Kategorie: Pressemitteilungen

In die­ser Sek­ti­on wer­den Pres­se­mit­tei­lun­gen der Her­stel­ler 1:1 ver­öf­fent­licht. Pla­net 3DNow! über­nimmt weder für die Rich­tig­keit der Anga­ben noch für die Art der For­mu­lie­rung jed­we­de Ver­ant­wor­tung. Die Anga­ben kön­nen sub­jek­tiv sein und geben nicht not­wen­di­ger­wei­se die Mei­nung der auf Pla­net 3DNow! schrei­ben­den Autoren wieder.

Qualcomm Unleashes Wi-Fi Gaming Performance for Windows 11 PCs

Verfasst vonpipin

Micro­soft Win­dows 11 nati­ve sup­port for Wi-Fi Dual Sta­ti­on, cou­pled with Qual­comm Fast­Con­nect 4‑stream Dual Band Simul­ta­neous and broad indus­try sup­port, enables Gam­ing and PC OEMs to effort­less­ly deli­ver ether­net-like relia­bi­li­ty and latency.

Eco­sys­tem sup­port from Acer, AMD, Leno­vo, Micro­soft, Snapd­ra­gon Com­pu­te Plat­forms and Valve

OCT 5, 2021 SAN DIEGO

Qual­comm Tech­no­lo­gies, Inc., tog­e­ther with eco­sys­tem lea­ders span­ning key plat­forms and OEMs, is set to rede­fi­ne wire­less expec­ta­ti­ons for laten­cy-sen­si­ti­ve gam­ing, pro­duc­ti­vi­ty and lear­ning appli­ca­ti­ons on Window’s 11 PCs with Qual­comm® Fast­Con­nect™ sys­tems. Wi-Fi Dual Sta­ti­on desi­gned using Qual­comm® 4‑Stream Dual Band Simul­ta­neous, harnes­ses mul­ti­ple Wi-Fi bands and anten­nas con­curr­ent­ly, to out­per­form tra­di­tio­nal sin­gle band con­nec­tions.  By simul­ta­neous­ly uti­li­zing the 2.4 GHz and 5 GHz band (or 6 GHz whe­re available), laten­cy issues in one band can be easi­ly resol­ved at a sys­tem-level both quick­ly and trans­par­ent­ly to the end user. (…) Wei­ter­le­sen »

3.5” Single Board Computer with AMD Ryzen™ V2000 Processors

Verfasst vonpipin

Tai­pei, Tai­wan, Octo­ber 5, 2021 — IBASE Tech­no­lo­gy Inc. (TPEx: 8050), pro­vi­der of indus­tri­al mother­boards and embedded sys­tems, has rol­led out the IB952 3.5‑inch SBC that is based on AMD Ryzen™ Embedded V2000 pro­ces­sors built with inno­va­ti­ve 7nm pro­cess tech­no­lo­gy and fea­turing up to 8 cores and 16 threads to pro­vi­de the com­pu­ting per­for­mance and power effi­ci­en­cy for today’s IoT mar­ket. With the inte­gra­ted AMD Rade­on Vega gra­phics, the board can sup­port four dis­plays in 4K reso­lu­ti­on through the onboard inter­faces — dual Dis­play­Po­rt, an eDP, and a 24-bit LVDS dual-chan­nel interface.

Mea­su­ring 102mm x 147mm, the IB952 is packed with fea­tures to dri­ve a diver­se ran­ge of space-limi­t­ed appli­ca­ti­ons in POS, kiosk, digi­tal signage and fac­to­ry auto­ma­ti­on. It comes with two DDR4 SO-DIMM sockets to fit up to 64MB RAM, a wide input vol­ta­ge ran­ge (12V ~ 24V) and two Giga­bit Ether­net for high net­work through­put. The board pro­ces­sor is moun­ted on the under­si­de to allow the heats­ink to occu­py the enti­re foot­print, hel­ping desi­gners crea­te sys­tem housings with effi­ci­ent heat dissipation.

Other fea­tures include a TPM (Trus­ted Plat­form Modu­le) chip for hard­ware-based secu­ri­ty and high-speed peri­phe­ral con­nec­ti­vi­ty with two USB 2.0, three USB 3.1, two SATA III, two seri­al ports, and two M.2 sockets (M‑key/E‑key). Both Win­dows 10 and Linux Ubun­tu ope­ra­ting sys­tems are supported.

