Kategorie: Pressemitteilungen

In die­ser Sek­ti­on wer­den Pres­se­mit­tei­lun­gen der Her­stel­ler 1:1 ver­öf­fent­licht. Pla­net 3DNow! über­nimmt weder für die Rich­tig­keit der Anga­ben noch für die Art der For­mu­lie­rung jed­we­de Ver­ant­wor­tung. Die Anga­ben kön­nen sub­jek­tiv sein und geben nicht not­wen­di­ger­wei­se die Mei­nung der auf Pla­net 3DNow! schrei­ben­den Autoren wieder.

AMD Brings World-Class Performance of 4th Gen AMD EPYC™ Processors to Embedded Networking, Security, Storage and Industrial Systems

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New ener­gy-effi­ci­ent EPYC Embedded 9004 Series com­bi­nes embedded sys­tem-opti­mi­zed fea­tures, enhan­ced secu­ri­ty and sca­la­bi­li­ty up to 96 cores —

Sie­mens and Advan­tech are initi­al cus­to­mers deploy­ing solu­ti­ons based on EPYC Embedded 9004 Series —

NÜRNBERG, Ger­ma­ny, March 14, 2023 (GLOBE NEWSWIRE) — Embedded World 2023 (Hall 2, Stand 2–411) — AMD (NASDAQ: AMD) today announ­ced it is brin­ging world-class per­for­mance and ener­gy effi­ci­en­cy to embedded sys­tems with AMD EPYC™ Embedded 9004 Series pro­ces­sors. The new 4th gene­ra­ti­on EPYC Embedded pro­ces­sors powered by “Zen 4” archi­tec­tu­re pro­vi­de tech­no­lo­gy and fea­tures for embedded net­wor­king, security/firewall and sto­rage sys­tems in cloud and enter­pri­se com­pu­ting as well as indus­tri­al edge ser­vers for the fac­to­ry flo­or (…) Wei­ter­le­sen »

AMD Announces Appointment of New Corporate Fellows

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Five indus­try inno­va­tors reco­gni­zed for out­stan­ding tech­ni­cal contributions

SANTA CLARA, Calif., March 13, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced the appoint­ment of five tech­ni­cal lea­ders to the role of AMD Cor­po­ra­te Fel­low. The­se appoint­ments reco­gni­ze each leader’s signi­fi­cant impact on semi­con­duc­tor inno­va­ti­on across various are­as, from gra­phics archi­tec­tu­re to advan­ced pack­a­ging (…) Wei­ter­le­sen »

Octavo Systems Releases the OSDZU3-REF Development Platform for the AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package

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Hous­ton, Texas, United Sta­tes (March 1, 2023) – Octa­vo Sys­tems LLC, a lea­ding pro­vi­der of Sys­tem-in-Packa­ge (SiP) solu­ti­ons, has offi­ci­al­ly released its latest offe­ring, the OSDZU3-REF Deve­lo­p­ment Plat­form. This plat­form gives sys­tem desi­gners a com­pre­hen­si­ve deve­lo­p­ment envi­ron­ment for eva­lua­ting, test­ing, and start­ing pro­duct deve­lo­p­ment using the OSDZU3 Sys­tem-in-Packa­ge (SiP). (…) Wei­ter­le­sen »

Synology enthüllt DiskStation DS1823xs+, eine leistungsstarke Tower-Speicherlösung für bis zu 324 TB

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Düs­sel­dorf, Deutsch­land — 1. März 2023 — Syn­o­lo­gy prä­sen­tier­te heu­te die Disk­Sta­ti­on DS1823xs+, eine leis­tungs­star­ke Lösung für die zen­tra­le Daten­spei­che­rung im Desk­top­Form­fak­tor. Mit bis zu 144 TB Brut­to­spei­cher­ka­pa­zi­tät1 vor Erwei­te­rung ist die DS1823xs+ ide­al zum Zusam­men­fas­sen unstruk­tu­rier­ter Daten, für die fir­men­wei­te Siche­rung von End­punk­ten und Ser­vern, das Tei­len und Syn­chro­ni­sie­ren von Datei­en zwi­schen Gerä­ten und Stand­or­ten oder die Ver­wal­tung loka­ler Video­über­wa­chung. Sie kann über­all dort fle­xi­bel ein­ge­setzt wer­den, wo kein eige­nes Ser­ver­rack oder Rechen­zen­trum ver­füg­bar ist. (…) Wei­ter­le­sen »

ASRock Releases New BIOS to support AMD Ryzen™ 7000 Series Processors with AMD 3D V‑Cache™ Technology

