Kategorie: Pressemitteilungen

AMD Processors Accelerating Performance of Top Supercomputers Worldwide

Growing preference for EPYC™ processors resulted in the number of AMD-powered supercomputers growing 3.5x year-over-year

SANTA CLARA, Calif., Nov. 16, 2021 (GLOBE NEWSWIRE) — During this year’s Super­com­pu­ting Con­fe­rence 2021 (SC21), AMD (NASDAQ: AMD) is show­ca­sing its expan­ded pre­sence and gro­wing pre­fe­rence in the high per­for­mance com­pu­ting (HPC) indus­try with the excep­tio­nal inno­va­ti­on and adop­ti­on of AMD data cen­ter pro­ces­sors and acce­le­ra­tors. Cus­to­mers across the indus­try con­ti­nue to expand their use of AMD EPYC™ pro­ces­sors and AMD Instinct™ acce­le­ra­tors to power cut­ting-edge rese­arch nee­ded to address some of the world’s big­gest chal­lenges in cli­ma­te, life sci­en­ces, medi­ci­ne, and more.

Gro­wing pre­fe­rence for AMD is show­ca­sed in the latest Top500 list. AMD now powers 73 super­com­pu­ters, com­pared to 21 in the Novem­ber 2020 list, a more than 3x year-over-year increase. Addi­tio­nal­ly, AMD powers four out of the top ten most powerful super­com­pu­ters in the world, as well as the most powerful super­com­pu­ter in EMEA. Final­ly, AMD EPYC 7003 series pro­ces­sors, which laun­ched eight months ago, are uti­li­zed by 17 of the 75 AMD powered super­com­pu­ters in the list, demons­t­ra­ting the rapid adop­ti­on of the latest gene­ra­ti­on of EPYC processors.

The demands of super­com­pu­ting users have increased expo­nen­ti­al­ly as the world seeks to acce­le­ra­te rese­arch, redu­cing the time to dis­co­very of valuable infor­ma­ti­on,” said For­rest Nor­rod, seni­or vice pre­si­dent and gene­ral mana­ger, Data Cen­ter and Embedded Solu­ti­ons Busi­ness Group, AMD. “With AMD EPYC CPUs and Instinct acce­le­ra­tors, we con­ti­nue to evol­ve our pro­duct offe­ring to push the boun­da­ries of data cen­ter tech­no­lo­gies enab­ling fas­ter rese­arch, bet­ter out­co­mes and more impact on the world.”

AMD has also been reco­gni­zed in the annu­al HPC­wire Rea­ders’ and Edi­tors’ Choice Awards at SC21. The com­pa­ny won ten awards inclu­ding Best Sus­taina­bi­li­ty Inno­va­ti­on in HPC, Best HPC Ser­ver Pro­duct and the Out­stan­ding Lea­der­ship in HPC award pre­sen­ted to Pre­si­dent and CEO Dr. Lisa Su. (…) Wei­ter­le­sen »

Still waiting for Exascale: Japan’s Fugaku outperforms all competition once again

FRANKFURT, Ger­ma­ny; BERKELEY, Calif.; and KNOXVILLE, Tenn.— The 58th annu­al edi­ti­on of the TOP500 saw litt­le chan­ge in the Top10. The Micro­soft Azu­re sys­tem cal­led Voy­a­ger-EUS2 was the only machi­ne to shake up the top spots, clai­ming No. 10. Based on an AMD EPYC pro­ces­sor with 48 cores and 2.45GHz working tog­e­ther with an NVIDIA A100 GPU and 80 GB of memo­ry, Voy­a­ger-EUS2 also uti­li­zes a Mel­lan­ox HDR Infi­ni­band for data transfer. 

While the­re were no other chan­ges to the posi­ti­ons of the sys­tems in the Top10, Perl­mut­ter at NERSC impro­ved its per­for­mance to 70.9 Pflop/s. Housed at the Law­rence Ber­ke­ley Natio­nal Labo­ra­to­ry, Perlmutter’s increased per­for­mance couldn’t move it from its pre­vious­ly held No. 5 spot. 

