Kategorie: Pressemitteilungen

ASUS Announces New World Records on AMD EPYC 7002 Series 1P Server on SPEC.org

RS500A-E10-RS12U with AMD EPYC 7742 pro­ces­sor achie­ves mul­ti­ple hig­hest scores for com­­pu­­te-inten­­si­­ve appli­ca­ti­ons   TAIPEI, Tai­wan, Octo­ber 9, 2019 ASUS, a lea­ding ser­ver sys­tem, ser­ver mother­board, work­sta­tion and work­sta­tion mother­board pro­vi­der, today announ­ced that the ASUS RS500A-E10-RS12U ser­ver with 2nd Gen AMD EPYC™ 7742 pro­ces­sors achie­ved the hig­hest scores across mul­ti­ple bench­marks for com­­pu­­te-inten­­si­­ve appli­ca­ti­ons, accor­ding (…) Wei­ter­le­sen »

AMD Introduces Radeon™ RX 5500 Series Graphics: Superior Visual Fidelity, Advanced Features and High-Performance Gaming Experiences

  – The AMD Rade­on™ RX 5500 series pro­vi­des up to 37 per­cent fas­ter per­for­mance on avera­ge than the com­pe­ti­ti­on in sel­ect titles at 1080p1, super­char­ging top AAA and eSports games – – Acer, HP, Leno­vo™ and MSI to pro­vi­de incre­di­ble game­play with new desk­top and note­book PCs powered by Rade­on™ RX 5500 series –   – Gamers recei­ve (…) Wei­ter­le­sen »

TSMC’s N7+ Technology is First EUV Process Delivering Customer Products to Market in High Volume

Hsin­chu, Tai­wan R.O.C., Oct 7, 2019 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced that its seven-nano­­me­­ter plus (N7+), the industry’s first com­mer­ci­al­ly available Extre­me Ultra­vio­let (EUV) litho­gra­phy tech­no­lo­gy, is deli­ve­ring cus­to­mer pro­ducts to mar­ket in high volu­me. The N7+ pro­cess with EUV tech­no­lo­gy is built on TSMC’s suc­cessful 7nm node and paves the way for (…) Wei­ter­le­sen »

Supermicro Expands European Manufacturing Facilities to Support Increased Server and Storage Volume in EMEA Markets

Increased Local Manu­fac­tu­ring Impro­ves Time to Mar­ket, Fle­xi­bi­li­ty, and Logi­stics for Rapidly Expan­ding Cloud, 5G and Enter­pri­se Cus­to­mers   ’s‑Hertogenbosch, THE NETHERLANDS, Octo­ber 1, 2019 — Super Micro Com­pu­ter, Inc. (SMCI), a glo­bal lea­der in enter­pri­se com­pu­ting, sto­rage, net­wor­king solu­ti­ons, and green com­pu­ting tech­no­lo­gy, expan­ded its EMEA Ope­ra­ti­ons Park in s‑Hertogenbosch, The Net­her­lands, with the (…) Wei­ter­le­sen »

THX, MOTILE and AMD Bring Breakthrough Laptop Experiences

THX, MOTILE™, AMD Join Forces to Bring to Mar­ket Lap­tops Opti­mi­zed for Enter­tain­ment THX, MOTILE™ and AMD Join Forces to Bring Breakth­rough Enter­tain­ment Expe­ri­en­ces on Lap­tops AMD-powered MOTILE pro­ducts fea­turing Tun­ed by THX™ dis­plays and THX® Spa­ti­al Audio tech­no­lo­gy now exclu­si­ve­ly available on Walmart.com San Fran­cis­co, Cali­for­nia (Oct 3, 2019) – THX Ltd., renow­ned for the cer­ti­fi­ca­ti­on of world-class cine­mas and con­su­mer (…) Wei­ter­le­sen »

AMD and Microsoft Announce New 15 Inch Thin and Light Microsoft® Surface® Laptop 3

