Schlagwort: AMD

AMD Unveils New Power-Efficient, High-Performance Mobile Graphics for Premium and Thin-and-Light Laptops, and New Desktop Graphics Cards

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– Expan­ded AMD Rade­on RX 6000M Series mobi­le gra­phics offer 20 per­cent fas­ter per­for­mance on avera­ge than cur­rent lin­e­up1; New AMD Rade­on RX 6000S Series mobi­le gra­phics deli­ver world-class, high-per­­for­­mance gam­ing for next-gen thin-and-light lap­tops – AMD Rade­on RX 6500 XT desk­top gra­phics cards, start­ing at $199 SEP USD, make incre­di­ble 1080p gam­ing acces­si­ble to more (…) Wei­ter­le­sen »

AMD Unveils New Ryzen Mobile Processors Uniting “Zen 3+” core with AMD RDNA 2 Graphics in Powerhouse Design

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— Ryzen 6000 Series pro­ces­sors offer huge gene­ra­tio­nal uplift with up to 11% more sin­gle threa­ded per­for­mance, up to 28% more mul­ti-threa­ded per­for­mance, and up to 2x more gra­phics per­for­mance com­pared to the Ryzen 5000 Series — 

— New AMD Ryzen 7 5800X3D desk­top pro­ces­sors with powerful 3D V‑Cache tech­no­lo­gy ele­va­te gam­ing performance — 

SANTA CLARA, Calif. 01/04/2022

Today, during the 2022 Pro­duct Pre­mie­re live­stream event,  AMD (NASDAQ: AMD) announ­ced the full lin­e­up of new AMD Ryzen™ 6000 Series pro­ces­sors for lap­tops, brin­ging the new, high­ly-effi­ci­ent and extre­me­ly powerful, “Zen 3+” core archi­tec­tu­re tog­e­ther with all-new AMD RDNA™ 2 archi­tec­tu­re-based on-chip gra­phics. The new AMD Ryzen 6000 Series pro­ces­sors are built using TSMC’s 6nm pro­cess tech­no­lo­gy and deli­ver unpre­ce­den­ted levels of built-in gra­phics per­for­mance, offe­ring revo­lu­tio­na­ry 1080p AAA gam­ing, along with cut­ting-edge fea­tures and superb bat­tery life. AMD also announ­ced the new Ryzen™ 7 5800X3D desk­top pro­ces­sor with AMD 3D V‑Cache™ tech­no­lo­gy for eli­te-level gam­ing pe (…) Wei­ter­le­sen »

AMD: Präsentation Produktvorstellungen 2022 morgen ab 16:00 Uhr

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Nach­dem sich AMD — wie vie­le ande­ren Fir­men — von der am Mitt­woch begin­nen­den CES 2022 abge­mel­det hat, bleibt die bereits im Vor­feld für mor­gen ange­kün­dig­te Pro­dukt­prä­sen­ta­ti­on bestehen. Hier dürf­te AMD mehr zu den kom­men­den Desk­top­pro­zes­so­ren mit 3D V‑Cache, Mobi­le­pro­zes­so­ren mit inte­grier­ter RDNA2-Gra­fik (“Rem­brandt”) sagen. Laut Gerüch­te­kü­che wer­den aber auch neue Mobi­le GPUs (RX 6850 XT), der Rade­on RX 6500 XT (“Navi 24”) sowie eine neue Ups­ca­ling-Tech­nik namens Rade­on Super Reso­lu­ti­on vor­ge­stellt. Und last but not least hat AMD bereits ver­lau­ten las­sen, dass es zumin­dest einen Aus­blick auf Zen 4 geben soll. (…) Wei­ter­le­sen »

AMD Corporate Presentation Dezember 2021

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Seit dem Sep­tem­ber 2019 stellt AMD neben der Inves­to­ren­prä­sen­ta­ti­on eine Unter­neh­mens­prä­sen­ta­ti­on (Cor­po­ra­te Pre­sen­ta­ti­on) zur Ver­fü­gung, die auf die aktu­ells­ten Pro­duk­te des Unter­neh­mens ein­geht, etwas aus­führ­li­cher ist und die aktu­ells­ten Road­maps ent­hält. Gegen­über der aktu­ells­ten AMD Inves­tor-Prä­sen­ta­ti­on vom Novem­ber 2021 gibt es aller­dings so kurz vor der CES kei­ne Neu­ig­kei­ten. Erwähnt wer­den nun 3D V‑Cache, die kom­men­den Ser­ver­pro­zes­so­ren auf Basis von Zen 4 bzw. Zen 4c sowie die MI200-GPU-Beschleunigerkarten.
(…) Wei­ter­le­sen »

AMD and Xilinx Provide Update Regarding Expected Timing of Acquisition Close

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SILICON VALLEY, Calif., Dec. 30, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) and Xilinx, Inc. (NASDAQ: XLNX) today released the fol­lo­wing state­ment rela­ted to the sta­tus of glo­bal regu­la­to­ry appr­ovals for AMD’s pro­po­sed acqui­si­ti­on of Xilinx.

