Kategorie: News

Intel Launches 4th Gen Xeon Scalable Processors, Max Series CPUs

Verfasst vonpipin

Intel high­lights broad indus­try adop­ti­on across all major CSPs, OEMs, ODMs and ISVs, and show­ca­ses increased per­for­mance in AI, net­wor­king and high per­for­mance computing.

NEWS HIGHLIGHTS
 

  • Expan­si­ve cus­to­mer and part­ner adop­ti­on from AWS, Cis­co, Clou­de­ra, Core­Wea­ve, Dell Tech­no­lo­gies, Drop­box, Erics­son, Fuji­tsu, Goog­le Cloud, Hew­lett Packard Enter­pri­se, IBM Cloud, Inspur Infor­ma­ti­on, IONOS, Leno­vo, Los Ala­mos Natio­nal Labo­ra­to­ry, Micro­soft Azu­re, NVIDIA, Ora­cle Cloud, OVH­cloud, phoe­nix­NAP, Red­Hat, SAP, Super­Mi­cro, Tele­fo­ni­ca and VMware, among others.
  • With the most built-in acce­le­ra­tors of any CPU in the world for key workloads such as AI, ana­ly­tics, net­wor­king, secu­ri­ty, sto­rage and high per­for­mance com­pu­ting (HPC), 4th Gen Intel Xeon Sca­lable and Intel Max Series fami­lies deli­ver lea­der­ship per­for­mance in a pur­po­se-built workload-first approach.
  • 4th Gen Intel Xeon Sca­lable pro­ces­sors are Intel’s most sus­tainable data cen­ter pro­ces­sors, deli­ve­ring a ran­ge of fea­tures for opti­mi­zing power and per­for­mance, making opti­mal use of CPU resour­ces to help achie­ve cus­to­mers’ sus­taina­bi­li­ty goals.
  • When com­pared with pri­or gene­ra­ti­ons, 4th Gen Xeon cus­to­mers can expect a 2.9x1 avera­ge per­for­mance per watt effi­ci­en­cy impro­ve­ment for tar­ge­ted workloads when uti­li­zing built-in acce­le­ra­tors, up to 70-watt2 power savings per CPU in opti­mi­zed power mode with mini­mal per­for­mance loss for sel­ect workloads and a 52% to 66% lower total cost of owner­ship (TCO)3.

(…) Wei­ter­le­sen »

The Greenest Generation: NVIDIA, Intel and Partners Supercharge AI Computing Efficiency

Verfasst vonpipin

Acce­le­ra­ted NVIDIA Hop­per sys­tems with 4th Gen Intel Xeon Sca­lable pro­ces­sors — inclu­ding NVIDIA DGX H100 and 60+ sys­tems from NVIDIA part­ners — pro­vi­de 25x more effi­ci­en­cy than tra­di­tio­nal data cen­ter ser­vers to save big on ener­gy costs.
(…) Wei­ter­le­sen »

Microsoft announces acquisition of Fungible to accelerate datacenter innovation

Verfasst vonpipin

Jan 9, 2023 — Today, Micro­soft is announ­cing the acqui­si­ti­on of Fun­gi­ble Inc., a pro­vi­der of com­posable infra­struc­tu­re aimed at acce­le­ra­ting net­wor­king and sto­rage per­for­mance in dat­a­cen­ters with high-effi­ci­en­cy, low-power data pro­ces­sing units (DPUs).

Fungible’s tech­no­lo­gies help enable high-per­for­mance, sca­lable, dis­ag­gre­ga­ted, sca­led-out dat­a­cen­ter infra­struc­tu­re with relia­bi­li­ty and secu­ri­ty. (…) Wei­ter­le­sen »