 – Micro­soft® Sur­face® Lap­top 3 fea­tures the most powerful AMD mobi­le pro­ces­sors for ultrath­in lap­tops ever1 – NEW YORK, Oct. 02, 2019 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) and Micro­soft announ­ced the first-ever 15-inch Micro­soft Sur­face Lap­top powered by new AMD Ryzen™ Micro­soft Sur­face Edi­ti­on pro­ces­sors. A signi­fi­cant, mul­­ti-year co-engi­­nee­ring pro­gram bet­ween AMD and Micro­soft at the sili­con, plat­form, and soft­ware levels crea­ted this 15” Micro­soft® Sur­face® Lap­top 3 (…) Wei­ter­le­sen »

Compact AMD Ryzen SBC Featuring Four Independent 4K Displays

Tai­pei, Tai­wan, Octo­ber 1st, 2019 — IBASE Tech­no­lo­gy Inc. (TPEx: 8050), a world lea­ding pro­vi­der of indus­tri­al com­pu­ters and embedded com­pu­ting solu­ti­ons, releases the IB918 AMD Ryzen™ 3.5‑inch Disk-Size SBC based on the AMD Ryzen™ Embedded V1000/R1000 SoC. The IB918 allows sys­tem desi­gners to crea­te fea­ture rich sys­tems tar­ge­ting panel PC, kiosk, POS, medi­cal dis­play (…) Wei­ter­le­sen »

TSMC Files Complaints Against GlobalFoundries in U.S., Germany and Singapore for Infringement of 25 Patents to Affirm its Technology Leadership and to Protect Its Customers and Consumers Worldwide

Hsin­chu, Tai­wan R.O.C., Oct 1, 2019 — TSMC, the world’s lea­ding glo­bal inno­va­tor in semi­con­duc­tor manu­fac­tu­ring, filed mul­ti­ple lawsuits on Sep­tem­ber 30, 2019 against Glo­bal­Found­ries in the United Sta­tes, Ger­ma­ny and Sin­ga­po­re for its ongo­ing inf­rin­ge­ment of 25 TSMC patents by at least its 40nm, 28nm, 22nm, 14nm, and 12nm node pro­ces­ses. In the com­plaints, TSMC (…) Wei­ter­le­sen »

MSI liefert BIOS-Update für AM4-Mainboards

Frank­furt am Main, 30.09.2019 – MSI stat­tet sei­ne AM4-Main­­boards mit dem lan­ge erwar­te­ten 1003-ABBA-Update für BIOS aus. Damit wird unter ande­rem ein Fix für die CPU-Boost-Ratio gelie­fert, was für spür­ba­re Per­for­mance­ver­bes­se­run­gen beim Sin­g­le-Boost sorgt. Für einen Groß­teil der Main­­board-Model­­le steht das BIOS-Update ab sofort zur Ver­fü­gung. Die übri­gen Model­le erhal­ten das Update gegen Ende Okto­ber. (…) Wei­ter­le­sen »

AMD Announces Worldwide Availability of AMD Ryzen™ PRO 3000 Series Processors Designed to Power the Modern Business PC

– Powerful per­for­mance for ener­­gy-effi­ci­ent busi­ness desk­top PCs from pro­ces­sors offe­ring up to 12 cores –  – Strong port­fo­lio of enter­pri­se offe­rings from glo­bal com­mer­cial PC manu­fac­tu­r­ers inclu­ding HP and Leno­vo – SANTA CLARA, Calif.  09/30/2019 Today, AMD (NASDAQ: AMD) announ­ced the glo­bal avai­la­bi­li­ty of its new AMD Ryzen™ PRO 3000 Series desk­top pro­ces­sor lin­e­up, along with new AMD Ryzen™ (…) Wei­ter­le­sen »

HPE completes acquisition of supercomputing leader Cray Inc.