IB952 FEATURES:

  • AMD Ryzen™ Embedded V2000 pro­ces­sor on board
  • 2x DDR4 SO-DIMM, Max. 64GB
  • 2x PCI‑E Giga­bit LAN
  • 4Supports 2x Dis­play­Po­rt (DP con­nec­tor and Type‑C), 1x eDP, 1x 24-bit LVDS dual-channel
  • 2x USB2.0, 3x USB3.1, 2x SATA III, 2x COM
  • 2x M.2 sockets (M‑key/ E‑key)

(…) Wei­ter­le­sen »

GlobalFoundries Files Registration Statement for Proposed Initial Public Offering

Verfasst vonpipin

Mal­ta, NY, Octo­ber 4, 2021 – Glo­bal­Found­ries® (GF®), a glo­bal lea­der in fea­ture-rich semi­con­duc­tor manu­fac­tu­ring, today announ­ced that it has publicly filed a regis­tra­ti­on state­ment on Form F‑1 with the U.S. Secu­ri­ties and Exch­an­ge Com­mis­si­on (the “SEC”) rela­ting to the pro­po­sed initi­al public offe­ring of its ordi­na­ry shares. The num­ber of ordi­na­ry shares to be offe­red and the pri­ce ran­ge for the pro­po­sed offe­ring have not yet been deter­mi­ned. GF has appli­ed to list its ordi­na­ry shares on the Nasdaq Glo­bal Sel­ect Mar­ket under the ticker sym­bol “GFS.”

Mor­gan Stan­ley, BofA Secu­ri­ties, J.P. Mor­gan, Citigroup and Cre­dit Suis­se are acting as acti­ve book-run­ning mana­gers for the pro­po­sed offe­ring. Deut­sche Bank Secu­ri­ties, HSBC and Jef­fe­ries are acting as addi­tio­nal book-run­ning mana­gers for the pro­po­sed offe­ring. Baird, Cowen, Need­ham & Com­pa­ny, Ray­mond James, Wed­bush Secu­ri­ties, Dre­xel Hamil­ton, Sie­bert Wil­liams Shank and IMI – Inte­sa San­pao­lo are acting as co-mana­gers for the pro­po­sed offe­ring. (…) Wei­ter­le­sen »

AMD Expands European Engineering Capabilities With New Design Center in Romania

Verfasst vonpipin

—New design cen­ter high­lights com­mit­ment to expand engi­nee­ring resour­ces focu­sed on sili­con design in the EU —

SANTA CLARA, Calif. — Oct. 1, 2021 — AMD (NASDAQ: AMD) today announ­ced the ope­ning of a new Design Cen­ter in Roma­nia. Loca­ted in Iasi, the new AMD design cen­ter will employ a diver­se team of engi­neers focu­sed on fur­the­ring both hard­ware and soft­ware inno­va­tions at the heart of the company’s lea­ding high-per­for­mance com­pu­ting solu­ti­ons. (…) Wei­ter­le­sen »

AMD Announces Ambitious Goal to Increase Energy Efficiency of Processors Running AI Training and High Performance Computing Applications 30x by 2025

Verfasst vonpipin

— High-per­for­mance AMD EPYC™ CPUs and AMD Instinct™ acce­le­ra­tors tar­get deli­ve­ring unpre­ce­den­ted advan­ce in ener­gy effi­ci­en­cy for Arti­fi­ci­al Intel­li­gence trai­ning and Super­com­pu­ting applications —

SANTA CLARA, Calif. 09/29/2021

AMD (NASDAQ: AMD) today announ­ced a goal to deli­ver a 30x increase in ener­gy effi­ci­en­cy for AMD EPYC CPUs and AMD Instinct acce­le­ra­tors in Arti­fi­ci­al Intel­li­gence (AI) trai­ning and High Per­for­mance Com­pu­ting (HPC) appli­ca­ti­ons run­ning on acce­le­ra­ted com­pu­te nodes by 2025.1 Accom­pli­shing this ambi­tious goal will requi­re AMD to increase the ener­gy effi­ci­en­cy of a com­pu­te node at a rate that is more than 2.5x fas­ter than the aggre­ga­te indus­try-wide impro­ve­ment made during the last five years.2 (…) Wei­ter­le­sen »

AMD Expands Collaboration With Google Cloud to Deliver Faster Application Performance and Elevate Business Productivity with AMD EPYC™ Processors

Verfasst vonpipin

— Latest Goog­le Com­pu­te Engi­ne N2D vir­tu­al machi­nes use 3rd Gen EPYC™ pro­ces­sors for on avera­ge, over 30% bet­ter price-performance —
SANTA CLARA, Calif. 09/30/2021

AMD (NASDAQ: AMD) today announ­ced Goog­le Cloud is expan­ding its use of AMD EPYC™ pro­ces­sors with the pre­view of N2D Vir­tu­al Machi­nes (VMs) powered by AMD EPYC™ 7003 Series pro­ces­sors. (…) Wei­ter­le­sen »