Deutsche Hardware-Seiten deaktivieren ihre Marktplätze

Verfasst vonNero24

Vie­le Inter­net-Sei­ten, die auch ein Forum betrei­ben, haben dort ver­schie­de­ne Rubri­ken – im Fal­le einer Hard­ware-Web­sei­te oft “Pro­zes­so­ren”, “Main­boards”, “Gra­fik­kar­ten”, etc. – und oft auch eine Sek­ti­on “Markt­platz” oder “Pri­va­te Ver­käu­fe, Gesu­che und Tausch­ge­schäf­te”, so auch bei uns im Forum. Eini­gen Besu­chern mag auf­ge­fal­len sein, dass seit gestern die meis­ten davon nicht mehr zugäng­lich sind. Com­pu­ter­Ba­se etwa hat sei­nen Markt­platz eben­so deak­ti­viert wie Hard­ware­Lu­xx und 3DCenter auf pri­vat geschal­tet. Und auch wir wer­den dem Bei­spiel wohl (vor­erst) fol­gen (müs­sen). (…) Wei­ter­le­sen »

Vorsicht vor BIOS-Updates mit AGESA ComboAM5PI 1.0.0.4

Verfasst vonNero24

Im Zuge der Markt­ein­füh­rung der neu­en Ryzen-7000-Pro­zes­so­ren mit 65 W TDP hat AMD auch ein neu­es AGE­SA-Paket ComboAM5PI 1.0.0.4 geschnürt und den Main­board-Her­stel­lern für ihre BIOS-Updates zur Ver­fü­gung gestellt. Jedoch gibt es damit offen­bar Boot-Pro­ble­me sofern ein AMD Ryzen 5 7600X im Sys­tem ver­baut ist. Abhil­fe ist in Arbeit, daher ist erst ein­mal Vor­sicht ange­sagt beim Ein­spie­len von BIOS-Updates. (…) Wei­ter­le­sen »

AMD stellt “die besseren” Ryzen-7000-Prozessoren vor

Verfasst vonNero24

Die neue AM5-Platt­form und die dazu gehö­ri­gen Ryzen-7000-Pro­zes­so­ren auf Zen-4-Basis hat AMD bereits im letz­ten Herbst vor­ge­stellt. Dabei han­del­te es sich aus­nahms­los um X‑Varianten, die am obe­ren Limit der TDP-Klas­sen ein­ge­stuft waren. Schon bei der Markt­ein­füh­rung war in diver­sen Reviews auf­ge­fal­len, dass die Ener­gie-Effi­zi­enz der neu­en Zen-4-Pro­zes­so­ren mas­siv steigt, wenn man die PPT limi­tiert. Gestern nun hat AMD jene Ener­gie-Effi­zi­enz-Modell offi­zi­ell ein­ge­führt. (…) Wei­ter­le­sen »

AMD Unveils Suite of New Radeon GPUs to Power High-Performance, Power-Efficient Gaming Laptops

Verfasst vonpipin

AMD Rade­on RX 7000M Series Gra­phics deli­ver out­stan­ding per­for­mance-per-watt, sta­te-of-the-art visu­als and high-frame­ra­te gam­ing, with 26% hig­her per­for­mance on avera­ge than pre­vious gene­ra­ti­on; AMD Rade­on RX 7000S Series Gra­phics rede­fi­ne gam­ing per­for­mance for thin and light laptops

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023, AMD (NASDAQ: AMD) announ­ced the AMD Rade­on™ RX 7000 Series Gra­phics for Lap­tops. Built on the ground­brea­king AMD RDNA™ 3 archi­tec­tu­re, the new GPUs are desi­gned to deli­ver excep­tio­nal ener­gy effi­ci­en­cy and per­for­mance to power 1080p gam­ing at ultra set­tings and advan­ced con­tent crea­ti­on appli­ca­ti­ons on next-gene­ra­ti­on pre­mi­um laptops.

The new GPUs expand the recent­ly announ­ced AMD Rade­on RX 7000 Series Gra­phics fami­ly. The new AMD Rade­on RX 7000M Series Gra­phics offer out­stan­ding per­for­mance-per-watt while deli­ve­ring sta­te-of-the-art visu­als and high-FPS gam­ing, while the new AMD Rade­on RX 7000S Series Gra­phics maxi­mi­ze the effi­ci­en­ci­es of AMD RDNA 3 archi­tec­tu­re to deli­ver out­stan­ding per­for­mance at low power levels ide­al­ly sui­ted for thin and light lap­tops. (…) Wei­ter­le­sen »

AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop

Verfasst vonpipin

— AMD Ryzen™ 7000X3D Series Desk­top pro­ces­sors bring the power of AMD 3D V‑Cache™ tech­no­lo­gy to gamers and creators —

— AMD Ryzen 7000 Series Mobi­le pro­ces­sors deli­ver unpar­al­le­led per­for­mance for deman­ding workloads with up to 16 powerful “Zen 4” cores and bring new Ryzen AI tech­no­lo­gy to sel­ect lap­top devices—

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023, AMD (NASDAQ: AMD) announ­ced a varie­ty of new com­pu­ting pro­ducts across desk­top and mobi­le, brin­ging new levels of per­for­mance for gamers, crea­tors, pro­fes­sio­nals, and main­stream users. AMD is sub­stan­ti­al­ly expan­ding the ran­ge of opti­ons for Socket AM5 users with the new Ryzen 7000X3D Series Desk­top pro­ces­sors and 65W Ryzen 7000 Series Desk­top pro­ces­sors. AMD also announ­ced a new lin­e­up of Ryzen 7000 Series Mobi­le pro­ces­sors, inclu­ding the AMD Ryzen 7045HX Series Mobi­le pro­ces­sors, which deli­ver on avera­ge over 50% more per­for­mance across a wide ran­ge of appli­ca­ti­ons to enable gamers and crea­tors on the go 1. AMD is also intro­du­cing the Ryzen 7040 Series Mobi­le pro­ces­sors, which fea­ture the first dedi­ca­ted arti­fi­ci­al intel­li­gence hard­ware in an x86 pro­ces­sor on sel­ect models. (…) Wei­ter­le­sen »

AMD Highlights Future of High-Performance and Adaptive Computing During Opening Keynote of CES 2023

Verfasst vonpipin

— AMD CEO and part­ners inclu­ding Micro­soft, HP, Leno­vo, Magic Leap and Intui­ti­ve Sur­gi­cal show­ca­se AMD tech­no­lo­gies advan­cing AI, hybrid work, gam­ing, health­ca­re, aero­space and sus­tainable computing —

— Unveils new mobi­le CPUs and GPUs, inclu­ding first x86 PC CPU with dedi­ca­ted AI engi­ne and new 3D sta­cked desk­top pro­ces­sors with lea­der­ship gam­ing per­for­mance, and pre­views lea­der­ship AI infe­rence acce­le­ra­tor and data cen­ter APU —

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023, AMD (NASDAQ: AMD) Chair and CEO Dr. Lisa Su detail­ed the signi­fi­cant role high-per­for­mance and adap­ti­ve com­pu­ting plays in crea­ting solu­ti­ons to the world’s most important chal­lenges. During her live key­note, Dr. Su show­ca­sed next-gene­ra­ti­on AMD lea­der­ship pro­ducts rede­fi­ning what’s pos­si­ble across the broad mar­kets AMD ser­ves today.

“It is an honor to kick off CES 2023 and high­light all the ways AMD is pushing the enve­lo­pe in high-per­for­mance and adap­ti­ve com­pu­ting to help sol­ve the world’s most important chal­lenges,” said Dr. Su.  “Tog­e­ther with our part­ners, we high­ligh­ted how AMD tech­no­lo­gy is advan­cing what is pos­si­ble in AI, hybrid work, gam­ing, health­ca­re, aero­space and sus­tainable com­pu­ting. We also laun­ched mul­ti­ple new mobi­le, gam­ing and AI chips that will make 2023 an exci­ting year for AMD and the indus­try.” (…) Wei­ter­le­sen »

CES 2023: AMD-Keynote Donnerstagmorgen um 3:30 Uhr

Verfasst vonpipin

Für die in die­ser Woche star­ten­de CES wird AMD in Ver­tre­tung durch CEO und Prä­si­den­tin Dr. Lisa Su eine der Key­notes abhal­ten. Die­se wird mor­gen früh ab 3:30 Uhr star­ten und kann in einem Live­stream — unter ande­rem auch bei uns im Forum mit­ver­folgt wer­den. Laut der Pres­se­mel­dung aus dem Sep­tem­ber wird Dr. Lisa Su über Pro­duk­te der nächs­ten High-Per­for­mance-Gene­ra­ti­on und adap­ti­ve Com­pu­ting-Inno­va­tio­nen reden. (…) Wei­ter­le­sen »