Fug­a­ku con­ti­nues to hold the No. 1 posi­ti­on that it first ear­ned in June 2020. Its HPL bench­mark score is 442 Pflop/s, which excee­ded the per­for­mance of Sum­mit at No. 2 by 3x. Instal­led at the Riken Cen­ter for Com­pu­ta­tio­nal Sci­ence (R‑CCS) in Kobe, Japan, it was co-deve­lo­ped by Riken and Fuji­tsu and is based on Fujitsu’s cus­tom ARM A64FX pro­ces­sor. Fug­a­ku also uses Fujitsu’s Tofu D inter­con­nect to trans­fer data bet­ween nodes. 

In sin­gle or fur­ther-redu­ced pre­cis­i­on, which are often used in machi­ne lear­ning and A.I. appli­ca­ti­on, Fug­a­ku has a peak per­for­mance abo­ve 1,000 PFlop/s (1 Exaflop/s). As a result, Fug­a­ku is often intro­du­ced as the first “Exas­ca­le” super­com­pu­ter. (…) Wei­ter­le­sen »

Xilinx Launches Alveo U55C, Its Most Powerful Accelerator Card Ever, Purpose-Built for HPC and Big Data Workloads

Breakthrough HPC clustering solution and simplified programmability enable massive scale-out of cutting-edge compute across existing customer infrastructure and network

ST. LOUIS–(BUSINESS WIRE)–SC21  Xilinx, Inc. (NASDAQ: XLNX), the lea­der in adap­ti­ve com­pu­ting, today at the SC21 super­com­pu­ting con­fe­rence intro­du­ced the Alveo™ U55C data cen­ter acce­le­ra­tor card and a new stan­dards-based, API-dri­ven clus­te­ring solu­ti­on for deploy­ing FPGAs at mas­si­ve sca­le. The Alveo U55C acce­le­ra­tor brings supe­ri­or per­for­mance-per-watt to high per­for­mance com­pu­ting (HPC) and data­ba­se workloads and easi­ly sca­les through the Xilinx® HPC clus­te­ring solution.

Pur­po­se-built for HPC and big data workloads, the new Alveo U55C card is the company’s most powerful Alveo acce­le­ra­tor card ever, offe­ring the hig­hest com­pu­te den­si­ty and HBM capa­ci­ty in the Alveo acce­le­ra­tor port­fo­lio. Tog­e­ther with the new Xilinx RoCE v2-based clus­te­ring solu­ti­on, a broad spec­trum of cus­to­mers with lar­ge-sca­le com­pu­te workloads can now imple­ment powerful FPGA-based HPC clus­te­ring using their exis­ting data cen­ter infra­struc­tu­re and net­work. (…) Wei­ter­le­sen »

Samsung Develops Industry’s First LPDDR5X DRAM

Samsung’s LPDDR5X DRAM will provide over 1.3x faster processing speeds and consumer nearly 20% less power than the previous LPDDR5 solution

The LPDDR5X solution will broaden the use of high-performance, low-power memory beyond smartphones to AI and edge applications

 

Sam­sung Elec­tro­nics Co., Ltd., the world lea­der in advan­ced memo­ry tech­no­lo­gy, today announ­ced that it has deve­lo­ped the industry’s first 14-nano­me­ter (nm) based 16-giga­bit (Gb) Low Power Dou­ble Data Rate 5X (LPDDR5X) DRAM, desi­gned to dri­ve fur­ther growth throug­hout the high-speed data ser­vice appli­ca­ti­ons inclu­ding 5G, arti­fi­ci­al intel­li­gence (AI) and the metaverse.
(…) Wei­ter­le­sen »

Avnet Collaborates with Digital Realty to Develop “Try and Buy” High Performance, Cloud-Based Universal Video Streaming Solutions

Solu­ti­ons enable com­pa­nies to be their own video broad­cas­ters and appli­ca­ti­on pro­vi­ders to enhan­ce their pro­duct offering