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TAIPEI, Tai­wan, Febru­ary 28, 2023 – ASRock has released new BIOS to sup­port the latest AMD Ryzen™ 7000 Series Pro­ces­sors with AMD 3D V‑Cache™ Tech­no­lo­gy, with new BIOS on ASRock X670E/B650E/B650 mother­boards, you may enjoy the enhan­ced gam­ing per­for­mance powered by AMD Ryzen™ 7000X3D series pro­ces­sors. (…) Wei­ter­le­sen »

NVIDIA Announces Financial Results for Fourth Quarter and Fiscal 2023

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Wed­nes­day, Febru­ary 22, 2023

  • Quar­ter­ly reve­nue of $6.05 bil­li­on, down 21% from a year ago
  • Fis­cal-year reve­nue of $27.0 bil­li­on, flat from a year ago
  • Quar­ter­ly and annu­al return to share­hol­ders of $1.15 bil­li­on and $10.44 bil­li­on, respectively

SANTA CLARA, Calif., Feb. 22, 2023 — NVIDIA (NASDAQ: NVDA) today repor­ted reve­nue for the fourth quar­ter ended Janu­ary 29, 2023, of $6.05 bil­li­on, down 21% from a year ago and up 2% from the pre­vious quarter.

GAAP ear­nings per diluted share for the quar­ter were $0.57, down 52% from a year ago and up 111% from the pre­vious quar­ter. Non-GAAP ear­nings per diluted share were $0.88, down 33% from a year ago and up 52% from the pre­vious quarter.

For fis­cal 2023, reve­nue was $26.97 bil­li­on, flat from a year ago. GAAP ear­nings per diluted share were $1.74, down 55% from a year ago. Non-GAAP ear­nings per diluted share were $3.34, down 25% from a year ago. (…) Wei­ter­le­sen »

AMD Expands 5G Telco Market Leadership with New High-Performance and Adaptive Computing Products and Testing Services at MWC 2023

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SANTA CLARA, Calif., Feb. 22, 2023 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) announ­ced it will be expan­ding sup­port of its gro­wing 5G part­ner eco­sys­tem span­ning from core to radio access net­works (RAN) appli­ca­ti­ons, deli­ve­ring addi­tio­nal new test capa­bi­li­ties and unvei­ling new 5G pro­ducts. The AMD wire­less tele­com part­ner eco­sys­tem has more than dou­bled in the past year, bols­te­red by the inte­gra­ti­on of the AMD and Xilinx pro­duct lines as well as the crea­ti­on of its new Tel­co Solu­ti­ons test­ing lab in col­la­bo­ra­ti­on with VIAVI (…) Wei­ter­le­sen »

AMD to Present at Morgan Stanley’s Technology, Media and Telecom Conference

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SANTA CLARA, Calif., Feb. 20, 2023 — Today, AMD (NASDAQ: AMD) announ­ced that Mark Paper­mas­ter, chief tech­no­lo­gy offi­cer and exe­cu­ti­ve vice pre­si­dent, Tech­no­lo­gy and Engi­nee­ring, will pre­sent at the Mor­gan Stan­ley Tech­no­lo­gy, Media and Tele­com Con­fe­rence on Mon­day, March 6th at 11:35 a.m. EST/8:35 a.m. PST.

(…) Wei­ter­le­sen »

Atos to build Max Planck Society’s new BullSequana XH3000-based supercomputer

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Munich, February 9th, 2023

Atos today announ­ces a con­tract to build and install a new high-per­for­mance com­pu­ter for the Max Planck Socie­ty, a world-lea­ding sci­ence and tech­no­lo­gy rese­arch orga­niza­ti­on. The new sys­tem will be based on Atos’ latest Bull­Se­qua­na XH3000 plat­form, which is powered by AMD EPYC™ CPUs and Instinct™ acce­le­ra­tors. In its final con­fi­gu­ra­ti­on, the appli­ca­ti­on per­for­mance will be three times hig­her than the cur­rent “Cobra” sys­tem, which is also based on Atos technologies.

The new super­com­pu­ter, with a total order value of over 20 mil­li­on euros, will be ope­ra­ted by the Max Planck Com­pu­ting and Data Faci­li­ty (MPCDF) in Gar­ching near Munich and will pro­vi­de high-per­for­mance com­pu­ting (HPC) capa­ci­ty for many insti­tu­tes of the Max Planck Socie­ty. Par­ti­cu­lar­ly deman­ding sci­en­ti­fic pro­jects, such as tho­se in astro­phy­sics, life sci­ence rese­arch, mate­ri­als rese­arch, plas­ma phy­sics, and AI will bene­fit from the high-per­for­mance capa­bi­li­ties of the new sys­tem. (…) Wei­ter­le­sen »