TSMC November 2022 Revenue Report

Verfasst vonpipin

HSINCHU, Tai­wan, R.O.C. – Dec. 9, 2022 - TSMC (TWSE: 2330, NYSE: TSM) today announ­ced its net reve­nue for Novem­ber 2022: On a con­so­li­da­ted basis, reve­nue for Novem­ber 2022 was appro­xi­m­ate­ly NT$222.71 bil­li­on, an increase of 5.9 per­cent from Octo­ber 2022 and an increase of 50.2 per­cent from Novem­ber 2021. Reve­nue for Janu­ary through Novem­ber 2022 tota­led NT$2,071.33 bil­li­on, an increase of 44.6 per­cent com­pared to the same peri­od in 2021. (…) Wei­ter­le­sen »

TSMC Announces Updates for TSMC Arizona

Verfasst vonpipin

PHOENIX, Ari­zo­na, Dec. 6, 2022 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced that in addi­ti­on to TSMC Arizona’s first fab, which is sche­du­led to begin pro­duc­tion of N4 pro­cess tech­no­lo­gy in 2024, TSMC has also star­ted the con­s­truc­tion of a second fab which is sche­du­led to begin pro­duc­tion of 3nm pro­cess tech­no­lo­gy in 2026. The over­all invest­ment for the­se two fabs will be appro­xi­m­ate­ly US$40 bil­li­on, repre­sen­ting the lar­gest for­eign direct invest­ment in Ari­zo­na histo­ry and one of the lar­gest for­eign direct invest­ments in the histo­ry of the United Sta­tes. (…) Wei­ter­le­sen »

AMD Chipsatz-Treiber Adrenalin Edition 4.11.15.342

Verfasst vonpipin

Bereits in der letz­ten Woche hat AMD den Chip­satz-Trei­ber für Win­dows 10 und 11 auf die Ver­si­on 4.11.15.342 aktua­li­siert der laut Chan­ge­log eini­ge Bug­fi­xes bie­tet. So wur­den ver­schie­de­ne BSOD-Aus­lö­ser unter ande­rem im Zusam­men­hang mit Win­dows 11 22H2 und USB4 besei­tigt. Zusätz­lich gibt es eine neue Ver­si­on des PCI-Device-Trei­bers. Die Vor­gän­ger­ver­si­on 4.09.23.507 hat­te erst­mal die Unter­stüt­zung der neu­en AM5-Platt­form für die Ryzen 7000 Pro­zes­so­ren gebo­ten. (…) Wei­ter­le­sen »

AMD and Viettel Collaborate on 5G Mobile Network Expansion

Verfasst vonpipin

── Viettel selects Xilinx Zynq MPSoC and RFSoC adaptive platforms to enable its next-generation 5G systems serving more than 130 million mobile customers globally ──

SANTA CLARA, Calif., Dec. 01, 2022 — AMD (NASDAQ: AMD) and Viet­tel High Tech (Mem­ber of Viet­tel Group) today announ­ced the suc­cessful com­ple­ti­on of a 5G mobi­le net­work field tri­al deploy­ment con­duc­ted by Viet­tel and powered by AMD Xilinx Zynq™ UltraS­ca­le+™ MPSoC devices. As the lar­gest tele­com ope­ra­tor in Viet­nam ser­ving more than 130 mil­li­on mobi­le cus­to­mers, Viet­tel High Tech has a rich histo­ry of using AMD radio tech­no­lo­gy with pri­or 4G deploy­ments and is now acce­le­ra­ting new net­works via new 5G remo­te radio heads. Desi­gned to meet the gro­wing capa­ci­ty and per­for­mance requi­re­ments of mobi­le users glo­bal­ly, the Viet­tel 5G mobi­le net­work is expec­ted to be com­ple­ted by the end of 2022.

(…) Wei­ter­le­sen »