“We con­ti­nue making good pro­gress on the requi­red regu­la­to­ry appr­ovals to clo­se our tran­sac­tion. While we had pre­vious­ly expec­ted that we would secu­re all appr­ovals by the end of 2021, we have not yet com­ple­ted the pro­cess and we now expect the tran­sac­tion to clo­se in the first quar­ter of 2022. Our con­ver­sa­ti­ons with regu­la­tors con­ti­nue to pro­gress pro­duc­tively, and we expect to secu­re all requi­red appr­ovals.” (…) Wei­ter­le­sen »

AMD and MediaTek Develop AMD RZ600 Series Wi-Fi 6E Modules to Enhance Laptop and Desktop PC Connectivity Experiences

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New Media­Tek Filo­gic 330P Wi-Fi 6E chip­set deli­vers seam­less con­nec­ti­vi­ty and lon­ger bat­tery life

LAGUNA BEACH, Calif., Nov.18, 2021 /PRNewswire/ — Media­Tek (TWSE: 2454) and AMD (NASDAQ: AMD) today announ­ced a col­la­bo­ra­ti­on to co-engi­neer indus­try lea­ding Wi-Fi® solu­ti­ons, start­ing with the AMD RZ600 Series Wi-Fi 6E modu­les con­tai­ning MediaTek’s new Filo­gic 330P chip­set. The Filo­gic 330P chip­set will power next-gene­ra­ti­on AMD Ryzen-series lap­top and desk­top PCs in 2022 and bey­ond, deli­ve­ring fast Wi-Fi speeds with low laten­cy and less inter­fe­rence from other signals.

To opti­mi­ze the AMD RZ600 Series Wi-Fi 6E modu­les with a focus on deli­ve­ring seam­less con­nec­ti­vi­ty expe­ri­en­ces for cus­to­mers, AMD and Media­Tek deve­lo­ped and cer­ti­fied PCIe® and USB inter­faces for modern sleep sta­tes and power manage­ment, which are vital ele­ments of modern cus­to­mer expe­ri­en­ces. Fur­ther, the opti­miza­ti­on pro­cess included stress test­ing and ensu­ring com­pa­ti­bi­li­ty stan­dards, which may ulti­m­ate­ly redu­ce deve­lo­p­ment time for OEM cus­to­mers. (…) Wei­ter­le­sen »

AMD Processors Accelerating Performance of Top Supercomputers Worldwide

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Growing preference for EPYC™ processors resulted in the number of AMD-powered supercomputers growing 3.5x year-over-year

SANTA CLARA, Calif., Nov. 16, 2021 (GLOBE NEWSWIRE) — During this year’s Super­com­pu­ting Con­fe­rence 2021 (SC21), AMD (NASDAQ: AMD) is show­ca­sing its expan­ded pre­sence and gro­wing pre­fe­rence in the high per­for­mance com­pu­ting (HPC) indus­try with the excep­tio­nal inno­va­ti­on and adop­ti­on of AMD data cen­ter pro­ces­sors and acce­le­ra­tors. Cus­to­mers across the indus­try con­ti­nue to expand their use of AMD EPYC™ pro­ces­sors and AMD Instinct™ acce­le­ra­tors to power cut­ting-edge rese­arch nee­ded to address some of the world’s big­gest chal­lenges in cli­ma­te, life sci­en­ces, medi­ci­ne, and more.

Gro­wing pre­fe­rence for AMD is show­ca­sed in the latest Top500 list. AMD now powers 73 super­com­pu­ters, com­pared to 21 in the Novem­ber 2020 list, a more than 3x year-over-year increase. Addi­tio­nal­ly, AMD powers four out of the top ten most powerful super­com­pu­ters in the world, as well as the most powerful super­com­pu­ter in EMEA. Final­ly, AMD EPYC 7003 series pro­ces­sors, which laun­ched eight months ago, are uti­li­zed by 17 of the 75 AMD powered super­com­pu­ters in the list, demons­t­ra­ting the rapid adop­ti­on of the latest gene­ra­ti­on of EPYC processors.