TSMC Offers the Industry’s Most Successful FinFET Technology to Academia

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HSINCHU, Tai­wan, R.O.C., Feb. 3, 2023 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced the launch of its “TSMC Uni­ver­si­ty Fin­FET Pro­gram”, aimed at deve­lo­ping future IC design talent for the indus­try and empowe­ring aca­de­mic inno­va­ti­on around the world. The pro­gram will pro­vi­de broad edu­ca­tio­nal access for uni­ver­si­ty stu­dents, facul­ty, and aca­de­mic rese­ar­chers to the pro­cess design kit (PDK) of the industry’s most suc­cessful fin field-effect tran­sis­tor (Fin­FET) tech­no­lo­gy at 16nm, brin­ging the IC design lear­ning expe­ri­ence to the advan­ced Fin­FET level. The pro­gram will also pro­vi­de access for lea­ding IC rese­ar­chers in uni­ver­si­ties to both 16nm (N16) and 7nm (N7) sili­con through mul­ti-pro­ject wafer (MPW) ser­vices to acce­le­ra­te impactful rese­arch inno­va­tions towards real-world appli­ca­ti­ons. (…) Wei­ter­le­sen »

Entry-level uCPE/SD-WAN Appliance with AMD Ryzen Embedded R1000/V1000 Processor

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Tai­pei, Tai­wan, Febru­ary 2nd, 2023 — IBASE Tech­no­lo­gy Inc. (TPEx: 8050), a lea­ding pro­vi­der of IPC pro­ducts and net­wor­king plat­forms, laun­ches its new INA1600 uCPE/SD-WAN appli­ance. Powered by AMD Ryzen Embedded R1000/V1000 pro­ces­sor, the ent­ry-level INA1600 sup­ports WiFi 6 and 5G LTE Cat20 con­nec­ti­vi­ty and is cer­ti­fied by Fle­xi­WAN, making it easy for sys­tem inte­gra­tors to deploy enter­pri­se net­works lever­aging uni­ver­sal cus­to­mer pre­mi­ses equip­ment (uCPE).

“With Soft­ware-defi­ned WAN (SD-WAN), enter­pri­ses can deli­ver more respon­si­ve and pre­dic­ta­ble appli­ca­ti­ons in less time and at lower cos­ts than tra­di­tio­nal MPLS ser­vices. Cloud-based SD-WAN adds value by pro­vi­ding an inte­gra­ted view of the net­work that can be easi­ly mana­ged at sca­le,” said Jes­se Chiang, seni­or direc­tor of IBASE’s Net­com Pro­ducts Busi­ness Divi­si­on. “The INA1600 is desi­gned to help enter­pri­ses cen­tra­li­ze manage­ment, and enable auto­ma­tic con­fi­gu­ra­ti­on and pro­vi­si­on with zero-touch pro­vi­sio­ning.” (…) Wei­ter­le­sen »

AMD Reports Fourth Quarter and Full Year 2022 Financial Results

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― Record full year reve­nue of $23.6 Bil­li­on up 44% year-over-year ―

SANTA CLARA, Calif., Jan. 31, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ:AMD) today announ­ced reve­nue for the fourth quar­ter of 2022 of $5.6 bil­li­on, gross mar­gin of 43%, ope­ra­ting loss of $149 mil­li­on, net inco­me of $21 mil­li­on and diluted ear­nings per share of $0.01. On a non-GAAP(*) basis, gross mar­gin was 51%, ope­ra­ting inco­me was $1.3 bil­li­on, net inco­me was $1.1 bil­li­on and diluted ear­nings per share was $0.69.

For full year 2022, the com­pa­ny repor­ted reve­nue of $23.6 bil­li­on, gross mar­gin of 45%, ope­ra­ting inco­me of $1.3 bil­li­on, net inco­me of $1.3 bil­li­on and diluted ear­nings per share of $0.84. On a non-GAAP(*) basis, gross mar­gin was 52%, ope­ra­ting inco­me was $6.3 bil­li­on, net inco­me was $5.5 bil­li­on and diluted ear­nings per share was $3.50.

GAAP Quar­ter­ly Finan­cial Results

(…) Wei­ter­le­sen »

Intel Reports Fourth-Quarter and Full-Year 2022 Financial Results

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▪Fourth-quar­ter reve­nue was $14.0 bil­li­on, down 32 per­cent year-over-year (YoY) and down 28 per­cent YoY on a non-GAAP basis. Full-year reve­nue was $63.1 bil­li­on, down 20 per­cent YoY and down 16 per­cent YoY on a non-GAAP basis.

▪Fourth-quar­ter ear­nings (loss) per share (EPS) was $(0.16); non-GAAP EPS was $0.10. Full-year EPS was $1.94; non-GAAP EPS was $1.84.

▪Fore­cas­ting first-quar­ter 2023 reve­nue of $10.5 bil­li­on to $11.5 bil­li­on; expec­ting first-quar­ter EPS of $(0.80) (non-GAAP EPS of $(0.15)).

