­li­on, an increase of 17.5 per­cent com­pared to the same peri­od in 2020.
(…) Wei­ter­le­sen »

Synopsys Accelerates Multi-Die Designs with Industry’s First Complete HBM3 IP and Verification Solutions

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HBM3 IP Solu­ti­on Deli­vers Maxi­mum Memo­ry Band­width of 921 GB/s for High-Per­for­mance Com­pu­ting, AI, and Gra­phics SoCs

MOUNTAIN VIEW, Calif., Oct. 7, 2021 /PRNews­wire/ –

High­lights of this Announcement:

  • The Design­Wa­re HBM3 Con­trol­ler, PHY, and Veri­fi­ca­ti­on IP redu­ces inte­gra­ti­on risk and maxi­mi­zes memo­ry per­for­mance in 2.5D mul­ti-die systems
  • Low-laten­cy HBM3 Con­trol­ler with fle­xi­ble con­fi­gu­ra­ti­on opti­ons enhan­ce memo­ry bandwidth
  • Pre-har­den­ed or con­fi­gura­ble HBM3 PHY in 5‑nm pro­cess ope­ra­tes at 7200 Mbps for up to 2X the data rate and impro­ves power effi­ci­en­cy by up to 60% com­pared to HBM2E
  • Veri­fi­ca­ti­on IP and memo­ry models for ZeBu and HAPS offer an end-to-end solu­ti­on for rapid veri­fi­ca­ti­on clo­sure from IP to SoC
  • Syn­op­sys’ 3DIC Com­pi­ler, an inte­gra­ted mul­ti-die design and ana­ly­sis plat­form, pro­vi­des a com­pre­hen­si­ve HBM3 auto-rou­ting solu­ti­on for rapid and robust design development

Syn­op­sys, Inc. (Nasdaq: SNPS) today announ­ced the industry’s first com­ple­te HBM3 IP solu­ti­on, inclu­ding con­trol­ler, PHY, and veri­fi­ca­ti­on IP for 2.5D mul­ti-die packa­ge sys­tems. HBM3 tech­no­lo­gy helps desi­gners meet essen­ti­al high-band­width and low-power memo­ry requi­re­ments for sys­tem-on-chip (SoC) designs tar­ge­ting high-per­for­mance com­pu­ting, AI and gra­phics appli­ca­ti­ons. Syn­op­sys’ Design­Wa­re® HBM3 Con­trol­ler and PHY IP, built on sili­con-pro­ven HBM2E IP, levera­ge Syn­op­sys’ inter­po­ser exper­ti­se to pro­vi­de a low-risk solu­ti­on that enables high memo­ry band­width at up to 921 GB/s.
(…) Wei­ter­le­sen »