“The demands of super­com­pu­ting users have increased expo­nen­ti­al­ly as the world seeks to acce­le­ra­te rese­arch, redu­cing the time to dis­co­very of valuable infor­ma­ti­on,” said For­rest Nor­rod, seni­or vice pre­si­dent and gene­ral mana­ger, Data Cen­ter and Embedded Solu­ti­ons Busi­ness Group, AMD. “With AMD EPYC CPUs and Instinct acce­le­ra­tors, we con­ti­nue to evol­ve our pro­duct offe­ring to push the boun­da­ries of data cen­ter tech­no­lo­gies enab­ling fas­ter rese­arch, bet­ter out­co­mes and more impact on the world.”

AMD has also been reco­gni­zed in the annu­al HPC­wire Rea­ders’ and Edi­tors’ Choice Awards at SC21. The com­pa­ny won ten awards inclu­ding Best Sus­taina­bi­li­ty Inno­va­ti­on in HPC, Best HPC Ser­ver Pro­duct and the Out­stan­ding Lea­der­ship in HPC award pre­sen­ted to Pre­si­dent and CEO Dr. Lisa Su. (…) Wei­ter­le­sen »

AMD — Präsentation Accelerated Data Center Premiere

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Für die AMD-Ver­an­stal­tung vom letz­ten Mon­tag, der “Acce­le­ra­ted Data Cen­ter Pre­mie­re”, rei­chen wir hier­mit die Prä­sen­ta­ti­on nach, die vor­ab als Infor­ma­ti­on her­aus­ge­ge­ben wur­de. Dar­in sind aller­dings nicht die Updates der AMD-Road­map bzw. die Daten zu Zen 4 ent­hal­ten. (…) Wei­ter­le­sen »

AMD beseitigte zahlreiche Sicherheitslücken im Grafiktreiber für Windows 10

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In einem in die­ser Woche erschie­ne­nen Secu­ri­ty Bul­le­tin hat AMD ins­ge­samt 27 Sicher­heits­lü­cken im Gra­fik­trei­ber für Win­dows 10 auf­ge­führt, von denen man die meis­ten bereits im Jahr 2020 besei­tigt hat. Zwei davon wur­den aller­dings erst mit der Ver­si­on 21.4.1 ange­gan­gen und besit­zen jeweils die Ein­stu­fung “Hoch”.

Es emp­fiehlt sich also nicht nur wegen der bei­den letzt­ge­nann­ten Sicher­heits­lü­cken, CVE-2020–12960 und CVE-2020–12981, oder zum Bei­spiel wegen der Per­for­mance­ver­bes­se­run­gen im gestern erschie­ne­nen Rade­on Soft­ware Adre­na­lin 21.11.2 den Gra­fik­trei­ber aktu­ell zu halten.
(…) Wei­ter­le­sen »

IBM Cloud Selects 3rd Gen AMD EPYC™ Processors for New Bare Metal Offering for Compute-Intensive Workloads

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SANTA CLARA, Calif. — 11/10/2021- AMD (NASDAQ: AMD) announ­ced today that IBM Cloud has cho­sen 3rd Gen AMD EPYC™ pro­ces­sors to expand its bare metal ser­vice offe­rings desi­gned to power cus­to­mers’ deman­ding workloads and solu­ti­ons. The new ser­vers, fea­turing 128 cores, up to 4TB of memo­ry and 10 NVMe dri­ves per ser­ver, give users full access to high-end, dual-socket per­for­mance with AMD EPYC 7763 pro­ces­sors; a first for IBM Cloud in a dual-socket platform.

“Our cus­to­mers have a high demand for com­pu­ting pro­ces­sing power and the new 3rd Gen AMD EPYC pro­ces­sors pro­vi­de the high levels of per­for­mance and sca­la­bi­li­ty we were loo­king for,” said Suresh Gopa­l­a­krish­n­an, vice pre­si­dent, IBM Cloud. “Our col­la­bo­ra­ti­on with AMD has hel­ped us deli­ver our hig­hest core counts and band­width ever available for IBM Cloud cus­to­mers, to offer top mar­ket per­for­mance for today and tomorrow’s deman­ding workloads.” (…) Wei­ter­le­sen »

AMD Unveils Workload-Tailored Innovations and Products at The Accelerated Data Center Premiere

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— AMD laun­ches AMD Instinct™ MI200 series acce­le­ra­tors, pre­views 3rd Gen AMD EPYC™ pro­ces­sors with AMD 3D V‑Cache, and pro­vi­des new details on expan­ded set of next-gene­ra­ti­on EPYC™ pro­ces­sors powered by “Zen 4” and “Zen 4c” CPU cores—