PHOENIX–Leading glo­bal tech­no­lo­gy solu­ti­ons pro­vi­der Avnet (Nasdaq: AVT) is team­ing up with Digi­tal Real­ty (NYSE: DLR), the lar­gest glo­bal pro­vi­der of cloud- and car­ri­er-neu­tral data cen­ter, colo­ca­ti­on and inter­con­nec­tion solu­ti­ons, to equip com­pa­nies and appli­ca­ti­on pro­vi­ders to deve­lop, launch, sca­le and/or enhan­ce their video broad­cast pro­duct offe­rings. Joint­ly deve­lo­ped spe­ci­fi­cal­ly for high per­for­mance, cloud-based and secu­re uni­ver­sal video strea­ming, the solu­ti­ons from Digi­tal Real­ty and Avnet will be one-touch (tran­sac­tion), cost-effec­ti­ve “try and buy” opti­ons. The team’s first available solu­ti­on uti­li­zes a 3rd Gen AMD EPYC-based ser­ver inte­gra­ted with a Xilinx U30 FPGA* acce­le­ra­tor card deli­ve­ring excep­tio­nal per­for­mance and flexibility.

A recent stu­dy by Deloit­te (2021) notes that the avera­ge Ame­ri­can home has four digi­tal video ser­vice sub­scrip­ti­ons and the same stu­dy found that 39% of Baby Boo­mers and 29% of Gene­ra­ti­on X rank on demand video as their pre­fer­red enter­tain­ment acti­vi­ty. The joint Avnet and Digi­tal Real­ty video strea­ming solu­ti­ons enable sup­port for a wide base of video strea­ming appli­ca­ti­ons such as: video-based eCom­mer­ce, social media-based appli­ca­ti­ons, video col­la­bo­ra­ti­on, tele­me­di­ci­ne, live sports and events, auc­tions, gambling and sports bet­ting. (…) Wei­ter­le­sen »

CXL™ Consortium & Gen‑Z Consortium Sign Letter of Intent to Advance Interconnect Technology

Novem­ber 10, 2021 — High per­for­mance com­pu­ting con­ti­nues to evolve—meeting the ever-incre­asing demand for high effi­ci­en­cy, low-laten­cy, rapid and seam­less pro­ces­sing. The Gen‑Z Con­sor­ti­um was foun­ded in 2016 to crea­te a next-gene­ra­ti­on fabric capa­ble of bridging exis­ting solu­ti­ons while enab­ling new, unboun­ded inno­va­ti­on in an open, non-pro­prie­ta­ry stan­dards body.

In 2019, the CXL™ Con­sor­ti­um laun­ched to deli­ver Com­pu­te Express Link™ (CXL™), an indus­try-sup­port­ed cache-coher­ent inter­con­nect desi­gned for pro­ces­sors, memo­ry expan­si­on, and acce­le­ra­tors. The CXL Con­sor­ti­um and the Gen‑Z Con­sor­ti­um estab­lished a joint memo­ran­dum of under­stan­ding (MOU) pro­vi­ding an oppor­tu­ni­ty for col­la­bo­ra­ti­on to defi­ne bridging bet­ween the pro­to­cols. This took the form of a joint working group that encou­ra­ged crea­ti­vi­ty and inno­va­ti­on bet­ween the two orga­niza­ti­ons toward the bet­ter­ment of the indus­try as a whole. 

Loo­king to the future, the CXL Con­sor­ti­um and Gen‑Z Con­sor­ti­um have iden­ti­fied syn­er­gies bet­ween the two con­sor­tia that resul­ted in the sig­ning of a Let­ter of Intent which, if pas­sed and agreed upon by all par­ties, would trans­fer the Gen‑Z Spe­ci­fi­ca­ti­ons and all Gen‑Z assets to the CXL Con­sor­ti­um. (…) Wei­ter­le­sen »

IBM Cloud Selects 3rd Gen AMD EPYC™ Processors for New Bare Metal Offering for Compute-Intensive Workloads

SANTA CLARA, Calif. — 11/10/2021- AMD (NASDAQ: AMD) announ­ced today that IBM Cloud has cho­sen 3rd Gen AMD EPYC™ pro­ces­sors to expand its bare metal ser­vice offe­rings desi­gned to power cus­to­mers’ deman­ding workloads and solu­ti­ons. The new ser­vers, fea­turing 128 cores, up to 4TB of memo­ry and 10 NVMe dri­ves per ser­ver, give users full access to high-end, dual-socket per­for­mance with AMD EPYC 7763 pro­ces­sors; a first for IBM Cloud in a dual-socket platform.