HPC is a key com­po­nent of HPE’s visi­on and growth stra­tegy San Jose, Calif., Sep­tem­ber 25, 2019 – Hew­lett Packard Enter­pri­se (NYSE:HPE) today announ­ced it has com­ple­ted the acqui­si­ti­on of super­com­pu­ting lea­der Cray Inc., ear­lier than the ori­gi­nal tar­get date. HPE paid $35.00 per share, in a tran­sac­tion valued at appro­xi­m­ate­ly $1.4 bil­li­on, net of cash. The (…) Wei­ter­le­sen »

GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications

Inno­va­ti­ve solu­ti­on based on GF’s most advan­ced Fin­FET plat­form offers best-in-class per­for­mance, key new fea­tures to address evol­ving AI requi­re­ments, com­pel­ling eco­no­mics and indus­­try-lea­­ding phy­si­cal IP from Arm San­ta Cla­ra, Calif., Sep­tem­ber 24, 2019 – GLOBALFOUNDRIES (GF), the world’s lea­ding spe­cial­ty foundry, announ­ced today at its Glo­bal Tech­no­lo­gy Con­fe­rence the avai­la­bi­li­ty of 12LP+, an inno­va­ti­ve new solu­ti­on (…) Wei­ter­le­sen »

15,6″ All-in-One-PC mit großem Funktionsumfang auf Whiskey Lake-Basis

  Elms­horn, Deutsch­land, 2019-09-26 – Shut­tle erwei­tert sei­ne erfolg­rei­che XPC all-in-one-Bau­­rei­he, die mitt­ler­wei­le vier ver­schie­de­ne Platt­for­men umfasst, um ein Modell, das auf Intels Whis­key Lake Pro­­zes­­sor-Gene­ra­­ti­on basiert. Das P51U war­tet neben dem genann­ten 15,6″ kapa­zi­ti­ven Touch­screen zudem mit einem IP54-zer­­ti­­fi­­zier­­ten Front­pa­nel auf. Das Dis­play löst in Full HD auf, ein strom­spa­ren­der Intel Cele­ron 4205U Dual-Core-Pro­­zes­­sor (…) Wei­ter­le­sen »

Neuer Curved-Monitor für Gaming mit AMD FreeSync — ViewSonic launcht VX3258-2KPC-MHD mit WQHD-Auflösung

Dors­ten, den 26. Sep­tem­ber 2019 – View­So­nic, ein welt­weit füh­ren­der Anbie­ter visu­el­ler Pro­dukt­lö­sun­gen, prä­sen­tiert heu­te einen neu­en Moni­tor, der sowohl durch ele­gan­tes Design als auch durch star­ke Gam­ing-Fea­­tures über­zeugt. Der VX3258-2KPC-MHD lie­fert auf 32 Zoll eine WQHD-Auf­­­lö­­sung sowie eine Bild­wie­der­ho­lungs­ra­te von 144Hz und eine extrem kur­ze Bild­ver­zö­ge­rung von 1 Mil­li­se­kun­de. Zugleich zeich­net sich der Moni­tor (…) Wei­ter­le­sen »

Arm and TSMC Demonstrate Industry’s First 7nm Arm-based CoWoS® Chiplets for High-Performance Computing

Hsin­chu, Tai­wan R.O.C., Sep­tem­ber 26, 2019 — Arm and TSMC, the High-Per­­for­­mance Com­pu­ting (HPC) indus­try lea­ders, today announ­ced an indus­­try-first 7nm sili­­con-pro­­ven chip­let sys­tem based on mul­ti­ple Arm® cores and lever­aging TSMC’s Chip-on-Wafer-on-Sub­­s­tra­­te (CoWoS®) advan­ced pack­a­ging solu­ti­on. This sin­gle pro­of-of-con­cept chip­let sys­tem suc­cessful­ly demons­tra­tes the key tech­no­lo­gies for buil­ding an HPC Sys­­tem-On-Chip (SoC) with Arm-based cores (…) Wei­ter­le­sen »