AIC Launches Multi-node Server and Storage Systems Powered by AMD EPYC™ 7003 Series Processors

Verfasst vonpipin

Tai­pei, Tai­wan, Sep­tem­ber 29, 2021—  AIC Inc., (from now on refer­red to as “AIC”), a lea­ding pro­vi­der in enter­pri­se sto­rage and ser­ver solu­ti­ons, today announ­ced the avai­la­bi­li­ty of its new mul­ti-node per­for­mance opti­mi­zed sys­tems powered by AMD EPYC™ 7003 Series pro­ces­sors. The­se AIC and AMD based pro­ducts are ide­al for edge-cloud sto­rage, enter­pri­se sto­rage, arti­fi­ci­al intel­li­gence, machi­ne lear­ning, HPC, and edge computing.

(…) Wei­ter­le­sen »

Lights, Camera, Action: Xilinx Powers Sony’s New-Gen Live Production Video Switcher

Verfasst vonpipin

Powerful and pro­gramma­ble, Xilinx devices hand­le real-time pro­ces­sing for a wide ran­ge of Sony’s pro­fes­sio­nal products

Sep 29, 2021 — SAN JOSE, Calif.–(BUSINESS WIRE)– Xilinx, Inc. (NASDAQ: XLNX), the lea­der in adap­ti­ve com­pu­ting, today announ­ced that its field-pro­gramma­ble gate array (FPGA) and adap­ti­ve sys­tem-on-chip (SoC) devices are powe­ring a ran­ge of Sony’s elec­tro­nics pro­ducts used for pro­fes­sio­nal audio-video (A/V) appli­ca­ti­ons, inclu­ding the new XVS-G1 4K Live Pro­duc­tion Swit­cher. Tog­e­ther, the com­pa­nies’ cut­ting-edge tech­no­lo­gies are making pos­si­ble the most advan­ced A/V pro­ducts in the world, used to cap­tu­re and broad­cast live events world­wi­de. (…) Wei­ter­le­sen »

Xilinx and NEC Accelerate Next-Generation 5G Radio Units for Global Deployment

Verfasst vonpipin

Sep 23, 2021 — 5G radio units to incor­po­ra­te the Xilinx 7nm Ver­sal AI Core series, enab­ling breakth­rough signal pro­ces­sing for mas­si­ve MIMO beam­forming with O‑RAN interfaces

SAN JOSE, Calif. & TOKYO–(BUSINESS WIRE)– Xilinx, Inc., (NASDAQ: XLNX), a lea­der in adap­ti­ve com­pu­ting, and NEC Cor­po­ra­ti­on (NEC; TSE: 6701) today announ­ced that the com­pa­nies are col­la­bo­ra­ting on NEC’s next-gene­ra­ti­on 5G radio units (RUs) expec­ted to be available for glo­bal deploy­ment in 2022. Xilinx® 7nm Ver­sal® AI Core series devices, which are curr­ent­ly ship­ping in volu­me pro­duc­tion, will enable grea­ter per­for­mance in the new NEC RUs. (…) Wei­ter­le­sen »

AMD CAPTURES HISTORIC-BEST 16% OF SERVER CPU MARKET ACCORDING TO OMDIA DATA CENTER SERVER MARKET TRACKER

Verfasst vonpipin

Com­pe­ti­ti­on in the mar­ket for high-per­for­mance semi­con­duc­tors tar­ge­ting data cen­ter workloads is red hot accor­ding to the latest Data Cen­ter Ser­ver Mar­ket Tra­cker from rese­arch group Omdia.

In the ser­ver CPU mar­ket, AMD scored its best-ever quar­ter from a mar­ket share and sales per­spec­ti­ve with demand from hypers­ca­le cloud ser­vice pro­vi­ders, and Goog­le in par­ti­cu­lar, being a big con­tri­bu­ting fac­tor to AMD’s strong performance.