Our cus­to­mers have a high demand for com­pu­ting pro­ces­sing power and the new 3rd Gen AMD EPYC pro­ces­sors pro­vi­de the high levels of per­for­mance and sca­la­bi­li­ty we were loo­king for,” said Suresh Gopa­l­a­krish­n­an, vice pre­si­dent, IBM Cloud. “Our col­la­bo­ra­ti­on with AMD has hel­ped us deli­ver our hig­hest core counts and band­width ever available for IBM Cloud cus­to­mers, to offer top mar­ket per­for­mance for today and tomorrow’s deman­ding workloads.” (…) Wei­ter­le­sen »

AMD Unveils Workload-Tailored Innovations and Products at The Accelerated Data Center Premiere

AMD laun­ches AMD Instinct™ MI200 series acce­le­ra­tors, pre­views 3rd Gen AMD EPYC™ pro­ces­sors with AMD 3D V‑Cache, and pro­vi­des new details on expan­ded set of next-gene­ra­ti­on EPYC™ pro­ces­sors powered by “Zen 4” and “Zen 4c” CPU cores—

— Meta choo­ses EPYC™ CPUs for its data center —

SANTA CLARA, Calif., Nov. 08, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) held the vir­tu­al Acce­le­ra­ted Data Cen­ter Pre­mie­re, laun­ching the new AMD Instinct™ MI200 series acce­le­ra­tors, the world’s fas­test acce­le­ra­tor for high per­for­mance com­pu­ting (HPC) and arti­fi­ci­al intel­li­gence (AI) workload­si, and pro­vi­ded a pre­view of the inno­va­ti­ve 3rd Gen AMD EPYC™ pro­ces­sors with AMD 3D V‑Cache. AMD also reve­a­led new infor­ma­ti­on about its next gene­ra­ti­on “Zen 4” pro­ces­sor core and announ­ced the new “Zen 4c” pro­ces­sor core, both of which will power future AMD ser­ver pro­ces­sors and are desi­gned to extend the company’s lea­der­ship pro­ducts for the data center.

We are in a high-per­for­mance com­pu­ting mega­cy­cle that is dri­ving demand for more com­pu­te to power the ser­vices and devices that impact every aspect of our dai­ly lives,” said Dr. Lisa Su, pre­si­dent and CEO, AMD. “We are buil­ding signi­fi­cant momen­tum in the data cen­ter with our lea­der­ship pro­duct port­fo­lio, inclu­ding Meta’s adop­ti­on of AMD EPYC to power their infra­struc­tu­re and the buil­dout of Fron­tier, the first U.S. exas­ca­le super­com­pu­ter which will be powered by EPYC and AMD Instinct pro­ces­sors. In addi­ti­on, today we announ­ced a breadth of new pro­ducts that build on that momen­tum in next-gene­ra­ti­on EPYC pro­ces­sors with new inno­va­tions in design, lea­der­ship, 3D pack­a­ging tech­no­lo­gy, and 5 nm high-per­for­mance manu­fac­tu­ring to fur­ther extend our lea­der­ship for cloud, enter­pri­se and HPC cus­to­mers.” (…) Wei­ter­le­sen »

New AMD Instinct™ MI200 Series Accelerators Bring Leadership HPC and AI Performance to Power Exascale Systems and More

Novem­ber 08, 2021 12:00pm EST

- With new AMD CDNA™ 2 archi­tec­tu­re, AMD Instinct MI200 series acce­le­ra­tors deli­ver ground-brea­king 4.9x advan­ta­ge in HPC per­for­mance1 com­pared to com­pe­ting data cen­ter acce­le­ra­tors, expe­diting sci­ence and discovery -

- MI200 series acce­le­ra­tors are first mul­ti-die GPU, first to sup­port 128GB of HBM2e memo­ry, and deli­ver a sub­stan­ti­al boost for appli­ca­ti­ons cri­ti­cal to the foun­da­ti­on of science -

SANTA CLARA, Calif., Nov. 08, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced the new AMD Instinct™ MI200 series acce­le­ra­tors, the first exas­ca­le-class GPU acce­le­ra­tors. AMD Instinct MI200 series acce­le­ra­tors includes the world’s fas­test high per­for­mance com­pu­ting (HPC) and arti­fi­ci­al intel­li­gence (AI) acce­le­ra­tor,1 the AMD Instinct™ MI250X. (…) Wei­ter­le­sen »