— Meta choo­ses EPYC™ CPUs for its data center —

SANTA CLARA, Calif., Nov. 08, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) held the vir­tu­al Acce­le­ra­ted Data Cen­ter Pre­mie­re, laun­ching the new AMD Instinct™ MI200 series acce­le­ra­tors, the world’s fas­test acce­le­ra­tor for high per­for­mance com­pu­ting (HPC) and arti­fi­ci­al intel­li­gence (AI) workload­si, and pro­vi­ded a pre­view of the inno­va­ti­ve 3rd Gen AMD EPYC™ pro­ces­sors with AMD 3D V‑Cache. AMD also reve­a­led new infor­ma­ti­on about its next gene­ra­ti­on “Zen 4” pro­ces­sor core and announ­ced the new “Zen 4c” pro­ces­sor core, both of which will power future AMD ser­ver pro­ces­sors and are desi­gned to extend the company’s lea­der­ship pro­ducts for the data center.

“We are in a high-per­for­mance com­pu­ting mega­cy­cle that is dri­ving demand for more com­pu­te to power the ser­vices and devices that impact every aspect of our dai­ly lives,” said Dr. Lisa Su, pre­si­dent and CEO, AMD. “We are buil­ding signi­fi­cant momen­tum in the data cen­ter with our lea­der­ship pro­duct port­fo­lio, inclu­ding Meta’s adop­ti­on of AMD EPYC to power their infra­struc­tu­re and the buil­dout of Fron­tier, the first U.S. exas­ca­le super­com­pu­ter which will be powered by EPYC and AMD Instinct pro­ces­sors. In addi­ti­on, today we announ­ced a breadth of new pro­ducts that build on that momen­tum in next-gene­ra­ti­on EPYC pro­ces­sors with new inno­va­tions in design, lea­der­ship, 3D pack­a­ging tech­no­lo­gy, and 5 nm high-per­for­mance manu­fac­tu­ring to fur­ther extend our lea­der­ship for cloud, enter­pri­se and HPC cus­to­mers.” (…) Wei­ter­le­sen »

New AMD Instinct™ MI200 Series Accelerators Bring Leadership HPC and AI Performance to Power Exascale Systems and More

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Novem­ber 08, 2021 12:00pm EST

- With new AMD CDNA™ 2 archi­tec­tu­re, AMD Instinct MI200 series acce­le­ra­tors deli­ver ground-brea­king 4.9x advan­ta­ge in HPC per­for­mance1 com­pared to com­pe­ting data cen­ter acce­le­ra­tors, expe­diting sci­ence and discovery -

- MI200 series acce­le­ra­tors are first mul­ti-die GPU, first to sup­port 128GB of HBM2e memo­ry, and deli­ver a sub­stan­ti­al boost for appli­ca­ti­ons cri­ti­cal to the foun­da­ti­on of science -

SANTA CLARA, Calif., Nov. 08, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced the new AMD Instinct™ MI200 series acce­le­ra­tors, the first exas­ca­le-class GPU acce­le­ra­tors. AMD Instinct MI200 series acce­le­ra­tors includes the world’s fas­test high per­for­mance com­pu­ting (HPC) and arti­fi­ci­al intel­li­gence (AI) acce­le­ra­tor,1 the AMD Instinct™ MI250X. (…) Wei­ter­le­sen »

Was zeigt AMD morgen — Trento, Instinct MI250(X), OAM, Milan‑X?

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Nach­dem in den letz­ten Wochen bereits ers­te Leaks zu den kom­men­den MI200-Gra­fik­be­schleu­ni­gern ver­öf­fent­licht wur­den, hat AMD vor Kur­zem für den mor­gi­gen 8. Novem­ber ein Event ange­kün­digt, dass sich dem The­ma Daten­zen­tren und CPU- und GPU-Beschleu­ni­gern wid­men soll. Dabei dürf­ten vor allem die bereits für den anste­hen­den Exas­ca­le-Super­com­pu­ter “Fron­tier” aus­ge­lie­fer­ten spe­zi­el­len Pro­duk­te vor­ge­stellt wer­den. Ein Tweet von AMDs Prä­si­den­tin und CEO Dr. Lisa Su gibt aber wohl auch Hin­wei­se dar­auf, dass ein OAM-Beschleu­ni­ger zum Ein­satz kommt. (…) Wei­ter­le­sen »