The demand for ser­vers across all mar­ket seg­ments remain­ed strong in the second quar­ter of 2021 amidst con­cerns about order ful­fill­ment due to com­po­nent cons­traints. The indus­try saw 3.4 mil­li­on ser­vers ship­ped in the second quar­ter of 2021, the same amount as during the record second quar­ter of 2020. This was in line with Omdia’s fore­cast for the quar­ter and resul­ted in a total of $21.5 bil­li­on dol­lars of ven­dor revenue.
(…) Wei­ter­le­sen »

VIA Labs Announces Launch of USB4 Device Silicon

Verfasst vonNero24

VL830 USB4 End­point Device fea­tures 40Gbps band­width with 8K Video and Super­Speed USB sup­port  Tai­pei, Tai­wan, 16th Sep­tem­ber 2021 – VIA Labs, Inc. (VLI), a lea­ding sup­pli­er of Super­Speed USB, USB Power Deli­very Con­trol­lers, and now USB4 con­trol­lers today unvei­led the VIA Labs VL830 USB4 End­point Device. USB4 is a major update to the USB (…) Wei­ter­le­sen »

AMD to Present at the Deutsche Bank 2021 Technology Conference

Verfasst vonpipin

SANTA CLARA, Calif., Sept. 01, 2021 — Today, AMD (NASDAQ: AMD) announ­ced that Devin­der Kumar, exe­cu­ti­ve vice pre­si­dent, chief finan­cial offi­cer and tre­asurer, will pre­sent at the Deut­sche Bank 2021 Tech­no­lo­gy Con­fe­rence on a vir­tu­al basis on Fri­day, Sep­tem­ber 10, 2021 at 2:05pm ET/11:05am PT.   A real-time video web­cast of the pre­sen­ta­ti­on can be acces­sed on AMD’s Inves­tor Rela­ti­ons web­site ir.amd.com.
(…) Wei­ter­le­sen »

AMD EPYC™ Processors Picked by Argonne National Laboratory to Prepare for Exascale Future

Verfasst vonpipin

- The new Pola­ris super­com­pu­ter will opti­mi­ze AI, engi­nee­ring, and sci­en­ti­fic pro­jects for forth­co­ming exas­ca­le super­com­pu­ter at Argon­ne Natio­nal Laboratory -

SANTA CLARA, Calif., Aug. 30, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) announ­ced that the U.S. Depart­ment of Energy’s (DOE) Argon­ne Natio­nal Labo­ra­to­ry (Argon­ne) has cho­sen AMD EPYC™ pro­ces­sors to power a new super­com­pu­ter, cal­led Pola­ris, which will prepa­re rese­ar­chers for the forth­co­ming exas­ca­le super­com­pu­ter at Argon­ne cal­led Auro­ra. Pola­ris is built by Hew­lett Packard Enter­pri­se (HPE), will use 2nd Gen EPYC pro­ces­sors and then upgrade to 3rd Gen AMD EPYC pro­ces­sors, and will allow sci­en­tists and deve­lo­pers to test and opti­mi­ze soft­ware codes and appli­ca­ti­ons to tack­le a ran­ge of AI, engi­nee­ring, and sci­en­ti­fic pro­jects. (…) Wei­ter­le­sen »

POWERCOLOR ANNOUNCES ITS AMD RADEON™ RX 6600 XT GRAPHICS CARD LINEUP

Verfasst vonpipin

Gamers want opti­ons, we deliver!
RED DEVIL, HELLHOUND and FIGHTER models available begin­ning August 11

Tai­pei, Tai­wan – Aug 10th, 2021 — TUL Cor­po­ra­ti­on, a lea­ding and inno­va­ti­ve manu­fac­tu­rer of AMD-powered gra­phic cards sin­ce 1997, today announ­ced their new AMD Rade­on™ RX 6600 XT series gra­phics cards for gamers loo­king for unmat­ched relia­bi­li­ty and per­for­mance for 1080p gaming.
(…) Wei­ter­le­sen »

New AMD Radeon PRO W6000X Series GPUs Bring Groundbreaking High-Performance AMD RDNA 2 Architecture to Mac Pro

Verfasst vonpipin

–New AMD GPUs harness the high-per­for­mance, ener­gy effi­ci­ent AMD RDNA™ 2 archi­tec­tu­re, AMD Infi­ni­ty Cache and other advan­ced tech­no­lo­gies to power deman­ding pro­fes­sio­nal design and con­tent crea­ti­on workloads

– AMD Rade­on™ PRO W6800X Duo gra­phics card with high-speed AMD Infi­ni­ty Fabric™ inter­con­nect tech­no­lo­gy deli­vers up to a mas­si­ve 30.2 tera­flops of com­pu­te performance

SANTA CLARA, Calif., Aug. 03, 2021 — AMD (NASDAQ: AMD) today announ­ced avai­la­bi­li­ty of the new AMD Rade­on™ PRO W6000X series GPUs for Mac Pro. The new GPU pro­duct line deli­vers excep­tio­nal per­for­mance and incre­di­ble visu­al fide­li­ty to power a wide varie­ty of deman­ding pro­fes­sio­nal appli­ca­ti­ons and workloads, inclu­ding 3D ren­de­ring, 8K video com­po­si­ting, color cor­rec­tion and more. (…) Wei­ter­le­sen »