AMD Radeon™ PRO V620 GPU Delivers Powerful, Multi-Purpose Data Center Visual Performance for Today’s Demanding Cloud Workloads

SANTA CLARA, Calif., Nov. 04, 2021 — AMD (NASDAQ: AMD) announ­ced the AMD Rade­on PROV620 GPU, built with the latest AMD RDNA™ 2 archi­tec­tu­re which deli­vers high-per­for­mance GPU acce­le­ra­ti­on for today’s deman­ding cloud workloads inclu­ding immersi­ve AAA game expe­ri­en­ces, inten­si­ve 3D workloads and modern office pro­duc­ti­vi­ty appli­ca­ti­ons at sca­le in the cloud.

With its inno­va­ti­ve GPU-par­ti­tio­ning capa­bi­li­ties, mul­ti-stream hard­ware acce­le­ra­ted enco­ders and 32GB GDDR6 memo­ry, the AMD Rade­on PRO V620 offers dedi­ca­ted GPU resour­ces that sca­le to mul­ti­ple gra­phics users, hel­ping ensu­re cost-effec­ti­ve gra­phics acce­le­ra­ti­on for a ran­ge of workloads1. Built using the same GPU archi­tec­tu­re that powers the latest gene­ra­ti­on game con­so­les and PC game expe­ri­en­ces, the AMD Rade­on PRO V620 GPU is also desi­gned to deve­lop and deli­ver immersi­ve AAA game experiences.

AMD is brin­ging high-per­for­mance AAA gam­ing expe­ri­ence to the cloud with the intro­duc­tion of the AMD Rade­on PRO V620,” said Jeff Con­nell, cor­po­ra­te vice pre­si­dent, Visu­al and Cloud Gam­ing, AMD. “We’re see­ing adop­ti­on of gam­ing in the cloud from cus­to­mers around the world, taking advan­ta­ge of the latest vir­tua­liza­ti­on fea­tures deli­ve­ring effi­ci­ent and low laten­cy con­tent strea­ming to mul­ti­ple simul­ta­neous users. AMD Rade­on PRO V620 is yet ano­ther pro­of point of AMD’s excel­lence in gam­ing – from the PC to the con­so­le and now to the cloud.” (…) Wei­ter­le­sen »

AMD EPYC™ Processors Expand Performance and Security Innovation Across Microsoft Azure Virtual Machines Portfolio

—Micro­soft Azu­re intro­du­ces new Dasv5 and Easv5 VMs based on 3rd Gen AMD EPYC™ pro­ces­sors, and new con­fi­den­ti­al VMs based on AMD SEV-SNP technology —

SANTA CLARA, Calif. 11/04/2021 — Today, AMD announ­ced its con­tin­ued momen­tum and col­la­bo­ra­ti­on with Micro­soft Azu­re,  who is offe­ring the 3rd Gen AMD EPYC™ pro­ces­sor in the latest gene­ra­ti­on of Dasv5 and Easv5 Azu­re Vir­tu­al Machi­nes (VMs). Azu­re is also intro­du­cing new con­fi­den­ti­al VMs, DCasv5 and ECasv5, which use the latest advan­ced secu­ri­ty fea­tures available in 3rd Gen EPYC pro­ces­sors, inclu­ding Secu­re Encrypt­ed Vir­tua­liza­ti­on-Secu­re Nes­ted Paging (SEV-SNP).

The new Azu­re con­fi­den­ti­al VMs, DCasv5 and ECasv5, the first EPYC pro­ces­sor-based con­fi­den­ti­al VMs at Azu­re and the first con­fi­den­ti­al VMs to use SEV-SNP, will enable cus­to­mers to have the data in their secu­ri­ty focu­sed appli­ca­ti­ons encrypt­ed in use, in tran­sit and at rest. The updated Dasv5 VMs, opti­mi­zed for gene­ral pur­po­se workloads, and the Easv5 VMs, opti­mi­zed for memo­ry-based workloads, deli­ver bet­ter pri­ce-per­for­mance for most gene­ral pur­po­se and memo­ry inten­si­ve workloads com­pared to pri­or EPYC pro­ces­sor-based Micro­soft Azu­re VMs.
(…) Wei­ter­le­sen »