▪Decla­res quar­ter­ly cash divi­dend of $0.365 per share.

SANTA CLARA, Calif., Jan. 26, 2023 — Intel Cor­po­ra­ti­on today repor­ted fourth-quar­ter and full-year 2022 finan­cial results. The com­pa­ny also announ­ced that its board of direc­tors has declared a quar­ter­ly divi­dend of $0.365 per share on the company’s com­mon stock, which will be paya­ble on March 1, 2023, to share­hol­ders of record as of Febru­ary 7, 2023.

“Despi­te the eco­no­mic and mar­ket head­winds, we con­tin­ued to make good pro­gress on our stra­te­gic trans­for­ma­ti­on in Q4, inclu­ding advan­cing our pro­duct road­map and impro­ving our ope­ra­tio­nal struc­tu­re and pro­ces­ses to dri­ve effi­ci­en­ci­es while deli­ve­ring at the low-end of our gui­ded ran­ge,” said Pat Gel­sin­ger, Intel CEO. “In 2023, we will con­ti­nue to navi­ga­te the short-term chal­lenges while stri­ving to meet our long-term com­mit­ments, inclu­ding deli­ve­ring lea­der­ship pro­ducts ancho­red on open and secu­re plat­forms, powered by at-sca­le manu­fac­tu­ring and super­char­ged by our incre­di­ble team.” 

“In the fourth quar­ter, we took steps to right-size the orga­niza­ti­on and ratio­na­li­ze our invest­ments, prio­ri­tiz­ing the are­as whe­re we can deli­ver the hig­hest value for the long term,” said David Zins­ner, Intel CFO. “The­se actions under­pin our cost-reduc­tion tar­gets of $3 bil­li­on in 2023, and set the stage to achie­ve $8 bil­li­on to $10 bil­li­on by the end of 2025.” (…) Wei­ter­le­sen »

Noctua präsentiert NH-L9a-AM5 Low-Profile Kühler für AMD Ryzen Prozessoren

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Wien, 24. Janu­ar 2023 – Noc­tua prä­sen­tier­te heu­te die jüngs­ten Model­le sei­ner erfolg­rei­chen Low-Pro­fi­le-Küh­ler­se­rie NH-L9: Mit einer Bau­hö­he von nur 37mm stel­len die neu­en NH-L9a-AM5 und NH-L9a-AM5 chromax.black eine her­vor­ra­gen­de Wahl für lei­se, hoch­kom­pak­te HTPCs und Small Form Fac­tor (SFF) Sys­te­me auf der Basis von AMDs neu­es­ten, AM5-basier­ten Ryzen Pro­zes­so­ren dar.

„AMDs gera­de vor­ge­stell­ten Ryzen Pro­zes­so­ren mit 65W eig­nen sich ide­al für kom­pak­te aber den­noch leis­tungs­fä­hi­ge Sys­te­me und unser neu­er NH-L9a-AM5 ist der per­fek­te Küh­ler dafür,“ erklärt Roland Mos­sig (Noc­tua CEO). „Er kühlt die neu­en Model­le 7900, 7700 und 7600 pro­blem­los bei flüs­ter­lei­sen Dreh­zahl­ein­stel­lun­gen und bie­tet aus­rei­chend Leis­tungs­re­ser­ven, falls Kun­den sie mit mehr als 65W betrei­ben möch­ten – wir haben auf dem Ryzen 7950X und 7900X bis zu 130W erzielt.“ (…) Wei­ter­le­sen »

AMD Adaptive Computing Technology Enables Next-Generation DENSO LiDAR System, Delivering 20X Improvement in Resolution

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── AMD Xilinx Auto­mo­ti­ve Zynq UltraS­ca­le+ MPSoC in DENSO plat­form pro­vi­des hig­hest point-cloud den­si­ty level of any SPAD LiDAR sys­tem in mar­ket today ──

SANTA CLARA, Calif., Jan. 19, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that its adap­ti­ve com­pu­ting tech­no­lo­gy is powe­ring lea­ding mobi­li­ty sup­pli­er DENSO Corporation’s next-gene­ra­ti­on LiDAR plat­form. The new plat­form will enable over 20X1 impro­ve­ment in reso­lu­ti­on with extre­me­ly low laten­cy for increased pre­cis­i­on in detec­ting pede­stri­ans, vehic­les, free space and more. The DENSO LiDAR plat­form, tar­ge­ted to begin ship­ping in 2025, will levera­ge the AMD Xilinx Auto­mo­ti­ve (XA) Zynq™ UltraS­ca­le+™ adap­ti­ve SoC and its func­tion­al safe­ty suite of deve­lo­per tools to enable ISO 26262 ASIL‑B cer­ti­fi­ca­ti­on. (…) Wei­ter­le­sen »