G.SKILL Showcases DDR5-7000 CL40 Extreme Speed Memory

(2 Novem­ber 2021) – G.SKILL Inter­na­tio­nal Enter­pri­se Co., Ltd., the world’s lea­ding manu­fac­tu­rer of extre­me per­for­mance memo­ry and gam­ing peri­pherals, is thril­led to announ­ce the achie­ve­ment of DDR5-7000 CL40-40–40-76 32GB (2x16GB) extre­me speed, pas­sing the Mem­test sta­bi­li­ty test. 7000MT/s memo­ry speed is an exci­ting mile­stone, as it was only seen under liquid nitro­gen sub-zero tem­pe­ra­tu­re coo­ling not long ago in over­clo­cking records. Accom­plished with high-per­for­mance Sam­sung DDR5 com­pon­ents, this extre­me speed memo­ry is tru­ly wort­hy of the G.SKILL flag­ship Trident Z5 fami­ly clas­si­fi­ca­ti­on. (…) Wei­ter­le­sen »

Micron Delivers High-Performance GDDR6 Memory for AMD Radeon RX 6000 Series Graphics Cards

Col­la­bo­ra­ti­on lever­a­ges inno­va­ti­on in Ultra-Band­width Solu­ti­ons to enable high frame rates and enhan­ced 4K reso­lu­ti­on gaming

BOISE, Ida­ho, Nov. 01, 2021 (GLOBE NEWSWIRE) — Micron Tech­no­lo­gy, Inc. (Nasdaq: MU), today announ­ced that its high-per­for­mance 16Gb/16Gbps GDDR6 memo­ry solu­ti­on is now available with AMD Rade­on™ RX 6000 Series gra­phics cards built on the AMD RDNA™ 2 gam­ing archi­tec­tu­re. Using Micron’s advan­ced 1z pro­cess tech­no­lo­gy, this latest ver­si­on of GDDR6 enables up to 512GB/s sys­tem per­for­mance for deman­ding appli­ca­ti­ons like gam­ing and gra­phics. Today’s announce­ment con­ti­nues Micron’s rich histo­ry of inno­va­ti­on and col­la­bo­ra­ti­on with indus­try lea­ders to deli­ver breakth­rough per­for­mance that enables the most advan­ced gam­ing solutions.

As gra­phics and gam­ing appli­ca­ti­ons beco­me more deman­ding, so do the requi­re­ments for high band­width memo­ry and sys­tem per­for­mance. Modern gamers expect high-reso­lu­ti­on, immersi­ve expe­ri­en­ces, and GDDR6 deli­vers with its sup­port of fast frame rates. The result is excel­lent per­for­mance and speed that mini­mi­ze lag time and pro­vi­de gamers with life­li­ke effects.
(…) Wei­ter­le­sen »

AMD Promotes Server SoC Architect Kevin Lepak to Corporate Fellow

Lepak reco­gni­zed at hig­hest tech­ni­cal level for out­stan­ding con­tri­bu­ti­ons to AMD pro­ces­sor design

SANTA CLARA, Calif. 10/28/2021 AMD (NASDAQ: AMD) today announ­ced the appoint­ment of Seni­or Fel­low and Ser­ver SoC (sys­tem on chip) Archi­tect Kevin Lepak to AMD Cor­po­ra­te Fel­low, in reco­gni­ti­on of his cri­ti­cal role in the design of next-gene­ra­ti­on AMD EPYC™ pro­ces­sors. Lepak achie­ved an excel­lent record of over­see­ing the exe­cu­ti­on and deli­very of lea­der­ship data cen­ter pro­ces­sors for AMD, inclu­ding 2nd and 3rd Gen AMD EPYC™ CPUs and next gene­ra­ti­on AMD Instinct™ acce­le­ra­tors. As AMD Cor­po­ra­te Fel­low, Lepak expands on his lea­der­ship in chip design to play a lar­ger role in evol­ving AMD’s pro­ces­sor and sys­tems visi­on. (…) Wei­ter­le­sen »